CN106816502A - 一种led芯片、led发光基板、显示装置及彩色显示控制方法 - Google Patents

一种led芯片、led发光基板、显示装置及彩色显示控制方法 Download PDF

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CN106816502A
CN106816502A CN201710238220.1A CN201710238220A CN106816502A CN 106816502 A CN106816502 A CN 106816502A CN 201710238220 A CN201710238220 A CN 201710238220A CN 106816502 A CN106816502 A CN 106816502A
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led chip
led
electric current
light
unit
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CN106816502B (zh
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王慧娟
王美丽
吕振华
王飞
杨泽洲
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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Priority to US16/063,336 priority patent/US11430913B2/en
Priority to PCT/CN2017/114888 priority patent/WO2018188360A1/zh
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    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
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Abstract

本发明实施例提供一种LED芯片、LED发光基板、显示装置及彩色显示控制方法,涉及LED显示技术领域,能够解决现有的用于彩色显示的Micro LED的制作和转移工艺的难度较高的问题。包括:N型半导体层、量子阱层和P型半导体层。量子阱层的材料包括氮化铟镓,其中,铟原子在氮化铟镓中的摩尔比大于等于0.3。通过选用氮化铟镓作为LED芯片中量子阱层的主要材料,且其中铟原子在氮化铟镓中的摩尔比大于等于0.3,这样一来,在将LED芯片制作的发光基板应用于显示装置中时,能够通过调整输入LED芯片的电流控制LED芯片发光侧发出光线所显示出的颜色,从而实现应用于显示装置时的彩色显示。

Description

一种LED芯片、LED发光基板、显示装置及彩色显示控制方法
技术领域
本发明涉及LED显示技术领域,尤其涉及一种LED芯片、LED发光基板、显示装置及彩色显示控制方法。
背景技术
LED(Light Emitting Diode,发光二极管)属于半导体二极管的一种,是一种依靠半导体PN结的单向导电性发光的光电元件,LED是目前世界范围市场上广泛使用的照明元件,具有体积小,亮度高,耗电量低,发热少,使用寿命长,环保等优点,并且具有丰富多彩的颜色种类,深受消费者的喜爱。
LED芯片作为背光源在手机,电视机等需要背光显示的电子产品中发挥着不可或缺的作用。随着电子产品尺寸的不断缩小,需要LED芯片的尺寸也能够大幅减小,以在较小的尺寸范围内实现更强更稳定的显示亮度。
