CN106796403A - 引线框制造用曝光装置 - Google Patents

引线框制造用曝光装置 Download PDF

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Publication number
CN106796403A
CN106796403A CN201580051377.2A CN201580051377A CN106796403A CN 106796403 A CN106796403 A CN 106796403A CN 201580051377 A CN201580051377 A CN 201580051377A CN 106796403 A CN106796403 A CN 106796403A
Authority
CN
China
Prior art keywords
mask
copper coin
main body
lead frame
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580051377.2A
Other languages
English (en)
Chinese (zh)
Inventor
李海泆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Puri technology co Ltd
Original Assignee
Puri technology co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Puri technology co Ltd filed Critical Puri technology co Ltd
Publication of CN106796403A publication Critical patent/CN106796403A/zh
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201580051377.2A 2014-11-10 2015-11-10 引线框制造用曝光装置 Pending CN106796403A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20140155682A KR101510156B1 (ko) 2014-11-10 2014-11-10 리드프레임 제조용 노광장치
KR10-2014-0155682 2014-11-10
PCT/KR2015/012068 WO2016076610A1 (ko) 2014-11-10 2015-11-10 리드프레임 제조용 노광장치

Publications (1)

Publication Number Publication Date
CN106796403A true CN106796403A (zh) 2017-05-31

Family

ID=53033900

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580051377.2A Pending CN106796403A (zh) 2014-11-10 2015-11-10 引线框制造用曝光装置

Country Status (3)

Country Link
KR (1) KR101510156B1 (ko)
CN (1) CN106796403A (ko)
WO (1) WO2016076610A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109976086A (zh) * 2017-11-30 2019-07-05 株式会社阿迪泰克工程 掩模对、两面曝光装置及掩模更换方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1703137A (zh) * 2004-05-13 2005-11-30 三荣技研股份有限公司 曝光装置
JP2007072171A (ja) * 2005-09-07 2007-03-22 Fujifilm Corp パターン露光方法及び装置
CN101887217A (zh) * 2009-05-15 2010-11-17 三荣技研股份有限公司 曝光装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0878182A (ja) * 1994-09-02 1996-03-22 Toppan Printing Co Ltd パターン露光方法
KR970016822A (ko) * 1995-09-21 1997-04-28 조희재 포토에칭용 노광장치
JPH10339954A (ja) * 1997-06-09 1998-12-22 Sumitomo Metal Mining Co Ltd リードフレーム露光装置
KR20020061389A (ko) * 2001-01-16 2002-07-24 성우전자 주식회사 리드프레임 제조방법
KR20050048401A (ko) * 2003-11-19 2005-05-24 엘지전자 주식회사 리드 프레임 제작방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1703137A (zh) * 2004-05-13 2005-11-30 三荣技研股份有限公司 曝光装置
JP2007072171A (ja) * 2005-09-07 2007-03-22 Fujifilm Corp パターン露光方法及び装置
CN101887217A (zh) * 2009-05-15 2010-11-17 三荣技研股份有限公司 曝光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109976086A (zh) * 2017-11-30 2019-07-05 株式会社阿迪泰克工程 掩模对、两面曝光装置及掩模更换方法
CN109976086B (zh) * 2017-11-30 2024-04-19 株式会社阿迪泰克工程 掩模对、两面曝光装置及掩模更换方法

Also Published As

Publication number Publication date
KR101510156B1 (ko) 2015-04-08
WO2016076610A1 (ko) 2016-05-19

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