CN106785526A - A kind of deck - Google Patents
A kind of deck Download PDFInfo
- Publication number
- CN106785526A CN106785526A CN201611246757.4A CN201611246757A CN106785526A CN 106785526 A CN106785526 A CN 106785526A CN 201611246757 A CN201611246757 A CN 201611246757A CN 106785526 A CN106785526 A CN 106785526A
- Authority
- CN
- China
- Prior art keywords
- deck
- overflow launder
- pin
- insulator foot
- metal shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a kind of deck, including metal shell, insulator foot and multiple pins, metal shell fastens to form draw-in groove up and down with insulator foot, draw-in groove is used to place card, pin stretches out in the edge of metal shell or the edge of insulator foot, the edge inner side of insulator foot is provided with least one overflow launder, and overflow launder is correspondingly arranged with the pin.Deck provided in an embodiment of the present invention is when deck crosses stove in SMT flows, the gap that the rosin in scolding tin on deck pin is heated in the middle of the metal shell and insulator foot of deck enters overflow launder, the rosin of stove process overflow was contained by the overflow launder on the inside of the edge of insulator foot, improve the smoothness and efficiency of the operating process of card insertion deck, it is ensured that the using effect of deck.
Description
Technical field
The present invention relates to mobile communication equipment technical field, more particularly to a kind of deck.
Background technology
SMT (Surface Mount Technology, surface mounting technology) is that surface-assembled component is attached at into PCB
The process of (Printed Circuit Board, printed circuit board plate), is a kind of skill the most frequently used in current electronic assembly industry
Art and technique.
For cartridge structure, such as SIM (Subscriber Identification Module, client identification module)
Card, RAM card, release etc., in SMT, deck is reliably combined together with pcb board surface pads by solder(ing) paste alloy.
SMT flows included stove, and the effect for crossing stove is to melt soldering paste, component is welded to connect with pcb board, there is temperature in this process
The cataclysm of degree, i.e. temperature rise to peak temperature (230 DEG C~250 DEG C) by room temperature, then quick cooling.
In the prior art during deck SMT, deck is pasted in first face of pcb board first, then in second face of pcb board
Patch chip.When second face patch chip crosses stove, the rosin in the first deck scolding tin of face patch is heated will be along deck
Gap in the middle of iron-clad and plastic cement enters deck, so as to hinder card to insert the operating process of deck, influences plug-in card smoothness and effect
Rate.Additionally, for the cartridge structure with push rod, with the accumulation of rosin, part rosin is flowed into the gap of the push rod of deck
Face, cause push rod have some setbacks even push rod it is stuck, so as to cause deck to fail.
In sum, existing cartridge structure causes resistance during SMT because the accumulation of rosin is operated to plug-in card
Hinder, influence the using effect of deck.
Application content
The embodiment of the present invention provides a kind of deck, be used to solve in the prior art deck during SMT, due to rosin
Pile up and cause obstruction to plug-in card operation, influence the problem of the using effect of deck.
The embodiment of the present invention provides a kind of deck, including metal shell, insulator foot and multiple pins;
The metal shell fastens to form draw-in groove up and down with the insulator foot, and the draw-in groove is used to place card;It is described to draw
Pin stretches out in the edge of the metal shell or the edge of the insulator foot;
The edge inner side of the insulator foot is provided with least one overflow launder, and the overflow launder is corresponding with the pin to be set
Put.
Optionally, the pin is electrically connected with the pad on circuit substrate, the outer surface of the overflow launder and the pin
Connection.
Optionally, also including push rod, the default edge inner side of the insulator foot sets guide rail, and the push rod is slidably installed
In in the guide rail;The push rod is stuck in motion in the draw-in groove described in driving;The upper surface of the overflow launder pushes away less than described
The lower surface of bar.
Optionally, the multiple pin includes stretching out in the earth mat pin on the outside of the edge of the metal shell, described to overflow
The outer surface of chute contacts with the earth mat pin, the upper surface of the overflow launder and the push rod movable contact.
Optionally, the insulator foot lower surface is contacted with the circuit substrate, the metal shell lower surface with it is described
Insulator foot upper surface fastens to form draw-in groove, and the metal shell is pointed in the opening of the overflow launder.