Micro LED(微LED)即LED芯片微缩化和矩阵化技术。指的是在一个芯片上集成高密度微小尺寸的LED芯片阵列,其中每一个LED芯片可定址、单独驱动点亮,能够将相邻两个LED芯片的像素点距离从毫米级降低至微米级,提高显示效果,同时,Micro LED还具有节能高效、解析度高、体积小、薄型化等优点。Micro LED需要在一片显示面板的尺寸范围内嵌入数百万颗LED芯片,LED芯片的外延结构通常需要在衬底材料(如蓝宝石衬底)上生长完成,再切割剥离后转移至驱动基板上,尤其是对于RGB三色彩色显示的显示面板而言,用于形成R、G、B三种颜色的LED所用的材料不同,其需要首先在不同的晶圆上生长以形成不同的外延结构,再分别转移至驱动基板上,不同材料制作的LED芯片需要单独制作,并分次对应转移设置在与R、G、B亚像素单元对应的位置,使得LED制作和转移工艺的难度增大,阻碍了量产效率的提高。
发明内容
本发明实施例提供一种LED芯片组及其彩色显示控制方法、显示装置,能够解决现有的用于彩色显示的Micro LED的制作和转移工艺的难度较高的问题。
为达到上述目的,本发明的实施例采用如下技术方案:
本发明实施例的一方面,提供一种LED芯片,包括:N型半导体层、量子阱层和P型半导体层。量子阱层的材料包括氮化铟镓,其中,铟原子在氮化铟镓中的摩尔比大于等于0.3。
优选的,铟原子在氮化铟镓中的摩尔比为0.4。
进一步的,本发明实施例的LED芯片,还包括衬底层,衬底层上设置有缓冲层,N型半导体层、量子阱层和P型半导体层设置在缓冲层上。
本发明实施例的另一方面,提供一种LED发光基板,包括多个上述任一项的LED芯片,还包括线路板,线路板包括衬底基板以及设置在衬底基板上的驱动电路,LED芯片设置在线路板上。
优选的,线路板包括CMOS基板或TFT基板。
本发明实施例的再一方面,提供一种显示装置,包括上述任一项的LED发光基板,LED发光基板上的每一个LED芯片对应设置在每一个亚像素单元内,LED发光基板的驱动电路用于向各LED芯片传输电流,以使得LED芯片发出相应波长的光。
优选的,本发明实施例的显示装置,包括至少三种原色亚像素,其中包括蓝色亚像素,在对应每一个蓝色亚像素单元的LED芯片的出光侧设置有蓝色滤光层。
优选的,至少三种原色亚像素中还包括红色亚像素和绿色亚像素,在对应每一个红色亚像素单元的LED芯片的出光侧设置有红色滤光层,在对应每一个绿色亚像素单元的LED芯片的出光侧设置有绿色滤光层。
进一步的,在本发明实施例的显示装置中,还包括在LED发光基板出光方向依次设置的下偏光单元、液晶层和上偏光单元,其中,下偏光单元的透过轴方向与上偏光单元的透过轴方向相互垂直或平行。
优选的,下偏光单元和/或上偏光单元为金属线栅。
优选的,下偏光单元为金属线栅时,金属线栅设置在每一个LED芯片的出光侧。
本发明实施例的又一方面,提供一种使用上述权利要求7-11任意一项的显示装置实现彩色显示的控制方法,包括:向对应设置在红色亚像素单元的LED芯片输入第一电流,第一电流的电流值范围小于0.1mA;向对应设置在绿色亚像素单元的LED芯片输入第二电流,第二电流的电流值范围在25mA至100mA之间;向对应设置在蓝色亚像素单元的LED芯片输入第三电流,第三电流的电流值大于0.5mA。
优选的,第一电流的电流值为0.1mA;第二电流的电流值为60mA;第三电流的电流值为8mA。
优选的,白平衡条件下,第一电流的占空比与第二电流的占空比以及第三电流的占空比之间的比值为120:1:4。
本发明实施例提供一种LED芯片、LED发光基板、显示装置及彩色显示控制方法,包括:N型半导体层、量子阱层和P型半导体层。量子阱层的材料包括氮化铟镓,其中,铟原子在氮化铟镓中的摩尔比大于等于0.3。通过选用氮化铟镓作为LED芯片中量子阱层的主要材料,且其中铟原子在氮化铟镓中的摩尔比大于等于0.3,这样一来,在将LED芯片制作的发光基板应用于显示装置中时,能够通过调整输入LED芯片的电流控制LED芯片发光侧发出光线所显示出的颜色,从而实现应用于显示装置时的彩色显示。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的一种LED芯片的层级结构示意图;
图2为本发明实施例提供的一种LED芯片中,发射光的波长随输入的驱动电流的变化而变化的光谱图;
图3为本发明实施例提供的一种LED发光基板的结构示意图;
图4为本发明实施例提供的一种显示装置的结构示意图;
图5为本发明实施例提供的一种显示装置中,一个像素单元内,对应蓝色亚像素单元的LED芯片出光侧设置有蓝色滤光层的结构示意图;
图6为本发明实施例提供的一种显示装置中,一个像素单元内,对应红色亚像素单元和对应绿色亚像素单元的LED芯片出光侧分别还设置有红色滤光层和绿色滤光层的结构示意图;
