CN106847738A - 一种晶圆夹紧装置 - Google Patents

一种晶圆夹紧装置 Download PDF

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CN106847738A
CN106847738A CN201710039066.5A CN201710039066A CN106847738A CN 106847738 A CN106847738 A CN 106847738A CN 201710039066 A CN201710039066 A CN 201710039066A CN 106847738 A CN106847738 A CN 106847738A
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wafer
fix bar
activity folder
lead column
clamping device
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舒福璋
史霄
熊朋
陶利权
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Beijing Semiconductor Equipment Institute
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Beijing Semiconductor Equipment Institute
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

本发明公开了一种晶圆夹紧装置，应用于化学机械抛光后清洗设备技术领域，其包括由固定盘及固定杆构成的转盘，导向柱及活动夹；固定盘位于转盘的中心，固定杆设置在固定盘的周围；导向柱固定在固定杆的端部，活动夹铰接于固定杆的端部，晶圆放置在导向柱上；活动夹上设置有弹性装置，弹性装置推动活动夹沿铰接处旋转，周向夹紧放置在导向柱上的晶圆；工作时，驱动单元与转盘连接并带动转盘旋转，即而夹紧在导向柱上的晶圆旋转，以完成晶圆的清洗。本发明提供的一种晶圆夹紧装置，其结构合理，安装快捷，固定可靠；主体采用圆弧形结构，减少空气流阻，降低晶圆的振动频率，提高晶圆的颗粒度，保证晶圆加工质量。

