CN106783678A - The recognition methods of lead frame unit, lead frame bar and packaging body - Google Patents
The recognition methods of lead frame unit, lead frame bar and packaging body Download PDFInfo
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- CN106783678A CN106783678A CN201611121846.6A CN201611121846A CN106783678A CN 106783678 A CN106783678 A CN 106783678A CN 201611121846 A CN201611121846 A CN 201611121846A CN 106783678 A CN106783678 A CN 106783678A
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- lead frame
- frame unit
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- mark
- supporting part
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention is the recognition methods on lead frame unit, lead frame bar and packaging body.The recognition methods of the lead frame unit that one embodiment of the invention is provided is included：Lead frame unit to be identified is provided；Determine the position of all mark parts on the lead frame unit；All mark parts are combined in the positional information on lead frame unit to obtain position identification information, the position code that the position identification information is provided with predefined coding rule is associated；Position code indicates lead frame unit in the position on lead frame bar；And determine position code so as to recognize lead frame unit in the position on lead frame bar.The embodiment of the present invention can effectively determine position of the lead frame unit in lead frame bar, determine the regularity of distribution of lead frame unit of problems in lead frame bar.Compare prior art and saved manpower and time, reduce cost, improve efficiency.
Description
Technical field
Recognition methods, lead frame bar and packaging body the present invention relates to lead frame unit.
Background technology
There are several lead frame units for the lead frame bar of quad flat non-pin package (QFN).Work as wire
When there are quality problems in frame unit, it is impossible to determine the residing position in lead frame bar of lead frame unit of problems
Put, i.e., cannot determine the regularity of distribution of lead frame unit of problems in lead frame bar.Accordingly, it would be desirable to ancillary cost is big
The manpower of amount and time determine the regularity of distribution to carry out experimental design (hereinafter referred to as " DOE "), and high cost, efficiency is low.
Thus, need the recognition methods that a kind of lead frame unit is provided and the lead frame bar for being available for this kind of method to recognize badly
And packaging body, determine the regularity of distribution of lead frame unit of problems in lead frame bar to replace extra DOE, from
And reduces cost.
The content of the invention
An object of the present invention is to provide the recognition methods of a lead frame unit, and it can determine that lead frame unit
The location of in lead frame bar.
The second object of the present invention is to provide the lead frame bar and packaging body that are available for this kind of method identification.
An embodiment of the invention, the recognition methods of a lead frame unit, it is included：Wire to be identified is provided
Frame unit；Determine the position of all mark parts on the lead frame unit；All mark parts are combined on lead frame unit
Positional information to obtain position identification information, the position code that the position identification information is provided with predefined coding rule
It is associated；The position code indicates lead frame unit in the position on lead frame bar；And determine position code so as to know
Other lead frame unit is in the position on lead frame bar.
In another embodiment of the invention, the recognition methods of the lead frame unit is further led comprising predefined instruction
The flag information of the row and column positional information of each lead frame unit on wire frame wire frame bar, each flag information is indicated
The value of each significance bit in position code.The significance bit of predefined position code is 4.Predefined lead frame unit
Flag information in four support bars indicated by each is for determining the value of one in significance bit, wherein flag letter
Breath is determined by the position grouping of at least position of a mark part or all mark parts on respective support bar；Or predefined lead frame
Per the flag information indicated by the pin of side for determining the value of one in significance bit in four side pins of frame unit, its
Middle flag information is determined by the position grouping of at least position of a mark part or all mark parts on corresponding side pin.Mark
Portion is projection or depression.Support bar has the first supporting part and the second supporting part；First supporting part is coupled to lead frame unit
Carrier, the second supporting part is connected by the first supporting part with carrier；Mark part is arranged on the second supporting part.
A lead frame bar is additionally provided according to another embodiment of the present invention, and it includes several lead frame units；
The lead frame unit is included：Carrier, support bar, some pins and an at least mark part.The carrier is configured to carry
Integrated circuit to be packaged；The support bar is extended between the edge and carrier of lead frame unit；Several pins around
Carrier is extended around, and is configured to be electrically connected to integrated circuit to be packaged；An at least mark part is arranged on support bar
It is upper with least one of pin and be configured for use in identification lead frame unit in the position on lead frame bar.
