CN106793471A - A kind of ceramic circuit-board - Google Patents
A kind of ceramic circuit-board Download PDFInfo
- Publication number
- CN106793471A CN106793471A CN201710041798.8A CN201710041798A CN106793471A CN 106793471 A CN106793471 A CN 106793471A CN 201710041798 A CN201710041798 A CN 201710041798A CN 106793471 A CN106793471 A CN 106793471A
- Authority
- CN
- China
- Prior art keywords
- layer
- ceramic
- metallic base
- pressure
- ceramic layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of ceramic circuit-board, including metallic base layer, pressure-resistant ceramic layer, thermal conductive ceramic layer and luminescent ceramic layer are sequentially formed with the metallic base layer, metal circuitry is formed with the luminescent ceramic layer, also including being arranged on Porous transition layer between metallic base layer and pressure-resistant ceramic layer, for preventing from being ftractureed between metallic base layer and pressure-resistant ceramic layer.It is preferred that, the thickness of the Porous transition layer is between 10 30 microns.It is preferred that, the Porous transition layer is formed by porous material sintering.Existing ceramic circuit-board structure is improved, it is to avoid ftractureed between metallic base layer and pressure-resistant ceramic layer, improves the stability of ceramic circuit-board.
Description
Technical field
The present invention relates to a kind of ceramic circuit-board.
Background technology
The patent of Application No. 201310238637.X discloses a kind of many ceramic layer printed substrates, as shown in figure 1, bag
Metallic matrix is included, and pressure-resistant ceramic layer, highly heat-conductive carbon/ceramic enamel coating and luminescent ceramic layer is sequentially formed with the metallic matrix,
And it is formed with metal circuitry in the luminescent ceramic layer.Printed substrate has multiple function ceramics layers, can realize
Heat conduction, the high pressure resistant purpose for puncturing and improving light efficiency.
But, between metallic base layer and pressure-resistant ceramic layer, thermal coefficient of expansion is different, in assist side process and after
In continuous welding process, it is required to operate in high temperature environments, is easily caused and ftractures between layers, influences the steady of ceramic circuit-board
Qualitative energy.
The content of the invention
Regarding to the issue above, the present invention provides a kind of ceramic circuit-board, and existing ceramic circuit-board structure is improved,
Avoid being ftractureed between metallic base layer and pressure-resistant ceramic layer, improve the stability of ceramic circuit-board.
To realize above-mentioned technical purpose, above-mentioned technique effect is reached, the present invention is achieved through the following technical solutions：
A kind of ceramic circuit-board, including metallic base layer, are sequentially formed with pressure-resistant ceramic layer, heat conduction on the metallic base layer
Ceramic layer and luminescent ceramic layer, are formed with metal circuitry, also including being arranged on metallic base layer in the luminescent ceramic layer
Porous transition layer and pressure-resistant ceramic layer between, for preventing from being ftractureed between metallic base layer and pressure-resistant ceramic layer.
It is preferred that, the thickness of the Porous transition layer is between 10-30 microns.
It is preferred that, the Porous transition layer is formed by porous material sintering.
It is preferred that, the metallic base layer is Al, Cu, Ag or Ni metallic base layer or their alloy substrate layer.
It is preferred that, the thickness of the pressure-resistant ceramic layer is between 15-200 microns.
It is preferred that, the thickness of the thermal conductive ceramic layer is between 15-200 microns.
It is preferred that, the thickness of the luminescent ceramic layer is between 15-200 microns.
The beneficial effects of the invention are as follows：The overall structure of ceramic circuit-board is simple, by metallic base layer and pressure-resistant pottery
Porous transition layer is set between enamel coating, can be adjusted between metallic base layer and pressure-resistant ceramic layer because of layer caused by thermal expansion
Between stress, and then prevent between metallic base layer and pressure-resistant ceramic layer ftracture, it is ensured that the stability of ceramic circuit-board.
