CN106671303B - A kind of multi-wire saw unit exception shut down after processing method - Google Patents
A kind of multi-wire saw unit exception shut down after processing method Download PDFInfo
- Publication number
- CN106671303B CN106671303B CN201611127659.9A CN201611127659A CN106671303B CN 106671303 B CN106671303 B CN 106671303B CN 201611127659 A CN201611127659 A CN 201611127659A CN 106671303 B CN106671303 B CN 106671303B
- Authority
- CN
- China
- Prior art keywords
- wire saw
- cutting blade
- blade material
- unit exception
- equal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to photovoltaic silicon wafer production technical fields, and in particular to a kind of multi-wire saw unit exception shut down after processing method, this approach includes the following steps：It is first shut off the cooling water disengaging valve of guide wheel；Then workbench is promoted into 0 0.2mm；Start cutting blade material circulator, then moved steel wire along the direction that cutting blade material discharges with the speed less than or equal to 2m/s, finally starts multi-wire saw equipment.The present invention is switched on after there is multi-wire saw unit exception to shut down in the cutting process for carrying out silicon chip again, eliminates or mitigates influence of the single stria to silicon chip, reach silicon chip and be increased to A or A from B grades of pieces‑Grade, to improve the economic benefit of whole qualification rate and production.
Description
Technical field
The invention belongs to photovoltaic silicon wafer production technical fields, and in particular to a kind of multi-wire saw unit exception shut down after place
Reason method.
Background technology
The basic principle of multi-wire saw is to drive the cutting blade material being attached on steel wire to silicon by the steel wire of high-speed motion
Block rubs, to which the hard brittle materials such as silico briquette to be once cut into a kind of cutting process method of thousands of plate sheets simultaneously,
In whole process, steel wire forms a cutting gauze by the guiding of more than ten of guide wheel on guide wheel, and silico briquette to be processed is logical
Cross the feeding that silico briquette is realized in the movement of workbench from top to bottom.Multi-wire saw due to its is more efficient, smaller cutting loss and more
High-precision advantage has big advantage for cutting valuable, superhard material, has replaced traditional inner circle cutting nearly ten years
As the major way of silicon chip cutting processing.
HCT-B5 type multi-wire saws equipment advanced solar silicon wafers linear cutting equipment in the world belongs to a kind of accurate more
Line processes cutting equipment.HCT-B5 type multi-wire saw equipment uses cutting blade material during carrying out multi-wire saw, due to cutting
Time is longer (about 9-11 hours), factory service hydraulic pressure, air pressure and voltage instability and equipment itself needed for cutting process
The abnormal conditions such as hardware and software failure can lead to occur cancel closedown in cutting process.The average speed of gauze steel wire in wire cutting
For 10.5-13m/s, therefore after midway is shut down, gauze steel wire moment high speed stops, and old cutting blade material is big in silicon chip and steel wire gap
Amount deposition, such as directly booting continues to cut at this time, and HCT-B5 type multi-wire saws equipment cannot reach steel wire line in the short time
Net steadily runs at high speed, and frictional force of the steel wire of gauze between stop place and silico briquette increases, and is shutting down cutting position silicon
Piece surface will produce the bad stria such as apparent bright line or single stria, influence product quality and quality.
Invention content
In order to solve the above-mentioned problems in the prior art, the present invention provides a kind of shutdown of multi-wire saw unit exception
Processing method afterwards.The technical problem to be solved in the present invention is achieved through the following technical solutions：
A kind of multi-wire saw unit exception shut down after processing method, this approach includes the following steps：
Step S100 closes the cooling water switch of multi-wire saw apparatus control system, be then shut off the cooling water of guide wheel into
Go out valve；
Step S200, cutting position of the steel wire on silico briquette when record multi-wire saw unit exception is shut down, then to be less than
Workbench is promoted 0-0.2mm by the speed equal to 30 μm/min；
Step S300 starts cutting blade material circulator if multi-wire saw unit exception downtime is less than 30min,
Cutting blade material circulator runs 3min-5min, and then steel wire is discharged along cutting blade material with the speed less than or equal to 2m/s
Direction moves, and run duration is more than or equal to 30s；Finally start multi-wire saw equipment；
If multi-wire saw unit exception downtime is more than or equal to 30min, start cutting blade material circulator, cutting edge
Expect that circulator runs 10min or more, is then transported steel wire along the direction that cutting blade material discharges with the speed less than or equal to 2m/s
Dynamic, run duration is more than or equal to 30s；Finally start multi-wire saw equipment.