A packaging body is additionally provided according to another embodiment of the present invention, and it is manufactured by above-mentioned lead frame bar.
The recognition methods of lead frame unit provided in an embodiment of the present invention, can effectively determine lead frame unit in
Position in lead frame bar, therefore, it is possible to determine the regularity of distribution of lead frame unit of problems in lead frame bar.
Compare to be analyzed by DOE and determine the regularity of distribution, saved manpower and time, reduce cost, improve efficiency.
Brief description of the drawings
It is the floor map of lead frame bar according to an embodiment of the invention shown in Fig. 1
It is a floor map for lead frame unit that the lead frame bar in Fig. 1 is included shown in Fig. 2
It is that the plane of the second supporting part of the support bar in the upper left corner positioned at lead frame unit in Fig. 2 is put shown in Fig. 3
Big figure
It is the floor map of lead frame bar according to another embodiment of the present invention shown in Fig. 4
It is as shown in Figure 5 a floor map for lead frame unit that the lead frame bar in Fig. 4 is included
It is as shown in Figure 6 the floor map of the packaging body according to one embodiment of invention
Specific embodiment
Spirit for a better understanding of the present invention, makees furtherly below in conjunction with part preferred embodiment of the invention to it
It is bright.
Embodiment 1
It is the floor map of lead frame bar 100 according to an embodiment of the invention shown in Fig. 1.As shown in figure 1, wire
Sheth 100 includes several lead frame units 10.
It is a floor map for lead frame unit 10 that the lead frame bar 100 in Fig. 1 is included shown in Fig. 2.
As shown in Fig. 2 lead frame unit 10 is included：Carrier 12, support bar 14, several pins 16, and at least one
Mark part 20.Wherein, carrier 12 is configured to carry circuit (not shown) to be packaged.Support bar 14 extends lead frame
Between the edge and carrier 12 of frame unit 10, so that the carrier 12 kept enough stabilizations before singulation process treatment
Property.In the present embodiment, one end being connected with carrier 12 of support bar 14 is provided with the first supporting part 142, and extends lead frame
The other end at the edge of frame unit 10 is then provided with the second supporting part 144.Several extending around around carrier 12 of pin 16,
And can be configured the circuit to be packaged that carrier 12 is carried on to be electrically connected to.At least a mark part 20 is arranged on support bar 14
And can be configured and recognized with by the recognition methods of the lead frame unit 10 of one embodiment of the invention.
Specifically, in the present embodiment, at least one mark part 20 is provided in the support bar 14 of lead frame unit 10
On an at least projection 22.In other embodiments, at least one mark part 20 can also be provided in lead frame unit
At least one depression on 10 support bar 14.The all positional informations of at least projection 22 on support bar 14 are given into group
Close so as to obtain the lead frame unit 10 in the position identification information on lead frame bar 100, the position identification information can enter
One step is encoded to the position code M of the position of the instruction lead frame unit 10 according to predefined coding rule.Thus, lead
Positional information of at least projection 22 on support bar 14 set on different conductor frame unit 10 on wire frame bar 100
Combination is different, and it is also different according to the position code M that predefined coding rule coding is obtained.
For Fig. 1, the lead frame unit 10 of 2 illustrated embodiments, lead frame according to an embodiment of the invention is used
The recognition methods of unit 10 is included：Determine the position of all mark parts 20 on lead frame unit 10.Combine the lead frame list
The positional information of all mark parts 20 is obtaining the position identification information of the lead frame unit 10, location recognition letter in unit 10
Ceasing the position code M provided with predefined coding rule be associated, and position code M instructions lead frame unit 10 in
Position on lead frame bar 100.After position code M associated therewith is determined according to above-mentioned position identification information
Identify lead frame unit 10 in the position on lead frame bar 100 according to predefined coding rule.