图7为本发明实施例提供的一种显示装置中还包括有下偏光单元、液晶层和上偏光单元的结构示意图之一;
图8为本发明实施例提供的一种显示装置中还包括有下偏光单元、液晶层和上偏光单元的结构示意图之二;
图9为本发明实施例提供的一种实现彩色显示的控制方法的流程图;
图10为本发明实施例提供的一种实现彩色显示的控制方法中,第一电流的占空比、第二电流的占空比与第三电流占空比的一种设置示意图。
附图标记:
10-N型半导体层;11-下偏光单元;12-上偏光单元;13-液晶层;20-量子阱层;30-P型半导体层;40-衬底层;50-缓冲层;60-LED芯片;70-线路板;80-LED发光基板;91-蓝色滤光层;92-红色滤光层;93-绿色滤光层;A-亚像素单元;A1-蓝色亚像素单元;A2-红色亚像素单元;A3-绿色亚像素单元。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明实施例提供一种LED芯片,如图1所示,包括:N型半导体层10、量子阱层20和P型半导体层30。量子阱层20的材料包括氮化铟镓,其中,铟原子在氮化铟镓中的摩尔比大于等于0.3。
LED(发光二极管)主要是由PN结组成,具有单向导电性,其发光原理为:向LED加正向电压后,从P区注入到N区的空穴和由N区注入到P区的电子,在PN结附近数微米内分别与N区的电子和P区的空穴复合,电子和空穴消失的同时产生光子,即产生了自发辐射的荧光。不同的半导体材料中电子和空穴所处的能量状态(带隙)不同。当电子和空穴复合时释放出的能量多少不同,电子和空穴之间的能量越大,产生的光子的能量就越高。光子的能量反过来与光的颜色对应,由于不同的材料具有不同的带隙,从而能够发出不同颜色的光。LED芯片是一种固态的半导体器件,其能够实现LED的发光显示。
需要说明的是,第一,本发明实施例的LED芯片,对于N型半导体层10、量子阱层20和P型半导体层30的形成顺序不做限定,可以为如图1所示,由下向上依次为N型半导体层10、量子阱层20和P型半导体层30的结构,也可以为由下向上依次为P型半导体层30、量子阱层20和N型半导体层10的结构均可。本领域技术人员可以根据具体使用要求进行设置。
第二,对于使用氮化铟镓材料且铟原子在氮化铟镓中的摩尔比大于等于0.3的量子阱层20,其量子阱层20中铟原子在氮化铟镓中的摩尔比较高,使用这种材料的量子阱层20制作而成的LED芯片在通入驱动电流时,当调整驱动电流的电流值由低逐渐增高,LED芯片发光侧发射的光会产生蓝移现象,发射光波长随着驱动电流的增大而逐渐变小,即显示光的颜色由红色逐渐向绿色变化。
本发明实施例提供一种LED芯片,包括:N型半导体层、量子阱层和P型半导体层。量子阱层的材料包括氮化铟镓,其中,铟原子在氮化铟镓中的摩尔比大于等于0.3。通过选用氮化铟镓作为LED芯片中量子阱层的主要材料,且其中铟原子在氮化铟镓中的摩尔比大于等于0.3,这样一来,在将LED芯片制作的发光基板应用于显示装置中时,能够通过调整输入LED芯片的电流值的大小,来控制LED芯片发光侧发出光线所显示出的颜色,从而实现应用于显示装置时的彩色显示。
优选的,在本发明实施例的LED芯片中,量子阱层20内铟原子在氮化铟镓中的摩尔比为0.4。
对于使用氮化铟镓材料且铟原子在氮化铟镓中的摩尔比为0.4的量子阱层20,制作而成的LED芯片在通入驱动电流时,如图2所示,为其发射光的波长随驱动电流增加而变化的光谱图。如图2中虚线箭头所示,当驱动电流由0.1mA逐渐增至60mA时,发射光产生蓝移现象,发射光波长随着驱动电流的增大而逐渐变小(如图2中所示,光波长由600nm移动至550nm),显示光的颜色由红色逐渐变为绿色。
进一步的,如图1所示,本发明实施例的LED芯片,还包括衬底层40,衬底层40上设置有缓冲层50,N型半导体层10、量子阱层20和P型半导体层30设置在缓冲层50上。
衬底层40通常在以下三种材料中选取:蓝宝石(Al2O3)、硅(Si)或碳化硅(SiC)。以蓝宝石(Al2O3)材料制作的衬底层40为例,在衬底层40上首先形成缓冲层50,然后再在缓冲层50上形成N型半导体层10、量子阱层20和P型半导体层30,形成上述的外延结构时,通常采用金属有机物化学气相沉积(Metal-Organic Chemical Vapor Deposition,简称MOCVD)的方式,或者也可以采用其他制作方式,本发明实施例中对此制作方式不作限定。