Brief description of the drawings
Fig. 1 is the structural representation of a kind of many ceramic layer printed substrates of existing design；
Fig. 2 is a kind of structural representation of ceramic circuit-board of the invention；
The mark implication of accompanying drawing is as follows：
1：Metallic base layer；2：Pressure-resistant ceramic layer；3：Thermal conductive ceramic layer；4：Luminescent ceramic layer；5：Metal circuitry；6：Porous mistake
Cross layer.
Specific embodiment
Technical solution of the present invention is described in further detail with specific embodiment below in conjunction with the accompanying drawings, so that ability
The technical staff in domain can be better understood from the present invention and can be practiced, but illustrated embodiment is not as to limit of the invention
It is fixed.
As shown in Fig. 2 a kind of ceramic circuit-board, including metallic base layer, it is sequentially formed with the metallic base layer
Pressure-resistant ceramic layer, thermal conductive ceramic layer and luminescent ceramic layer, are formed with metal circuitry, also including setting in the luminescent ceramic layer
Put it is between metallic base layer and pressure-resistant ceramic layer, for prevent between metallic base layer and pressure-resistant ceramic layer ftracture it is porous
Transition zone.
Wherein, it can be Al, Cu, Ag or Ni metallic base layer that metallic base layer is, or their alloy substrate layer.
Pressure-resistant ceramic layer can be Al2O3, AlON or SiC.Thermal conductive ceramic layer can be AlN or AlON.Luminescent ceramic layer can be dilute
The ceramic layer of soil doping.
For ceramic circuit-board, the thickness between each layer is also a very important parameter, should holding structure it is compact,
Holding structure is stable again, and the thickness of preferably each layer is as follows：
The thickness of Porous transition layer is between 10-30 microns, the Porous transition layer is formed by porous material sintering.
The thickness of the pressure-resistant ceramic layer is between 15-200 microns.
The thickness of the thermal conductive ceramic layer is between 15-200 microns.
The thickness of the luminescent ceramic layer is between 15-200 microns.
The overall structure of ceramic circuit-board is simple, and Porous transition is set by between metallic base layer and pressure-resistant ceramic layer
Layer, can be adjusted because of inter-laminar stress caused by thermal expansion between metallic base layer and pressure-resistant ceramic layer, and then prevent metal
Ftractureed between base layer and pressure-resistant ceramic layer, it is ensured that the stability of ceramic circuit-board.
The preferred embodiments of the present invention are these are only, the scope of the claims of the invention is not thereby limited, it is every to utilize this hair
Equivalent structure or equivalent flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, be included within the scope of the present invention.
Claims (7)
1. a kind of ceramic circuit-board, including metallic base layer, pressure-resistant ceramic layer is sequentially formed with the metallic base layer, is led
Thermal Ceramics layer and luminescent ceramic layer, metal circuitry is formed with the luminescent ceramic layer, it is characterised in that also including setting
Porous mistake between metallic base layer and pressure-resistant ceramic layer, for preventing from being ftractureed between metallic base layer and pressure-resistant ceramic layer
Cross layer.
2. a kind of ceramic circuit-board according to claim 1, it is characterised in that the thickness of the Porous transition layer is 10-
Between 30 microns.
3. a kind of ceramic circuit-board according to claim 2, it is characterised in that the Porous transition layer is burnt by porous material
Knot is formed.
4. a kind of ceramic circuit-board according to claim 3, it is characterised in that the metallic base layer is Al, Cu, Ag
Or Ni metallic base layers or their alloy substrate layer.
5. a kind of ceramic circuit-board according to claim 3, it is characterised in that the thickness of the pressure-resistant ceramic layer is 15-
Between 200 microns.
6. a kind of ceramic circuit-board according to claim 3, it is characterised in that the thickness of the thermal conductive ceramic layer is 15-
Between 200 microns.