In the present embodiment, it is contemplated that the number of the lead frame unit 10 on common lead frame bar 100, predefine
Coding rule provide each position code M be respectively provided with four significance bits (ABCD), indicate one by each position code M
Lead frame unit 10 is in the position on lead frame bar 100.The value of each significance bit of position code M is by instruction wire
Each flag information of the row and column positional information of each lead frame unit 10 determines on wire sheth 100.For example it is directed to
Lead frame bar 100 as shown in Figure 1, the first two significance bit (AB) of each position code M indicates a lead frame unit 10
In the line number (for example, the 01st row, 12 rows, 57 rows etc.) on lead frame article 100, and latter two significance bit (CD) indicates the wire
Frame unit 10 is in the columns (for example, the 01st row, 09 row, 15 row etc.) on lead frame article 100.For example, leading in Fig. 1
The position of lead frame unit 10a in wire frame article 100 in lead frame article 100 is the 01st row, the 01st row, associated
Position code M is 0101.Certainly in other embodiments, predefined coding rule also can be using rear the two of position code M
Position indicating line number and front two indicate the mode of columns, or according to the quantity of lead frame unit 10 to the digit of position code M
Adjusted with indicated positional information, these are all that those skilled in the art are based on the teaching of the application and enlightenment to be thought
Arrive.
It is the second supporting part 144a of the support bar 14 in the upper left corner positioned at lead frame unit 10 in Fig. 2 shown in Fig. 3
Enlarged plan view.
According to above-mentioned predefined coding rule, it is respectively provided with four support bars 14 of each lead frame unit 10
One projection 22, the flag information in four support bars 14 of lead frame unit 10 indicated by each is used to determine one
The value of significance bit, wherein flag information are determined by the position of the mark part 20 on each support bar 14, i.e. projection 22.So as to
So that flag information of each projection 22 of each lead frame unit 10 on four support bars 14 is respectively according to predefined
Coding rule be encoded to the significance bit (i.e. A, B, C or D) of each position code M.
As shown in figure 3, as a example by positioned at the support bar 14 in the upper left corner of lead frame unit 10, according to predefined coding
Rule, by a projection 22a in four projections 22 of each lead frame unit 10 support bar 14 the second supporting part
Different 10 position on 144a is separately encoded the significance bit A for " 0-9 " for numerical value.Wherein, the projection 22a institutes that solid line is represented
Positional representation A values be " 0 ", the position where remaining the 9 projection 22a being represented by dashed line represent successively A values be " 1-
9”.By that analogy, by the projection 22 on the second supporting part 144 of the other three support bar 14 of each lead frame unit 10
10 different positions are separately encoded significance bit B, C and D for " 0-9 " for numerical value.
It is convex to four on the support bar 14 on lead frame unit 10 using conventional identification instrument, such as high-power microscope
Block 22 is identified, and determines that four projections 22, in the position on the second supporting part 14, combine these positional informations to obtain respectively
To the position identification information of the lead frame unit 10.For example, as shown in Fig. 2 comply with order left-to-right, from top to bottom, can
The significance bit A that projection 22 on the support bar 14 for respectively obtaining is represented is 5, significance bit B is 7, significance bit C be 1, and significance bit
D is 5.Then determine that the position code M that predefined coding rule associated therewith is provided is according to the position identification information
5715, so as to identify the lead frame unit 10 in the position on lead frame article 100 be the 57th row, the 15th row (such as Fig. 1 institutes
Show).
It has been observed that in other embodiments, it is also possible to the quantity of the lead frame unit 10 in lead frame bar 100
To adjust predefined coding rule, such as line number of the lead frame unit 10 in lead frame bar 100 or columns increases, makes a reservation for
Number in the position code M that the coding rule of justice is provided for indicating line number or the significance bit of columns increases.Conversely, position generation
Number in code M for indicating line number or the significance bit of columns is reduced.The number increase of the significance bit in code M can be by each
The flag information number of the mark part 20 set on lead frame unit 10, such as projection or depression increases and realizes so that
Mark part 20 is in more diversity in lead frame unit 10, such as the flag information combination on support bar 14.In some embodiments
In, mark part 20 as one kind of flag information can will be also not provided with, so as to increase the flag letter of lead frame unit 10
The diversity of breath.
