CN106768520A - pressure sensor and preparation method thereof - Google Patents
pressure sensor and preparation method thereof Download PDFInfo
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- CN106768520A CN106768520A CN201611237468.8A CN201611237468A CN106768520A CN 106768520 A CN106768520 A CN 106768520A CN 201611237468 A CN201611237468 A CN 201611237468A CN 106768520 A CN106768520 A CN 106768520A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
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Abstract
The invention discloses a kind of pressure sensor and preparation method thereof, the pressure sensor includes two external electrodes and two resilient substrates of the tool being oppositely arranged, there is bulge-structure on the contact surface of at least one substrate, contact surface is the relative one side of two substrates, substrate is electric conductor, each substrate connects an external electrode, and the surface of bulge-structure is coated with conductive layer.So as to, both the piezoresistive effect that make use of elastic conduction substrate to produce deformation under pressure in itself and caused resistance to change, the effect that make use of the substrate conductive layers make contact area change on its bulge-structure surface under pressure again and cause contact resistance to change, pressure detecting range is greatly expanded by the synergy of the two, and in compared with the prior art between two substrates sandwiched circuit layer mode, its contact area change in bulge-structure deformation of conductive layer in the embodiment of the present invention is bigger, therefore sensitivity and the reliability of pressure sensor are further increased.
Description
Technical field
The present invention relates to sensor technical field, more particularly, to a kind of pressure sensor and preparation method thereof.
Background technology
Pressure sensor be it is a kind of can by transformation for stress for electrical signal electronic device, can be widely used for flexible touch screen,
The fields such as artificial intelligence, wearable electronic, portable medical.According to signal switching mechanism, pressure sensor is broadly divided into resistance-type
Sensor, capacitance type sensor and piezoelectric transducer.Wherein, the basic functional principle of resistive pressure sensor is to be tested
The change transitions of pressure are the change of the resistance value of sensor.Resistive pressure sensor is due to simple, electric with device architecture
Resistance signal stabilization is easily surveyed, sensitivity higher the advantages of receive much concern.
It is to improve transducer sensitivity, reliability to have that the electrod-array of resistive pressure sensor is carried out into micro-structural
One of effect approach.For example, proposing a kind of resistive pressure sensor with micro-structural in the prior art, it includes base
Bottom, lower substrate, body circuit layer and extraction electrode；Upper substrate and lower substrate are the elastic organic material of insulation, and it is simultaneously phase
With stereochemical structure, and the one side for having stereochemical structure is oppositely arranged；Body circuit layer is flexibility, conductive material is set thereon and is made
Conductive circuit layer；Body circuit layer is folded between substrate and lower substrate, and draws electricity respectively at the two ends of body circuit layer
Pole.When pressure acts on pressure sensor, the microstructured contact area of upper and lower substrate surface changes under pressure
And cause the resistance of body circuit layer therebetween to change, it is that can detect that pressure size by resistance variations, therefore have
Sensitivity higher.
But, although the sensitivity of the resistive pressure sensor with micro-structural is higher, but due to the change of micro-structural
Shape amount is smaller, therefore, it is possible to detection pressure limit also tend to it is smaller, so as to limit its range of application.
The content of the invention
The main purpose of the embodiment of the present invention is to provide a kind of pressure sensor and preparation method thereof, it is intended to solved existing
The less technical problem of the pressure detecting range of resistive pressure sensor in technology.
To achieve these objectives, a kind of pressure sensor is on the one hand proposed, the pressure sensor includes two external electrodes
With two resilient substrates of the tool being oppositely arranged, there is bulge-structure on the contact surface of at least one substrate, the contact surface is
The relative one side of two substrates, the substrate is electric conductor, and each substrate connects an external electrode, the table of the bulge-structure
Face is coated with conductive layer.
Alternatively, the substrate is that the elastomeric polymer base conduction being made by elastomeric polymer and conductive filler is combined
Material.
Alternatively, the elastomeric polymer based conductive composite material is by physical mechanical blending method, solution blended process or molten
Melt blending method to be prepared from.
Alternatively, the conductive filler include metal conductive powder, carbon conductive filler, the conductive filler of plating metal on surface,
One kind in bimetallic conductive filler or at least two.
