CN106796403A - 引线框制造用曝光装置 - Google Patents
引线框制造用曝光装置 Download PDFInfo
- Publication number
- CN106796403A CN106796403A CN201580051377.2A CN201580051377A CN106796403A CN 106796403 A CN106796403 A CN 106796403A CN 201580051377 A CN201580051377 A CN 201580051377A CN 106796403 A CN106796403 A CN 106796403A
- Authority
- CN
- China
- Prior art keywords
- mask
- copper coin
- main body
- lead frame
- making
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20140155682A KR101510156B1 (ko) | 2014-11-10 | 2014-11-10 | 리드프레임 제조용 노광장치 |
KR10-2014-0155682 | 2014-11-10 | ||
PCT/KR2015/012068 WO2016076610A1 (ko) | 2014-11-10 | 2015-11-10 | 리드프레임 제조용 노광장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106796403A true CN106796403A (zh) | 2017-05-31 |
Family
ID=53033900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201580051377.2A Pending CN106796403A (zh) | 2014-11-10 | 2015-11-10 | 引线框制造用曝光装置 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101510156B1 (ko) |
CN (1) | CN106796403A (ko) |
WO (1) | WO2016076610A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109976086A (zh) * | 2017-11-30 | 2019-07-05 | 株式会社阿迪泰克工程 | 掩模对、两面曝光装置及掩模更换方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1703137A (zh) * | 2004-05-13 | 2005-11-30 | 三荣技研股份有限公司 | 曝光装置 |
JP2007072171A (ja) * | 2005-09-07 | 2007-03-22 | Fujifilm Corp | パターン露光方法及び装置 |
CN101887217A (zh) * | 2009-05-15 | 2010-11-17 | 三荣技研股份有限公司 | 曝光装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0878182A (ja) * | 1994-09-02 | 1996-03-22 | Toppan Printing Co Ltd | パターン露光方法 |
KR970016822A (ko) * | 1995-09-21 | 1997-04-28 | 조희재 | 포토에칭용 노광장치 |
JPH10339954A (ja) * | 1997-06-09 | 1998-12-22 | Sumitomo Metal Mining Co Ltd | リードフレーム露光装置 |
KR20020061389A (ko) * | 2001-01-16 | 2002-07-24 | 성우전자 주식회사 | 리드프레임 제조방법 |
KR20050048401A (ko) * | 2003-11-19 | 2005-05-24 | 엘지전자 주식회사 | 리드 프레임 제작방법 |
-
2014
- 2014-11-10 KR KR20140155682A patent/KR101510156B1/ko active IP Right Grant
-
2015
- 2015-11-10 WO PCT/KR2015/012068 patent/WO2016076610A1/ko active Application Filing
- 2015-11-10 CN CN201580051377.2A patent/CN106796403A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1703137A (zh) * | 2004-05-13 | 2005-11-30 | 三荣技研股份有限公司 | 曝光装置 |
JP2007072171A (ja) * | 2005-09-07 | 2007-03-22 | Fujifilm Corp | パターン露光方法及び装置 |
CN101887217A (zh) * | 2009-05-15 | 2010-11-17 | 三荣技研股份有限公司 | 曝光装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109976086A (zh) * | 2017-11-30 | 2019-07-05 | 株式会社阿迪泰克工程 | 掩模对、两面曝光装置及掩模更换方法 |
CN109976086B (zh) * | 2017-11-30 | 2024-04-19 | 株式会社阿迪泰克工程 | 掩模对、两面曝光装置及掩模更换方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101510156B1 (ko) | 2015-04-08 |
WO2016076610A1 (ko) | 2016-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170531 |
|
WD01 | Invention patent application deemed withdrawn after publication |