Using the recognition methods of above-mentioned lead frame unit 10, can effectively determine lead frame unit 10 in lead frame
Position in frame bar 100, the distribution therefore, it is possible to determine the lead frame unit 10 of problems in lead frame bar 100 is advised
Rule.Compare to be analyzed by DOE and determine the regularity of distribution, saved manpower and time, reduce cost, improve efficiency.
Embodiment 2
It is the floor map of lead frame bar 300 according to another embodiment of the present invention shown in Fig. 4.As shown in figure 4, leading
Wire frame bar 300 includes several lead frame units 30.
It is a floor map for lead frame unit 30 that the lead frame bar 300 in Fig. 4 is included shown in Fig. 5.
As shown in figure 5, lead frame unit 30 is included：Carrier 32, support bar 34, several pins 36, and at least one
Mark part 40.Wherein, carrier 32 is configured to carry circuit (not shown) to be packaged.Support bar 34 extends lead frame
Between the edge and carrier 32 of frame unit 30, so that the carrier 32 kept enough stabilizations before singulation process treatment
Property.In the present embodiment, one end that support bar 34 is connected with carrier 32 is provided with the first supporting part 342, and extends lead frame
The other end at the edge of unit 30 is then provided with the second supporting part 344.Several extending around around carrier 32 of pin 36, and
Can be configured the circuit to be packaged that carrier 32 is carried on to be electrically connected to.At least a mark part 40 is arranged on pin 36 and can
It is configured to be recognized by the recognition methods of the lead frame unit 30 of one embodiment of the invention.
Specifically, in the present embodiment, at least one mark part 40 is provided on the pin 36 of lead frame unit 30
At least one depression 42.In other embodiments, at least one mark part 40 can also be provided in lead frame unit 30
Pin 36 at least one projection.42 positional information on pin 36 of all depressions on the lead frame unit 30 is given
To combine so as to the lead frame unit 30 can be obtained in the position identification information on lead frame bar 300, location recognition letter
Breath can further be encoded to the position code M of the position of the instruction lead frame unit 30 according to predefined coding rule.
Thus, at least one set 42 position on pin 36 of depression on the different conductor frame unit 30 on lead frame bar 300
It is different to put information combination, and it is also different according to the position code M that predefined coding rule coding is obtained.
For Fig. 4 and the lead frame unit 30 of embodiment illustrated in fig. 5, lead frame according to an embodiment of the invention is used
The recognition methods of frame unit 30 is included：Determine the position of all mark parts 40 on lead frame unit 30；Combine all mark parts
40 in the positional information on lead frame unit 30 obtaining the position identification information of the lead frame unit 30, the location recognition
The position code M that information is provided with predefined coding rule is associated, and position code M indicates lead frame unit 30
Position on lead frame bar 300.After position code M associated therewith is determined according to above-mentioned position identification information i.e.
According to predefined coding rule lead frame unit 30 can be identified in the position on lead frame bar 300.
In the present embodiment, equally according to the number of the lead frame unit 30 on common lead frame bar 300, predefine
Each position code M that provides of coding rule there are four significance bits (ABCD), led by each position code M
Wire frame unit 30 is in the position on lead frame bar 300.The value of each of position code M is by instruction lead frame wire frame
Each flag information of the row and column positional information of each lead frame unit 30 determines on frame bar 300.For example it is directed to such as Fig. 4 institutes
The lead frame bar 300 for showing, the first two significance bit (AB) of each position code M indicates a lead frame unit 30 in lead frame
Line number (for example, the 01st row, 12 rows, 57 rows etc.) on frame article 300, and latter two significance bit (CD) indicates the lead frame unit
30 in the columns (for example, the 01st row, 09 row, 15 row etc.) on lead frame article 300.In other words, the four of lead frame unit 30
In side pin 36 per side pin indicated by flag information be used to determine the value of one in significance bit, and flag information
Determined by the position grouping of the mark part 40 on every side pin 36.For example, leading in lead frame bar 300 in Fig. 4
Positions of the wire frame unit 30a in lead frame article 300 is the 01st row, the 07th row, and associated position code M is
0107.Equally, in other embodiments also can using position code M rear two indicating line numbers and front two indicate columns side
Formula, or the digit and indicated positional information of position code M are adjusted according to the quantity of lead frame unit 30, these
All it is that teaching and enlightenment institute of the those skilled in the art based on the application are thinkable.
