CN112563167A - Lead frame unit identification method, lead frame strip and packaging body - Google Patents
Lead frame unit identification method, lead frame strip and packaging body Download PDFInfo
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- CN112563167A CN112563167A CN202011406056.9A CN202011406056A CN112563167A CN 112563167 A CN112563167 A CN 112563167A CN 202011406056 A CN202011406056 A CN 202011406056A CN 112563167 A CN112563167 A CN 112563167A
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013401 experimental design Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The application relates to a lead frame unit identification method, a lead frame strip and a packaging body. An embodiment of the present invention provides a method for identifying a lead frame unit, including: providing a lead frame element to be identified; determining the positions of all the marks on the lead frame unit; combining the position information of all the markers on the lead frame unit to obtain position identification information, wherein the position identification information is associated with a position code provided by a predefined coding rule; the position code indicates a position of the lead frame unit on the lead frame strip; and determining a position code to identify the position of the lead frame element on the lead frame strip. The embodiment of the invention can effectively determine the position of the lead frame unit in the lead frame strip and determine the distribution rule of the lead frame unit with problems in the lead frame strip. Compared with the prior art, the method saves labor and time, reduces cost and improves efficiency.
Description
Related information of divisional application
This application is a divisional application. The parent application of this division is an invention patent application having an application date of 2016, 12/month, 08, and an application number of "201611121846.6", entitled "method for identifying lead frame elements, lead frame strip, and package.
Technical Field
The invention relates to a lead frame unit identification method, a lead frame strip and a packaging body.
Background
A leadframe strip for a quad flat non-leaded package (QFN) has a number of leadframe cells. When a quality problem occurs in the lead frame units, the positions of the lead frame units with problems in the lead frame strips cannot be determined, that is, the distribution rules of the lead frame units with problems in the lead frame strips cannot be determined. Therefore, it takes a lot of additional labor and time to perform experimental design (hereinafter referred to as "DOE") to determine the distribution rule, which is costly and inefficient.
Accordingly, it is desirable to provide a lead frame unit identification method, and a lead frame strip and a package identified by the method, to replace an additional DOE to determine the distribution rule of the lead frame units having problems in the lead frame strip, thereby reducing the cost.
Disclosure of Invention
It is an object of the present invention to provide a method of identifying lead frame elements that determines where the lead frame elements are located in a lead frame strip.
It is a further object of the present invention to provide lead frame strips and packages that can be identified by such methods.
According to an embodiment of the present invention, a method for identifying a lead frame unit includes: providing a lead frame element to be identified; determining the positions of all the marks on the lead frame unit; combining the position information of all the markers on the lead frame unit to obtain position identification information, wherein the position identification information is associated with a position code provided by a predefined coding rule; the position code indicating a position of the lead frame element on the lead frame strip; and determining a position code to identify the position of the lead frame element on the lead frame strip.
In another embodiment of the present invention, the method of identifying lead frame elements further comprises predefining identification bit information indicative of row and column position information for each lead frame element on the lead frame strip, each identification bit information indicative of a value of a respective significant bit in the position code. The valid bits of the predefined position code are 4 bits. Predefining identification bit information indicated by each of the four support bars of the lead frame unit for determining a value of one of the active bits, wherein the identification bit information is determined by a position of at least one identification portion or a combination of positions of all identification portions on the corresponding support bar; or predefining identification bit information indicated by each pin on four sides of the lead frame unit for determining the value of one of the effective bits, wherein the identification bit information is determined by the position of at least one identification part on the corresponding pin or the position combination of all the identification parts. The identification portion is a bump or a depression. The supporting rod is provided with a first supporting part and a second supporting part; the first supporting part is coupled to the bearing plate of the lead frame unit, and the second supporting part is connected with the bearing plate through the first supporting part; the mark part is arranged on the second support part.