Further, workbench hoisting depth is 0.1mm in the step S200.
Further, the direction movement velocity that steel wire discharges along cutting blade material in the step S300 be less than or equal to
0.15m/s。
Further, the direction run duration that steel wire discharges along cutting blade material in the step S300 is 40s-60s.
Compared with prior art, beneficial effects of the present invention：
1, the present invention promotes the position of workbench by the platform speed to work less than workbench after shutdown, not only reduces
Steel wire line bends, and also reduces steel wire and silico briquette caused by the gap deposition in subsequent step due to old cutting blade material between steel wire
Frictional force, while reducing in subsequent step because the frictional force generates the bad stria such as bright line or single stria and reduces
The length of bad stria.
2, after the present invention starts cutting blade material circulator, after new cutting blade material circular flow is steady, by making steel
Line movement drives new cutting blade material to enter the gap between silico briquette gap and steel wire, and takes the old cutting blade material of deposition out of silicon chip
Gap and steel wire gap, after the restarting of multi-wire saw equipment, new cutting blade material directly participates in cutting, and avoids because of cutting force deficiency
Caused apparent bad stria.
3, in addition, the present invention passes in and out valve closing by that will pass in and out the cooling water of guide wheel, guide wheel temperature and steel wire temperature are prevented
Guided wheel slot caused by degree drastically reduces and the variation of silico briquette gap micro, it is therefore prevented that lateral displacement occurs for steel wire, improves and cuts again
Cut the irregularity degree of rear silicon chip surface.The present invention effectively eliminates influence of the bad stria to silicon chip quality, improves production
Economic benefit.
Description of the drawings
Fig. 1 is the schematic diagram of Multi-wire wafer cutting primary structure；
Fig. 2 is that multi-wire saw unit exception of the present invention shuts down postcooling water cycle schematic diagram；
Fig. 3 is that the present invention improves steel wire line bow change schematic diagram after workbench；
Fig. 4 is flow diagram of the present invention.
In figure：1, guide wheel；11, guided wheel slot；2, cutting blade material circulator；3, silico briquette；4, steel wire；41, steel wire line bends；5、
Cooling water passes in and out valve；6, cooling water in guide wheel；7, cooling water circulation pipeline；8, workbench；9, workbench when cancel closedown
Position；91, aftertable position is promoted；10, cutting position when cancel closedown.
Specific implementation mode
Further detailed description is done to the present invention with reference to specific embodiment, but embodiments of the present invention are not limited to
This.
As depicted in figs. 1 and 2, the basic principle of HCT-B5 types multi-wire saw equipment is 4 band of steel wire by high-speed motion
The dynamic cutting blade material being attached on steel wire 4 rubs to silico briquette 3, to which silico briquette 3 is once cut into thousands of plate sheets simultaneously.
In the whole process, several steel wires 4 form a cutting gauze by the guiding of more than ten of guide wheel 1 on guide wheel 1, and wait for
The silico briquette 3 of processing realizes the feeding of silico briquette by the movement of workbench from top to bottom.Cooling water is followed by cooling water circulation pipeline 7
In ring to guide wheel, cooling water 6 passes in and out valve 5 by cooling water and passes in and out in guide wheel.