Description

一种晶圆夹紧装置
技术领域
本发明涉及化学机械抛光后清洗设备技术领域，尤其涉及一种晶圆夹紧设备。
背景技术
在晶圆加工中，需要化学机械抛光处理（Chemical Mechanical Polishing，CMP）。抛光处理后的晶圆需要进行清洗作业。在晶圆清洗工序中，需要对晶圆进行固定。
目前在旋转清洗干燥工艺环节中，晶圆固定装置的结构一般比较复杂，尤其高速旋转时，晶圆受到空气扰动，产生振动，影响晶圆洁净度，影响应用加工质量。
因此，亟需设计一种结构合理的晶圆夹紧装置，安装快捷，固定可靠，减少空气流阻，降低晶圆的振动频率，提高晶圆的颗粒度，保证晶圆加工质量。
发明内容
本发明提供的一种晶圆夹紧装置，应用于化学机械抛光后清洗设备技术领域，其结构合理，安装、拆卸快捷，减少空气流阻，降低晶圆的振动频率，提高晶圆的颗粒度。
本发明的技术方案：
为解决上述技术问题，本发明提供一种晶圆夹紧装置，包括由固定盘及固定杆构成的转盘，导向柱及活动夹。
固定盘位于转盘的中心，固定杆设置在固定盘的周围；导向柱固定在固定杆的端部，活动夹铰接于固定杆的端部，晶圆放置在导向柱上；活动夹上设置有弹性装置，弹性装置推动活动夹沿铰接处旋转，周向夹紧放置在导向柱上的晶圆。
进一步地，所述导向柱上设置有导向斜面和台阶，用于晶圆的导向与限位。晶圆沿导向斜面向下，由台阶限制晶圆的纵向位移。
进一步地，活动夹包括夹板及立柱，立柱上设置有导向孔，弹性装置设置在立柱的导向孔内；弹性装置与固定杆连接，推动活动夹沿铰接处转动，夹紧放置在导向柱上的晶圆。通过弹性装置，实现活动夹的开合，对放置在导向柱上的晶圆的夹紧与松开。
进一步地，所述弹性装置包括调节杆及压簧，压簧套在调节杆的外侧，调节杆及压簧的组件安装在导向孔内；弹性装置结构合理，调节灵活，通过调节压簧的压缩量，可以实现对晶圆夹紧力的调整，具有较强的适用性。
进一步地，所述固定杆的数量至少三个，其均布在固定盘的周围，这样设置在固定杆上的导向柱对晶圆定心，并均匀夹紧，有效保证晶圆夹紧的可靠性。
进一步地，所述固定杆及其与固定盘的连接处为圆弧形结构，圆弧形结构有利于减少空气流阻，降低晶圆旋转时产生的振动，提高晶圆颗粒度。
进一步地，所述活动夹通过转轴与固定杆铰接，以实现活动夹的灵活开合。
本发明有益效果：
本发明提供的一种晶圆夹紧装置，应用于化学机械抛光后清洗设备技术领域，其结构合理，有效解决了现场存在的问题，产生以下技术效果：
（1）本申请所述晶圆夹紧装置，固定杆及其对应的活动夹的数量至少三个，且沿固定盘圆周均匀排列，有效保证了夹紧的可靠性；
（2）本申请所述晶圆夹紧装置，采用具有弹性装置的活动夹，晶圆安装、拆卸便捷，提高加工效率；
（3）本申请所述晶圆夹紧装置的主体结构采用圆弧形结构，有效减少空气流阻，降低晶圆旋转时产生的振动，提高晶圆颗粒度。
附图说明
图1是本发明的轴测图；
图2是本发明的剖视图；
图3是本发明之转盘的轴测图；
图4是本发明之导向柱的结构示意图；
图5是本发明之活动夹的结构示意图；
图6是本发明的应用实施例；
图7是图6的局部放大图。
其中：
1.转盘；1a.固定盘；1b.固定杆；2.导向柱；2a.导向斜面；2b.台阶；3.活动夹；3a.夹板；3b.立柱；4.转轴；5.调节杆；6.压簧；7.晶圆。
具体实施方式
下面结合具体实施例和附图对本发明的一种晶圆夹紧装置进行详细说明：
图1至图7是本申请所述的一种晶圆夹紧装置的相关示意图。
图1是一种晶圆夹紧装置的轴测图，其包括转盘1，导向柱2及活动夹3。图2是本发明的剖视图，通过剖视图可以清晰的表示各个部件的连接及位置关系。
转盘1的结构示意图，如图3所示，其包括固定盘1a及固定杆1b，固定盘1a位于转盘1的中心，固定杆1b设置在固定盘1a的周围，其直接或间接的与驱动单元连接。
导向柱2固定在固定杆1b的端部，活动夹3铰接于固定杆1b的端部，晶圆7放置在导向柱2上，活动夹3上设置有弹性装置，弹性装置推动活动夹3沿铰接处旋转，周向夹紧放置在导向柱2上的晶圆7（图6示出）。
图4是本发明之导向柱的结构示意图，导向柱2上设置有导向斜面2a及台阶2b，晶圆7沿导向斜面2a向下，由台阶2b限制晶圆7的纵向位移；所述固定杆1b的数量至少三个，其均布在固定盘1a的周围。在图6所示的实施例中，固定杆1b的数量为四个，固定杆1b呈十字形固定在固定盘1a上（如图3所示）。这样设置在固定杆上的导向柱对晶圆定心，并均匀夹紧，有效保证晶圆夹紧的可靠性。
本发明之活动夹的结构示意图，如图5所示。活动夹3包括夹板3a及立柱3b，立柱3b上设置有导向孔，弹性装置设置在立柱3b的导向孔内；弹性装置与固定杆1b连接，推动活动夹3沿铰接处转动，夹紧放置在导向柱2上的晶圆7。
图7是图6的局部放大图，所述弹性装置包括调节杆5及压簧6，压簧6套在调节杆5的外侧，调节杆5及压簧6的组件安装在导向孔内，螺母拧在活动夹3上，以压紧压簧6。本发明所述的弹性装置结构合理，调节灵活，通过调节压簧6的压缩量，可以实现对晶圆夹紧力的调整，具有较强的适用性。
在本发明中，所述固定杆1b及其与固定盘1a的连接处为圆弧形结构，圆弧形结构有利于减少空气流阻，降低晶圆旋转时产生的振动，提高晶圆颗粒度。
下面结合图6所示实施例，描述晶圆夹紧装置的具体使用步骤。
首先，晶圆7经过化学机械抛光处理后，活动夹3上的立柱3b被推动装置推动，活动夹3上部的夹板3a打开；
接着，将晶圆7沿着导向柱2上的导向斜面2a下落，然后水平搁在导向柱2上的台阶2b上；
最后，脱开推动装置，在压簧6的作用下，活动夹3上的夹板3a向中心夹紧，将晶圆7夹紧。
本发明提供的一种晶圆夹紧装置，应用于化学机械抛光后清洗设备技术领域，其结构合理，安装快捷，固定可靠；主体采用圆弧形结构，减少空气流阻，降低晶圆的振动频率，提高晶圆的颗粒度，保证晶圆加工质量。
本发明不局限于上述实施方式，任何人在本发明的启示下都可得出其他各种形式的产品，但不论在其形状或结构上作任何变化，凡是具有与本申请相同或相近似的技术方案，均落在本发明的保护范围之内。

