CN106661267B - 具有相反固化特征行为的聚合物厚膜银导体 - Google Patents

具有相反固化特征行为的聚合物厚膜银导体 Download PDF

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Publication number
CN106661267B
CN106661267B CN201580035873.9A CN201580035873A CN106661267B CN 106661267 B CN106661267 B CN 106661267B CN 201580035873 A CN201580035873 A CN 201580035873A CN 106661267 B CN106661267 B CN 106661267B
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CN
China
Prior art keywords
thick film
silver
weight
organic medium
polymer thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201580035873.9A
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English (en)
Chinese (zh)
Other versions
CN106661267A (zh
Inventor
J·R·多尔夫曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronics Inc
Original Assignee
EI Du Pont de Nemours and Co
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Publication of CN106661267A publication Critical patent/CN106661267A/zh
Application granted granted Critical
Publication of CN106661267B publication Critical patent/CN106661267B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C09D127/16—Homopolymers or copolymers of vinylidene fluoride
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Dispersion Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN201580035873.9A 2014-07-15 2015-07-02 具有相反固化特征行为的聚合物厚膜银导体 Expired - Fee Related CN106661267B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462024542P 2014-07-15 2014-07-15
US62/024,542 2014-07-15
US201562140664P 2015-03-31 2015-03-31
US62/140,664 2015-03-31
PCT/US2015/039012 WO2016010744A1 (en) 2014-07-15 2015-07-02 Polymer thick film silver conductor with inverted cure profile behavior

Publications (2)

Publication Number Publication Date
CN106661267A CN106661267A (zh) 2017-05-10
CN106661267B true CN106661267B (zh) 2019-07-30

Family

ID=53765536

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580035873.9A Expired - Fee Related CN106661267B (zh) 2014-07-15 2015-07-02 具有相反固化特征行为的聚合物厚膜银导体

Country Status (5)

Country Link
US (1) US9718966B2 (enExample)
EP (1) EP3170188B1 (enExample)
JP (1) JP6517915B2 (enExample)
CN (1) CN106661267B (enExample)
WO (1) WO2016010744A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TR201815525T4 (tr) * 2013-11-15 2018-11-21 Autotech Eng A I E U bi̇çi̇mli̇ eni̇ne kesi̇tli̇ ki̇ri̇şler
DE102016125465B4 (de) * 2016-12-22 2022-08-11 Pas Deutschland Gmbh Siebdruckpaste, Verfahren zur Herstellung der Siebdruckpaste, Verwendung der Siebdruckpaste und elektrisch leitfähige Struktur
DE102021208924A1 (de) * 2021-08-13 2023-02-16 Mahle International Gmbh Wärmeübertrager

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834549A (en) * 1993-12-22 1998-11-10 Sekisui Chemical Co., Ltd. Transparent conductive coating composition and transparent antistatic molded article
JP2001202821A (ja) * 2000-01-18 2001-07-27 Fujikura Ltd 導電性インキ組成物およびそれを用いた面状発熱体
CN1624810A (zh) * 2003-12-04 2005-06-08 E.I.内穆尔杜邦公司 膜接触开关用厚膜导电组合物
CN1637059A (zh) * 2003-12-04 2005-07-13 E.I.内穆尔杜邦公司 用在场致发光用途上的厚膜组合物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3947287B2 (ja) * 1997-12-27 2007-07-18 大日本印刷株式会社 感光性導体ペーストおよびこれを用いた転写シート
US9573438B2 (en) * 2013-04-10 2017-02-21 E I Du Pont De Nemours And Company Polymer thick film positive temperature coefficient carbon composition

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5834549A (en) * 1993-12-22 1998-11-10 Sekisui Chemical Co., Ltd. Transparent conductive coating composition and transparent antistatic molded article
JP2001202821A (ja) * 2000-01-18 2001-07-27 Fujikura Ltd 導電性インキ組成物およびそれを用いた面状発熱体
CN1624810A (zh) * 2003-12-04 2005-06-08 E.I.内穆尔杜邦公司 膜接触开关用厚膜导电组合物
CN1637059A (zh) * 2003-12-04 2005-07-13 E.I.内穆尔杜邦公司 用在场致发光用途上的厚膜组合物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Microporous pvdf-hfp-based polymer membranes formed from supercritical co2 induced phase seperation";Jian-hua Cao等;《Chinese journal of polymer science》;20080507;第26卷(第1期);第13-21页 *

Also Published As

Publication number Publication date
US20160017156A1 (en) 2016-01-21
EP3170188A1 (en) 2017-05-24
JP2017522421A (ja) 2017-08-10
JP6517915B2 (ja) 2019-05-22
US9718966B2 (en) 2017-08-01
WO2016010744A1 (en) 2016-01-21
EP3170188B1 (en) 2019-08-21
CN106661267A (zh) 2017-05-10

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PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20221116

Address after: Delaware

Patentee after: DuPont Electronics

Address before: Delaware

Patentee before: E.I. Nemours DuPont

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190730