Alternatively, the elastomeric polymer is silicon rubber, natural rubber, butadiene-styrene rubber, dimethyl silicone polymer, thermoplasticity
Polyurethane elastomer, styrenic elastomer, SIS or hydrogenated styrene-fourth two
Alkene block copolymer.
Alternatively, the conductive layer includes the one kind or extremely in gold, silver, copper, aluminium, nickel, palladium, platinum, carbon and indium tin oxide
Few two kinds of conductive materials.
Alternatively, the conductive layer is by any one method preparation in evaporation, chemical deposition, printing and coating
Into.
Alternatively, there is identical bulge-structure on two contact surfaces of substrate, and the contact surface of described two substrates is convex
Portion and convex portion are just pair or convex portion is just right with recess.
Alternatively, the substrate is flexible material, and thickness is 20 μm~1mm.
Alternatively, the thickness of the conductive layer is 5nm-500nm.
On the other hand, a kind of preparation method of pressure sensor is proposed, is the described method comprises the following steps：
Two resilient conductive substrates of tool are prepared, and has bulge-structure on the contact surface of at least one substrate；
A conductive layer is covered on the surface of the bulge-structure of substrate；
Folded after the contact surface of two substrates is mutually aligned and be buckled together, and connect an external electricity on each substrate
Pole.
Alternatively, the step of substrate of two tools of the preparation resilient conduction includes：
Elastomeric polymer and conductive filler are mixed into the mixture of flow morphology；
The mixture is deposited into the prefabricated template with sunk structure curing molding for elastomeric polymer base is led
Composite, the elastomeric polymer based conductive composite material is the resilient conductive substrate of the tool.
Alternatively, it is described elastomeric polymer and conductive filler are mixed into flow morphology mixture the step of include：Will
Elastomeric polymer is mixed by physical mechanical blending method, solution blended process or melt-blending process together with conductive filler as matrix
It is combined into the mixture of flow morphology.
It is alternatively, described that the mixture is deposited in the prefabricated template with sunk structure into curing molding is elasticity
The step of polymer base conductive composite material, includes：
Being deposited to the mixture by any one method in cast, spin coating, blade coating and silk-screen prefabricated is had
In the template of sunk structure；
Be heating and curing the mixture or conductive multiple after elastomeric polymer base after the mixture spontaneous curing, is shaped to
Condensation material.
Alternatively, the step of surface of the bulge-structure in substrate covers a conductive layer includes：By evaporation, chemistry
Any one method in deposition, printing and coating, a conductive layer is covered on the surface of the bulge-structure of substrate.
Alternatively, there is identical bulge-structure on two contact surfaces of substrate, the contact surface by two substrates is mutual
The step of being buckled together is folded after alignment to be included：After two convex portions of the contact surface of substrate are aligned with convex portion or convex portion with recess
It is folded to be buckled together.
A kind of pressure sensor that the embodiment of the present invention is provided, by setting a pair of resilient conductive substrates of tool,
And one layer of conductive layer is covered on the bulge-structure surface of substrate, both make use of elastic conduction substrate to produce under pressure in itself
Deformation and the piezoresistive effect that causes resistance to change, make use of the conduction on substrate its bulge-structure surface under pressure again
The effect that layer contact area changes and cause contact resistance to change, pressure is greatly expanded by the synergy of the two
Detection range, and compared with the prior art between two substrates sandwiched circuit layer mode, leading in the embodiment of the present invention
Electric layer in bulge-structure deformation the change of its contact area more greatly, therefore further increase the sensitivity of pressure sensor with can
By property.The pressure sensor structure of the embodiment of the present invention is simple, with low cost, easy to make, respond sensitive, pressure detecting range
Extensively, with good mechanical flexibility, it is adaptable to the emerging field such as wearable electronic, electronic skin, human-machine intelligence.
Brief description of the drawings
Fig. 1 is the structural representation of the pressure sensor of first embodiment of the invention；
Fig. 2 is the schematic diagram that the pressure sensor stress in Fig. 1 is deformed upon；
Fig. 3 is the another structural representation of the pressure sensor of the embodiment of the present invention；
Fig. 4 is the flow chart of the preparation method of the pressure sensor of second embodiment of the invention；
Fig. 5 is the flow chart of the step of preparing substrate in the embodiment of the present invention.