Optionally, the upper surface of the overflow launder sets chamfering.
Optionally, the upper surface of the drainage side of the overflow launder sets arc angling, and the drainage side is the overflow launder
The side contacted with the pin, the chamfering is more than 90 °.
Optionally, the drainage side of the overflow launder sets opening, and the drainage side connects for the overflow launder with the pin
Tactile side.
Optionally, length of the length of the overflow launder not less than the pin.
Optionally, thickness of the depth of the overflow launder less than the insulator foot.
A kind of deck provided in an embodiment of the present invention, including metal shell, insulator foot and multiple pin, metal shell with
Insulator foot fastens to form draw-in groove up and down, and draw-in groove is used to place and blocks, and pin stretches out in the edge or insulator foot of metal shell
Edge, the edge inner side of insulator foot is provided with least one overflow launder, and overflow launder is correspondingly arranged with the pin.It is of the invention real
The deck of example offer is applied when deck crosses stove in SMT flows, the rosin in scolding tin on deck pin is heated along the gold of deck
Gap in the middle of category housing and insulator foot enters overflow launder, and stove was contained by the overflow launder on the inside of the edge of insulator foot
The rosin of process overflow, improves the smoothness and efficiency of the operating process of card insertion deck, it is ensured that the using effect of deck.
Brief description of the drawings
Fig. 1 a are a kind of cartridge structure figure when being not inserted into card provided in an embodiment of the present invention;
Fig. 1 b are a kind of cartridge structure figure inserted when blocking provided in an embodiment of the present invention;
Fig. 1 c are a kind of cartridge structure partial enlarged drawing provided in an embodiment of the present invention;
Fig. 1 d are another cartridge structure partial enlarged drawing provided in an embodiment of the present invention;
Fig. 2 is a kind of deck section partial enlarged drawing provided in an embodiment of the present invention.
Specific embodiment
In order that the object, technical solutions and advantages of the present invention are clearer, below in conjunction with accompanying drawing the present invention is made into
One step ground is described in detail, it is clear that described embodiment is only some embodiments of the invention, rather than whole implementation
Example.Based on the embodiment in the present invention, what those of ordinary skill in the art were obtained under the premise of creative work is not made
All other embodiment, belongs to the scope of protection of the invention.
Cartridge structure provided in an embodiment of the present invention for fix all kinds of cards and for all kinds of cards provide electrical connection device knot
Structure, specifically include various types of SIM (Subscriber Identification Module, client identification module) deck,
RAM card does and other information cartridge structure, is not limited herein.
As shown in Figure 1a, it is a kind of cartridge structure figure when being not inserted into card provided in an embodiment of the present invention, including insulation bottom
Seat 101, metal shell 102, and multiple pins include pin 1031, pin 1032, pin 1033 ... pin 103n.
Wherein, in order to realize the Electricity Federation of card and circuit substrate PCB (Printed Circuit Board, printed circuit board)
Connect, multiple pins are provided with deck, the number of pins of the deck of different packing forms can be differed, and different packing forms
The function of each pin of deck is also differed.The difference of the function based on each pin, pin can be arranged on metal shell
On 102, it is also possible to be arranged on insulator foot 101.Specifically, pin stretches out in the edge or insulator foot of metal shell 102
101 edge, i.e., usual pin is arranged on the edge of metal shell 102 or the marginal position of insulator foot 101, in Fig. 1 a
Pin 1031, pin 1032, pin 1033 ... pin 103n.Metal shell 102 fastens formation card with insulator foot about 101
Groove 104, is a kind of cartridge structure figure inserted when blocking provided in an embodiment of the present invention, in the draw-in groove 104 of deck as shown in Figure 1 b
Placed SIM 105, SIM 105 connects deck pin by internal copper interface, the pin of deck be welded on PCB from
And realize the logic function of SIM 105.
Fig. 1 c are a kind of cartridge structure partial enlarged drawing provided in an embodiment of the present invention, as illustrated in figure 1 c, insulator foot 101
Edge on the inside of be provided with overflow launder 106, overflow launder 106 is correspondingly arranged with pin 1031, and pin 1031 is arranged on metal-back
On body 102.Wherein, a pin at least corresponds to an overflow launder, and overflow launder 106 is used to house rosin.
