CN106883505A - 一种柔性半导电屏蔽料及其制备方法 - Google Patents
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Abstract
本发明提供一种柔性半导电屏蔽料及其制备方法,按照重量份数组成如下:EVA 70~90;SEBS 10~30;高导电炭黑30~40;抗氧剂0.5~1.5;交联剂DCP 1.0~2.0;交联助剂TAIC 1.5~3.0;固体石蜡1.0~2.5;其制备包括以下步骤:(1)在高温混合器中,将EVA与高导电炭黑、抗氧剂熔融混合均匀;(2)之后加入SEBS热塑性弹性体,熔融混合均匀;(3)最后加入固体石蜡、交联剂DCP和交联助剂TAIC,熔融混合均匀后,迅速从混合器中取出物料并冷却至室温。本发明的半导电屏蔽料具有柔性和半导电功能。
Description
技术领域
本发明涉及一种柔性半导电屏蔽料及其制备方法,具体地说,涉及一种通过多相体系的组份调控而获得具有柔性的半导电屏蔽料的制备方法,属于电缆屏蔽料的制备与性能研究。
背景技术
高分子半导电屏蔽料在电缆屏蔽领域应用十分广泛,通常在电缆的导体外围设置半导电屏蔽层来使电场分布均匀,提高电缆的电气强度和使用寿命。现有的交联聚乙烯电力电缆用内屏蔽料大多采用乙烯-醋酸乙烯共聚物(EVA)作为基础树脂,通过添加炭黑以及抗氧剂、润滑剂,经过挤出造粒后吸收过氧化物交联剂制备而成;为了使其具有较低的体积电阻率,常见的制备方法是在EVA基体中添加大量导电炭黑;但体系中的炭黑填充量过高,会使得复合体系硬化和脆化,导致力学性能的下降以及在电缆挤出时加工性能的恶化,使得屏蔽层表面粗糙,在高压电场条件下易导致电缆绝缘层击穿。如何在确保半导电屏蔽料具有半导电功能的同时,使其自身具有一定的柔软性,成为目前面临的难题。
本发明提供一种新的技术方案,对于以EVA基材的半导电屏蔽料,通过对多相体系的组份调控,在不提高导电材料含量的基础上,制备出具有柔性和良好加工性能的半导体屏蔽料。
发明内容
本发明针对在目前电力电缆用半导电屏蔽料的应用中,由于EVA基体中导电炭黑填充量过高而导致了半导电屏蔽料硬化脆化且加工性能下降的问题,制备了一种柔性电缆用半导电屏蔽料,进一步开发了半导电屏蔽料的产品品级,产物具有显著柔性。
本发明提供了一种柔性半导电屏蔽料及其制备方法,包括下列顺序步骤:
(1)通过熔融共混工艺,在115℃的高温混合器中,将EVA与高导电炭黑、抗氧剂混合均匀;
(2)将SEBS热塑性弹性体加入步骤(1)所获得的混合物中,继续熔融混合至均匀;
(3)最后将固体石蜡、交联剂DCP和交联助剂TAIC加入步骤(2)所获得的混合物中,熔融混合至均匀,之后迅速从混合器中取出物料并冷却至室温。
其中,按照重量份数组成如下:EVA 70~90;SEBS 10~30;高导电炭黑30~40;抗氧剂0.5~1.5;交联剂DCP 1.0~2.0;交联助剂TAIC 1.5~3.0;固体石蜡1.5~2.5。
在上述的技术方案中,EVA是半导电屏蔽料的基体材料,也就是产物的连续相;而SEBS热塑性弹性体、高导电炭黑、抗氧剂、交联剂、交联助剂和固体石蜡等,则在熔融共混过程中,成为产物的分散相,并与基体共同构成了多相复合体系。SEBS热塑性弹性体是以聚苯乙烯为末端段,以聚丁二烯加氢得到的乙烯-丁烯共聚物为中间弹性嵌段的线性嵌段共聚物;SEBS中的聚苯乙烯链段赋予其良好的加工流动性能,而聚丁二烯链段则赋予其良好的橡胶高弹性;SEBS不含不饱和双键,具有良好的稳定性和耐老化性。当SEBS与EVA的复合体系进行熔融共混时,由于SEBS与EVA之间只具有一定的相容性,因此在熔融共混过程中,两者不能达到分子级的分散水平,最终SEBS只能以分散相分散于EVA基体中;另一方面,由于SEBS自身为热塑性弹性体,具有良好的加工流动性,因而在熔融过程中,在剪切力作用下,SEBS可以在EVA基体中形成尺寸较小的分散相。