The realization of the object of the invention, functional characteristics and advantage will be described further referring to the drawings in conjunction with the embodiments.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
Embodiment one
Referring to Fig. 1, the pressure sensor of first embodiment of the invention is proposed, the pressure sensor includes two external electricity
The substrate 10 that pole 30 and two are oppositely arranged, the substrate 10 has elasticity and is electric conductor.As shown in figure 1, two substrates 10
There are miniature bulge-structure 11 (or micro-convex structure), two projections of substrate 10 on contact surface (the relative one side of two substrates)
Structure 11 is preferably identical structure, and bulge-structure 11 causes have convex portion and recess on contact surface, can be by two substrates 10
Contact surface convex portion and convex portion just to contacting, or can also convex portion with recess just to contacting.Cover on the surface of bulge-structure 11
Conductive layer 20 is stamped, each substrate 10 connects an external electrode 30, for connecting external circuit to test the sensor in pressure
The situation of change of the lower resistance/electric current of effect.
In the embodiment of the present invention, substrate 10 is the elastomeric polymer base being made by elastomeric polymer and conductive filler 12
Conducing composite material, the elastomeric polymer based conductive composite material can be by physical mechanical blending method, solution blended process, melting
The hybrid techniques such as blending method are prepared from, and are molded by the template with miniature sunk structure (or spill micro-structural).
The substrate 10 that the elastomeric polymer based conductive composite material is made is flexible material, and thickness is preferably 20 μm of -1mm, is capable of achieving curved
It is bent, fold, distortion, the mechanically deform such as stretching, it is adaptable to modern flexible electronics field, meet electronic device lightness,
Miniaturization, flexibility, the demand for development of wearableization.
Aforementioned flexible polymer can select silicon rubber, natural rubber (NR), butadiene-styrene rubber (SBR), polydimethylsiloxanes
(such as s-B-S block is total to for alkane (PDMS), TPUE (TPU), styrenic elastomer
Polymers (SBS)), SIS (SIS), hydrogenated styrene-butadiene block copolymer
(SEBS) any one in polymer such as.
Forgoing conductive fillers 12 including metal conductive powder (such as bronze, silver powder, copper powder, nickel powder), carbon conductive filler (such as
Carbon black, CNT, graphite, Graphene etc.), the conductive filler of plating metal on surface (such as：Fiberglass surfacing plating gold, silver, copper,
Nickel etc., polymer microballoon plated surface gold, silver, copper, nickel etc.), the one kind in bimetallic conductive filler (such as silver-colored copper-clad, nickel copper-clad)
Or at least two.
In other embodiments, it is also possible to directly to having resilient conductive material (such as conductive thermoplastic elastomer, conduction
Silicone elastomer etc.) it is processed (as being processed by MEMS (MEMS) technology) and is made surface with projection
The substrate 10 of structure 11.
Bulge-structure 11 on the contact surface of substrate 10, can be prism, pyramid, cylinder, pyrometric cone, pyramid, ball etc.
One kind or at least two combination in regular stereochemical structure or the irregular stereochemical structure such as curved protrusion, wavy, it is raised
The highly preferred of structure 11 is 200nm-200 μm.
The conductive layer 20 on the surface of bulge-structure 11 can be by any one in evaporation, chemical deposition, printing and coating
Method is prepared from, and the conductive layer 20 includes the one kind in gold, silver, copper, aluminium, nickel, palladium, platinum, carbon and indium tin oxide (ITO)
Or at least two conductive materials.The thickness of conductive layer 20 is preferably 5nm-500nm, is closely as one with bulge-structure, complete
Entirely change with the change in shape of bulge-structure, therefore sensitiveer to deformation, contact area change is bigger during deformation.
The outer surface (one side i.e. relative with contact surface) of the preferred connection substrate 10 of external electrode 30, external electrode 30 includes
One kind or at least two in goldleaf/line, silver foil/line, Copper Foil/line, aluminium foil/line.
