CN105385109A - Epoxy resin composition and application of epoxy resin composition in dipping coil preparation - Google Patents
Epoxy resin composition and application of epoxy resin composition in dipping coil preparation Download PDFInfo
- Publication number
- CN105385109A CN105385109A CN201510981125.1A CN201510981125A CN105385109A CN 105385109 A CN105385109 A CN 105385109A CN 201510981125 A CN201510981125 A CN 201510981125A CN 105385109 A CN105385109 A CN 105385109A
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- Prior art keywords
- epoxy resin
- urea
- hour
- dipping
- composition epoxy
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/127—Encapsulating or impregnating
Abstract
The invention discloses an epoxy resin composition. The epoxy resin composition is prepared from, by weight, 100 parts of epoxy resin, 10-30 parts of flexibilizer, 1-10 parts of curing agent, 5-20 parts of heat conduction agent, 1-5 parts of release agent, 1-5 parts of fire retardant and 1-3 parts of pigment. The curing agent is a liquid mixture formed by mixing hydrogen cyanamide and derivatives of urea according to the weight ratio between 3 to 1 and 2 to 1. The derivatives of urea include N,N-diethyl urea, N,N-dipropyl urea and N,N-methylethyl urea. The flexibilizer is polyether-polyamine. The heat conduction agent is selected from AlN, BN, MgO and ZnO. The composition can be used for dipping coils.
Description
Technical field
The invention belongs to technical field of polymer materials, be specifically related to a kind of composition epoxy resin and uses thereof.
Background technology
Due to the good chemical product resistance of thermosetting epoxy resin, extraordinary thermal property and power-mechanical characteristic and high electrical isolation capabilities and widespread use.In addition, epoxy resin demonstrates the attachment good to a lot of base material, and is therefore suitable for use in most in fibre composite (matrix material).For the use in fibre composite, both expected the good wet of fiber, namely, the low viscosity of the selected resin formulations product for the preparation of matrix material, mechanical characteristics high after also expecting to solidify completely.
The air-core reactor that power system uses at present, its coil can adopt glass fibre coiling then dipping lacquer together with wire, also on-the-spot wet method coiling can be adopted together with glass fibre, wire, solvent impregnated resin, but no matter adopt how coiling, all need the air gap existed by resin filling coil inside, then curing molding is as a whole.Resin plays filling air gap, heat transfer, protection against the tide, prevents the effects such as shelf depreciation in reactor winding.
Because the molecular structure of epoxy resin is contradiction in its viscosity of reduction and its thermotolerance of improvement, so determine that the molecular structure of resin is difficult.For the no-solvent type thermosetting resin composition of dipping dynamoelectric coil, usually adopt the composition epoxy resin containing traditional double functional epoxy resins and acid anhydrides, as described in Japanese Laid-Open Patent Publication 60-5210 (1985).
Although epoxy resin can use such as acid and/or anhydride-cured, some shortcomings are generally acknowledged.Acid and/or anhydride-cured system often to water sensitive and cause solidify Matrix lysis.In addition, comprise the curable epoxy resin composition of acid anhydrides when for flooding, a large amount of acid anhydrides steams is in large chamber and in the event that an accident occurs, very large to the healthy effect of operator.In use, coil exposed is in the temperature change of high humidity and-40 DEG C to 150 DEG C.The system of current use is based on bisphenol A epoxide resin/anhydride system, and particularly at high temperature it can degrade because of moisture this system, and its splitting resistance is also more weak, can occur crackle and moisture can permeate better and cause more serious damage in causing it to use.
Therefore, need to provide a kind of composition epoxy resin that may be used for coil, while there is the mechanical property (such as toughness) meeting service requirements, there is good workability, the viscosity of reduction.
Summary of the invention
The object of the present invention is to provide a kind of composition epoxy resin, it, when for the preparation of coil solvent impregnated resin, has good mobility, is convenient to processing, environmental protection more simultaneously.
Technical scheme of the present invention is as follows:
A kind of composition epoxy resin, is made up of the component of following weight part,
Wherein, described solidifying agent is the liquid form mixt that the derivative of cyanamide and urea is mixed to form with the part by weight of 3:1-2:1, and the derivative of urea is N, N-diethyl urea, N, N-dipropyl urea, N, N-methylethyl urea, toughner is polyether-polyamines, and thermal conducting agent is selected from AlN, BN, MgO, ZnO.
Described epoxy resin is selected from bisphenol A-type, bisphenol-f type, bisphenol-s epoxy resin, and oxirane value is 0.40-0.55 equivalent/100g.