Cartridge structure provided in an embodiment of the present invention, during deck SMT, pastes card in first face of pcb board first
Seat, then pastes chip in second face of pcb board.When second face patch chip crosses stove, on the correspondence pad of deck pin 1031
Rosin in scolding tin is heated along the metal shell 102 of deck and the gap of the centre of insulator foot 101 into overflow launder 106, leads to
The overflow launder 106 crossed on the inside of the edge of insulator foot 101 contained the rosin of stove process overflow, improve card insertion deck
The smoothness and efficiency of operating process, it is ensured that the using effect of deck.
It should be noted that the embodiment of the present invention eventually can be in the position of the corresponding insulator foot 101 of each pin of deck
Setting overflow launder is put, for example, on the inside of the edge of insulator foot 101, near pin 1031, pin 1032, pin 1033 ...
The position of pin 103n, is respectively provided with overflow launder, so that the rosin on each pin correspondence pad flows into overflow when crossing stove
Groove, it is to avoid the draw-in groove 104 that rosin is flowed between insulator foot 101 and metal shell 102 influences the smoothness and efficiency of plug-in card.
Optionally, as illustrated in figs. 1A and ib, pin 1031 is electrically connected with the pad 107 on circuit substrate.Such as Fig. 1 d institutes
Show, be another cartridge structure partial enlarged drawing that embodiment is provided, wherein, outer surface and the pin 1031 of overflow launder 106 connect
Connect.Now, overflow launder 106 is close to pad 107, and rosin flows rapidly into overflow launder 106 in pad when being conducive to SMT.
Optionally, deck provided in an embodiment of the present invention also includes push rod 108, insulator foot 101 as shown in figs. la-ld
An edge inner side guide rail 109 is set, push rod 108 is slidably mounted in guide rail 109;Push rod 108 drives SIM 105 described
Motion in draw-in groove 104.Additionally, lower surface of the upper surface of overflow launder 106 less than push rod 108, therefore during SMT, rosin
Flow into the draw-in groove 104 between insulator foot 101 and metal shell 102 first, it is to avoid rosin is deposited in the gap of push rod 108
Face cause push rod 108 have some setbacks even push rod 108 it is stuck, so as to cause deck fail problem, improve band the structure of push rod 108
Deck using effect.
Optionally, multiple pin Pins 1031, pin 1032, pin 1033 ... pin 103n include stretching out in metal
Earth mat pin 1031 on the outside of the edge of housing 102, its function is connected with earth mat.Draw with earth mat the outer surface of overflow launder 106
Pin 1031 is contacted, upper surface and the movable contact of push rod 108 of overflow launder.Additionally, the lower surface and circuit substrate of insulator foot 101
PCB is contacted, and the lower surface of metal shell 102 fastens to form draw-in groove 104 with the upper surface of insulator foot 101, the opening of overflow launder 106
Point to metal shell 102.Therefore, during SMT, rosin is flowed directly into excessive by the position of pad 107 along metal shell 102
Chute 106.
Optionally, the upper surface of overflow launder 106 sets chamfering 1061, as shown in Fig. 1 c and Fig. 2, the drainage of overflow launder 106
The upper surface of side is provided with arc angling 1061, wherein, drainage side is the side that overflow launder 106 is contacted with pin 1031, chamfering
It is set greater than 90 °.Therefore during SMT crosses stove, rosin flows from top to bottom along metal shell 102, due to overflow launder 106
Surface is provided with chamfering 1061, accelerates the speed that rosin flows to overflow launder 106, and improve the smoothness of backflow.
Optionally, the drainage side of overflow launder 106 sets opening 1062, similar with chamfering 1061, and opening 1062 is same to accelerate
Rosin flows to the speed of overflow launder 106, and improves the smoothness of backflow.Needs are said, based on opening 1062 beneficial to rosin
Flooding process, opening 1062 can be arranged on the optional position of drainage side, and the size of opening 1062 can also arbitrarily be set, for example
Using drainage side all as opening 1062, also it is not limited herein.