本发明实施例的另一方面,提供一种LED发光基板,包括多个上述任一项的LED芯片60,如图3所示,包括3个上述任一项的LED芯片60,还包括线路板70,线路板70包括衬底基板以及设置在衬底基板上的驱动电路,LED芯片60设置在线路板70上。
线路板70包括衬底基板以及设置在衬底基板上的驱动电路,LED芯片60设置在线路板70上,通过线路板70上的驱动电路向LED芯片60输入驱动电流,以控制LED芯片60的发光。
需要说明的是,本发明实施例的LED芯片60应用于Micro LED(微LED)中,LED芯片60以高密度微小尺寸集成为芯片阵列,当每一个LED芯片60在小于50微米的尺寸时,由于每一个LED芯片60的尺寸过小,在将LED芯片60剥离并转移线路板70时,在缓冲层50位置处进行剥离,剥离后的LED芯片60转移至线路板70上,与对应的驱动电路相连通,在缓冲层50处进行剥离,能够保护缓冲层50以上的芯片结构不在剥离的过程中受到破坏。转移至线路板70上的LED芯片60不包括衬底层40。当每一个LED芯片60在100微米以上的尺寸时,如图3所示,通常会包括一部分厚度的衬底层40一起切割后,将带有衬底层40的LED芯片60转移至线路板70上与对应的驱动电路相连通,带有衬底层40的LED芯片60在连接驱动电路发光时功能实现更加稳定。
优选的,线路板70包括CMOS基板或TFT基板。
例如,本发明实施例的LED发光基板应用于OLED显示装置中时,线路板70为TFT基板,在衬底基板上通过成膜、显影、剥离、曝光、刻蚀等工艺制作各层级结构以形成TFT基板,将LED芯片60剥离后转移至TFT基板上,通过TFT基板上制作的驱动电路向LED芯片60输入驱动电流。
本发明实施例的再一方面,提供一种显示装置,如图4所示,包括上述任一项的LED发光基板80,LED发光基板80上的每一个LED芯片60对应设置在每一个亚像素单元A内,LED发光基板80的驱动电路用于向各LED芯片60传输电流,以使得LED芯片60发出相应波长的光。
例如,如图4所示,在显示装置中,LED发光基板80的线路板70为TFT基板,在TFT基板上通过横纵交叉的栅线(如图4中G1、G2、G3、G4…)和数据线(如图4中D1、D2、D3、D4…)界定出多个亚像素单元A,LED发光基板80上的每一个LED芯片60对应设置在每一个亚像素单元A内,TFT基板上的驱动电路可以扫描的方式单独定址控制每一个LED芯片60,向对应设置在不同的亚像素单元A内的LED芯片60中输入驱动电流,该驱动电流的电流值可以相同也可以不同,每一个LED芯片60根据输入的驱动电流,发出相应波长的光,从而能够在每一个亚像素单元A内设置的LED芯片60的结构均相同的情况下,通过调整向每一个LED芯片60输入的驱动电流的电流值,控制显示装置以实现彩色显示。
优选的,本发明实施例的显示装置,如图5所示,包括至少三种原色亚像素,其中包括蓝色亚像素,在对应每一个蓝色亚像素单元A1的LED芯片60的出光侧设置有蓝色滤光层91。
由于本发明实施例的LED芯片60的光谱中始终包含有蓝光,在对应每一个蓝色亚像素单元A1的LED芯片60的出光侧设置蓝色滤光层91,向对应蓝色亚像素单元A1的LED芯片60输入如图2所示的光谱范围内的任意电流值后使得LED芯片60发光,发出的光线经过蓝色滤光层91的滤光作用后,使得对应蓝色亚像素单元A1的LED芯片60最终向外发出蓝色光线,而发出其他颜色的光线均被蓝色滤光层91阻挡。
这样一来,通过控制向LED芯片60输入低电流值(如图2所示,输入电流0.1mA)使得LED芯片60能够发射红光,通过控制向LED芯片60输入较高电流值(如图2所示,输入电流60mA)使得LED芯片60能够发射绿光,并且,通过蓝色滤光层91的滤光作用,使得LED芯片60的出光侧能够最终显示为蓝光,从而能够通过对相同的LED芯片60输入不同大小的电流值或增加滤光层等方式实现红、绿、蓝三种原色的分别显示,进而能够使得本发明实施例的显示装置实现全彩色的显示效果。