According to above-mentioned predefined coding rule, by be recessed 42 every side of lead frame unit 30 some pins 36
In arranging situation be encoded to the significance bit (i.e. A, B, C or D) of each position code M.Specifically, depression 42 can led
Different 10 kind arranging situation in some pins 36 of every side of wire frame unit 30 is separately encoded as numerical value is " 0-9 "
One significance bit.
As shown in figure 5, by taking some pins 36 of the upside 38a of lead frame unit 30 as an example, pin 36 is provided with depression
42 situation is labeled as x, and the situation without depression 42 on pin 36 is labeled as y, upside 38a of the depression 42 in lead frame unit 30
Six pins 36 in arranging situation, i.e. flag information is that xxxxxx (takes order for from left to right, left and right in the present embodiment
Both sides are for from top to bottom), A values can be determined for " 0 " according to the flag information, remaining 9 kinds of flag information represents that A takes successively
It is " 1-9 " to be worth, as shown in Table 1.
Table one
| Arranging situation | The numerical value of significance bit A |
| xxxxxx | 0 |
| xxxxyx | 1 |
| xxxyxx | 2 |
| xxyxxx | 3 |
| xyxxxx | 4 |
| xxxyyx | 5 |
| xxyxyx | 6 |
| xyyxxx | 7 |
| xyxyxx | 8 |
| xyxxyx | 9 |
By that analogy, by depression 42 in another three side of lead frame unit 30, such as right side 38b, downside 38c, left side 38d
Different 10 kind arranging situation in some pins 36 is separately encoded significance bit B, C and D for " 0-9 " for numerical value.Such as Fig. 5 institutes
Show, in the present embodiment, the position code M of the lead frame unit 30 is 0105.Certainly, in other embodiments, can set only
The arranging situation of four pins 36 rather than side whole pin 36 per side is considered, as long as it is " 0-9 " to meet number range
It is required that.
Similar, using conventional identification instrument, such as high-power microscope, the depression 42 on lead frame unit 30 is known
Not, and depression is determined 42 in the position on pin 36, combine these positional informations to obtain depression 42 in lead frame unit 30
Each side some pins 36 in arranging situation, so as to obtain the position identification information of the lead frame unit 30.Then root
The position code M that predefined coding rule associated therewith is provided is determined according to the position identification information, so as to identify this
Lead frame unit 30 is in the position on lead frame bar 300.For embodiment illustrated in fig. 5, by the lead frame unit 30
Position code M0105, may recognize that its position on lead frame article 300 for the 1st row, the 5th row (as shown in Figure 4).
It is as shown in Figure 6 the floor map of the packaging body 50 according to one embodiment of invention, its usable previous embodiment
The lead frame bar 300 and lead frame unit 30 of displaying are manufactured.
As shown in fig. 6, packaging body 50 comprising carrier 32, support bar 34, several pins 36, an at least mark part 40,
The integrated circuit 52 and the plastic packaging housing 54 of masking integrated circuit 52 carried by carrier 32.Support bar 34 extends packaging body
Between 50 edge and carrier 32, so that the carrier 32 kept enough stability before singulation process treatment.This reality
In applying example, one end that support bar 34 is connected with carrier 32 is provided with the first supporting part 342, and extend the edge of packaging body 50
The other end is then provided with the second supporting part 344.Several extending around around carrier 32 of pin 36, and it is configured to electrical connection
To the integrated circuit 52 for being carried on carrier 32.At least a mark part 40 is arranged on pin 36 and can be configured with of the invention
The recognition methods of the lead frame unit 30 of above-described embodiment is recognized.Specifically, in the present embodiment, at least one mark part
40 are provided at least one depression 42 on the pin 36 of packaging body 50.In other embodiments, at least one mark part 40
At least one projection on the pin 36 of packaging body 50 can also be provided in.