Workable polycrystalline silicon monolithic divides A level silicon wafers and B level silicon wafers at present, and A level silicon wafer ratio B level silicon wafers are best in quality, and
Monolithic A level silicon wafers give birth to about 1 yuan of economic benefit than monolithic B level silicon wafer fecund.According to current HCT-B5 types multi-wire saw tables of equipment
Platform semi-load cutting hilted broadsword be averaged the calculating of output 2800, and if we need to produce about 28000 silicon chips, cutter number is 10,
Caused due to equipment fault etc. different in HCT-B5 type multi-wire saw equipment cutting process of yield silicon chip needed for not completing
It often shuts down, after cancel closedown, such as directly restarts multi-wire saw equipment, the silicon chip grade after cutting is relatively low, directly affects life
The efficiency of production.
It is the specific implementation mode that method through the invention is handled below：
Processing method after a kind of multi-wire saw unit exception shutdown as Figure 1-Figure 4, this method includes following step
Suddenly：
Step S100 closes the cooling water switch of multi-wire saw apparatus control system, be then shut off the cooling water of guide wheel 1 into
Go out valve 5.
Step S200, the cutting position 10 when record multi-wire saw unit exception is shut down on silico briquette 3, and to be less than or equal to 30
μm/workbench 8 promotes 0-0.2mm by the speed of min by the position 9 of workbench when cancel closedown, after so that workbench 8 is reached and is promoted
Operating position 91.
Step S300 starts cutting blade material circulator 2 if multi-wire saw unit exception downtime is less than 30min,
Cutting blade material circulator 2 run 3min-5min, then with the speed less than or equal to 2m/s by the steel wire 4 of gauze along cutting edge
The direction movement of material discharging, run duration are more than or equal to 30s；, finally start multi-wire saw equipment；
If multi-wire saw unit exception downtime is more than or equal to 30min, start cutting blade material circulator 2, cuts
Sword material circulator 2 runs 10min or more, is then gone out the steel wire 4 of gauze along cutting blade material with the speed less than or equal to 2m/s
The direction of material moves, and run duration is more than or equal to 30s；, finally start multi-wire saw equipment.
After the shutdown of multi-wire saw unit exception, the 30 μm/min of platform speed when working less than workbench 8 is carried the present invention
The position for rising workbench 8 reduces steel wire line bow 41.Steel wire line as shown in Figure 3 bends 41 due to the change after the promotion of 8 position of workbench
Change situation, spacing is generated between silico briquette and steel wire, reduces steel wire line bow 41.With work less than workbench 8 30 μm of platform speed/
Min promotes the position of workbench 8, prevents generation during promoting workbench 8 from breaking.When the operation of cutting blade material circulator 2
Between be new cutting blade material flow trim after, it is contemplated that the factors such as production efficiency, when the operation of cutting blade material circulator
Between for 3min-10min or so.
It carries out restarting HCT-B5 type multi-wire saw equipment by above method, cuts output silicon chip after silico briquette again, pass through
The silicon chip of hand sense of touch and stria detecting instrument detection output, hand sense of touch only have slight stria, the detection of stria detecting instrument
Stria value is less than or equal to 20 μm, wherein the silicon chip grade for having about 35% or more is A grades or A-Grade, is equivalent to A level silicon wafer redemption rates
It is 35% or more, it can thus be appreciated that the present invention can effectively improve the economic benefit of production.
Illustrate that the present invention can be in multi-wire saw below by way of specific embodiment and with the contrast experiment of the method for the present invention
Unit exception shut down restart cutting after reduce silicon chip bad stria generation, silicon chip grade is improved, and improve production
Economic benefit.
Embodiment 1：
Step S100 closes the cooling water switch of multi-wire saw apparatus control system, be then shut off the cooling water of guide wheel into
Go out valve 5.
The position of step S200, workbench 8 are constant, i.e., workbench promotes 0mm.