优选的,如图6所示,至少三种原色亚像素中还包括红色亚像素和绿色亚像素,在对应每一个红色亚像素单元A2的LED芯片60的出光侧设置有红色滤光层92,在对应每一个绿色亚像素单元A3的LED芯片60的出光侧设置有绿色滤光层93。
例如,如图6所示,显示装置中的每一个像素单元中包括有红色亚像素单元A2、绿色亚像素单元A3和蓝色亚像素单元A1,对应设置在每一个红色亚像素单元A2内的LED芯片60的出光侧发出红色光,对应设置在每一个绿色亚像素单元A3内的LED芯片60的出光侧发出绿色光,对应设置在每一个蓝色亚像素单元A1内的LED芯片60的出光侧通过蓝色滤光层91后显示为蓝色光。通过对每一个像素单元内的红色亚像素单元A2、绿色亚像素单元A3和蓝色亚像素单元A1的发光控制,能够在显示装置上显示出所需的彩色画面。由于LED芯片60的光谱中始终包含有蓝光,这就可能导致红色亚像素单元A2内发出的红光和绿色亚像素单元A3内发出的绿光纯度较差,从而影响显示装置的彩色显示效果,因此,如图6所示,在对应每一个红色亚像素单元A2的LED芯片60的出光侧设置红色滤光层92,对红色亚像素单元A2内除红光以外的光线进行阻挡,同样的,在对应每一个绿色亚像素单元A3的LED芯片60的出光侧设置绿色滤光层93,对绿色亚像素单元A3内除绿光以外的光线进行阻挡,这样一来,就能够提高每一个亚像素单元A中发出的光线的纯度,进而提高显示装置的彩色显示效果。
还需要说明的是,本发明实施例的显示装置中,所述的蓝色滤光层91、红色滤光层92以及绿色滤光层93可以为滤光片,也可以为其他能够实现使特定波长的光线通过、其他波长的光线被阻挡的效果的材料和形式,本发明实施例中对此不作具体限定。
进一步的,在本发明实施例的显示装置中,当所述的显示装置为液晶显示装置时,如图7所示,还包括在LED发光基板80出光方向依次设置的下偏光单元11、液晶层13和上偏光单元12,其中,下偏光单元11的透过轴方向与上偏光单元12的透过轴方向相互垂直或平行。
如图7所示,当显示装置为液晶显示装置时,在LED发光基板80出光方向设置有下偏光单元11、液晶层13和上偏光单元12,由LED发光基板80出光方向发出的光线,经过下偏光单元11后,只有偏振方向与下偏光单元11的透过轴方向相同的部分光线能够通过下偏光单元11进入液晶层13中,经过液晶层13中液晶分子的偏转作用后,射向上偏光单元12,其中,偏振方向与上偏光单元12的透过轴方向相同的部分光线通过上偏光单元后出射,实现显示。
需要说明的是,第一,本发明实施例中下偏光单元11与上偏光单元12的透过轴方向可以相互垂直,也可以相互平行。例如,当下偏光单元11与上偏光单元12的透过轴方向相互垂直时,液晶层13中的液晶分子以TN(Twisted Nematic,扭曲向列型)显示模式排列,TN显示模式在无外加电压的通常情况下,通过下偏光单元11的光线理论上能够全部由上偏光单元12出射,因此,显示装置背光投射为“常白模式”。反之,当下偏光单元11与上偏光单元12的透过轴方向相互平行时,显示装置在无外加电压的通常情况下背光投射为“常黑模式”。
第二,本发明实施例的显示装置中,对于上偏光单元12和下偏光单元11的具体结构不做限定,例如,可以为偏光片,或者也可以为其他结构,只要能够实现仅使偏振方向与透过轴方向相同的光线透过即可。
第三,液晶层13中的液晶分子通常是设置在两基板之间,且侧面通过胶体粘贴封闭,以避免液晶分子泄露,本发明实施例中对于上偏光单元12和下偏光单元11与设置液晶层13的两基板之间的相对位置不做限定,例如,如图7所示,上偏光单元11可以设置于液晶层13上侧基板之外,或者,也可以设置在上侧基板的内侧,只要能够保证由LED发光基板80出射的光线依次经过下偏光单元11、液晶层13和上偏光单元12即可。
优选的,下偏光单元11和/或上偏光单元13为金属线栅。
这样一来,当下偏光单元11和/或上偏光单元13为金属线栅时,可以通过纳米压印等方式,直接将金属线栅集成在其他基板上,例如,对于下偏光单元11,可以直接用纳米压印的方法集成在LED发光基板80上,从而不必再增设偏光片层,进而降低显示装置的厚度,使得显示装置轻薄化。
优选的,如图8所示,下偏光单元11为金属线栅时,金属线栅设置在每一个LED芯片60的出光侧。