It is similar using conventional identification instrument, such as high-power microscope, can equally recognize be arranged on it is recessed on pin 36
Fall into 42.Therefore, even if plastic packaging forms packaging body 50 to lead frame unit 30, still can be using above-mentioned lead frame unit 30
Recognition methods determines position of the lead frame unit 30 in lead frame bar 300, and then can determine lead frame bar 300
In lead frame unit 30 of problems the regularity of distribution.Compare to be analyzed by DOE and determine the regularity of distribution, saved people
Power and time, cost is reduced, improve efficiency.
It is explanation essence place of the invention that above-described embodiment is only, rather than is only used for limiting the scope of the present invention.Such as this
Art personnel are to understand, and the method to set up and codified rule of the mark part 20 in embodiment 1 may be equally applied to
The second supporting part 144 may not be defined on pin 36 or other positions, or be arranged on simultaneously on support bar and pin, need to only expired
The ranks numerical requirements of sufficient coding rule requirement.For example, for there are 10 lead frame units of pin every side,
10 identification positions of mark part can be provided per side.Or for there are 5 lead frame units of pin every side, often
5 pins of side recognize that position cooperation is same and can reach identifying purpose with 4 on a support bar.And in another embodiment
In, can be to the setting of the mark part on support bar using the similar method taught with embodiment 2, by determining at each
Whether four positions on strut are provided with mark part, and such as projection or depression is realized 10 on each support bar (0 ... 9)
The identification requirement of numerical value.Specifically, being expressed as x to be provided with mark part, without y is then expressed as, such as four positions are all without mark part
(i.e. xxxx), then the significance bit value is 0, and such as the last has (i.e. xxxy), then the significance bit value is 1, the like.
The recognition methods of lead frame unit provided in an embodiment of the present invention, can effectively determine lead frame unit in
Position in lead frame bar, the distribution therefore, it is possible to determine the lead frame unit of problems in lead frame bar is advised
Rule.Compare to be analyzed by DOE and determine the regularity of distribution, saved manpower and time, reduce cost, improve efficiency.
Technology contents of the invention and technical characterstic have revealed that as above, but those of ordinary skill in the art still may base
Make a variety of replacements and modification without departing substantially from spirit of the present invention in teachings of the present invention and announcement.Therefore, protection model of the invention
Enclose the content that should be not limited to disclosed in embodiment, and should include various without departing substantially from replacement of the invention and modification, and be this patent
Application claims are covered.
Claims (11)
1. a kind of recognition methods of lead frame unit, it is included：
Lead frame unit to be identified is provided；
Determine the position of all mark parts on the lead frame unit；
All mark parts are combined in the positional information on the lead frame unit to obtain position identification information, institute's rheme
Putting the position code that identification information provides with predefined coding rule is associated；The position code indicates the lead frame
Frame unit is in the position on lead frame bar；And
The position code is determined so as to recognize the lead frame unit in the position on the lead frame bar.
2. the recognition methods of lead frame unit according to claim 1, it further indicates lead frame comprising predefined
The flag information of the row and column positional information of each lead frame unit on wire frame bar, each flag information indicates described
The value of each significance bit in position code.
3. the recognition methods of lead frame unit according to claim 2, it is further included：
The significance bit for predefining the position code is 4；
The flag information in four support bars of the predefined lead frame unit indicated by each is for true
The value of one in the fixed significance bit, wherein position of the flag information by least mark part on respective support bar
Or the position grouping of all mark parts determines.