Step S300, if first starting cutting blade material circulator, the operation a period of time of cutting blade material circulator 2, then
To move the steel wire 4 of gauze along the direction that cutting blade material discharges more than 0.15m/s and less than or equal to the speed of 2m/s, when movement
Between be more than or equal to 30s, finally start multi-wire saw equipment；Or
If first starting cutting blade material circulator, operation a period of time of cutting blade material circulator 2, then to be less than or equal to
The steel wire 4 of gauze is moved 40s-60s by the speed of 0.15m/s along the direction that cutting blade material discharges, and is finally started multi-wire saw and is set
It is standby.
Contrast experiment is carried out, multi-wire saw equipment is directly restarted, the steel wire 4 of gauze is run with the speed of 11m/s, after
Continuous cutting silico briquette；And contrast experiment in step S300 with the speed more than 0.15m/s and less than or equal to 2m/s by gauze
Steel wire 4 is moved along the direction that cutting blade material discharges, and run duration is less than 30s.
Embodiment 1 and contrast and experiment are as shown in table 1：Wherein experiment serial number 2 and 3 is embodiment 1, tests serial number 1
It is contrast experiment with 13.
Table 1
Embodiment 2 and embodiment 3 are to be less than or equal to the speed of 30 μm/min by workbench by different on the basis of embodiment 1
The position of workbench is promoted when often shutting down, other experiment conditions are constant, experimental result such as table 2：Wherein, experiment serial number 5 and 6 is real
Example 2 is applied, experiment serial number 4 is contrast experiment；It is contrast experiment to test serial number 7-9；Experiment serial number 11 and 12 is embodiment 3, experiment
Serial number 10 is contrast experiment.
Table 2
By Tables 1 and 2 it is found that after the shutdown of HCT-B5 type multi-wire saw unit exceptions, handles, cut again through the invention
Output silicon chip after silico briquette, best effect can reach the only slight single stria of hand sense of touch, stria detecting instrument detection line
Trace value is less than or equal to 15 μm, wherein the silicon chip grade for having about 91% is A grades or A-Grade, about 4% silicon chip grade is B grades, quite
It is 91% in A level silicon wafer redemption rates, substantially all promotes the grade of this batch of silicon chip, it can thus be appreciated that the present invention can effectively improve life
The economic benefit of production.The present invention's promotes workbench 8 by the 30 μm/min of platform speed to work less than workbench 8 after shutdown
Position not only reduces steel wire line bow 41, and prevents generation during promoting workbench 8 from breaking, and also reduces in subsequent step
Due to the frictional force of steel wire 4 and silico briquette 3 caused by gap deposition of the old cutting blade material between steel wire 4, while reducing follow-up
Because frictional force generates the bad stria such as bright line or single stria and reduces the length of bad stria in step.Start cutting edge
After expecting circulator 2, after the flow trim of new cutting blade material cycle, by making the steel wire 4 of gauze with less than or equal to 2m/s's
Speed moves, it is contemplated that the factors such as production efficiency can control steel wire run duration in 30s-60s, drive new cutting blade material into
Enter the gap between the gap of silico briquette 3 and steel wire 4, and by the old cutting blade material of deposition between steel tapping line 4 gap and silico briquette
Gap.After the restarting of multi-wire saw equipment, new cutting blade material directly participates in cutting, and avoids apparent caused by cutting force deficiency
Bad stria.In addition, the present invention is closed by the way that the cooling water for passing in and out guide wheel 1 is passed in and out valve 5, the temperature and steel of guide wheel 1 are prevented
The temperature of line 4 drastically reduces so as to cause the gap of guided wheel slot 11 and the variation of silico briquette gap micro, avoids in guided wheel slot 11
Lateral displacement occurs for steel wire 4, improves silicon chip surface irregularity degree after cutting again.The present invention is effectively eliminated due to multi-wire cutting
Influence of the bad stria to silicon chip quality caused by unit exception is shut down is cut, by silicon after the shutdown of multi-wire saw unit exception is restarted
Piece quality is significantly promoted to A grades by B grades, significantly promotes the quality of silicon chip, improves the economic benefit of production.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
The specific implementation of the present invention is confined to these explanations.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to the present invention's
Protection domain.
