CN106695176A - 一种焊膏用无卤免清洗助焊剂的制备方法 - Google Patents
一种焊膏用无卤免清洗助焊剂的制备方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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Abstract
本发明涉及一种焊膏用无卤免清洗助焊剂的制备方法,属于免清洗助焊剂技术领域。本发明首先配制复合有机酸活性剂,再用氢化松香包裹,过滤干燥后研磨过筛,制得松香包裹有机酸活性剂,最后将其与乳化剂OP‑10、苯并三氮唑等加入二乙二醇乙醚中分散均匀,再加入成膜物质和防腐剂,混合均匀后用纱布过滤,收集滤液,即得焊膏用无卤免清洗助焊剂,本发明采用有机酸活性剂制得的焊膏用无卤免清洗助焊剂,具有焊接性能优良,残留物少,对基板无腐蚀性,实现了免清洗的目的,不污染环境。
Description
技术领域
本发明涉及一种焊膏用无卤免清洗助焊剂的制备方法,属于免清洗助焊剂技术领域。
背景技术
助焊剂是电子电器行业中的一种重要的过程材料,其质量的好坏不仅影响到电子电器产品生产过程中的效率、合格率、成本等方面控制,而且对电子电器产品的后续长期可靠性起着关键作用。助焊剂是一种由多种原料均匀混合而成的物质,它主要是由溶剂、活化剂、成膜剂、表面活性剂等组成。当采用不同配比的原料、采用不同的制备方法,助焊剂将表现出不同的使用性能和长期可靠性。助焊剂的作用主要表现在:去除氧化物、降低被焊接材质表面张力、防止再氧化、辅助热传导、去除被焊接材质表面油污、增大焊接面积等几个方面。
免清洗助焊剂可以降低成本,缩短生产周期,减少生产工艺流程,具有重要的经济效益和社会效益,已成为电子行业发展的重要方向。但迄今的许多“免清洗”概念更多只侧重于确保电子产品的可靠性方面,环保因素方面考虑的还是不够。随着现代电子电器产品的不断发展,人们对免清洗助焊剂也提出了更为严格的要求。目前市场上的免清洗助焊剂往往存在储存时间短、焊后残留多,且大多助焊剂含有卤素,使得焊后的残留物有较大的腐蚀性等问题而无法满足更高的使用要求。
发明内容
本发明主要解决的技术问题是:针对传统免清洗助焊剂存在储存时间短、焊后残留多,且大多含有卤素,使得焊后的残留物有较大的腐蚀性的问题,提供了一种焊膏用无卤免清洗助焊剂的制备方法,本发明首先配制复合有机酸活性剂,再用氢化松香包裹,过滤干燥后研磨过筛,制得松香包裹有机酸活性剂,最后将其与乳化剂OP-10、苯并三氮唑等加入二乙二醇乙醚中分散均匀,再加入成膜物质和防腐剂,混合均匀后用纱布过滤,收集滤液,即得焊膏用无卤免清洗助焊剂,本发明采用有机酸活性剂制得的焊膏用无卤免清洗助焊剂,具有焊接性能优良,残留物少,对基板无腐蚀性,实现了免清洗的目的,不污染环境。
为了解决上述技术问题,本发明所采用的技术方案是:
(1)称取2~3g苹果酸,2~3g富马酸,2~4g二苯乙醇酸,与40~60mL去离子水混合,在50~60℃恒温水浴下,以300~400r/min搅拌10~15min,随后加入4~6mL丁二酸,2~4mL己二酸,2~5mL乙酸异丁酸蔗糖酯继续恒温搅拌15~20min,得复合有机酸活性剂;
(2)向上述复合有机酸活性剂中加入18~25g氢化松香,在75~80℃恒温水浴下,以300~400r/min搅拌3~4h,冷却至室温后过滤,将滤渣置于干燥箱中,在105~110℃下干燥至恒重,随后将滤渣转入研钵中研磨,过60目筛,得松香包裹有机酸活性剂;
(3)称取20~25g步骤(2)制备的松香包裹有机酸活性剂,0.1~0.3g乳化剂OP-10,0.1~0.2g苯并三氮唑,20~30mL无水乙醇,加入30~40mL二乙二醇乙醚中,加热至30~40℃,并以300~400r/min搅拌30~40min,随后加入5~10g聚乙烯醇,2.0~2.5g失水山梨醇单油酸酯,继续加热至70~80℃,并以500~600r/min搅拌1~2h,静置沉淀2~3h后,用5层纱布过滤,收集滤液,得焊膏用无卤免清洗助焊剂。
本发明的应用方法:将本发明制备的无卤免清洗助焊剂与无铅Sn3.0Ag0.5Cu焊锡粉按质量比1:8配成焊膏进行焊接,即可。经检测,利用本发明助焊剂制得的焊膏呈弱酸性,在保持较高活性的同时,焊点饱满,表面光亮,扩展率为82.5~85.5%,助焊剂在25~32℃下存储时间达到18~24个月、焊后残留物少,无腐蚀性,且本发明助焊剂符合无卤要求,适用性更广,应用潜力大。
本发明的有益效果是:
(1)本发明制得的焊膏用无卤免清洗助焊剂有焊接性能好、焊后可靠性高、存储时间长、焊后残留物少,且满足无卤要求,具有较大的实用价值;
(2)本发明制备的焊膏用无卤免清洗助焊剂,不含重金属,具有快干、焊点明亮牢固、无腐蚀性、润焊性优良且性能稳定的优点。