There is also provided in accordance with another embodiment of the present invention a lead frame strip including a plurality of lead frame elements; the lead frame unit includes: the device comprises a bearing plate, a supporting rod, a plurality of pins and at least one identification part. The carrier tray is configured to carry an integrated circuit to be packaged; the supporting rod extends between the edge of the lead frame unit and the bearing disc; the pins extend around the periphery of the bearing disc and are configured to be electrically connected to an integrated circuit to be packaged; the at least one identification portion is disposed on at least one of the support bar and the pin and configured for identifying a position of the lead frame unit on the lead frame strip.
There is also provided, in accordance with another embodiment of the present invention, a package fabricated from the leadframe strip.
The method for identifying the lead frame units provided by the embodiment of the invention can effectively determine the positions of the lead frame units in the lead frame strips, so that the distribution rule of the lead frame units with problems in the lead frame strips can be determined. Compared with the method for determining the distribution rule through DOE analysis, the method saves labor and time, reduces cost and improves efficiency.
Drawings
Fig. 1 is a schematic plan view of a lead frame strip according to an embodiment of the invention
Fig. 2 is a schematic plan view of a lead frame element included in the lead frame strip of fig. 1
Fig. 3 is an enlarged plan view of the second support part of the support bar in fig. 2, which is located at the upper left corner of the lead frame unit
Fig. 4 is a schematic plan view of a lead frame strip according to another embodiment of the invention
Fig. 5 is a schematic plan view of a lead frame element included in the lead frame strip of fig. 4
FIG. 6 is a schematic plan view of a package according to an embodiment of the invention
Detailed Description
In order that the spirit of the invention may be better understood, some preferred embodiments of the invention are described below.
Example 1
Fig. 1 is a schematic plan view of a lead frame strip 100 according to an embodiment of the invention. As shown in fig. 1, the lead frame strip 100 comprises a number of lead frame elements 10.
Fig. 2 is a schematic plan view of one lead frame element 10 comprised by the lead frame strip 100 of fig. 1.
As shown in fig. 2, the lead frame unit 10 includes: the support device comprises a bearing plate 12, a support rod 14, a plurality of pins 16 and at least one identification part 20. The tray 12 is configured to carry a circuit (not shown) to be packaged. Support bars 14 extend between the edge of the lead frame unit 10 and the carrier tray 12 to maintain sufficient stability of the carrier tray 12 prior to the singulation process. In this embodiment, one end of the supporting rod 14 connected to the carrier tray 12 is provided with a first supporting portion 142, and the other end extending to the edge of the lead frame unit 10 is provided with a second supporting portion 144. A number of pins 16 extend around the perimeter of the carrier tray 12 and may be configured to electrically connect to a circuit to be packaged carried on the carrier tray 12. At least one identification feature 20 is disposed on the support bar 14 and is configured to be identified by a method of identifying the lead frame unit 10 according to an embodiment of the invention.
Specifically, in this embodiment, the at least one identification feature 20 is at least one tab 22 disposed on the support bar 14 of the lead frame unit 10. In other embodiments, the at least one identification 20 may also be at least one recess provided on the support bar 14 of the lead frame element 10. All position information of the at least one bump 22 on the support bar 14 is combined to obtain position identification information of the lead frame element 10 on the lead frame strip 100, which may further be encoded according to predefined encoding rules as a position code M indicating the position of the lead frame element 10. Thus, the combination of the position information on the support bar 14 of at least one bump 22 provided on different lead-frame elements 10 on the lead-frame strip 100 is different, as is the position code M encoded according to the predefined encoding rule.
With respect to the lead frame unit 10 of the embodiment shown in fig. 1 and 2, an identification method using the lead frame unit 10 according to an embodiment of the invention includes: the positions of all the markers 20 on the lead frame element 10 are determined. The position information of all the markers 20 on the lead frame element 10 is combined to obtain position identification information of the lead frame element 10, which is associated with a position code M provided by predefined coding rules, which position code M indicates the position of the lead frame element 10 on the lead frame strip 100. After determining the position code M associated therewith based on the position identification information, the position of the lead frame element 10 on the lead frame strip 100 is identified based on the predefined coding rules.