以EVA基材的半导电屏蔽料中SEBS分散相的存在,可以对EVA基体起到了良好的增韧效果,并由此赋予了复合体系一定的柔性;而且,SEBS在EVA中的分散相尺寸较小,这样SEBS的存在就不会对EVA半导电连续相的导电性造成明显的阻碍效应。将EVA与高导电炭黑、抗氧剂混合均匀之后,再加入SEBS进行熔融共混,可以保证体系中高导电炭黑分散于EVA基体中,而较少扩散到SEBS相,这样在确保基体EVA连续相导电的同时,降低了导电材料在整个复合体系中的重量含量。可见,将SEBS熔融共混到EVA半导电屏蔽料,SEBS以小的分散相分散于EVA基体,显著提高了基体的韧性,赋予了复合体系的柔性;SEBS分散相的细化,则对EVA连续相的导电性影响较小,确保了复合体系的半导电功能。
本发明与现有技术相比,具有显著的积极效果和先进性:本发明的半导电屏蔽料中适量SEBS热塑性弹性体的引入,赋予了复合体系良好的柔性和良好的加工性能。
本发明制得的柔性半导电屏蔽料可用于高压电缆的内屏蔽料。
具体实施方式:下面的实施例是对本发明的进一步说明,而不是限制本发明的范围。
实施例1:柔性半导电屏蔽料的制备
(1)先将70.0克EVA粒子加入的115℃的转矩流变仪,转速为65rpm,之后加入30.0克高导电炭黑和0.5克抗氧剂1010,熔融共混6分钟;
(2)将30.0克SEBS加入(1)的混合物中,熔融共混3分钟;
(3)将1.0克交联剂DCP、1.5克交联助剂TAIC及1.0克固体石蜡加入(2)的混合物中,熔融共混3分钟,迅速从混合器中取出物料并冷却至室温;
(4)将样品放入垫有聚四氟乙烯隔离膜的不锈钢模具内,用平板硫化机在160℃温度下预热1min,在10MPa的压力下模压8min,之后在室温条件的平板硫化机上冷压定型,获得测试用片状样品。
邵A硬度的测试:采用LX-A型橡胶硬度计,按照GB/T531.1-2008,测试样品邵A硬度。
正温度系数效应的测定:将模压制备的长*宽*厚为110mm*50mm*2mm的测试样品置于程序控温的真空干燥箱中升温,用电线电缆半导电橡塑电阻测试仪测量并记录体积电阻率数据,根据测试数据计算从25℃到90℃度这一温度范围内的正温度系数效应,即PTC强度,即升温过程中90℃时材料的体积电阻率与室温25℃时材料的体积电阻率的比值的对数值。
通过熔融共混所制备出的柔性半导电屏蔽料的邵A硬度,以及其在室温25℃时的体积电阻率、90℃时的体积电阻率及正温度系数效应见表1。
实施例2:柔性半导电屏蔽料的制备
70.0克EVA;35.0克高导电炭黑;1.0克抗氧剂1010;20.0克SBS热塑性弹性体;1.5克交联剂DCP、2.5克交联助剂TAIC及1.5克固体石蜡。其余与实施1相同。
实施例3:柔性半导电屏蔽料的制备
80.0克EVA;40.0克高导电炭黑;1.5克抗氧剂1010;25.0克SEBS热塑性弹性体;2.0克交联剂DCP、3.0克交联助剂TAIC及2.5克固体石蜡。其余与实施1相同。
实施例4:柔性半导电屏蔽料的制备
90.0克EVA;40.0克高导电炭黑;1.0克抗氧剂1010;10.0克SEBS热塑性弹性体;1.5克交联剂DCP、2.5克交联助剂TAIC及2.0克固体石蜡。其余与实施1相同。
表1半导电屏蔽料的邵A硬度、25℃时体积电阻率、90℃时体积电阻率及正温度系数效应
在柔性半导电屏蔽料中,决定其柔性和半导电性的主要因素分别是SEBS热塑性弹性体的含量以及导电材料的含量。提高导电材料的用量,可适当降低室温下的体积电阻率,但同时降低了屏蔽料的柔性和加工流动性,且容易造成表层粗糙;适量的SEBS热塑性弹性体在半导电屏蔽料中的存在,会在赋予复合体系柔软性的同时,确保复合体系必要的加工性;另外,从表1可以看出,柔性半导电屏蔽料可以显著弱化正温度系数效应,这就保证半导电屏蔽料在电缆额定工作温度下也能保证较低的体积电阻率,有效提高了半导体屏蔽料的性能。