The operation principle of the pressure sensor of the embodiment of the present invention is as follows：
As shown in Fig. 2 when external pressure F acts on pressure sensor, on the one hand, substrate 10 produces deformation, in pressure
Direction thickness diminishes, and causes the conductive filler 12 inside substrate 10 to narrow in the distance of pressure direction, and the plane side of substrate 10
To the effect due to pressure, its length and width size can become big, cause the conductive filler 12 inside substrate 10 in the transverse direction of in-plane
Distance broadens.Tunnel conduction theory according to composite conducting material understands that the change of the distance between conductive filler 12 will make to be combined
The resistance of material changes.Pressure size is different, and the change of the distance between conductive filler 12 is also different, and the resistance of generation changes
Also it is just different.
On the other hand, in the presence of external pressure F, the bulge-structure 11 of the contact surface of substrate 10 can produce obvious shape
Become, thus cause the contact area of the conductive layer 20 on the surface of bulge-structure 11 to change, and then between causing upper and lower substrate 10
Contact resistance changes.
The collective effect of said two devices so that resistance changes pressure sensor under pressure, by resistance
Situation of change is the size of can detect pressure.When pressure is removed, due to the elastic reaction of substrate 10, its deformation will then revert to as
Original state shown in Fig. 1, resistance also will then revert to initial value.
In an alternative embodiment, it is also possible to which bulge-structure 11 is only set on a contact surface for substrate 10.Such as Fig. 3 institutes
Show to have on the contact surface of upper substrate 10 on bulge-structure 11, and bulge-structure 11 and be coated with conductive layer 20, lower substrate 10 connects
There is no bulge-structure 11 in contacting surface, its contact surface can cover conductive layer 20, it is also possible to do not cover conductive layer 20.Although lower substrate
10 without bulge-structure 11, but lower substrate 10 is the resilient conductive material of tool, and deformation still can be produced during compression, and resistance is become
Change is contributed, and the sensitivity of sensor is still improve relative to prior art, expands pressure detecting range.
The pressure sensor of the embodiment of the present invention, by setting a pair of resilient conductive substrates 10 of tool, and in substrate
10 surface of bulge-structure 11 covers one layer of conductive layer 20, both make use of elastic conduction substrate 10 itself to produce under pressure
Deformation and the piezoresistive effect that causes resistance to change, make use of its surface of bulge-structure 11 under pressure of substrate 10 again
The effect that the contact area of conductive layer 20 changes and causes contact resistance to change, is greatly expanded by the synergy of the two
Pressure detecting range, and compared with the prior art between two substrates sandwiched circuit layer mode, the embodiment of the present invention
In conductive layer 20 in 11 deformation of bulge-structure the change of its contact area more greatly, therefore further increase pressure sensor
Sensitivity and reliability.The pressure sensor structure of the embodiment of the present invention is simple, with low cost, easy to make, respond sensitive, pressure
Power detection range is wide, with good mechanical flexibility, it is adaptable to the emerging field such as wearable electronic, electronic skin, human-machine intelligence.
Embodiment two
Reference picture 4, proposes the preparation method of the pressure sensor of second embodiment of the invention, and methods described includes following step
Suddenly：
S11, the resilient conductive substrates of two tools of preparation, and have bulge-structure on the contact surface of at least one substrate.
In this step S11, two elastic conduction substrates are prepared, and have bulge-structure on the contact surface of at least one substrate,
The contact surface is that most latter two substrate folds one side relative when being buckled together.
The embodiment of the present invention is preferred to prepare two substrates with identical bulge-structure, in other embodiments, two
Bulge-structure on substrate can also be differed, or have bulge-structure on only one of which substrate.It is convex on substrate contact face
It can be the regular stereochemical structure such as prism, pyramid, cylinder, pyrometric cone, pyramid, ball or curved protrusion, wavy to play structure
Etc. the one kind in irregular stereochemical structure or at least two combination, the highly preferred of bulge-structure is 200nm-200 μm.
The substrate of the embodiment of the present invention be elastomeric polymer based conductive composite material, its preparation method as shown in figure 5, including
Following steps：
S111, the mixture that elastomeric polymer and conductive filler are mixed into flow morphology.
In this step S111, elastomeric polymer as matrix can be blended together with conductive filler by physical mechanical
Method, solution blended process or melt-blending process etc. are mixed into the mixture of flow morphology, such as mixed solution, mixed slurry, compound
Deng.