In the present embodiment, the predefined coding rules provide each position code M with four significant bits (ABCD) by which the position of a lead frame element 10 on the lead frame strip 100 is indicated, taking into account the usual number of lead frame elements 10 on the lead frame strip 100. The value of each valid bit of the position code M is determined by identification bit information indicating the row and column position information of each lead frame element 10 on the lead frame strip 100. For example, for the lead frame strip 100 shown in fig. 1, the first two significant bits (AB) of each position code M indicate the number of rows (e.g., 01 th row, 12 th row, 57 th row, etc.) of a lead frame unit 10 on the lead frame strip 100, and the last two significant bits (CD) indicate the number of columns (e.g., 01 th column, 09 th column, 15 th column, etc.) of the lead frame unit 10 on the lead frame strip 100. For example, the lead frame unit 10a in the lead frame strip 100 in fig. 1 is located in the 01 th row and the 01 th column of the lead frame strip 100, and the associated location code M is 0101. Of course, in other embodiments, the predefined encoding rules may be implemented by indicating the number of rows by the last two digits of the position code M and the number of columns by the first two digits, or by adjusting the number of digits of the position code M and the indicated position information according to the number of lead frame units 10, as will be appreciated by those skilled in the art based on the teachings and teachings of the present application.
Fig. 3 is an enlarged plan view of the second support portion 144a of the support bar 14 located at the upper left corner of the lead frame unit 10 in fig. 2.
According to the above-mentioned predefined coding rule, a bump 22 is provided on each of the four support bars 14 of each lead frame element 10, and the identification bit information indicated by each of the four support bars 14 of the lead frame element 10 is used to determine the value of a valid bit, wherein the identification bit information is determined by the position of the bump 22, i.e. the identification portion 20 on each support bar 14. So that the identification bit information of each lug 22 of each lead-frame element 10 on the four supporting bars 14 is encoded according to a predefined coding rule into one significant bit (i.e. A, B, C or D) of each position code M, respectively.
As shown in fig. 3, taking the support bar 14 located at the upper left corner of the lead frame elements 10 as an example, one bump 22a of the four bumps 22 of each lead frame element 10 is coded as a valid bit a with a value of "0-9" at different 10 positions on the second support part 144a of the support bar 14, respectively, according to a predefined coding rule. The position of the bump 22a indicated by the solid line indicates that a takes a value of "0", and the positions of the remaining 9 bumps 22a indicated by the dotted line sequentially indicate that a takes a value of "1 to 9". By analogy, the different 10 positions of the bumps 22 on the second support 144 of the other three support bars 14 of each lead frame element 10 are coded as the valid bits B, C and D, respectively, having the value "0-9".
The four bumps 22 on the support bars 14 of the lead frame unit 10 are identified using conventional identification equipment, such as a high power microscope, and the positions of the four bumps 22 on the second support portion 14 are determined, respectively, and the position information is combined to obtain the position identification information of the lead frame unit 10. For example, as shown in fig. 2, the valid bit a, the valid bit B, the valid bit C and the valid bit D of the bump 22 on the supporting bar 14 are 5, 7, 1 and 5 respectively, in the order from left to right and from top to bottom. The position code M provided by the predefined coding rule associated with the position identification information is then determined to be 5715, thereby identifying the position of the lead frame element 10 on the lead frame strip 100 as row 57 and column 15 (as shown in fig. 1).
As mentioned before, in other embodiments, the predefined coding rules may also be adjusted according to the number of lead frame elements 10 in the lead frame strip 100, such as an increase in the number of rows or columns of lead frame elements 10 in the lead frame strip 100, the predefined coding rules providing an increase in the number of significant bits in the position code M indicating the number of rows or columns. Conversely, the number of valid bits in the position code M for indicating the number of rows or columns is reduced. The increased number of valid bits in the code M may be achieved by increasing the number of flag bits, such as bumps or pits, of the flag 20 disposed on each lead frame unit 10, so that the combination of flag bits on the lead frame units 10, such as the support bars 14, by the flag 20 is more versatile. In some embodiments, the absence of the flag 20 may also be used as one type of flag information, thereby increasing the variety of flag information for the lead frame unit 10.
