CN106825821A - Pcb电子元件拆除装置 - Google Patents
Pcb电子元件拆除装置 Download PDFInfo
- Publication number
- CN106825821A CN106825821A CN201710062895.5A CN201710062895A CN106825821A CN 106825821 A CN106825821 A CN 106825821A CN 201710062895 A CN201710062895 A CN 201710062895A CN 106825821 A CN106825821 A CN 106825821A
- Authority
- CN
- China
- Prior art keywords
- bell
- flue
- mouth
- tin
- tin melt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 88
- 238000005192 partition Methods 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims description 3
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 210000000941 bile Anatomy 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710062895.5A CN106825821B (zh) | 2017-01-24 | 2017-01-24 | Pcb电子元件拆除装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710062895.5A CN106825821B (zh) | 2017-01-24 | 2017-01-24 | Pcb电子元件拆除装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106825821A true CN106825821A (zh) | 2017-06-13 |
CN106825821B CN106825821B (zh) | 2019-07-12 |
Family
ID=59121305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710062895.5A Active CN106825821B (zh) | 2017-01-24 | 2017-01-24 | Pcb电子元件拆除装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106825821B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115070156A (zh) * | 2021-08-11 | 2022-09-20 | 结诚电子(上海)有限公司 | 一种焊接治具及焊接方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2520984Y (zh) * | 2001-12-21 | 2002-11-20 | 姚世伟 | 具焊接与修补功能的小型焊锡炉 |
CN201120512Y (zh) * | 2007-11-14 | 2008-09-24 | 中兴通讯股份有限公司 | 一种拆卸堆叠封装器件的装置 |
CN101695705A (zh) * | 2009-10-28 | 2010-04-21 | 合肥工业大学 | 可产业化实施废旧电路板元器件整体拆除的设备 |
CN102371412A (zh) * | 2011-11-16 | 2012-03-14 | 苏州伟翔电子废弃物处理技术有限公司 | 废电路板电子元器件及焊锡的脱除装置和方法 |
JP2014112597A (ja) * | 2012-12-05 | 2014-06-19 | Mitsubishi Electric Corp | リフローはんだ付け方法およびリフロー炉 |
CN104526099A (zh) * | 2014-12-31 | 2015-04-22 | 南京信息职业技术学院 | 一种用于拆卸线路板器件的装置 |
CN105834542A (zh) * | 2015-01-13 | 2016-08-10 | 中国人民解放军军械工程学院 | 一种双列直插封装芯片拆卸装置 |
CN206689569U (zh) * | 2017-01-24 | 2017-12-01 | 安徽锐能科技有限公司 | Pcb电子元件拆除装置 |
-
2017
- 2017-01-24 CN CN201710062895.5A patent/CN106825821B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2520984Y (zh) * | 2001-12-21 | 2002-11-20 | 姚世伟 | 具焊接与修补功能的小型焊锡炉 |
CN201120512Y (zh) * | 2007-11-14 | 2008-09-24 | 中兴通讯股份有限公司 | 一种拆卸堆叠封装器件的装置 |
CN101695705A (zh) * | 2009-10-28 | 2010-04-21 | 合肥工业大学 | 可产业化实施废旧电路板元器件整体拆除的设备 |
CN102371412A (zh) * | 2011-11-16 | 2012-03-14 | 苏州伟翔电子废弃物处理技术有限公司 | 废电路板电子元器件及焊锡的脱除装置和方法 |
JP2014112597A (ja) * | 2012-12-05 | 2014-06-19 | Mitsubishi Electric Corp | リフローはんだ付け方法およびリフロー炉 |
CN104526099A (zh) * | 2014-12-31 | 2015-04-22 | 南京信息职业技术学院 | 一种用于拆卸线路板器件的装置 |
CN105834542A (zh) * | 2015-01-13 | 2016-08-10 | 中国人民解放军军械工程学院 | 一种双列直插封装芯片拆卸装置 |
CN206689569U (zh) * | 2017-01-24 | 2017-12-01 | 安徽锐能科技有限公司 | Pcb电子元件拆除装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115070156A (zh) * | 2021-08-11 | 2022-09-20 | 结诚电子(上海)有限公司 | 一种焊接治具及焊接方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106825821B (zh) | 2019-07-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: PCB electronic component removal device Effective date of registration: 20220506 Granted publication date: 20190712 Pledgee: China Construction Bank Corporation Hefei Shushan sub branch Pledgor: ANHUI RNTEC TECHNOLOGY Co.,Ltd. Registration number: Y2022980004761 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20190712 Pledgee: China Construction Bank Corporation Hefei Shushan sub branch Pledgor: ANHUI RNTEC TECHNOLOGY Co.,Ltd. Registration number: Y2022980004761 |