Aforementioned flexible polymer can select silicon rubber, natural rubber (NR), butadiene-styrene rubber (SBR), polydimethylsiloxanes
(such as s-B-S block is total to for alkane (PDMS), TPUE (TPU), styrenic elastomer
Polymers (SBS)), SIS (SIS), hydrogenated styrene-butadiene block copolymer
(SEBS) any one in polymer such as.
Forgoing conductive fillers include metal conductive powder (such as bronze, silver powder, copper powder, nickel powder), carbon conductive filler (such as charcoal
Black, CNT, graphite, Graphene etc.), the conductive filler of plating metal on surface (such as：Fiberglass surfacing plating gold, silver, copper, nickel
Deng polymer microballoon plated surface gold, silver, copper, nickel etc.), the one kind in bimetallic conductive filler (such as silver-colored copper-clad, nickel copper-clad) or
At least two.
S112, mixture is deposited in the prefabricated template with sunk structure curing molding for elastomeric polymer base is led
Composite.
In this step S112, mixture is deposited to by methods such as cast, spin coating, blade coating, silk-screens first prefabricated
In template with sunk structure, after the solvent volatilization in be then heating and curing mixture or thing to be mixed after spontaneous curing, into
Type is a film for flexibility, and surface is then obtained after film is torn from template has the raised knot corresponding with sunk structure
The elastomeric polymer based conductive composite material of structure, i.e. surface have the flexible conductive substrates of bulge-structure.The flexible conductive substrates
Thickness be preferably 20 μm of -1mm, be capable of achieving bending, fold, distortion, stretching etc. mechanically deform, it is adaptable to modern flexible electronics produce
Product field, meets lightness, miniaturization, flexibility, the demand for development of wearableization of electronic device.
When needing to make the substrate without bulge-structure, then mixed using the templated deposition without sunk structure
Thing.
When elastomeric polymer based conductive composite material is prepared, conductive filler amount is preferably adjusted attached in its percolation threshold
Closely so that elastomeric polymer based conductive composite material is obtained in that piezoresistive effect high.Size, the shape of percolation threshold and conductive filler
The parameters such as looks, density are associated, and aforementioned parameters during specific implementation according to conductive filler determine.
In the embodiment of the present invention, the template with sunk structure can be prepared by the following method：
With silicon chip as substrate, by MEMS technology silicon chip surface preparing miniature array of recesses, the sunk structure
Can be the regular stereochemical structure such as prism, pyramid, cylinder, pyrometric cone, pyramid, ball or the non-rule such as concave curvatures, wavy
One kind then in stereochemical structure or at least two combination, the recess depths of sunk structure are preferably 200nm-200 μm.
In other embodiments, it is also possible to directly to having resilient conductive material (such as conductive thermoplastic elastomer, conduction
Silicone elastomer etc.) it is processed (be such as processed by MEMS technology) and being made surface has the substrate of bulge-structure.
S12, substrate bulge-structure surface cover a conductive layer.
In this step S12, can be by any one method in evaporation, chemical deposition, printing and coating, in substrate
The surface of bulge-structure covers a conductive layer, and the conductive layer includes gold, silver, copper, aluminium, nickel, palladium, platinum, carbon and indium tin oxide
In one kind or at least two conductive materials.The thickness of conductive layer is preferably 5nm-500nm.
S13, the contact surface of two substrates is mutually aligned after fold be buckled together, and on each substrate connect one it is external
Electrode.
In this step S13, when two contact surfaces of substrate all have bulge-structure, just there is convex portion and recessed on contact surface
Portion, then fold after two convex portions of the contact surface of substrate are aligned with convex portion or convex portion with recess and be buckled together, on two substrates
Bulge-structure contact with each other.And an external electrode is drawn on each substrate, for connecting external circuit to test the sensing
The situation of change of device resistance/electric current under pressure.Outer surface of the external electrode preferably from substrate is (i.e. relative with contact surface
Drawn on simultaneously), external electrode includes the one kind or at least two in goldleaf/line, silver foil/line, Copper Foil/line, aluminium foil/line.
By above method, finally produce a kind of with low cost, simple structure, it is easy to make, respond sensitive, test pressure
The pliable pressure sensor of power wide ranges.