With the above-described method of identifying the lead frame elements 10, the positions of the lead frame elements 10 in the lead frame strip 100 can be determined efficiently, and thus the distribution regularity of the lead frame elements 10 having problems in the lead frame strip 100 can be determined. Compared with the method for determining the distribution rule through DOE analysis, the method saves labor and time, reduces cost and improves efficiency.
Example 2
Fig. 4 is a schematic plan view of a lead frame strip 300 according to another embodiment of the invention. As shown in fig. 4, the lead frame strip 300 comprises several lead frame elements 30.
Fig. 5 is a schematic plan view of one lead frame element 30 comprised by the lead frame strip 300 of fig. 4.
As shown in fig. 5, the lead frame unit 30 includes: the support device comprises a bearing plate 32, a support rod 34, a plurality of pins 36 and at least one identification part 40. The tray 32 is configured to carry a circuit (not shown) to be packaged. Support bars 34 extend between the edge of the lead frame unit 30 and the carrier plate 32 to maintain sufficient stability of the carrier plate 32 prior to the singulation process. In this embodiment, a first supporting portion 342 is disposed at one end of the supporting rod 34 connected to the supporting tray 32, and a second supporting portion 344 is disposed at the other end extending to the edge of the lead frame unit 30. A number of pins 36 extend around the periphery of the carrier tray 32 and may be configured to electrically connect to a circuit to be packaged carried on the carrier tray 32. At least one identification portion 40 is disposed on the lead 36 and is configured to be identified by the identification method of the lead frame unit 30 according to an embodiment of the invention.
Specifically, in this embodiment, the at least one marking 40 is at least one depression 42 disposed on the lead 36 of the lead frame element 30. In other embodiments, the at least one identification feature 40 may also be at least one bump disposed on the lead 36 of the lead frame element 30. The positional information of all the recesses 42 on the lead 36 of the lead frame element 30 is combined to obtain the positional identification information of the lead frame element 30 on the lead frame strip 300, which may further be encoded according to predefined encoding rules into a position code M indicating the position of the lead frame element 30. Thus, the combination of position information on the leads 36 of at least one recess 42 provided on different lead frame elements 30 on the lead frame strip 300 is different, as is the position code M encoded according to the predefined encoding rule.
With respect to the lead frame units 30 of the embodiments shown in fig. 4 and 5, an identification method using the lead frame unit 30 according to an embodiment of the invention includes: determining the position of all of the markers 40 on the lead frame element 30; the position information of all the markers 40 on the lead frame elements 30 is combined to obtain position identification information of the lead frame elements 30, which is associated with a position code M provided by the predefined coding rules, which position code M indicates the position of the lead frame element 30 on the lead frame strip 300. After determining the position code M associated therewith based on the position identification information, the position of the lead frame element 30 on the lead frame strip 300 can be identified according to the predefined coding rule.
In the present embodiment, again depending on the number of lead frame elements 30 on the common lead frame strip 300, the predefined coding rules provide each position code M with four significant bits (ABCD), by which the position of a lead frame element 30 on the lead frame strip 300 is indicated. The value of each bit of the position code M is determined by identification bit information indicating the row and column position information of each lead frame element 30 on the lead frame strip 300. For example, for the lead frame strip 300 shown in fig. 4, the first two significant bits (AB) of each position code M indicate the number of rows (e.g., 01 th row, 12 th row, 57 th row, etc.) of a lead frame element 30 on the lead frame strip 300, and the last two significant bits (CD) indicate the number of columns (e.g., 01 th column, 09 th column, 15 th column, etc.) of the lead frame element 30 on the lead frame strip 300. In other words, the identification bit information indicated by each of the four side pins 36 of the lead frame unit 30 is used to determine the value of one of the valid bits, and the identification bit information is determined by the combination of the positions of the identification portions 40 on each of the side pins 36. For example, the lead frame unit 30a in the lead frame strip 300 in fig. 4 is located in row 01 and column 07 in the lead frame strip 300, and the associated location code M is 0107. Similarly, the last two digits of the position code M may indicate the number of rows and the first two digits may indicate the number of columns in other embodiments, or the number of digits of the position code M and the indicated position information may be adjusted according to the number of lead frame units 30, as will be appreciated by those skilled in the art based on the teachings and teachings of the present application.