Optionally, in order to accommodate the rosin of more accumulation, it is ensured that rosin does not overflow to the gap of draw-in groove 104 or push rod 108
In, the length of the length not less than pin 1031 of overflow launder 106.It should be noted that the above embodiment of the present invention is at insulation bottom
When 101 structures of seat cannot meet the length requirement of overflow launder 106, the length of overflow launder 106 might be less that the length of pin 1031
Degree, is not limited herein.
Additionally, the planarization in order to ensure insulator foot 101, the depth setting no more than insulator foot 101 of overflow launder 106
Thickness, be not limited herein.
A kind of deck provided in an embodiment of the present invention, including metal shell, insulator foot and multiple pin, metal shell with
Insulator foot fastens to form draw-in groove up and down, and draw-in groove is used to place and blocks, and pin stretches out in the edge or insulator foot of metal shell
Edge, the edge inner side of insulator foot is provided with least one overflow launder, and overflow launder is correspondingly arranged with the pin.It is of the invention real
The deck of example offer is applied when deck crosses stove in SMT flows, the rosin in scolding tin on deck pin is heated along the gold of deck
Gap in the middle of category housing and insulator foot enters overflow launder, and stove was contained by the overflow launder on the inside of the edge of insulator foot
The rosin of process overflow, improves the smoothness and efficiency of the operating process of card insertion deck, it is ensured that the using effect of deck.
The present invention is the flow with reference to method according to embodiments of the present invention, equipment (system) and computer program product
Figure and/or block diagram are described.It should be understood that every first-class during flow chart and/or block diagram can be realized by computer program instructions
The combination of flow and/or square frame in journey and/or square frame and flow chart and/or block diagram.These computer programs can be provided
The processor of all-purpose computer, special-purpose computer, Embedded Processor or other programmable data processing devices is instructed to produce
A raw machine so that produced for reality by the instruction of computer or the computing device of other programmable data processing devices
The system of the function of being specified in present one flow of flow chart or multiple one square frame of flow and/or block diagram or multiple square frames.
These computer program instructions may be alternatively stored in can guide computer or other programmable data processing devices with spy
In determining the computer-readable memory that mode works so that instruction of the storage in the computer-readable memory is produced and include finger
Make the manufacture of system, the instruction system realize in one flow of flow chart or multiple one square frame of flow and/or block diagram or
The function of being specified in multiple square frames.
These computer program instructions can be also loaded into computer or other programmable data processing devices so that in meter
Series of operation steps is performed on calculation machine or other programmable devices to produce computer implemented treatment, so as in computer or
The instruction performed on other programmable devices is provided for realizing in one flow of flow chart or multiple flows and/or block diagram one
The step of function of being specified in individual square frame or multiple square frames.
, but those skilled in the art once know basic creation although preferred embodiments of the present invention have been described
Property concept, then can make other change and modification to these embodiments.So, appended claims are intended to be construed to include excellent
Select embodiment and fall into having altered and changing for the scope of the invention.
It should be noted that in the embodiment of the present invention, " on " above and below D score correspondence picture, " left side " " right side " correspondingly
The left side and right side of device in picture, " inner side " refers to the face inside device in picture, and " outside " refers in picture outside device
The face in portion, the embodiment of the present invention is only example effect.
, but those skilled in the art once know basic creation although preferred embodiments of the present invention have been described
Property concept, then can make other change and modification to these embodiments.So, appended claims are intended to be construed to include excellent
Select embodiment and fall into having altered and changing for the scope of the invention.
Obviously, those skilled in the art can carry out various changes and modification without deviating from essence of the invention to the present invention
God and scope.So, if these modifications of the invention and modification belong to the scope of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to comprising these changes and modification.
Claims (10)
1. a kind of deck, it is characterised in that including metal shell, insulator foot and multiple pins;
The metal shell fastens to form draw-in groove up and down with the insulator foot, and the draw-in groove is used to place card;The pin is stretched
The edge at edge or the insulator foot for the metal shell;
The edge inner side of the insulator foot is provided with least one overflow launder, and the overflow launder is correspondingly arranged with the pin.
2. deck as claimed in claim 1, it is characterised in that the pin is electrically connected with the pad on circuit substrate, described
The outer surface of overflow launder is connected with the pin.
