CN106676613B - 一种金属材料表面复合镀过程中陶瓷颗粒的分散方法 - Google Patents
一种金属材料表面复合镀过程中陶瓷颗粒的分散方法 Download PDFInfo
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- CN106676613B CN106676613B CN201611234016.4A CN201611234016A CN106676613B CN 106676613 B CN106676613 B CN 106676613B CN 201611234016 A CN201611234016 A CN 201611234016A CN 106676613 B CN106676613 B CN 106676613B
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- plating
- ceramic particle
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Dispersion Chemistry (AREA)
- Chemically Coating (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201611234016.4A CN106676613B (zh) | 2016-12-28 | 2016-12-28 | 一种金属材料表面复合镀过程中陶瓷颗粒的分散方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201611234016.4A CN106676613B (zh) | 2016-12-28 | 2016-12-28 | 一种金属材料表面复合镀过程中陶瓷颗粒的分散方法 |
Publications (2)
Publication Number | Publication Date |
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CN106676613A CN106676613A (zh) | 2017-05-17 |
CN106676613B true CN106676613B (zh) | 2019-01-11 |
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CN201611234016.4A Active CN106676613B (zh) | 2016-12-28 | 2016-12-28 | 一种金属材料表面复合镀过程中陶瓷颗粒的分散方法 |
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CN (1) | CN106676613B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107790710B (zh) * | 2017-10-31 | 2019-10-18 | 深圳市海明润超硬材料股份有限公司 | 一种金刚石复合片及其制备方法 |
CN109097811B (zh) * | 2018-09-13 | 2020-09-22 | 济南东方结晶器有限公司 | Co-Ni-P-金刚石镀层的电镀液及其制备方法与电镀方法 |
CN115161732A (zh) * | 2022-08-17 | 2022-10-11 | 中冶赛迪技术研究中心有限公司 | 适用于Monel合金表面的镀层及其制备工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005126740A (ja) * | 2003-10-21 | 2005-05-19 | Meltex Inc | 電解めっき方法 |
CN1737213A (zh) * | 2005-06-30 | 2006-02-22 | 北京交通大学 | 一种用于电镀液中纳米微粒的分散方法 |
CN1896311A (zh) * | 2005-12-08 | 2007-01-17 | 郑州大学 | 一种镁合金表面直接纳米二氧化钛化学复合镀的方法 |
CN103184457A (zh) * | 2011-12-28 | 2013-07-03 | 北京有色金属研究总院 | 一种表面合金化强化方法 |
CN105568271A (zh) * | 2015-12-28 | 2016-05-11 | 北京有色金属研究总院 | 铝基复合材料表面的低膨胀耐磨复合镀层及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS62177199A (ja) * | 1986-01-31 | 1987-08-04 | Suzuki Motor Co Ltd | 分散メツキ液 |
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2016
- 2016-12-28 CN CN201611234016.4A patent/CN106676613B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005126740A (ja) * | 2003-10-21 | 2005-05-19 | Meltex Inc | 電解めっき方法 |
CN1737213A (zh) * | 2005-06-30 | 2006-02-22 | 北京交通大学 | 一种用于电镀液中纳米微粒的分散方法 |
CN1896311A (zh) * | 2005-12-08 | 2007-01-17 | 郑州大学 | 一种镁合金表面直接纳米二氧化钛化学复合镀的方法 |
CN103184457A (zh) * | 2011-12-28 | 2013-07-03 | 北京有色金属研究总院 | 一种表面合金化强化方法 |
CN105568271A (zh) * | 2015-12-28 | 2016-05-11 | 北京有色金属研究总院 | 铝基复合材料表面的低膨胀耐磨复合镀层及其制备方法 |
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CN106676613A (zh) | 2017-05-17 |
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Effective date of registration: 20190930 Address after: 101407 Beijing city Huairou District Yanqi Economic Development Zone Branch Hing Street No. 11 Patentee after: Research Institute of engineering and Technology Co., Ltd. Address before: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Patentee before: General Research Institute for Nonferrous Metals |
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Effective date of registration: 20210824 Address after: 101407 No. 11 Xingke East Street, Yanqi Economic Development Zone, Huairou District, Beijing Patentee after: Youyan metal composite technology Co.,Ltd. Address before: 101407 No. 11 Xingke East Street, Yanqi Economic Development Zone, Huairou District, Beijing Patentee before: YOUYAN ENGINEERING TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. |
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