The arrangement of the recesses 42 in the plurality of leads 36 on each side of the lead frame element 30 is encoded as a valid digit (i.e., A, B, C or D) of each position code M according to the predefined encoding rules described above. Specifically, the different 10 permutations of the recesses 42 in the plurality of leads 36 on each side of the lead frame element 30 may be encoded as a valid bit having a value of "0-9", respectively.
As shown in fig. 5, taking the plurality of pins 36 on the upper side 38a of the lead frame unit 30 as an example, the case where the pins 36 are provided with the recesses 42 is marked as x, the case where the pins 36 are not provided with the recesses 42 is marked as y, and the arrangement of the recesses 42 in the six pins 36 on the upper side 38a of the lead frame unit 30, that is, the flag information is xxxxxx (in this embodiment, the sequence is from left to right, and the left and right sides are from top to bottom), it can be determined that a takes a value of "0" according to the flag information, and the remaining 9 types of flag information sequentially indicate that a takes a value of "1-9", as shown in table one.
Watch 1
| Arrangement of conditions | The value of the significant |
| xxxxxx | |
| 0 | |
| xxxxyx | 1 |
| xxxyxx | 2 |
| xxyxxx | 3 |
| xyxxxx | 4 |
| xxxyyx | 5 |
| xxyxyx | 6 |
| xyyxxx | 7 |
| xyxyxx | 8 |
| xyxxyx | 9 |
By analogy, different 10 permutations of the recesses 42 in the leads 36 on the other three sides of the lead frame element 30, e.g., right side 38b, lower side 38c, left side 38D, are encoded as valid bits B, C and D, respectively, having values of "0-9". As shown in fig. 5, in the present embodiment, the position code M of the lead frame unit 30 is 0105. Of course, in other embodiments, it may be set to consider only four pins 36 on each side rather than the arrangement of all the pins 36 on that side, as long as the requirement of a numerical range of "0-9" is met.
Similarly, the position identifying information for the lead frame unit 30 is obtained by identifying the recesses 42 in the lead frame unit 30 using conventional identifying equipment, such as a high power microscope, and determining the positions of the recesses 42 on the leads 36, and combining the position information to obtain the arrangement of the recesses 42 in the leads 36 on each side of the lead frame unit 30. The position code M provided by the predefined coding rule associated therewith is then determined based on the position identification information, thereby identifying the position of the lead frame element 30 on the lead frame strip 300. For the embodiment shown in fig. 5, the position of the lead frame unit 30 on the lead frame strip 300 can be identified as the 1 st row and the 5 th row (as shown in fig. 4) by the position code M0105.
Fig. 6 is a schematic plan view of a package 50 according to an embodiment of the invention, which can be manufactured using the leadframe strip 300 and the leadframe units 30 shown in the previous embodiments.
As shown in fig. 6, the package 50 includes a carrier tray 32, a support bar 34, a plurality of pins 36, at least one mark 40, an integrated circuit 52 carried by the carrier tray 32, and a plastic casing 54 covering the integrated circuit 52. The support bars 34 extend between the edge of the package 50 and the carrier tray 32 to maintain sufficient stability of the carrier tray 32 before the singulation process. In this embodiment, a first supporting portion 342 is disposed at one end of the supporting rod 34 connected to the carrier tray 32, and a second supporting portion 344 is disposed at the other end extending to the edge of the package 50. A number of pins 36 extend around the perimeter of carrier plate 32 and are configured to electrically connect to integrated circuits 52 carried on carrier plate 32. At least one identification feature 40 is disposed on the lead 36 and is configured to be identified by the method of identifying the lead frame unit 30 according to the above-described embodiment of the present invention. Specifically, in the present embodiment, the at least one mark 40 is at least one recess 42 disposed on the lead 36 of the package body 50. In other embodiments, the at least one identification portion 40 may also be at least one bump disposed on the pin 36 of the package body 50.
