CN106803488A - 一种功率模块焊接装置 - Google Patents
一种功率模块焊接装置 Download PDFInfo
- Publication number
- CN106803488A CN106803488A CN201510834949.6A CN201510834949A CN106803488A CN 106803488 A CN106803488 A CN 106803488A CN 201510834949 A CN201510834949 A CN 201510834949A CN 106803488 A CN106803488 A CN 106803488A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Battery Mounting, Suspending (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510834949.6A CN106803488B (zh) | 2015-11-26 | 2015-11-26 | 一种功率模块焊接装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510834949.6A CN106803488B (zh) | 2015-11-26 | 2015-11-26 | 一种功率模块焊接装置 |
Publications (2)
Publication Number | Publication Date |
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CN106803488A true CN106803488A (zh) | 2017-06-06 |
CN106803488B CN106803488B (zh) | 2019-10-29 |
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Family Applications (1)
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CN201510834949.6A Active CN106803488B (zh) | 2015-11-26 | 2015-11-26 | 一种功率模块焊接装置 |
Country Status (1)
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CN (1) | CN106803488B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109807425A (zh) * | 2019-02-12 | 2019-05-28 | 上海航天电子有限公司 | 用于小型化射频功率模块共晶焊的定位工装及其使用方法 |
CN111465312A (zh) * | 2020-04-14 | 2020-07-28 | 杭州洛微科技有限公司 | 基于周期性阵列排布的光电产品封装生产方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101890605A (zh) * | 2010-07-08 | 2010-11-24 | 株洲南车时代电气股份有限公司 | 一种功率半导体芯片焊接装置 |
CN101913046A (zh) * | 2010-05-21 | 2010-12-15 | 苏州固锝电子股份有限公司 | 一种用于二极管焊接的焊接装置 |
CN202121873U (zh) * | 2011-06-01 | 2012-01-18 | 深圳市信太通讯有限公司 | 电路板焊盘结构 |
JP2013021145A (ja) * | 2011-07-12 | 2013-01-31 | Fuji Electric Co Ltd | 半導体装置の組立治具およびそれを用いた半導体装置の製造方法 |
CN103894697A (zh) * | 2014-04-25 | 2014-07-02 | 株洲南车时代电气股份有限公司 | 一种大功率igbt模块焊接装置 |
-
2015
- 2015-11-26 CN CN201510834949.6A patent/CN106803488B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101913046A (zh) * | 2010-05-21 | 2010-12-15 | 苏州固锝电子股份有限公司 | 一种用于二极管焊接的焊接装置 |
CN101890605A (zh) * | 2010-07-08 | 2010-11-24 | 株洲南车时代电气股份有限公司 | 一种功率半导体芯片焊接装置 |
CN202121873U (zh) * | 2011-06-01 | 2012-01-18 | 深圳市信太通讯有限公司 | 电路板焊盘结构 |
JP2013021145A (ja) * | 2011-07-12 | 2013-01-31 | Fuji Electric Co Ltd | 半導体装置の組立治具およびそれを用いた半導体装置の製造方法 |
CN103894697A (zh) * | 2014-04-25 | 2014-07-02 | 株洲南车时代电气股份有限公司 | 一种大功率igbt模块焊接装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109807425A (zh) * | 2019-02-12 | 2019-05-28 | 上海航天电子有限公司 | 用于小型化射频功率模块共晶焊的定位工装及其使用方法 |
CN111465312A (zh) * | 2020-04-14 | 2020-07-28 | 杭州洛微科技有限公司 | 基于周期性阵列排布的光电产品封装生产方法 |
Also Published As
Publication number | Publication date |
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CN106803488B (zh) | 2019-10-29 |
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CP01 | Change in the name or title of a patent holder |
Address after: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee after: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CSR TIMES ELECTRIC Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201014 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |
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