Claims (4)
1. the processing method after a kind of multi-wire saw unit exception shutdown, it is characterised in that：This approach includes the following steps：
Step S100 closes the cooling water switch of multi-wire saw apparatus control system, is then shut off the cooling water disengaging valve of guide wheel
Door；
Step S200, cutting position of the steel wire on silico briquette when record multi-wire saw unit exception is shut down, then to be less than or equal to
Workbench is promoted 0-0.2mm by the speed of 30 μm/min；
New cutting blade material is added in step S300, if multi-wire saw unit exception downtime is less than 30min, starts cutting
Sword material circulator, cutting blade material circulator run 3min-5min, are then cut steel wire edge with the speed less than or equal to 2m/s
The direction movement of sword material discharging is cut, run duration is more than or equal to 30s；Finally start multi-wire saw equipment；
If multi-wire saw unit exception downtime is more than or equal to 30min, start cutting blade material circulator, cutting blade material follows
Loop device runs 10min or more, is then moved steel wire along the direction that cutting blade material discharges with the speed less than or equal to 2m/s, transports
The dynamic time is more than or equal to 30s；Finally start multi-wire saw equipment.
2. the processing method after a kind of multi-wire saw unit exception shutdown according to claim 1, it is characterised in that：It is described
Workbench hoisting depth is 0.1mm in step S200.
3. the processing method after a kind of multi-wire saw unit exception shutdown according to claim 1 or 2, it is characterised in that：
Steel wire is less than or equal to 0.15m/s along the direction movement velocity that cutting blade material discharges in the step S300.
4. the processing method after a kind of multi-wire saw unit exception shutdown according to claim 3, it is characterised in that：It is described
Steel wire is 40s-60s along the direction run duration that cutting blade material discharges in step S300.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611127659.9A CN106671303B (en) | 2016-12-09 | 2016-12-09 | A kind of multi-wire saw unit exception shut down after processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611127659.9A CN106671303B (en) | 2016-12-09 | 2016-12-09 | A kind of multi-wire saw unit exception shut down after processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106671303A CN106671303A (en) | 2017-05-17 |
| CN106671303B true CN106671303B (en) | 2018-09-04 |
Family
ID=58869149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611127659.9A Expired - Fee Related CN106671303B (en) | 2016-12-09 | 2016-12-09 | A kind of multi-wire saw unit exception shut down after processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106671303B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110962247A (en) * | 2019-12-23 | 2020-04-07 | 无锡荣能半导体材料有限公司 | Slicer jumper shutdown processing method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102059748A (en) * | 2010-12-13 | 2011-05-18 | 天津市环欧半导体材料技术有限公司 | Process for cutting silicon chip by using steel wire with diameter of 0.11 millimeter |
| CN102363330A (en) * | 2011-06-30 | 2012-02-29 | 常州天合光能有限公司 | Cutting method for ultra-thin silicon chips |
| CN103273577A (en) * | 2013-06-04 | 2013-09-04 | 台州市双辉机械设备有限公司 | Circulating cooling device of multi-wire cutting machine and control method of circulating cooling device |
| CN204263383U (en) * | 2014-11-18 | 2015-04-15 | 青岛高校测控技术有限公司 | For the broken thread detector of multi-line cutting machine |
| CN204278282U (en) * | 2014-11-06 | 2015-04-22 | 邢台晶龙电子材料有限公司 | Silicon chip cutting machine tool refrigeration system |