7. a kind of ceramic circuit-board according to claim 3, it is characterised in that the thickness of the luminescent ceramic layer is 15-
Between 200 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710041798.8A CN106793471A (en) | 2017-01-20 | 2017-01-20 | A kind of ceramic circuit-board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710041798.8A CN106793471A (en) | 2017-01-20 | 2017-01-20 | A kind of ceramic circuit-board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106793471A true CN106793471A (en) | 2017-05-31 |
Family
ID=58944942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710041798.8A Pending CN106793471A (en) | 2017-01-20 | 2017-01-20 | A kind of ceramic circuit-board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793471A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079339A (en) * | 2013-01-28 | 2013-05-01 | 深圳市泓亚光电子有限公司 | Metal ceramic composite substrate and manufacturing method for same |
| CN103354699A (en) * | 2013-06-17 | 2013-10-16 | 苏州晶品光电科技有限公司 | Multi-ceramic-layer printed circuit board |
| CN203339224U (en) * | 2013-06-17 | 2013-12-11 | 苏州晶品光电科技有限公司 | A SMD LED packaging structure |
-
2017
- 2017-01-20 CN CN201710041798.8A patent/CN106793471A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079339A (en) * | 2013-01-28 | 2013-05-01 | 深圳市泓亚光电子有限公司 | Metal ceramic composite substrate and manufacturing method for same |
| CN103354699A (en) * | 2013-06-17 | 2013-10-16 | 苏州晶品光电科技有限公司 | Multi-ceramic-layer printed circuit board |
| CN203339224U (en) * | 2013-06-17 | 2013-12-11 | 苏州晶品光电科技有限公司 | A SMD LED packaging structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105272369B (en) | A kind of porous ceramics connection method | |
| WO2009094537A3 (en) | Nanoscale metal paste for interconnect and method of use | |
| EP1959100A3 (en) | Heat resistant member | |
| JP6580385B2 (en) | Composite of aluminum and carbon particles and method for producing the same | |
| TWI358800B (en) | ||
| CN105036783A (en) | Method for brazing ceramic and metal or ceramic and ceramic | |
| TWI512150B (en) | Preparation of copper - clad copper - clad copper clad copper | |
| CN107825806A (en) | A kind of preparation method of titanium/titanium carbide laminated composite materials | |
| JP5340069B2 (en) | Carbon-metal composite and circuit member or heat dissipation member using the same | |
| RU2012107462A (en) | DETAIL CONTAINING A SUBSTRATE WITH A CERAMIC COATING LAYER | |
| CN209643853U (en) | Porous heating component and electronic cigarette is connected in a kind of liquid height | |
| CN104022217A (en) | High-power curved surface LED (light-emitting diode) radiating base plate and encapsulating method thereof | |
| CN106793471A (en) | A kind of ceramic circuit-board | |
| CN105016762B (en) | One kind reinforcing porous ceramics connector connecting method | |
| CN104776742A (en) | Composite liquid sucking core for ultrathin heat pipe and manufacturing method of composite liquid sucking core | |
| CN206486584U (en) | A kind of linear evaporation source and vacuum deposition apparatus | |
| CN103354699B (en) | Many ceramic layers printed substrate | |
| CN100536623C (en) | Composite high temperature electrical heating element and its making method | |
| CN203339214U (en) | A multi-ceramic-layer LED packaging structure | |
| CN105861984B (en) | A kind of preparation method of carbon/carbon composite surface refractory oxide covering | |
| CN108135081A (en) | A kind of ceramic substrate circuit board | |
| RU2007148532A (en) | CORROSION-RESISTANT PRODUCT WITH EXTERNAL LAYER FROM CERAMIC MATERIAL | |
| CN207082543U (en) | A kind of UV LED chip die bond encapsulating structure | |
| CN104177113A (en) | SiC bonded ceramic matrix composite material and preparation method thereof | |
| CN101200126A (en) | Thermal-barrier coating and method for making same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |