CN106814302A - A kind of eMMC test circuits - Google Patents
A kind of eMMC test circuits Download PDFInfo
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- CN106814302A CN106814302A CN201510869846.3A CN201510869846A CN106814302A CN 106814302 A CN106814302 A CN 106814302A CN 201510869846 A CN201510869846 A CN 201510869846A CN 106814302 A CN106814302 A CN 106814302A
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Abstract
The invention discloses a kind of eMMC test circuits, the eMMC test circuits include：Test platform, eMMC plates and chip under test；The eMMC plates are electrically connected with the test platform and the chip under test respectively, and the test for the following eMMC agreements instruction for the test platform to be issued is transmitted to the chip under test；The chip under test, for according to the test instruction, performing corresponding test operation.The eMMC test circuits that the present invention is provided, its test platform issues the test instruction of eMMC agreements, and transmitted to chip under test by eMMC plates, tested with to chip under test, thus support of the test platform to eMMC products is not only realized, the functional check to the eMMC products beyond its galley and malfunction test is also facilitated.
Description
Technical field
The present embodiments relate to the detection technique of eMMC products, more particularly to a kind of eMMC test electricity
Road.
Background technology
Single board computer is to be produced on a bar printing plate, with complete computers function referred to as " single board computer "
Microcomputer, the critical piece such as including CPU, built-in storage, ancillary equipment, interface.
Multiple chips are integrated with existing single board computer, are examined by the treatment to chip, control, function
Look into and the treatment such as malfunction test is capable of achieving its complete computer function, be specifically herein in its galley
EMMC chips carry out functional check and malfunction test.
But existing single board computer, used as complete computers, the conduct to being welded in its galley is miniature
Functional check and malfunction test that the eMMC chips of a computer part are carried out, are only based on its computer work(
The inspection and debugging that can be carried out, it is impossible to realize the support of other eMMC products to being not in its galley.
The content of the invention
The embodiment of the present invention provides a kind of eMMC test circuits, with realize single board computer to its galley with
The support of outer eMMC products.
A kind of eMMC test circuits are the embodiment of the invention provides, the eMMC test circuits include：Survey
Examination platform, embedded multi-media card eMMC plates and chip under test；
The eMMC plates are electrically connected with the test platform and the chip under test respectively, for by described in
The test instruction of eMMC agreements that what test platform was issued follow is transmitted to the chip under test；
The chip under test, for according to the test instruction, performing corresponding test operation.
Further, the test platform is single board computer.
Further, the eMMC plates include eMMC connectors and eMMC sockets；
The eMMC connectors are electrically connected with the test platform and the eMMC sockets respectively, are used for
The test for the following eMMC agreements instruction that the test platform is issued is transmitted to the eMMC sockets；
The eMMC sockets are also electrically connected with the chip under test, and the test for that will receive is instructed and passed
Transport to the chip under test.
Further, the eMMC sockets are the jack module of integrated eMMC chips.
Further, the chip under test is the storage chip for following eMMC agreements.
Further, the storage chip is flash memory.
Further, the test instruction that the test platform is issued at least includes：Test is read function command, is surveyed
Function command, the instruction of test locking and blocking, test writing protection function instruction are write in examination.
A kind of eMMC test circuits provided in an embodiment of the present invention, including：Test platform, embedded many matchmakers
Body card eMMC plates and chip under test, wherein, eMMC plates are electric with test platform and chip under test respectively
Connection, the test for the following eMMC agreements instruction for test platform to be issued is transmitted to chip under test, quilt
Surveying chip is used to perform corresponding test operation according to test instruction.Test platform issues eMMC in the present invention
The test instruction of agreement, and transmitted to chip under test by eMMC plates, surveyed with to chip under test
Examination, thus not only realizes support of the test platform to eMMC products, also facilitates to beyond its galley
EMMC products functional check and malfunction test.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, institute in being described to embodiment below
The accompanying drawing for needing to use does one and simply introduces, it should be apparent that, drawings in the following description are of the invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work,
Other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of schematic diagram of eMMC test circuits that the embodiment of the present invention one is provided；
Fig. 2A is the schematic diagram of the eMMC connectors that the embodiment of the present invention two is provided；
Fig. 2 B are the schematic diagrames of the eMMC sockets that the embodiment of the present invention two is provided.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, hereinafter with reference to the embodiment of the present invention
In accompanying drawing, technical scheme is clearly and completely described by implementation method, it is clear that described
Embodiment be a part of embodiment of the invention, rather than whole embodiments.Based on the implementation in the present invention
Example, the every other implementation that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example, belongs to the scope of protection of the invention.