Similarly, the depressions 42 provided on the leads 36 can be identified using conventional identification equipment, such as a high power microscope. Therefore, even though the lead frame units 30 have been molded to form the package body 50, the positions of the lead frame units 30 in the lead frame strip 300 can be determined by using the recognition method of the lead frame units 30, and the distribution rule of the lead frame units 30 with problems in the lead frame strip 300 can be further determined. Compared with the method for determining the distribution rule through DOE analysis, the method saves labor and time, reduces cost and improves efficiency.
The above-mentioned embodiments are merely to explain the nature of the present invention and are not intended to limit the scope of the present invention. As will be understood by those skilled in the art, the method and the encoding rule of the mark 20 in embodiment 1 can be applied to the pins 36 or other positions without being limited to the second supporting portion 144, or to the supporting rods and pins at the same time, so long as the requirement of the encoding rule for the row and column values is satisfied. For example, for a lead frame unit having 10 leads on each side, each side may provide 10 identification locations for the identification feature. Or for a lead frame unit with 5 leads on each side, the identification can be achieved by matching the 5 leads on each side with 4 identification positions on one support bar. In yet another embodiment, the identification requirement of 10 (0 … … 9) values on each support bar can be achieved by determining whether the four positions on each support bar are provided with identification portions, such as bumps or depressions, in a similar manner to that taught in embodiment 2. Specifically, the identifier is set to represent x, otherwise, y, if no identifier exists at any of the four positions (i.e., xxxx), the valid bit takes the value of 0, if the last one exists (i.e., xxxy), the valid bit takes the value of 1, and so on.
The method for identifying the lead frame units provided by the embodiment of the invention can effectively determine the positions of the lead frame units in the lead frame strips, so that the distribution rule of the lead frame units with problems in the lead frame strips can be determined. Compared with the method for determining the distribution rule through DOE analysis, the method saves labor and time, reduces cost and improves efficiency.
While the foregoing has been with reference to the disclosure of the present invention, it will be appreciated by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention should not be limited to the disclosure of the embodiments, but should include various alternatives and modifications without departing from the invention, which are covered by the claims of the present patent application.
Claims (11)
1. A method of identifying a lead frame unit, comprising:
providing a lead frame element to be identified;
determining the positions of all identification parts on the lead frame unit;
combining the position information of all the identification portions on the lead frame unit to obtain position identification information, wherein the position identification information is associated with a position code provided by a predefined coding rule; the position code indicates a position of the lead frame element on a lead frame strip; and
determining the position code to identify the position of the lead frame element on the lead frame strip,
wherein the identification portion is disposed on at least one of a support bar and a pin of the lead frame unit.
2. The method of lead frame element identification of claim 1, further comprising predefining identification bit information indicative of row and column position information for each lead frame element on a lead frame strip, each identification bit information indicating a value of a respective significant bit in the position code.
3. The method of identifying a lead frame unit of claim 2, further comprising:
predefining the valid bit of the position code to be 4 bits;
predefining the identification bit information indicated by each of the four support bars of the lead frame unit for determining the value of one of the active bits, wherein the identification bit information is determined by the position of at least one identification portion or the combination of the positions of all identification portions on the corresponding support bar.
4. The method of identifying a lead frame unit of claim 2, further comprising:
predefining the valid bit of the position code to be 4 bits;
predefining the identification bit information indicated by each of the four sides of the lead frame element for determining a value of one of the valid bits, wherein the identification bit information is determined by a position of at least one identification portion or a combination of positions of all identification portions on the lead of the corresponding side.