The preparation method of the pressure sensor of the embodiment of the present invention will be described in detail by instantiation below：
Example 1：
(1) with silicon chip as substrate, the spherical pores array (sunk structure of semicircle is gone out in Surface machining of silicon wafer by MEMS technology
Array), its a diameter of 20 μm, be micro- template with the silicon chip after processing.
(2) silver strip from 1~10 μm of particle diameter is conductive filler, with dimethyl silicone polymer (PDMS) as matrix, will
PDMS prepolymers and its curing agent are well mixed with silver strip by mechanical agitation, obtain (the mixing of flow morphology of compliant conductive cream
Thing).PDMS prepolymers are 12 with the mass ratio of its curing agent:1~5:1, PDMS and its curing agent (gross mass of the two) with silver
The mass ratio of piece is 1:1~1:4.
(3) the compliant conductive cream for being made above-mentioned steps (2) is deposited on above-mentioned step by the method that mask plate scratches printing
Suddenly in the micro- template of silicon that (1) is made, 2 hours are heated by compliant conductive cream curing molding an as film with 80 DEG C, after solidification
Film is torn from the micro- template of silicon and just obtains the flexible conductive substrates with hemispherical projections structure.Substrate thickness can be by mask
The thickness of version is adjusted, and the thickness control of flexible conductive substrates is within 200 μm in this example.
(4) flexible conductive substrates that above-mentioned steps (3) are made are placed in evaporated device, the method using magnetron sputtering exists
The bulge-structure surface evaporation nm of gold electrically conductive layer of substrate, nm of gold thickness is 10nm, obtains the flexibility with conductive layer and leads
Electric substrate.
(5) there are the flexible conductive substrates of conductive layer to fold relatively two panels and is buckled together (hemispherical projections structure phase mutual connection
Touch), and the outer surface of upper and lower substrate each draw Copper Foil external electrode for connect external circuit use, that is, be made resistance-type soft
Property pressure sensor.
Example 2：
(1) with silicon chip as substrate, inverted triangle taper pores array (depression knot is gone out in Surface machining of silicon wafer by MEMS technology
Structure array), its depth is 100 μm, and a width of 100 μm of bottom surface, is micro- template with this silicon chip.
(2) it is conductive filler from the CNT that a diameter of 5~100nm, length are 2~30 μm, will with chloroform solvent
CNT is dispersed, obtains carbon nano tube dispersion liquid.With SBS (SBS) as base
Body, adds SBS pellets, stirring to obtain uniform composite mortar (fluid shape after being completely dissolved to SBS toward carbon nano tube dispersion liquid
The mixture of state).CNT is 1 with the mass ratio of SBS:19~1:4.
(3) composite mortar for being made above-mentioned steps (2) is deposited on the silicon that above-mentioned steps (1) are made by the method for spin coating
In micro- template, 24 hours natural film forming after chloroform volatilizees completely are stored at room temperature, film are torn from the micro- template of silicon and just obtains band
There are the flexible conductive substrates of triangular pyramidal bulge-structure.Substrate thickness can be entered by spin coating proceedings such as spin-coating time, spin speeds
Row regulation, the thickness control of flexible conductive substrates is within 500 μm in this example.
(4) flexible conductive substrates that above-mentioned steps (3) are made are placed in evaporated device, the method using magnetron sputtering exists
Bulge-structure surface evaporation Platinum Nanoparticles (Pt) electrically conductive layer of substrate, Pt thickness is 30nm, obtains the flexibility with conductive layer and leads
Electric substrate.
(5) two panels has the flexible conductive substrates of conductive layer are folded in opposite directions to be buckled together that (triangular pyramidal bulge-structure is mutual
Contact), and the outer surface of upper and lower substrate each draw silver wire external electrode for connect external circuit use, that is, be made resistance
Formula pliable pressure sensor.
Example 3：
(1) with silicon chip as substrate, reverse pyramid pores array (depression knot is gone out in Surface machining of silicon wafer by MEMS technology
Structure array), it is highly 2 μm, and bottom surface is wide 1 μm, and upper bottom surface is wide 4 μm, is micro- template with this silicon chip.