In described solidifying agent, the ratio of the derivative of cyanamide and urea is 2:1.
Described pigment is selected from light blue, titanium dioxide, cadmium red etc.
Described releasing agent is selected from wax class, calcium stearate, Zinic stearas.
Described fire retardant is selected from phosphonium flame retardant and nitrogenous flame ratardant.
Above-mentioned composition epoxy resin is preparing the purposes in dipping coil.
When using above-mentioned composition epoxy resin to carry out dipping coil, the mode by drip dipping or vacuum pressure impregnation etc. is carried out.
Vacuum pressure impregnation removes air, moisture and other pollutents by means of used vacuum for comprising and substitutes the processing technology in these spaces subsequently by dipping system from coil.
Concrete steps example is:
(1) by coil winding preheating 5-6 hour in 100-120 DEG C of temperature, before cast, 60-80 DEG C is cooled to;
(2) by composition epoxy resin at normal temperatures, in vacuum tightness 1-3mbar, deaeration 2.5-3.5 hour is stirred;
(3) coil winding is placed in pouring can under vacuum tightness 3-4mbar state, vacuumizes 2-3 hour;
(4) composition epoxy resin is poured in pouring can, keeps vacuum tightness 4-5mbar, dipping 1-3 hour;
(5) by flooded coil winding be placed in curing oven, 80 DEG C of maintenances are warmed up to 90-100 DEG C in 3-5 hour, 30-60 minute, keep 1.5-2 hour; Within 30-60 minute, be warmed up to 110-120 DEG C, keep 2.5-3 hour; Within 30-60 minute, be warmed up to 140-150 DEG C, keep 10-15 hour, finally solidify.
Dipping coil, adopts aforesaid method preparation.
In the present invention, cyanamide and specific urea derivatives form eutectic mixture at normal temperatures in the scope of 3:1-2:1, namely liquid state is formed, when it is for epoxy-resin systems, relative to adopting, other are solid-state, such as, during the solidifying agent of powdered form, there is the viscosity of reduction, be convenient to the flowing when dipping coil winding, be applicable to perfusion; And adopt Dyhard RU 100 to substitute cyanamide, then can not get liquid mixture; Relative to other liquid amine curing agents in prior art, solidifying agent of the present invention, when usage quantity is few, still can reach the solidification effect met the demands, and after solidification, the second-order transition temperature of system is higher.
Solidifying agent in the present invention has good latent at normal temperatures, causes it that bicomponent system need not be adopted to prepare solvent impregnated resin system.In addition, not using solvent in the present composition, is namely solvent-free, but it still has good flowing property.
In composition epoxy resin of the present invention, in conjunction with above-mentioned LCM, employ polyether-polyamines as toughner, because polyether-polyamines and epoxy resin have reactivity, than other toughner of use after its solidification, such as the segmented copolymer of polyethers, polycaprolactone block and polysiloxane, has more excellent mechanical property, such as higher Tg, higher shock strength and bending strength.
Embodiment
Below by way of embodiment, technical scheme of the present invention is further detailed and is described.
Epoxy resin is liquid bisphenol A type epoxy resin, and oxirane value is 0.51, from commercially available;
Toughner 1 polyether-polyamines is Huntsman Products;
Toughner 2 is polypropylene glycol;
Solidifying agent 1: cyanamide: the liquid form mixt that N, N-diethyl urea (part by weight) is 2:1;
Solidifying agent 2: cyanamide: the liquid form mixt that N, N-diethyl urea (part by weight) is 3:1;
Solidifying agent 3: cyanamide: the powdered mixture that N, N-diethyl urea (part by weight) is 5:1;
Solidifying agent 4: cyanamide: the powdered mixture that N, N-diethyl urea (part by weight) is 0.5:1;
Solidifying agent 5: liquid amine solidifying agent, model VestaminIPDA;
Solidifying agent 6: Dyhard RU 100: the powdered mixture that N, N-diethyl urea (part by weight) is 3:1;
Thermal conducting agent is AlN particle, and releasing agent is calcium stearate, and fire retardant is phosphate ester flame retardants, and pigment is titanium dioxide.
Embodiment 1-4 and each amounts of components of comparative example 1-5 and product performance are in table 1.
Accurately take each component, after being uniformly mixed, vacuumize removal bubble, prior to 90 times solidifications 2 hours, afterwards 120 times solidifications 3 hours, then be cured 10 hours at 140 DEG C, obtain solidifying product.