这样一来,如图8所示,只需要在每一个LED芯片60的出光侧通过纳米压印等方式制作金属线栅,即可使得LED芯片60偏振出光,每一个LED芯片60上出射的光线的偏振方向与金属线栅的栅条延伸方向相同。同时,由于在LED芯片60的出光侧设置的金属线栅就能够对LED芯片60出射的光线进行过滤,从而在除LED芯片60以外的部分不必再制作金属线栅,从而节省了金属线栅的制作材料,简化了制作工艺。
本发明实施例的又一方面,提供一种使用上述权利要求7-11任意一项的显示装置实现彩色显示的控制方法,如图9所示,包括:S101、向对应设置在红色亚像素单元A2的LED芯片60输入第一电流,第一电流的电流值范围小于0.1mA。S102、向对应设置在绿色亚像素单元A3的LED芯片60输入第二电流,第二电流的电流值范围在25mA至100mA之间。S103、向对应设置在蓝色亚像素单元A1的LED芯片60输入第三电流,第三电流的电流值大于0.5mA。
需要说明的是,本发明实施例的实现彩色显示的控制方法中,对于步骤S101-S103之间的先后顺序不做限定,可以为同时进行,也可以为任意的先后顺序,上述步骤顺序只是例举其中一种方式,步骤的先后顺序不会影响到本发明控制方法的实现。
向对应设置在红色亚像素单元A2的LED芯片60输入第一电流,如图2所示,当第一电流的电流值小于0.1mA时,LED芯片60的发光侧可发出红色光,向对应设置在绿色亚像素单元A3的LED芯片60输入第二电流,如图2所示,当第二电流的电流值为25mA至100mA之间的任意电流值时,LED芯片60的发光侧可发出绿色光,而且,由于上述权利要求7-11任意一项的显示装置至少在对应蓝色亚像素单元A1的LED芯片60的出光侧设置有蓝色滤光层91,因此,向对应设置在蓝色亚像素单元A1的LED芯片60输入第三电流,由于本发明实施例的LED芯片60的光谱中始终包含有蓝光,因此第三电流可以为如图2所示的光谱范围内的任意值,均可使对应设置在蓝色亚像素单元A1的LED芯片60发出光线,发出的光线通过蓝色滤光层91后,可显示蓝色光。考虑到若第三电流的电流值过低,会使得蓝色亚像素单元A1内显示的光强过低,因此,限定第三电流的电流值大于0.5mA。这样一来,分别控制每一个亚像素单元是否输入电流,即可实现每一个像素单元A呈现出相应的色彩,从而控制显示装置实现彩色显示。
对于LED芯片60来说,输入的电流值越大,其显示的光强度必然越大,因此,上述的显示装置虽然能够实现彩色显示,但是其中红色光的强度远小于绿色光的强度,会使得彩色显示的效果较差,影响显示装置整体显示出的色调,导致显示的颜色发生失真变色等问题。可以通过调节第一电流的占空比与第二电流的占空比之间的比值,来平衡红色光与绿色光之间的光强差,进而提高彩色显示的准确性,使得显示装置呈现较佳的显示效果。
此外,由于液晶层13在电压控制下能够发生相应角度的偏转,因此,当显示装置为液晶显示装置时,在通过调节第一电流的占空比与第二电流的占空比以及第三电流的占空比之间的比值以对显示装置彩色显示进行调节的基础上,还可以通过控制液晶层13中对应每一个像素单元内的红、绿、蓝显示位置的液晶分子的偏转,对每一个像素单元最终显示出的光亮度和色调进行进一步的调整,以进一步提高显示装置彩色显示的效果。
优选的,向对应设置在红色亚像素单元A2内的LED芯片60输入的第一电流的电流值设置为0.1mA;向对应设置在绿色亚像素单元A3内的LED芯片60输入的第二电流的电流值设置为60mA;向对应设置在蓝色亚像素单元A1内的LED芯片60输入的第三电流的电流值设置为8mA。
当第一电流的电流值为0.1mA时,对应设置在红色亚像素单元A2内的LED芯片60发出的光线中红光比例较高、纯度较好,同样的,当第二电流的电流值为60mA时,对应设置在绿色亚像素单元A3内的LED芯片60发出的光线中绿光比例较高、纯度较好,第三电流的电流值设置为8mA,一方面,能够在保证对应设置在蓝色亚像素单元A1内的LED芯片60的发光强度的前提下,降低第三电流的功耗。
优选的,如图10所示,在白平衡条件下,第一电流的占空比与第二电流的占空比以及第三电流的占空比之间的比值为120:1:4。
如图10所示,当对每一个像素单元A中,设置第一电流的电流值为0.1mA、第二电流的电流值为60mA、第三电流的电流值为8mA时,将第一电流的占空比与第二电流的占空比以及第三电流的占空比之间的比值设置为120:1:4,能够得到最佳的白平衡条件,从而降低显示装置发生色彩偏差的可能性,进一步提高显示装置在彩色显示时的显示效果和显示色彩的真实性。