(2) carbon black from 10~100nm of particle diameter is conductive filler, and ultrasonic disperse carbon black nano particle is dissolved with toluene,
Obtain carbon black dispersion liquid.With TPUE (TPU) as matrix, TPU pellets are gradually added into toward carbon black dispersion liquid,
Stirring obtains uniform composite mortar (mixture of flow morphology) after being completely dissolved to TPU.Carbon black is 1 with the mass ratio of TPU:
9~1:3.
(3) materials cast with composite paste for being made above-mentioned steps (2) is in the micro- template of silicon that above-mentioned steps (1) are made, with 80
DEG C heating is volatilized toluene solvant in 4 hours clean and film forming completely, film is torn from the micro- template of silicon and just obtain with pyramid
The flexible conductive substrates of shape bulge-structure.Substrate thickness can be adjusted by the concentration of composite mortar with the volume of cast, this
The thickness control of flexible conductive substrates is within 50 μm in example.
(4) flexible conductive substrates that above-mentioned steps (3) are made are placed in evaporated device, the method using magnetron sputtering exists
The bulge-structure surface evaporation Nanometer Copper electrically conductive layer of substrate, nanometer copper thickness is 15nm, obtains the flexibility with conductive layer and leads
Electric substrate.
(5) there are the flexible conductive substrates of conductive layer to fold relatively two panels and is buckled together (pyramid micro-convex structure phase mutual connection
Touch), and the outer surface of upper and lower substrate each draw aluminum conductor external electrode for connect external circuit use, that is, be made resistance-type
Pliable pressure sensor.
It will be understood by those skilled in the art that these are only the example that the present invention is enumerated, and it is not so limited of the invention
The scope of the claims.
The preparation method of the pressure sensor of the embodiment of the present invention, by preparing the bullet for being capable of conduction with bulge-structure
Property substrate, and substrate bulge-structure surface make conductive layer, a kind of resistive pressure sensor is constructed based on this,
The resistance variations that the sensor produces piezoresistive effect are combined with the contact resistance variation of bulge-structure conductive layer, combine two
Person's advantage, therefore with sensitivity higher and broader pressure detecting range, meets the lightness of electronic device, miniature
Change, flexibility, the demand for development of wearableization.
In sum, the pressure sensor for being made using the above method, with advantages below：
1), with good flexibility, the mechanically deforms such as bending, folding, distortion, stretching are capable of achieving, it is adaptable to modern flexible
Electronics field；
2), resistance signal easily detects, easy-to-use；
3), simple structure, it is easy to make, it is with low cost；
4) the contact resistance effect of piezoresistive effect and micro-structural electrode, is combined, the sensitivity of sensor is improve, is expanded
Pressure detecting range, the regulation and control of sensor performance are capable of achieving by the design of material and structure.
Above by reference to the preferred embodiments of the present invention have been illustrated, not thereby limit to interest field of the invention.This
Art personnel do not depart from the scope of the present invention and essence, can have various flexible programs to realize the present invention, for example as one
The feature of individual embodiment can be used for another embodiment and obtain another embodiment.It is all to use institute within technology design of the invention
Any modification, equivalent and the improvement made, all should be within interest field of the invention.
Claims (20)
1. a kind of pressure sensor, including two external electrodes (30) and the two resilient substrate of tools being oppositely arranged (10),
There is bulge-structure (11) on the contact surface of at least one substrate (10), the contact surface is the relative one side of two substrates (10),
Characterized in that, the substrate (10) is electric conductor, each substrate (10) connects an external electrode (30), the bulge-structure
(11) surface is coated with conductive layer (20).
2. pressure sensor according to claim 1, it is characterised in that the substrate (10) is by elastomeric polymer and leads
The elastomeric polymer based conductive composite material that electric filler (12) is made.
3. pressure sensor according to claim 2, it is characterised in that the elastomeric polymer based conductive composite material leads to
Physical mechanical blending method, solution blended process or melt-blending process is crossed to be prepared from.
4. pressure sensor according to claim 2, it is characterised in that the conductive filler (12) is including metallic conduction
One kind or at least two in powder, carbon conductive filler, the conductive filler of plating metal on surface, bimetallic conductive filler.
5. pressure sensor according to claim 2, it is characterised in that the elastomeric polymer is silicon rubber, natural rubber
Glue, butadiene-styrene rubber, dimethyl silicone polymer, TPUE, styrenic elastomer, styrene-isoprene-
Styrene block copolymer or hydrogenated styrene-butadiene block copolymer.