The mensuration of viscosity at 25 DEG C: carry out on HAAKERheostress1 (mPa*s), with the angle of diameter 35mm and 1 °, shearing rate is 5.01/s, and the sample of employing is the mixture of epoxy resin and solidifying agent, not containing the component of other such as toughner, thermal conducting agents.
Tg is according to ISO6721 twisting vibration test determination; Bending strength adopts ISO178 standard test; Shock strength, according to ISO179/1 standard test, all uses the sample test after solidification.
Table 1:
By above-described embodiment and comparative example known, composition of the present invention is owing to have employed liquid cyanamide and urea derivatives as solidifying agent, there is the viscosity obviously reduced, the various mechanical property of the epoxy resin cure product simultaneously prepared is substantially close with other solid-state solidifying agent of use, and relative to other liquid amine curing agents (comparative example 3) in prior art, solidifying agent of the present invention is issued to close solidification effect in the situation that consumption is less, and namely solidifying agent of the present invention has higher curing efficiency.Secondly, by adopting polyether-polyamines as toughner, obtaining product than employing polyethers toughner such as polypropylene glycol (comparative example 5) and there is higher Tg, and better mechanical property, such as bending strength, resistance to impact shock.
Embodiment 5 (application examples)
(1) by coil winding preheating 6 hours in 100 DEG C of temperature, 60 DEG C before cast, are cooled to;
(2) will accurately take each raw material of composition epoxy resin in the ratio in embodiment 1, at normal temperatures, in vacuum tightness 1-3mbar, stir deaeration 3 hours;
(3) coil winding is placed in pouring can under vacuum tightness 3mbar state, vacuumizes 2 hours;
(4) composition epoxy resin is poured in pouring can, keeps vacuum tightness 4mbar, flood 3 hours;
(5) by flooded coil winding be placed in curing oven, 80 DEG C keep 3 hours, within 30 minutes, be warmed up to 90 DEG C, keep 1.5 hours; Within 30 minutes, be warmed up to 110 DEG C, keep 2.5 hours; Within 60 minutes, be warmed up to 140 DEG C, keep 10 hours, finally solidify.
The above, be only preferred embodiment of the present invention, therefore can not limit scope of the invention process according to this, the equivalence change namely done according to the scope of the claims of the present invention and description with modify, all should still belong in scope that the present invention contains.
Claims (4)
1. a composition epoxy resin, is characterized in that: be made up of the component of following weight part,
Wherein, described solidifying agent is the liquid form mixt that the derivative of cyanamide and urea is mixed to form with the part by weight of 3:1-2:1, and the derivative of urea is N, N-diethyl urea, N, N-dipropyl urea, N, N-methylethyl urea, toughner is polyether-polyamines, and thermal conducting agent is selected from AlN, BN, MgO, ZnO;
Described epoxy resin is selected from bisphenol A-type, bisphenol-f type, bisphenol-s epoxy resin, and oxirane value is 0.4-0.55;
In described solidifying agent, the ratio of the derivative of cyanamide and urea is 2:1;
Described pigment is selected from light blue, titanium dioxide, cadmium red;
Described releasing agent is calcium stearate;
Described fire retardant is selected from phosphonium flame retardant and nitrogenous flame ratardant.
2. the composition epoxy resin of claim 1 is preparing the purposes in dipping coil.
3. use the composition epoxy resin of claim 1 to prepare dipping coil method, step is as follows:
(1) by coil winding preheating 5-6 hour in 100-120 DEG C of temperature, before cast, 60-80 DEG C is cooled to;
(2) by composition epoxy resin at normal temperatures, in vacuum tightness 1-3mbar, deaeration 2.5-3.5 hour is stirred;
(3) coil winding is placed in pouring can under vacuum tightness 3-4mbar state, vacuumizes 2-3 hour;
(4) composition epoxy resin is poured in pouring can, keeps vacuum tightness 4-5mbar, dipping 1-3 hour;
(5) by flooded coil winding be placed in curing oven, 80 DEG C of maintenances are warmed up to 90-100 DEG C in 3-5 hour, 30-60 minute, keep 1.5-2 hour; Within 30-60 minute, be warmed up to 110-120 DEG C, keep 2.5-3 hour; Within 30-60 minute, be warmed up to 140-150 DEG C, keep 10-15 hour, finally solidify.