Claims (7)

1.一种晶圆夹紧装置，其特征在于，包括由固定盘（1a）及固定杆（1b）构成的转盘（1），导向柱（2）及活动夹（3）；固定盘（1a）位于转盘（1）的中心，固定杆（1b）设置在固定盘（1a）的周围；导向柱（2）固定在固定杆（1b）的端部，活动夹（3）铰接于固定杆（1b）的端部，晶圆（7）放置在导向柱（2）上；活动夹（3）上设置有弹性装置，弹性装置推动活动夹（3）沿铰接处旋转，周向夹紧放置在导向柱（2）上的晶圆（7）。
2.根据权利要求1所述晶圆夹紧装置，其特征在于，所述导向柱（2）上设置有导向斜面（2a）和台阶（2b），晶圆（7）沿导向斜面（2a）向下，由台阶（2b）限制晶圆（7）的纵向位移。
3.根据权利要求1所述晶圆夹紧装置，其特征在于，所述活动夹（3）包括夹板（3a）及立柱（3b），立柱（3b）上设置有导向孔，弹性装置设置在立柱（3b）的导向孔内；弹性装置与固定杆（1b）连接，推动活动夹（3）沿铰接处转动，夹紧放置在导向柱（2）上的晶圆（7）。
4.根据权利要求3所述晶圆夹紧装置，其特征在于，所述弹性装置包括调节杆（5）及压簧（6），压簧（6）套在调节杆（5）的外侧，调节杆（5）及压簧（6）的组件安装在立柱（3b）的导向孔内。
5.根据权利要求1所述晶圆夹紧装置，其特征在于，所述固定杆（1b）的数量至少三个，其均布在固定盘（1a）的周围。
6.根据权利要求5所述晶圆夹紧装置，其特征在于，所述固定杆（1b）及其与固定盘（1a）的连接处为圆弧形结构。
7.根据权利要求1所述晶圆夹紧装置，其特征在于，所述活动夹（3）通过转轴（4）与固定杆（1b）铰接。
CN201710039066.5A 2017-01-19 2017-01-19 一种晶圆夹紧装置 Pending CN106847738A (zh)

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Cited By (7)

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CN109119362A (zh) * 2018-07-23 2019-01-01 上海集成电路研发中心有限公司 一种用于高温离子注入的加热装置和加热方法
CN109029335A (zh) * 2018-09-12 2018-12-18 江苏英锐半导体有限公司 一种晶圆流片表面平整度检测装置
CN109732473A (zh) * 2019-01-11 2019-05-10 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶圆载片台及晶圆装卸机构
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CN114291786A (zh) * 2021-12-29 2022-04-08 杭州电子科技大学 一种磁场与振动结合的硅片微纳米结构制备装置

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Application publication date: 20170613