显然,本发明上述实施例仅仅是为清楚地说明本发明所做的举例,而并非是对本发明的实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无法对所有的实施方式予以穷举。凡是属于本发明的技术方案所引伸出的显而易见的变化或变动仍处于本发明的保护范围之列。
Claims (2)
1.一种柔性半导电屏蔽料及其制备方法,其特征在于,按照重量份数包括以下组成:
EVA 70~90;SEBS 10~30;高导电炭黑30~40;抗氧剂0.5~1.5;交联剂DCP 1.0~2.0;交联助剂TAIC 1.5~3.0;固体石蜡1.0~2.5。
2.根据权利要求1所述的一种柔性半导电屏蔽料及其制备方法,其特征在于:首先在115℃的高温混合器中,将EVA与高导电炭黑、抗氧剂熔融混合均匀;之后加入SEBS热塑性弹性体,熔融混合均匀;最后加入固体石蜡、交联剂DCP和交联助剂TAIC,熔融混合均匀后,迅速从混合器中取出物料并冷却至室温。
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---|---|---|---|---|
CN110078990A (zh) * | 2019-04-01 | 2019-08-02 | 青岛科技大学 | 一种磁性复合高压直流电缆半导电屏蔽层及其制备方法 |
CN111454533A (zh) * | 2020-04-09 | 2020-07-28 | 东莞讯滔电子有限公司 | 一种导电塑胶及其应用 |
CN113621249A (zh) * | 2021-08-24 | 2021-11-09 | 浙江鼎富橡塑科技有限公司 | 一种防异响的tpe防尘套及其生产工艺 |
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Non-Patent Citations (2)
Title |
---|
张书华 等编著: "《高性能电缆材料及其应用技术》", 30 November 2015, 上海交通大学出版社 * |
王灿灿: "《功能型EVA/SBR TPV及EVA/EVM TPV的结构与性能》", 《青岛科技大学硕士论文》 * |
Cited By (5)
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CN110078990A (zh) * | 2019-04-01 | 2019-08-02 | 青岛科技大学 | 一种磁性复合高压直流电缆半导电屏蔽层及其制备方法 |
CN111454533A (zh) * | 2020-04-09 | 2020-07-28 | 东莞讯滔电子有限公司 | 一种导电塑胶及其应用 |
US11665873B2 (en) | 2020-04-09 | 2023-05-30 | Dongguan Luxshare Precision Industry Co. Ltd. | Conductive plastic and application thereof |
CN113621249A (zh) * | 2021-08-24 | 2021-11-09 | 浙江鼎富橡塑科技有限公司 | 一种防异响的tpe防尘套及其生产工艺 |
CN113621249B (zh) * | 2021-08-24 | 2022-07-26 | 浙江鼎富橡塑科技有限公司 | 一种防异响的tpe防尘套及其生产工艺 |
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