6. the pressure sensor according to claim any one of 1-5, it is characterised in that the conductive layer (20) including gold,
One kind or at least two conductive materials in silver, copper, aluminium, nickel, palladium, platinum, carbon and indium tin oxide.
7. the pressure sensor according to claim any one of 1-5, it is characterised in that the conductive layer (20) is by steaming
Any one method in plating, chemical deposition, printing and coating is prepared from.
8. the pressure sensor according to claim any one of 1-5, it is characterised in that on two contact surfaces of substrate (10)
Have an identical bulge-structure (11), and the contact surface of described two substrates (10) convex portion and convex portion just pair or convex portion and recess
It is just right.
9. the pressure sensor according to claim any one of 1-5, it is characterised in that the substrate (10) is flexible material
Material, thickness is 20 μm~1mm.
10. the pressure sensor according to claim any one of 1-5, it is characterised in that the thickness of the conductive layer (20)
It is 5nm-500nm.
11. a kind of preparation methods of pressure sensor, it is characterised in that comprise the following steps：
Two resilient conductive substrates of tool are prepared, and has bulge-structure on the contact surface of at least one substrate；
A conductive layer is covered on the surface of the bulge-structure of substrate；
Folded after the contact surface of two substrates is mutually aligned and be buckled together, and connect an external electrode on each substrate.
The preparation method of 12. pressure sensors according to claim 11, it is characterised in that the preparation two has bullet
The step of conductive substrate of property, includes：
Elastomeric polymer and conductive filler are mixed into the mixture of flow morphology；
It is conductive multiple elastomeric polymer base that the mixture is deposited into curing molding in the prefabricated template with sunk structure
Condensation material, the elastomeric polymer based conductive composite material is the resilient conductive substrate of the tool.
The preparation method of 13. pressure sensors according to claim 12, it is characterised in that it is described by elastomeric polymer and
The step of conductive filler is mixed into the mixture of flow morphology includes：
Using elastomeric polymer as matrix, together with conductive filler by physical mechanical blending method, solution blended process or melting altogether
Mixed method is mixed into the mixture of flow morphology.
The preparation method of 14. pressure sensors according to claim 12, it is characterised in that described that the mixture sinks
The step of product is elastomeric polymer based conductive composite material to curing molding in the prefabricated template with sunk structure includes：
The mixture is deposited to by any one method in cast, spin coating, blade coating and silk-screen prefabricated with depression
In the template of structure；
Be heating and curing the mixture or after after the mixture spontaneous curing, be shaped to elastomeric polymer base conduction composite wood
Material.
The preparation method of 15. pressure sensors according to claim 12, it is characterised in that the conductive filler includes gold
One kind or at least two in category conducting powder, carbon conductive filler, the conductive filler of plating metal on surface, bimetallic conductive filler.
The preparation method of 16. pressure sensors according to claim 12, it is characterised in that the elastomeric polymer is silicon
Rubber, natural rubber, butadiene-styrene rubber, dimethyl silicone polymer, TPUE, styrenic elastomer, benzene second
Alkene-isoprene-styrene block copolymer or hydrogenated styrene-butadiene block copolymer.
The preparation method of 17. pressure sensor according to claim any one of 11-16, it is characterised in that described in lining
The step of surface of the bulge-structure at bottom covers a conductive layer includes：
By any one method in evaporation, chemical deposition, printing and coating, in the surface covering one of the bulge-structure of substrate
Conductive layer.
The preparation method of 18. pressure sensor according to claim any one of 11-16, it is characterised in that the conduction
Layer includes one kind or at least two conductive materials in gold, silver, copper, aluminium, nickel, palladium, platinum, carbon and indium tin oxide.
The preparation method of 19. pressure sensor according to claim any one of 11-16, it is characterised in that two substrates
Contact surface on there is identical bulge-structure, the contact surface by two substrates to be mutually aligned after fold and wrap the step of be buckled together
Include：
Folded after two convex portions of the contact surface of substrate are aligned with convex portion or convex portion with recess and be buckled together.
The preparation method of 20. pressure sensor according to claim any one of 11-16, it is characterised in that the conduction
The thickness of layer is 5nm-500nm.
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