具体实施方式
称取2~3g苹果酸,2~3g富马酸,2~4g二苯乙醇酸,与40~60mL去离子水混合,在50~60℃恒温水浴下,以300~400r/min搅拌10~15min,随后加入4~6mL丁二酸,2~4mL己二酸,2~5mL乙酸异丁酸蔗糖酯继续恒温搅拌15~20min,得复合有机酸活性剂;向上述复合有机酸活性剂中加入18~25g氢化松香,在75~80℃恒温水浴下,以300~400r/min搅拌3~4h,冷却至室温后过滤,将滤渣置于干燥箱中,在105~110℃下干燥至恒重,随后将滤渣转入研钵中研磨,过60目筛,得松香包裹有机酸活性剂;称取20~25g松香包裹有机酸活性剂,0.1~0.3g乳化剂OP-10,0.1~0.2g苯并三氮唑,20~30mL无水乙醇,加入30~40mL二乙二醇乙醚中,加热至30~40℃,并以300~400r/min搅拌30~40min,随后加入5~10g聚乙烯醇,2.0~2.5g失水山梨醇单油酸酯,继续加热至70~80℃,并以500~600r/min搅拌1~2h,静置沉淀2~3h后,用5层纱布过滤,收集滤液,得焊膏用无卤免清洗助焊剂。
实例1
称取2g苹果酸,2g富马酸,2g二苯乙醇酸,与40mL去离子水混合,在50℃恒温水浴下,以300r/min搅拌10min,随后加入4mL丁二酸,2mL己二酸,2mL乙酸异丁酸蔗糖酯继续恒温搅拌15min,得复合有机酸活性剂;向上述复合有机酸活性剂中加入18g氢化松香,在75℃恒温水浴下,以300r/min搅拌3h,冷却至室温后过滤,将滤渣置于干燥箱中,在105℃下干燥至恒重,随后将滤渣转入研钵中研磨,过60目筛,得松香包裹有机酸活性剂;称取20g松香包裹有机酸活性剂,0.1g乳化剂OP-10,0.1g苯并三氮唑,20mL无水乙醇,加入30mL二乙二醇乙醚中,加热至30℃,并以300r/min搅拌30min,随后加入5g聚乙烯醇,2.0g失水山梨醇单油酸酯,继续加热至70℃,并以500r/min搅拌1h,静置沉淀2h后,用5层纱布过滤,收集滤液,得焊膏用无卤免清洗助焊剂。
将本发明制备的无卤免清洗助焊剂与无铅Sn3.0Ag0.5Cu焊锡粉按质量比1:8配成焊膏进行焊接,即可。经检测,利用本发明助焊剂制得的焊膏呈弱酸性,在保持较高活性的同时,焊点饱满,表面光亮,扩展率为82.5%,助焊剂在25℃下存储时间达到18个月、焊后残留物少,无腐蚀性,且本发明助焊剂符合无卤要求,适用性更广,应用潜力大。
实例2
称取3g苹果酸,3g富马酸,4g二苯乙醇酸,与60mL去离子水混合,在60℃恒温水浴下,以400r/min搅拌15min,随后加入6mL丁二酸,4mL己二酸,5mL乙酸异丁酸蔗糖酯继续恒温搅拌20min,得复合有机酸活性剂;向上述复合有机酸活性剂中加入25g氢化松香,在80℃恒温水浴下,以400r/min搅拌4h,冷却至室温后过滤,将滤渣置于干燥箱中,在110℃下干燥至恒重,随后将滤渣转入研钵中研磨,过60目筛,得松香包裹有机酸活性剂;称取25g松香包裹有机酸活性剂,0.3g乳化剂OP-10,0.2g苯并三氮唑,30mL无水乙醇,加入40mL二乙二醇乙醚中,加热至40℃,并以400r/min搅拌40min,随后加入10g聚乙烯醇,2.5g失水山梨醇单油酸酯,继续加热至80℃,并以600r/min搅拌2h,静置沉淀3h后,用5层纱布过滤,收集滤液,得焊膏用无卤免清洗助焊剂。
将本发明制备的无卤免清洗助焊剂与无铅Sn3.0Ag0.5Cu焊锡粉按质量比1:8配成焊膏进行焊接,即可。经检测,利用本发明助焊剂制得的焊膏呈弱酸性,在保持较高活性的同时,焊点饱满,表面光亮,扩展率为85.5%,助焊剂在32℃下存储时间达到24个月、焊后残留物少,无腐蚀性,且本发明助焊剂符合无卤要求,适用性更广,应用潜力大。
实例3
称取3g苹果酸,3g富马酸,3g二苯乙醇酸,与50mL去离子水混合,在55℃恒温水浴下,以350r/min搅拌13min,随后加入5mL丁二酸,3mL己二酸,4mL乙酸异丁酸蔗糖酯继续恒温搅拌18min,得复合有机酸活性剂;向上述复合有机酸活性剂中加入21g氢化松香,在78℃恒温水浴下,以350r/min搅拌4h,冷却至室温后过滤,将滤渣置于干燥箱中,在108℃下干燥至恒重,随后将滤渣转入研钵中研磨,过60目筛,得松香包裹有机酸活性剂;称取23g松香包裹有机酸活性剂,0.2g乳化剂OP-10,0.2g苯并三氮唑,25mL无水乙醇,加入35mL二乙二醇乙醚中,加热至35℃,并以350r/min搅拌35min,随后加入8g聚乙烯醇,2.3g失水山梨醇单油酸酯,继续加热至75℃,并以550r/min搅拌2h,静置沉淀3h后,用5层纱布过滤,收集滤液,得焊膏用无卤免清洗助焊剂。
