CN106654815A - Package device and method of solid ultraviolet laser - Google Patents

Package device and method of solid ultraviolet laser Download PDF

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Publication number
CN106654815A
CN106654815A CN201611216072.5A CN201611216072A CN106654815A CN 106654815 A CN106654815 A CN 106654815A CN 201611216072 A CN201611216072 A CN 201611216072A CN 106654815 A CN106654815 A CN 106654815A
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CN
China
Prior art keywords
temperature
crystal
laser
clamp base
frequency
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CN201611216072.5A
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Chinese (zh)
Inventor
程文雍
杨厚文
王军华
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Shandong University
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Shandong University
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Priority to CN201611216072.5A priority Critical patent/CN106654815A/en
Publication of CN106654815A publication Critical patent/CN106654815A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/025Constructional details of solid state lasers, e.g. housings or mountings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • H01S3/0405Conductive cooling, e.g. by heat sinks or thermo-electric elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • H01S3/042Arrangements for thermal management for solid state lasers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/131Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
    • H01S3/1317Stabilisation of laser output parameters, e.g. frequency or amplitude by controlling the active medium, e.g. by controlling the processes or apparatus for excitation by controlling the temperature

Abstract

The invention relates to a package device and method for a solid ultraviolet laser, belongs to the technical field of complicated non-linear optical frequency conversion, and relates to a phase matching adjustment method and a fixing device during the frequency-multiplied, frequency-tripled or frequency-quadruplicated non-linear process. On the condition that a laser optical path and an optical component are basically fixed, a thermistor and a thermo electric cooler (TEC) semiconductor temperature-control sheet are inserted into a non-linear crystal clip in order to compensate phase mismatching caused by oblique incidence of a light beam, adjustment is performed on the temperature of a frequency-multiplied, frequency-tripled or frequency-quadruplicated non-linear crystal on the basis of a proportion integral derivation (PID) temperature controller, so that the crystal reaches optimal phase matching, and the conversion efficiency is improved. The package method is easy to operate and is high in precision, a laser structure is simplified, and the laser output stability is improved.

Description

A kind of packaging system and method for solid ultraviolet laser
Technical field
The present invention relates to the packaging system and method for a kind of solid ultraviolet laser, belong to laser field, more particularly to it is multiple Miscellaneous nonlinear optical frequency conversion technology field.
Background technology
It is by nonlinear crystal when laser freuqency doubling, frequency tripling (or quadruple) experiment are carried out on the optical table of laboratory It is fixed in adjustment frame, nonlinear crystal is made in phase matching angle by adjusting knob, so that nonlinear frequency conversion effect Rate reaches most preferably.This method needs high accuracy, the optical adjusting frame of high stable.For ultraviolet laser engineering is encapsulated, should Method high cost, takes volume big, it is impossible to adapt to vibration environment.In conventional laser, in order to strengthen frame for movement fastness, one As using stationary fixture clamp nonlinear crystal.Due to adjusting crystal angle, fundamental frequency angle of light is difficult to reach phase just Position matching angle, therefore frequency conversion efficiency does not reach optimum.Additionally, by electric contact thermometer and TEC in encapsulation process (Thermo Electric Cooler) semiconductor temperature-control piece controls nonlinear crystal temperature, and the temperature control technology is simple to operate, institute With part is few, low cost, but control process has inertia, and temperature control error is larger, it is impossible to precise control of temperature, and laser output power It is sensitive to temperature change with stability, therefore, traditional ultraviolet laser encapsulation technology is difficult to the output of laser efficient stable.
Chinese patent document " a kind of all solid state laser of high stability " (application number 201510492390.3), discloses A kind of all solid state laser of high stability, changes non-linear in laser cavity by controlling the operating temperature of frequency doubling non-linear's crystal The size of loss, obtains the laser output of high stability.Non-linear process described in the patent is non-critical for the I classes of nonlinear crystal Phase matched process, only frequency multiplication process, realize that principle is to control the non-linear transfer loss of frequency doubling non-linear's crystal, and it is right to fail The present invention provides help.
A kind of Chinese patent document " use semiconductor Peltier adjusts the control device of laser crystal temperature " (application number 201520335417.3) control device that a kind of use semiconductor Peltier adjusts laser crystal temperature, is disclosed, the patent is adopted Linear regulative mode rather than on-off control mode, and using digital control pattern, crystal temperature effect is only controlled, to improving laser The laser in device field is exported and stably produced effects very little.