3. deck as claimed in claim 2, it is characterised in that also including push rod, the default edge inner side of the insulator foot
Guide rail is set, and the push rod is slidably mounted in the guide rail;The push rod is stuck in motion in the draw-in groove described in driving;It is described
Lower surface of the upper surface of overflow launder less than the push rod.
4. deck as claimed in claim 3, it is characterised in that the multiple pin includes stretching out in the side of the metal shell
Earth mat pin on the outside of edge, the outer surface of the overflow launder contacts with the earth mat pin, the upper surface of the overflow launder and institute
State push rod movable contact.
5. deck as claimed in claim 4, it is characterised in that the insulator foot lower surface is contacted with the circuit substrate,
The metal shell lower surface fastens to form draw-in groove with the insulator foot upper surface, and the gold is pointed in the opening of the overflow launder
Category housing.
6. the deck as described in any one of claim 2~5, it is characterised in that the upper surface of the overflow launder sets chamfering.
7. deck as claimed in claim 6, it is characterised in that the upper surface of the drainage side of the overflow launder sets arc and falls
Angle, the drainage side is the side that the overflow launder is contacted with the pin, and the chamfering is more than 90 °.
8. the deck as described in any one of claim 2~5, it is characterised in that the drainage side of the overflow launder sets opening, institute
It is the side that the overflow launder is contacted with the pin to state drainage side.
9. the deck as described in any one of Claims 1 to 5, it is characterised in that the length of the overflow launder is drawn not less than described
The length of pin.
10. the deck as described in any one of Claims 1 to 5, it is characterised in that the depth of the overflow launder is less than the insulation
The thickness of base.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611246757.4A CN106785526B (en) | 2016-12-29 | 2016-12-29 | Card seat |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611246757.4A CN106785526B (en) | 2016-12-29 | 2016-12-29 | Card seat |
Publications (2)
Publication Number | Publication Date |
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CN106785526A true CN106785526A (en) | 2017-05-31 |
CN106785526B CN106785526B (en) | 2022-06-21 |
Family
ID=58929119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201611246757.4A Active CN106785526B (en) | 2016-12-29 | 2016-12-29 | Card seat |
Country Status (1)
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CN (1) | CN106785526B (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2744006Y (en) * | 2004-09-29 | 2005-11-30 | 瀚宇电子股份有限公司 | Plate-to-plate connector |
US20060076410A1 (en) * | 2004-10-13 | 2006-04-13 | Sheng-Ching Ko | Card reading device |
CN201112662Y (en) * | 2007-09-29 | 2008-09-10 | 富士康(昆山)电脑接插件有限公司 | Electronic card connector |
JP2009117329A (en) * | 2007-11-07 | 2009-05-28 | Chant Sincere Co Ltd | Cover lift-up type memory card connector |
CN201270300Y (en) * | 2008-07-04 | 2009-07-08 | 富港电子(东莞)有限公司 | Electric connector |
CN203288877U (en) * | 2013-04-26 | 2013-11-13 | 富士康(昆山)电脑接插件有限公司 | Electronic card connector |
CN206564348U (en) * | 2016-12-29 | 2017-10-17 | 西安易朴通讯技术有限公司 | A kind of deck |
-
2016
- 2016-12-29 CN CN201611246757.4A patent/CN106785526B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2744006Y (en) * | 2004-09-29 | 2005-11-30 | 瀚宇电子股份有限公司 | Plate-to-plate connector |
US20060076410A1 (en) * | 2004-10-13 | 2006-04-13 | Sheng-Ching Ko | Card reading device |
CN201112662Y (en) * | 2007-09-29 | 2008-09-10 | 富士康(昆山)电脑接插件有限公司 | Electronic card connector |
JP2009117329A (en) * | 2007-11-07 | 2009-05-28 | Chant Sincere Co Ltd | Cover lift-up type memory card connector |
CN201270300Y (en) * | 2008-07-04 | 2009-07-08 | 富港电子(东莞)有限公司 | Electric connector |
CN203288877U (en) * | 2013-04-26 | 2013-11-13 | 富士康(昆山)电脑接插件有限公司 | Electronic card connector |
CN206564348U (en) * | 2016-12-29 | 2017-10-17 | 西安易朴通讯技术有限公司 | A kind of deck |
Also Published As
Publication number | Publication date |
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CN106785526B (en) | 2022-06-21 |
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