As shown in figure 1, a kind of schematic diagram of the eMMC test circuits for the offer of the embodiment of the present invention one.Should
The technical scheme of embodiment is suitable for use with test platform and the chip for following eMMC agreements is tested and adjusted
The situation of examination.
The eMMC test circuits that the present embodiment is provided include：Test platform 100, eMMC plates 200
With chip under test 300.EMMC plates 200 are electrically connected with test platform 100 and chip under test 300 respectively,
The test for following eMMC agreements instruction for test platform 100 to be issued is transmitted to chip under test 300；
Chip under test 300, for being instructed according to test, performs corresponding test operation.Wherein,
EMMC (Embedded Multi Media Card, embedded multi-media card) agreement is directed to mobile phone or flat board
The embedded memory standard specification of the products such as computer.Here, test platform 100, eMMC plates 200
It is three parts with chip under test 300, test platform 100 is electrically connected with eMMC plates 200, eMMC
Plate 200 is electrically connected with chip under test 300.
Specifically, the major function of test platform 100 is to issue to follow eMMC associations to chip under test 300
The test instruction of view；The major function of eMMC plates 200 is to electrically connect chip under test 300 and test flat
Platform 100, the test instruction of eMMC agreements is transmitted to chip under test 300；The master of chip under test 300
It is to receive the test instruction of eMMC agreements and perform phase according to the test of eMMC agreements instruction to want function
The test operation answered, to carry out functional check or malfunction test.Here, the test instruction nothing of eMMC agreements
Method is directly transmitted to chip under test 300 from test platform 100, and eMMC plates 200 turn with eMMC
Effect is connect, therefore test platform 100 need to be transmitted to chip under test by eMMC plates 200 by instruction is tested
300。
On the basis of above-mentioned technical proposal, preferably test platform 100 is single board computer, and its reason exists
In existing single board computer is only the eMMC cores to being welded in its galley based on its computer function
Piece carries out functional check and malfunction test, it is impossible to realize the branch to other eMMC products beyond its galley
Hold.And in the present embodiment, by eMMC plates 200 and the electricity of single board computer and chip under test 300
Connection, the instruction of the test based on eMMC agreements that can be issued single board computer is transmitted to outside its galley
Other chip under test 300 on, realize functional check to other chips and malfunction test.
In order that the process of design and producing is more convenient flexible, production and maintenance cost are reduced, inserted in this eMMC
Plate 200 includes connector and socket, it is known that eMMC plates 200 are used to follow eMMC associations by what is received
The test instruction of view is transmitted to chip under test 300, therefore constitutes the adapter and socket of eMMC plates 200
Follow eMMC agreements.It follows that optional eMMC plates 200 include eMMC connectors and
EMMC sockets；EMMC connectors are electrically connected with test platform 100 and eMMC sockets respectively, for inciting somebody to action
The test instruction of eMMC agreements that what test platform 100 was issued follow is transmitted to eMMC sockets；eMMC
Socket is also electrically connected with chip under test 300, for the test instruction of reception to be transmitted to chip under test 300.
It should be noted that the eMMC sockets in optional the present embodiment are the socket of integrated eMMC chips
Module, eMMC sockets are by following the pin of eMMC agreements and eMMC connectors and chip under test 300
Electrical connection, the test platform 100 received from eMMC connectors is issued test instruction transmit to be tested
Chip 300.
It is the storage chip for following eMMC agreements in this chip under test 300.Abided by when chip under test 300 is received
After following the test instruction of eMMC agreements, corresponding test operation is performed according to test instruction, to carry out work(
Can check and malfunction test.Optional storage chip is that flash memory, i.e. chip under test 300 are eMMC flash memories.