The content of the invention
Prior art method for packing is that crystal temperature effect is controlled in into demarcation temperature after directly encapsulation, or does not have crystal temperature control. For the deficiencies in the prior art and the problem for existing, the purpose of patent of the present invention is a kind of ultraviolet laser encapsulation side of design Method.The method is based on PID (Proportion Integral Derivative, proportional integral derivative) temperature controller, changes crystal Temperature, so as to compensate the phase mismatch that angledetuning during encapsulation is caused, improves efficiency of laser and power stability.The method is easy In operation, degree of regulation height, low cost, the laser structure encapsulated using the method is simple, power stability.
Technical scheme is as follows:
A kind of packaging system of solid ultraviolet laser, including laser base board and the crystal on laser base board And fixture, crystal include frequency doubling nonlinear crystal, frequency tripling or quadruple nonlinear crystal, fixture include frequency doubling nonlinear crystal Fixture, frequency tripling or quadruple nonlinear crystal fixture, fixture includes clamp cover and clamp base, and crystal is located at clamp cover with folder Between tool pedestal, clamp base side is provided with blind hole, and thermistor is provided with blind hole, and clamp base bottom is provided with TEC semiconductors Temperature control chip, TEC semiconductor temperature-controls piece and thermistor are connected with PID temperature controllers.
Temperature is controlled by TEC semiconductor temperature-controls piece, temperature is observed by thermistor.Crystal temperature effect is adjusted to crystal factory The design temperature that family demarcates, then each optical element in collimated light path.After Ultra-Violet Laser is exported, stationary fixture leads to again afterwards The regulation of TEC semiconductor temperature-controls piece is crossed, makes laser output power reach maximum.
According to currently preferred, thermistor includes positive temperature coefficient thermistor (Positive Temperature Coefficient, PTC), negative temperature thermosensitive resistor (Negative Temperature Coefficient, NTC) and critical temperature thermistor (Critical Temperature Resistor, CTR), electricity Resistance material can be semiconductor thermistor material, metal thermo-sensitive resistance material and alloy thermal responsive resistance material.
It will be understood by those skilled in the art that the thermistor of employing mentioned above not specifically refers in particular to the general of meaning Read, but refer to can fit applications in any thermistor of therm-param method module.
According to currently preferred, clamp base bottom is provided with groove, and TEC semiconductor temperature-controls piece is located in groove, TEC half Conductor temperature control chip outer surface is located at same level with clamp base lower surface.
According to currently preferred, clamp cover and clamp base bolt connection, clamp base connects with laser base board bolt Connect, clamp base is connected with thermistor by heat conductive silica gel, TEC semiconductor temperature-controls piece is by heat-conducting silicone grease and clamp base bottom Portion is connected.
It is further preferred that the clamp cover one side relative with clamp base is step surface.Crystal is located at clamp cover with folder Between tool pedestal, crystal is fixed by the L-type right-angle structure and bolt connection of step.
A kind of method for packing of solid ultraviolet laser, including step is as follows:
(1) first, make crystal temperature effect in factory-designed design temperature, crystal is put into fixture, fixture is placed in In laser optical path;
(2) secondly, collimation adjustment is carried out to frequency doubling nonlinear crystal, frequency tripling or quadruple nonlinear crystal, has been collimated Ultraviolet output is obtained into rear;
(3) change temperature near initial value, when power output maximum, fix this temperature value.
With it, the phase mismatch that angledetuning is caused during compensation encapsulation, obtains high efficiency, the laser of high stability Output.
According to currently preferred, in step (1), make crystal temperature effect in factory-designed design temperature, crystal is put In the right angle of the step surface of clamp base, placing clamp lid simultaneously fix by bolt;TEC semiconductor temperature is put into clamp base bottom Control wafer, clamp base bolt is fixed on laser base board, and thermistor is placed in the blind hole of clamp base side, will TEC semiconductor temperature-controls piece and thermistor are connected with PID temperature controllers, and fixture is placed in laser optical path.
According to currently preferred, in step (2), to non-linear including frequency doubling nonlinear crystal, frequency tripling or quadruple Crystal carries out collimation adjustment in interior optical element, and pumping source is opened after the completion of collimation, finely tunes outgoing mirror, bolt stationary fixture base Seat and laser base board, obtain Ultra-Violet Laser output after the completion of collimation.
According to currently preferred, in step (3), fixture temperature is fed back to PID temperature controllers, PID temperature controls by thermistor Device contrasts feedback temperature and design temperature, and according to comparing result TEC semiconductor temperature-control piece power is adjusted:Set when feedback temperature is less than When constant temperature is spent, PID temperature controllers send heating instructions to TEC semiconductor temperature-control pieces, and crystal temperature effect is risen into design temperature;Work as feedback When temperature is higher than design temperature, PID temperature controllers send refrigeration instruction to TEC semiconductor temperature-control pieces, and crystal temperature effect is down into setting Temperature.When power output reaches maximum, that is, determine that design temperature now is optimum temperature value.Two crystal are in most Good phase matched state, power conversion efficiency highest.Fix this temperature value, you can obtain the Ultra-Violet Laser output of efficient stable.