4. a dipping coil, adopts the method preparation in claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510981125.1A CN105385109B (en) | 2015-12-23 | 2015-12-23 | A kind of composition epoxy resin and its purposes in dipping coil is prepared |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510981125.1A CN105385109B (en) | 2015-12-23 | 2015-12-23 | A kind of composition epoxy resin and its purposes in dipping coil is prepared |
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| CN105385109A true CN105385109A (en) | 2016-03-09 |
| CN105385109B CN105385109B (en) | 2017-12-29 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106130133A (en) * | 2016-08-19 | 2016-11-16 | 深圳市元征科技股份有限公司 | Wireless charging coil module and electronic product thereof |
| CN106782997A (en) * | 2016-11-28 | 2017-05-31 | 潍坊新力超导磁电科技有限公司 | A kind of superconducting coil and its manufacture method |
| CN111508699A (en) * | 2020-04-21 | 2020-08-07 | 东莞市南祥磁电科技有限公司 | Method for reprocessing magnetic core powder after compression molding |
| CN112917782A (en) * | 2021-01-28 | 2021-06-08 | 中国航发长春控制科技有限公司 | Precision valve control coil encapsulation mold and encapsulation process method |
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| CN101870798A (en) * | 2010-06-29 | 2010-10-27 | 北京玻钢院复合材料有限公司 | Epoxy resin dough moulding compound and preparation method thereof |
| CN103045143A (en) * | 2012-11-14 | 2013-04-17 | 浙江华正新材料股份有限公司 | Halogen-free epoxy adhesive and cover film prepared by using halogen-free epoxy adhesive |
| CN104044231A (en) * | 2014-05-14 | 2014-09-17 | 广州仑利奇合成树脂有限公司 | Non post cure epoxy resin casting system |
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2015
- 2015-12-23 CN CN201510981125.1A patent/CN105385109B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101870798A (en) * | 2010-06-29 | 2010-10-27 | 北京玻钢院复合材料有限公司 | Epoxy resin dough moulding compound and preparation method thereof |
| CN103045143A (en) * | 2012-11-14 | 2013-04-17 | 浙江华正新材料股份有限公司 | Halogen-free epoxy adhesive and cover film prepared by using halogen-free epoxy adhesive |
| CN104044231A (en) * | 2014-05-14 | 2014-09-17 | 广州仑利奇合成树脂有限公司 | Non post cure epoxy resin casting system |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106130133A (en) * | 2016-08-19 | 2016-11-16 | 深圳市元征科技股份有限公司 | Wireless charging coil module and electronic product thereof |
| CN106782997A (en) * | 2016-11-28 | 2017-05-31 | 潍坊新力超导磁电科技有限公司 | A kind of superconducting coil and its manufacture method |
| CN106782997B (en) * | 2016-11-28 | 2018-09-28 | 潍坊新力超导磁电科技有限公司 | A kind of superconducting coil and its manufacturing method |
| CN111508699A (en) * | 2020-04-21 | 2020-08-07 | 东莞市南祥磁电科技有限公司 | Method for reprocessing magnetic core powder after compression molding |
| CN111508699B (en) * | 2020-04-21 | 2022-06-10 | 东莞市南祥磁电科技有限公司 | Method for reprocessing magnetic core powder after compression molding |
| CN112917782A (en) * | 2021-01-28 | 2021-06-08 | 中国航发长春控制科技有限公司 | Precision valve control coil encapsulation mold and encapsulation process method |
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| CN105385109B (en) | 2017-12-29 |
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Effective date of registration: 20171204 Address after: 315400 Zhejiang city of Ningbo province Yuyao Ditang streets Huang Wan Village HD Applicant after: Yuyao Feite Plastics Co. Ltd. Address before: 315400 Xiao Lu Village, Simen Town, Yuyao City, Ningbo, Zhejiang Applicant before: Ningbo Compx Electrical Industrial Co., Ltd. |
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Effective date of registration: 20191104 Address after: No. 651, Hengxing Road, Puyuan Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee after: Zhejiang Joytech Electronics Co., Ltd. Address before: 315400 Gaoqing Bay, Huanghu Village, Lower Tang Street, Yuyao City, Ningbo City, Zhejiang Province Patentee before: Yuyao Feite Plastics Co. Ltd. |
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Address after: 314500 No. 651 Hengxing Road, Puyuan Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee after: Zhejiang Jiuyi Electronic Technology Co., Ltd Address before: No. 651, Hengxing Road, Puyuan Town, Tongxiang City, Jiaxing City, Zhejiang Province Patentee before: Zhejiang Joytech Electronics Co., Ltd. |
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