将本发明制备的无卤免清洗助焊剂与无铅Sn3.0Ag0.5Cu焊锡粉按质量比1:8配成焊膏进行焊接,即可。经检测,利用本发明助焊剂制得的焊膏呈弱酸性,在保持较高活性的同时,焊点饱满,表面光亮,扩展率为84.5%,助焊剂在28℃下存储时间达到22个月、焊后残留物少,无腐蚀性,且本发明助焊剂符合无卤要求,适用性更广,应用潜力大。
Claims (1)
1.一种焊膏用无卤免清洗助焊剂的制备方法,其特征在于具体制备步骤为:
(1)称取2~3g苹果酸,2~3g富马酸,2~4g二苯乙醇酸,与40~60mL去离子水混合,在50~60℃恒温水浴下,以300~400r/min搅拌10~15min,随后加入4~6mL丁二酸,2~4mL己二酸,2~5mL乙酸异丁酸蔗糖酯继续恒温搅拌15~20min,得复合有机酸活性剂;
(2)向上述复合有机酸活性剂中加入18~25g氢化松香,在75~80℃恒温水浴下,以300~400r/min搅拌3~4h,冷却至室温后过滤,将滤渣置于干燥箱中,在105~110℃下干燥至恒重,随后将滤渣转入研钵中研磨,过60目筛,得松香包裹有机酸活性剂;
(3)称取20~25g步骤(2)制备的松香包裹有机酸活性剂,0.1~0.3g乳化剂OP-10,0.1~0.2g苯并三氮唑,20~30mL无水乙醇,加入30~40mL二乙二醇乙醚中,加热至30~40℃,并以300~400r/min搅拌30~40min,随后加入5~10g聚乙烯醇,2.0~2.5g失水山梨醇单油酸酯,继续加热至70~80℃,并以500~600r/min搅拌1~2h,静置沉淀2~3h后,用5层纱布过滤,收集滤液,得焊膏用无卤免清洗助焊剂。
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59229296A (ja) * | 1983-06-09 | 1984-12-22 | Senjiyu Kinzoku Kogyo Kk | クリ−ムはんだ |
JPS6064793A (ja) * | 1983-09-20 | 1985-04-13 | Uchihashi Kinzoku Kogyo Kk | 半田付用フラツクス |
JPS6390390A (ja) * | 1986-09-30 | 1988-04-21 | Asahi Chem Res Lab Ltd | 半田付け用フラツクス |
CN101062536A (zh) * | 2007-06-01 | 2007-10-31 | 中南大学 | 无铅焊锡用无卤素免清洗助焊剂 |
CN101524791A (zh) * | 2009-04-20 | 2009-09-09 | 泰州中义通信器材有限公司 | 一种无铅焊用免清洗水溶性助焊剂及制备方法 |
CN102513734A (zh) * | 2011-12-27 | 2012-06-27 | 厦门市及时雨焊料有限公司 | 一种膏状助焊剂的制备方法 |
CN104400257A (zh) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | 一种免清洗无铅低银焊膏用助焊剂 |
-
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59229296A (ja) * | 1983-06-09 | 1984-12-22 | Senjiyu Kinzoku Kogyo Kk | クリ−ムはんだ |
JPS6064793A (ja) * | 1983-09-20 | 1985-04-13 | Uchihashi Kinzoku Kogyo Kk | 半田付用フラツクス |
JPS6390390A (ja) * | 1986-09-30 | 1988-04-21 | Asahi Chem Res Lab Ltd | 半田付け用フラツクス |
CN101062536A (zh) * | 2007-06-01 | 2007-10-31 | 中南大学 | 无铅焊锡用无卤素免清洗助焊剂 |
CN101524791A (zh) * | 2009-04-20 | 2009-09-09 | 泰州中义通信器材有限公司 | 一种无铅焊用免清洗水溶性助焊剂及制备方法 |
CN102513734A (zh) * | 2011-12-27 | 2012-06-27 | 厦门市及时雨焊料有限公司 | 一种膏状助焊剂的制备方法 |
CN104400257A (zh) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | 一种免清洗无铅低银焊膏用助焊剂 |
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