The method that the present invention is provided, when having corresponded to a kind of fundamental frequency light non-normal incidence plane of crystal, phase matched optimization Effective way.Optimum phase matching angle in non-linear process, it is relevant with the main shaft refractive index size of crystal.By adjusting crystal Temperature, can change crystal main shaft refractive index, so as to change optimum phase matching angle.During individual laser package, because of assembling Error is present, and fundamental frequency light typically enters crystal with the angle for inclining the crystal plane of incidence, its incident angle and optimum phase matching angle Degree has a difference.Because fixture is fixed, fundamental frequency light incident angle is difficult to change.And main shaft refraction is controlled by changing temperature Rate size, thus it is possible to vary optimum phase matching angle, finally realizes phase matched on the premise of crystal angle is not adjusted.So Ensure that and remain in the presence of rigging error and realize highest nonlinear conversion efficiency.Meanwhile, accurate temperature control can be protected Card phase matched process all-the-time stable, it is ensured that laser instrument long-time stable is exported.
The method that the present invention is provided, has corresponded to a kind of thermoregulator effective way of laser system.Realize in PID temperature controllers During temperature control, the temperature of crystal is measured in real time by thermistor.For nonlinear phase matching process, temperature often changes 0.01 DEG C, phase difference accordingly changes 8 × 10-4(frequency multiplication) or 3.65 × 10-2(frequency tripling).Therefore, fast response time and Minimal overshoot can realize fast and accurately phase matched, it is ensured that laser conversion efficiency is optimal after encapsulation, so as to full Sufficient product is efficient, energy-conservation.
It will be understood by those skilled in the art that the concept that temperature not specifically refers in particular to meaning is demarcated by producer mentioned above, But refer to any nonlinear crystal in any manufacturer and the calibration value of any production batch.That is, of the invention Crystal is suitable for including the nonlinear crystal for growing and cutting under all conditions, using only need to be according to the tool of each crystal during the present invention Body demarcates temperature setting initial value.Meanwhile, the present invention is applied to remove causes all environment temperatures of crystal damage, and can adapt to Environment temperature changes.
It will be understood by those skilled in the art that method for packing mentioned above is not only applicable to what is adopted in conventional laser Stationary fixture, the phase matched for being also applied for optical table precise clamp is adjusted.That is, the present invention is applied to various regulations Environment.
The beneficial effects of the present invention is:
Non-linear process of the present invention is I classes and the critical phase place matching process of II classes, including frequency multiplication, frequency tripling or four times Frequency process;It realizes that principle is the phase mismatch that temperature-compensating angle is caused.
The present invention, so as to avoid numerous and diverse angular adjustment, simplifies regulation using temperature optimization phase matched angle is changed Difficulty, reduce regulating time;The temperature stability of PID temperature controllers can reach ± 0.01 DEG C;Phase difference accuracy can be with Reach 8 × 10-4(frequency multiplication) or 3.65 × 10-2(frequency tripling), higher than the accuracy of angular adjustment, and temperature can be with for its precision Keep constant, make this laser instrument that there is high stability, if after the micro- imbalance of light path, it is also possible to finely tune temperature to compensate phase misalignment Match somebody with somebody;This method is applied to various adjusting ambients, and range of application has been expanded significantly;This method can adapt to crystal and environment temperature Change, and can use in adverse circumstances;Jing is tested, and 2 hours internal power exporting changes of this method are less than 1%, meet stable work The demand of work.
Technical scheme has detailed structure description to grip device, and attemperating unit is located at outside fixture, and temperature Control device is TEC temperature control chips;The phase mismatch that angledetuning is caused during by changing temperature compensation packaging, does not result in laser instrument Power is reduced, and so as to realize that high efficiency high stability laser is exported, improves efficiency of laser and power stability.Not only control times Frequency crystal temperature effect, it is also possible to control frequency tripling or quadruple frequency crystal temperature, is capable of achieving individually control and controls various modes simultaneously; The control temperature of crystal is generally less than 100 DEG C.Meanwhile, the attemperating unit that the application is adopted can realize two kinds of work(of refrigeration and heating Can, it is obtained in that wider temperature regulating range.
Description of the drawings
Fig. 1 is two kinds of laser light paths that patent of the present invention is packaged regulation.