| CN104647616A (en) * | 2013-11-18 | 2015-05-27 | 烟台力凯电子科技有限公司 | Sand box cooling type multi-wire sawing machine |
| CN105082380A (en) * | 2015-09-09 | 2015-11-25 | 江西赛维Ldk太阳能高科技有限公司 | Method for taking out silicon wafer after cutting |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003159642A (en) * | 2001-11-22 | 2003-06-03 | Shinano Denki Seiren Kk | Work cutting method and multi-wire saw system |
-
2016
- 2016-12-09 CN CN201611127659.9A patent/CN106671303B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102059748A (en) * | 2010-12-13 | 2011-05-18 | 天津市环欧半导体材料技术有限公司 | Process for cutting silicon chip by using steel wire with diameter of 0.11 millimeter |
| CN102363330A (en) * | 2011-06-30 | 2012-02-29 | 常州天合光能有限公司 | Cutting method for ultra-thin silicon chips |
| CN103273577A (en) * | 2013-06-04 | 2013-09-04 | 台州市双辉机械设备有限公司 | Circulating cooling device of multi-wire cutting machine and control method of circulating cooling device |
| CN104647616A (en) * | 2013-11-18 | 2015-05-27 | 烟台力凯电子科技有限公司 | Sand box cooling type multi-wire sawing machine |
| CN204278282U (en) * | 2014-11-06 | 2015-04-22 | 邢台晶龙电子材料有限公司 | Silicon chip cutting machine tool refrigeration system |
| CN204263383U (en) * | 2014-11-18 | 2015-04-15 | 青岛高校测控技术有限公司 | For the broken thread detector of multi-line cutting machine |
| CN105082380A (en) * | 2015-09-09 | 2015-11-25 | 江西赛维Ldk太阳能高科技有限公司 | Method for taking out silicon wafer after cutting |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106671303A (en) | 2017-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205043554U (en) | High -efficient processingequipment of quartzy ring | |
| CN107718333A (en) | A kind of technique of 60um diameters Buddha's warrior attendant wire cutting silicon | |
| CN106313160B (en) | A kind of section bar, pipe cutting machine | |
| CN106671303B (en) | A kind of multi-wire saw unit exception shut down after processing method | |
| CN103072211A (en) | Fretsaw cutting method | |
| CN102544240B (en) | Method and device for integrating slicing and flocking of crystalline silicon wafer | |
| CN110181699A (en) | A kind of cutting technique of sapphire diamond wire multi-line slicer | |
| CN102626959B (en) | Equal-line-loss computation method for multi-line cutting machine | |
| CN102343632B (en) | A kind of method of Multi-wire wafer cutting burn out detection | |
| CN203994287U (en) | Cooling fluid treating apparatus and be provided with the slice systems of this cooling fluid treating apparatus | |
| CN110394912A (en) | A kind of efficient monocrystalline silicon piece cutting technique | |
| CN105957835B (en) | A kind of cutting method of chip | |
| CN102039638A (en) | Cutting method for cutting substrate by utilizing cutting line | |
| CN204278268U (en) | Pv600 slicer tilting gauze cutter sweep | |
| CN102049816B (en) | Constant tension numerical control multi-thread square cutting machine without pressure sensor | |
| CN102049821A (en) | Cutting rollers of multi-wire cutting machine | |
| CN208305174U (en) | A kind of safety cutting machine | |
| CN108437248A (en) | A kind of multi-wire saw vibration auxiliary device | |
| CN108032451A (en) | A kind of silicon rod cutting method | |
| CN101310951A (en) | Silicon slice cutting edge collapse control method | |
| CN201626019U (en) | Saw arbor water inlet device | |
| CN203418366U (en) | Vibration detection and protection device of milling machine | |
| CN109664423B (en) | Tension control system for cutting solar cell silicon wafer | |
| CN206878395U (en) | A kind of multi-functional rubber cable skin wire stripper | |
| CN201693248U (en) | Transverse-cutting feeding strip positioning device and single-shaft multi-saw-blade cutting device thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180904 Termination date: 20201209 |