It is the storage core for following eMMC agreements based on chip under test 300 on the basis of above-mentioned technical proposal
Piece, the then test instruction that optional test platform 100 is issued at least includes：Test is read function command, test and is write
Function command, the instruction of test locking and blocking, test writing protection function instruction.Specifically, test platform 100
Issue carries out reading function and/or writes the test instruction of function to storage chip, is capable of achieving the reading to storage chip
The debugging or inspection of function, accordingly, test platform 100 can also be adjusted to the other functions of storage chip
Examination and inspection.
It should be noted that chip under test 300 passes through eMMC sockets, eMMC connectors and test platform
100 connections, therefore the replaceable chip under test 300 electrically connected with eMMC sockets, to realize test platform
100 pairs of inspections and debugging of different test chips.The different test chips of test platform 100 pairs check and
During debugging, the difference of model or performance according to different test chips, can issue different test instructions is carried out
Check and debug, therefore the test instruction that test platform 100 is issued includes but is not limited to above-mentioned test instruction.
A kind of eMMC test circuits that the embodiment of the present invention one is provided, including：Test platform 100,
EMMC plates 200 and chip under test 300, wherein, eMMC plates 200 respectively with test platform 100
Electrically connected with chip under test 300, the test for following eMMC agreements for test platform 100 to be issued refers to
Order is transmitted to chip under test 300, and chip under test 300 is used to perform corresponding test behaviour according to test instruction
Make.Test platform 100 issues the test instruction of eMMC agreements in the present embodiment, and is inserted by eMMC
Plate 200 is transmitted to chip under test 300, is tested with to chip under test 300, thus not only realizes survey
Support of the examination platform 100 to eMMC products, also facilitates to the eMMC products beyond its galley
Functional check and malfunction test.
The embodiment of the present invention two provides a kind of eMMC test circuits, and the technical scheme of the embodiment is applied to
The situation tested and debugged using 100 pairs of chips for following eMMC agreements of test platform.Wherein, it is excellent
Select the single board computer that test platform 100 is model Odroid-XU4, the model of eMMC connectors
The model GD9E8M of GB042-34S-H10, eMMC socket, chip under test 300 dodges for eMMC
Deposit.It will be understood by those skilled in the art that test platform 100, eMMC connectors, eMMC sockets,
The model of chip under test 300 includes but is not limited to above species.
As shown in Figure 2 A, it is the schematic diagram of the eMMC connectors that the embodiment of the present invention two is provided, such as Fig. 2 B
It is shown, it is the schematic diagram of the eMMC sockets that the embodiment of the present invention two is provided.The pin of eMMC connectors with
The respective pins connection of eMMC sockets, the NC pins of eMMC sockets are all hanging, eMMC sockets
Other pins connect one to one with the pin of chip under test respectively.It should be noted that in eMMC sockets
The pin of the eMMC chips that effective pin is integrated is corresponded and identical.
Wherein, single board computer is electrically connected with eMMC connectors, eMMC connectors and eMMC sockets
Electrical connection, eMMC sockets are electrically connected with chip under test.Single board computer passes through eMMC connectors, eMMC
Socket, the test instruction that will comply with eMMC agreements is transmitted to chip under test, to realize the work(to chip under test
Can check and malfunction test.Here, Odroid-XU4 has good support to eMMC products, by setting
Meter eMMC sockets, facilitate functional check and the malfunction test of eMMC products.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.Those skilled in the art
It will be appreciated that the invention is not restricted to specific embodiment described here, can enter for a person skilled in the art
The various obvious changes of row, readjust and substitute without departing from protection scope of the present invention.Therefore, though
The present invention is described in further detail by above example so, but the present invention be not limited only to
Upper embodiment, without departing from the inventive concept, can also include more other Equivalent embodiments,
And the scope of the present invention is determined by scope of the appended claims.
Claims (7)
1. a kind of eMMC test circuits, it is characterised in that including：Test platform, built-in multimedia
Card eMMC plates and chip under test；
The eMMC plates are electrically connected with the test platform and the chip under test respectively, for by described in
The test instruction of eMMC agreements that what test platform was issued follow is transmitted to the chip under test；
The chip under test, for according to the test instruction, performing corresponding test operation.
2. eMMC test circuits according to claim 1, it is characterised in that the test platform
It is single board computer.