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应以所述权利要求的保护范围为准。

Claims (14)

1.一种LED芯片,其特征在于,包括:N型半导体层、量子阱层和P型半导体层;
所述量子阱层的材料包括氮化铟镓,其中,铟原子在氮化铟镓中的摩尔比大于等于0.3。
2.根据权利要求1所述的LED芯片,其特征在于,所述铟原子在氮化铟镓中的摩尔比为0.4。
3.根据权利要求1所述的LED芯片,其特征在于,还包括衬底层,所述衬底层上设置有缓冲层,所述N型半导体层、所述量子阱层和所述P型半导体层设置在所述缓冲层上。
4.一种LED发光基板,其特征在于,包括多个如权利要求1-3任一项所述的LED芯片,还包括线路板,所述线路板包括衬底基板以及设置在所述衬底基板上的驱动电路,所述LED芯片设置在所述线路板上。
5.根据权利要求4所述的LED发光基板,其特征在于,所述线路板包括CMOS基板或TFT基板。
6.一种显示装置,其特征在于,包括如权利要求4或5所述的LED发光基板,所述LED发光基板上的每一个LED芯片对应设置在每一个所述亚像素单元内,所述LED发光基板的驱动电路用于向各所述LED芯片传输电流,以使得所述LED芯片发出相应波长的光。
7.根据权利要求6所述的显示装置,其特征在于,包括至少三种原色亚像素,其中包括蓝色亚像素,在对应每一个蓝色亚像素单元的所述LED芯片的出光侧设置有蓝色滤光层。
8.根据权利要求7所述的显示装置,其特征在于,所述至少三种原色亚像素中还包括红色亚像素和绿色亚像素,在对应每一个红色亚像素单元的所述LED芯片的出光侧设置有红色滤光层,在对应每一个绿色亚像素单元的所述LED芯片的出光侧设置有绿色滤光层。
9.根据权利要求7所述的显示装置,其特征在于,还包括在所述LED发光基板出光方向依次设置的下偏光单元、液晶层和上偏光单元,其中,所述下偏光单元的透过轴方向与所述上偏光单元的透过轴方向相互垂直或平行。
10.根据权利要求9所述的显示装置,其特征在于,所述下偏光单元和/或所述上偏光单元为金属线栅。
11.根据权利要求10所述的显示装置,其特征在于,所述下偏光单元为金属线栅时,所述金属线栅设置在每一个所述LED芯片的出光侧。
12.一种使用如权利要求7-11任一项所述的显示装置实现彩色显示的控制方法,其特征在于,包括:
向对应设置在红色亚像素单元的LED芯片输入第一电流,所述第一电流的电流值范围小于0.1mA;
向对应设置在绿色亚像素单元的LED芯片输入第二电流,所述第二电流的电流值范围在25mA至100mA之间;
向对应设置在蓝色亚像素单元的LED芯片输入第三电流,所述第三电流的电流值大于0.5mA。
13.根据权利要求12所述的彩色显示的控制方法,其特征在于,
所述第一电流的电流值为0.1mA;所述第二电流的电流值为60mA;所述第三电流的电流值为8mA。
14.根据权利要求13所述的彩色显示的控制方法,其特征在于,白平衡条件下,第一电流的占空比与第二电流的占空比以及第三电流的占空比之间的比值为120:1:4。
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WO2020199527A1 (zh) * 2019-03-29 2020-10-08 云谷(固安)科技有限公司 显示面板制备方法、显示面板和显示装置
US11804575B2 (en) 2019-03-29 2023-10-31 Chengdu Vistar Optoelectronics Co., Ltd. Manufacturing method of display panel, display panel and display apparatus
CN114049849A (zh) * 2021-11-24 2022-02-15 深圳市洲明科技股份有限公司 显示屏
WO2023141764A1 (zh) * 2022-01-25 2023-08-03 泉州三安半导体科技有限公司 发光模组和显示装置

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