5. The method of identifying a lead frame unit of claim 1, wherein the identification feature is a bump or a depression.
6. The lead frame unit identification method of claim 3, wherein the support bar has a first support portion and a second support portion; the first support part is coupled to a carrier tray of the lead frame unit, and the second support part is connected with the carrier tray through the first support part; the mark part is arranged on the second support part.
7. A lead frame strip comprises a plurality of lead frame units; the lead frame unit includes:
a carrier tray configured to carry an integrated circuit to be packaged;
a support bar extending between the edge of the lead frame unit and the bearing disc;
a plurality of pins extending around the periphery of the carrier tray and configured to be electrically connected to the integrated circuit to be packaged; and
at least one identification disposed on at least one of the support bar and the pins and configured for identifying a location of the leadframe unit on the leadframe strip.
8. The lead frame strip of claim 7, wherein there are four support bars, the at least one identification portion is disposed on each of the four support bars, and the position of the at least one identification portion or the combination of the positions of all the identification portions on each support bar is used to determine identification bit information indicated by the support bar, the identification bit information being used to determine the value of one significant bit of a position code indicating the position of the lead frame unit.
9. The lead frame strip of claim 8, wherein the support bar has a first support and a second support; the first support part is coupled to a carrier tray of the lead frame unit, and the second support part is connected with the carrier tray through the first support part; the at least one mark part is arranged on the second support part.
10. The lead frame strip of claim 7, wherein the at least one identification portion is disposed on each of the four side leads of the lead frame element, and the position of the at least one identification portion on each side lead or the combination of the positions of all identification portions determines identification bit information indicated by the side lead, the identification bit information being used to determine the value of one significant bit of a position code indicating the position of the lead frame element.
11. A package manufactured from a lead frame strip according to one of claims 7-10.
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| CN202011406056.9A CN112563167A (en) | 2016-12-08 | 2016-12-08 | Lead frame unit identification method, lead frame strip and packaging body |
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| CN201611121846.6A CN106783678A (en) | 2016-12-08 | 2016-12-08 | The recognition methods of lead frame unit, lead frame bar and packaging body |
| CN202011406056.9A CN112563167A (en) | 2016-12-08 | 2016-12-08 | Lead frame unit identification method, lead frame strip and packaging body |
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| CN101587878A (en) * | 2008-05-19 | 2009-11-25 | 力成科技股份有限公司 | Chip bearing device and chip packaging array |
| JP2011029405A (en) * | 2009-07-24 | 2011-02-10 | Toppan Printing Co Ltd | Position identification mark and semiconductor integrated circuit |
| CN102800656A (en) * | 2011-05-20 | 2012-11-28 | 精材科技股份有限公司 | Chip package, method for forming the same, and package wafer |
| US20130069214A1 (en) * | 2011-09-21 | 2013-03-21 | Renesas Electronics Corporation | Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device |
| US8999752B1 (en) * | 2007-03-30 | 2015-04-07 | Cypress Semiconductor Corporation | Semiconductor packaging identifier |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101471328B (en) * | 2007-12-25 | 2010-06-09 | 力成科技股份有限公司 | Substrate panel |
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2016
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|---|---|---|---|---|
| US8999752B1 (en) * | 2007-03-30 | 2015-04-07 | Cypress Semiconductor Corporation | Semiconductor packaging identifier |
| CN101587878A (en) * | 2008-05-19 | 2009-11-25 | 力成科技股份有限公司 | Chip bearing device and chip packaging array |
| JP2011029405A (en) * | 2009-07-24 | 2011-02-10 | Toppan Printing Co Ltd | Position identification mark and semiconductor integrated circuit |
| CN102800656A (en) * | 2011-05-20 | 2012-11-28 | 精材科技股份有限公司 | Chip package, method for forming the same, and package wafer |
| US20130069214A1 (en) * | 2011-09-21 | 2013-03-21 | Renesas Electronics Corporation | Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device |
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