3. eMMC test circuits according to claim 1, it is characterised in that the eMMC is inserted
Plate includes eMMC connectors and eMMC sockets；
The eMMC connectors are electrically connected with the test platform and the eMMC sockets respectively, are used for
The test for the following eMMC agreements instruction that the test platform is issued is transmitted to the eMMC sockets；
The eMMC sockets are also electrically connected with the chip under test, and the test for that will receive is instructed and passed
Transport to the chip under test.
4. eMMC test circuits according to claim 3, it is characterised in that the eMMC is inserted
Seat is the jack module of integrated eMMC chips.
5. eMMC test circuits according to claim 1, it is characterised in that the chip under test
To follow the storage chip of eMMC agreements.
6. eMMC test circuits according to claim 5, it is characterised in that the storage chip
It is flash memory.
7. eMMC test circuits according to claim any one of 1-6, it is characterised in that described
The test instruction that test platform is issued at least includes：Test is read function command, test and writes function command, test
Locking and blocking instruction, test writing protection function instruction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510869846.3A CN106814302A (en) | 2015-12-02 | 2015-12-02 | A kind of eMMC test circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510869846.3A CN106814302A (en) | 2015-12-02 | 2015-12-02 | A kind of eMMC test circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106814302A true CN106814302A (en) | 2017-06-09 |
Family
ID=59107358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201510869846.3A Pending CN106814302A (en) | 2015-12-02 | 2015-12-02 | A kind of eMMC test circuits |
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Cited By (6)
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| CN108564985A (en) * | 2018-03-16 | 2018-09-21 | 广州视源电子科技股份有限公司 | EMMC test methods, device, mobile terminal and storage medium |
| CN109490751A (en) * | 2018-10-23 | 2019-03-19 | 锐捷网络股份有限公司 | A kind of EMMC test method and test circuit |
| CN111370053A (en) * | 2018-12-25 | 2020-07-03 | 北京兆易创新科技股份有限公司 | eMMC test method and device |
| CN113012750A (en) * | 2019-12-18 | 2021-06-22 | 中移物联网有限公司 | Testing device and method for memory chip |
| CN113160875A (en) * | 2021-03-25 | 2021-07-23 | 南京英锐创电子科技有限公司 | Chip test system and test method |
| CN115547396A (en) * | 2022-11-30 | 2022-12-30 | 合肥康芯威存储技术有限公司 | Test method and device for eMMC |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108564985A (en) * | 2018-03-16 | 2018-09-21 | 广州视源电子科技股份有限公司 | EMMC test methods, device, mobile terminal and storage medium |
| CN109490751A (en) * | 2018-10-23 | 2019-03-19 | 锐捷网络股份有限公司 | A kind of EMMC test method and test circuit |
| CN111370053A (en) * | 2018-12-25 | 2020-07-03 | 北京兆易创新科技股份有限公司 | eMMC test method and device |
| CN113012750A (en) * | 2019-12-18 | 2021-06-22 | 中移物联网有限公司 | Testing device and method for memory chip |
| CN113012750B (en) * | 2019-12-18 | 2023-08-15 | 中移物联网有限公司 | Testing device and method for memory chip |
| CN113160875A (en) * | 2021-03-25 | 2021-07-23 | 南京英锐创电子科技有限公司 | Chip test system and test method |
| CN115547396A (en) * | 2022-11-30 | 2022-12-30 | 合肥康芯威存储技术有限公司 | Test method and device for eMMC |
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Effective date of registration: 20200825 Address after: 100083 Beijing City, Haidian District Xueyuan Road No. 30, large industrial building A block 12 layer Applicant after: GIGADEVICE SEMICONDUCTOR(BEIJING) Inc. Address before: 202, room 52, building 2, 100176 North View Garden, Daxing District economic and Technological Development Zone, Beijing Applicant before: BEIJING JINGCUN TECHNOLOGY Co.,Ltd. |
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Address after: Room 101, Floor 1-5, Building 8, Yard 9, Fenghao East Road, Haidian District, Beijing 100094 Applicant after: Zhaoyi Innovation Technology Group Co.,Ltd. Address before: 100083 12 Floors, Block A, Tiangong Building, Science and Technology University, 30 College Road, Haidian District, Beijing Applicant before: GIGADEVICE SEMICONDUCTOR(BEIJING) Inc. |