4. the recognition methods of lead frame unit according to claim 2, it is further included：
The significance bit for predefining the position code is 4；
Predefine the flag information in four side pins of the lead frame unit indicated by per side pin for
The value of one in the significance bit is determined, wherein position of the flag information by least mark part on corresponding side pin
Put or the position grouping of all mark parts determines.
5. the recognition methods of lead frame unit according to claim 1, wherein the mark part is projection or depression.
6. the recognition methods of lead frame unit according to claim 3, wherein the support bar has the first supporting part
With the second supporting part；First supporting part is coupled to the carrier of the lead frame unit, and second supporting part passes through
First supporting part is connected with the carrier；The mark part is arranged on second supporting part.
7. a kind of lead frame bar, it includes several lead frame units；The lead frame unit is included：
Carrier, it is configured to carry integrated circuit to be packaged；
Between support bar, its edge and the carrier for extending the lead frame unit；
Several pins, it is extended around around the carrier, and is configured to be electrically connected to the integrated electricity to be packaged
Road；And
An at least mark part, it is arranged at least one of the support bar and the pin above and is configured for use in identification
The lead frame unit is in the position on the lead frame bar.
8. lead frame bar according to claim 7, wherein the support bar has four, at least mark part difference
It is arranged on four support bars, and at least position grouping of the position of a mark part or all mark parts on each support bar
For determining the flag information indicated by the support bar, the flag information is used to determine to indicate the lead frame unit
Position position code a value for significance bit.
9. lead frame bar according to claim 8, wherein the support bar has the first supporting part and the second supporting part；
, coupled to the carrier of the lead frame unit, second supporting part is by the first supporting part and institute for first supporting part
State carrier connection；An at least mark part is arranged on second supporting part.
10. lead frame bar according to claim 7, wherein an at least mark part is separately positioned on the lead frame
On four side pins of frame unit, the position grouping per at least position of a mark part or all mark parts on the pin of side determines
Flag information indicated by the side pin, the flag information is used to determine the position of the instruction lead frame unit
One value of significance bit of position code.
A kind of 11. packaging bodies, it is manufactured by according to one of claim 7-10 described lead frame bar.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011406056.9A CN112563167A (en) | 2016-12-08 | 2016-12-08 | Lead frame unit identification method, lead frame strip and packaging body |
| CN201611121846.6A CN106783678A (en) | 2016-12-08 | 2016-12-08 | The recognition methods of lead frame unit, lead frame bar and packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN112345975A (en) * | 2019-07-22 | 2021-02-09 | 深圳市创能亿科科技开发有限公司 | Wire identification system and method |
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| CN101471328A (en) * | 2007-12-25 | 2009-07-01 | 力成科技股份有限公司 | Substrate panel |
| CN101587878A (en) * | 2008-05-19 | 2009-11-25 | 力成科技股份有限公司 | Chip bearing device and chip packaging array |
| CN102800656A (en) * | 2011-05-20 | 2012-11-28 | 精材科技股份有限公司 | Chip package, method for forming the same, and package wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US8999752B1 (en) * | 2007-03-30 | 2015-04-07 | Cypress Semiconductor Corporation | Semiconductor packaging identifier |
| JP2011029405A (en) * | 2009-07-24 | 2011-02-10 | Toppan Printing Co Ltd | Position identification mark and semiconductor integrated circuit |
| JP2013069741A (en) * | 2011-09-21 | 2013-04-18 | Renesas Electronics Corp | Lead frame, semiconductor device, method for manufacturing lead frame and method for manufacturing semiconductor device |
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| CN101471328A (en) * | 2007-12-25 | 2009-07-01 | 力成科技股份有限公司 | Substrate panel |
| CN101587878A (en) * | 2008-05-19 | 2009-11-25 | 力成科技股份有限公司 | Chip bearing device and chip packaging array |
| CN102800656A (en) * | 2011-05-20 | 2012-11-28 | 精材科技股份有限公司 | Chip package, method for forming the same, and package wafer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112345975A (en) * | 2019-07-22 | 2021-02-09 | 深圳市创能亿科科技开发有限公司 | Wire identification system and method |
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