Fig. 2 is the frequency doubling nonlinear crystal holder device profile being previously mentioned in patent of the present invention.
Fig. 3 is the frequency tripling or quadruple nonlinear crystal grip device profile being previously mentioned in patent of the present invention.
Fig. 4 is the temperature control system schematic diagram being previously mentioned in patent of the present invention.
Wherein, 100. frequency doubling nonlinear crystal holders, 101. frequency doubling nonlinear crystal, 102. frequency triplings or quadruple non-thread Property crystal holder, 103. frequency triplings or quadruple nonlinear crystal, 104. laser base boards, 100A, 102A be clamp base, 100B, 102B be clamp cover, 100C, 102C be thermistor, 100D, 102D be TEC semiconductor temperature-control pieces, 100E, 100F, 100G, 100H, 102E, 102F, 102G, 102H are bolt, and 201 is PID temperature controllers, and 202 is TEC semiconductor temperature-control pieces, 203 is crystal, and 204 is thermistor.
Specific embodiment
Below by specific embodiment and combine accompanying drawing the present invention will be further described, but not limited to this.
A kind of packaging system of solid ultraviolet laser, including laser base board and the crystal on laser base board And fixture, as shown in figure 1, crystal includes frequency doubling nonlinear crystal, frequency tripling nonlinear crystal, fixture includes that frequency doubling nonlinear is brilliant Body fixture, frequency tripling nonlinear crystal fixture, fixture includes clamp cover and clamp base, and crystal is located at clamp cover and clamp base Between, clamp base side is provided with blind hole, and the hole depths of thermistor insertion blind hole simultaneously contacts with blind hole inwall.Thermistor Do not contact with crystal, it is ensured that plane of crystal is fully contacted fixture.
Clamp base bottom is provided with TEC semiconductor temperature-control pieces, the different operating power of its different Current Voltage value correspondence, TEC semiconductor temperature-controls piece and thermistor are connected with PID temperature controllers.Temperature is controlled by TEC semiconductor temperature-controls piece, by heat Quick induction motor temperature.Adjust crystal temperature effect to be allowed in factory-designed design temperature, then each optical element in collimated light path. After Ultra-Violet Laser is exported, fixed crystal holder, afterwards again by TEC semiconductor temperature-controls piece alignment jig temperature so as to changing Crystal temperature effect, changes the refractive index of crystal, realizes optimum phase matching, makes laser output power reach maximum.
Clamp base bottom is provided with groove, and TEC semiconductor temperature-controls piece is located in groove, TEC semiconductor temperature-control piece outer surfaces Same level is located at clamp base lower surface.
Clamp cover and clamp base bolt connection, clamp base and laser base board bolt connection, clamp base and temperature-sensitive Resistance is connected by heat conductive silica gel, and TEC semiconductor temperature-controls piece is connected by heat-conducting silicone grease with clamp base bottom.
The clamp cover one side relative with clamp base is step surface, and square cavity is constituted between step surface, and crystal is located at In square cavity between clamp cover and clamp base, crystal is fixed by the L-type right-angle structure and bolt connection of step, platform The structure of terrace makes crystal whole and holder contacts, fixation.Clamp material can be aluminium, or copper.
A kind of method for packing of solid ultraviolet laser, including step is as follows:
(1) first, make crystal temperature effect in factory-designed design temperature, crystal is placed in the step surface of clamp base Right angle, placing clamp lid and bolt are fixed;TEC semiconductor temperature-control pieces are put into clamp base bottom, clamp base is placed in On laser base board, in the blind hole of clamp base side thermistor is placed, by TEC semiconductor temperature-controls piece and thermistor with PID temperature controllers connect, and fixture is placed in laser optical path;
(2) secondly, by collimated light beam to including frequency doubling nonlinear crystal, in front and back frequency tripling nonlinear crystal, hysteroscope, work Make material carries out collimation adjustment in interior optical element, and pumping source is opened after the completion of collimation, finely tunes outgoing mirror, bolt stationary fixture Pedestal and laser base board, obtain ultraviolet output after the completion of collimation;
(3) fixture temperature is fed back to PID temperature controllers, PID temperature controllers contrast feedback temperature and design temperature by thermistor, PID arithmetic is carried out, corresponding current and voltage signals are provided according to operation result, control 202 semiconductor temperature-control pieces work adjusts TEC Semiconductor temperature-control piece power:When feedback temperature is less than design temperature, PID temperature controllers send heating to TEC semiconductor temperature-control pieces Instruction, by crystal temperature effect design temperature is risen to;When feedback temperature is higher than design temperature, PID temperature controllers are to TEC semiconductor temperature-controls Piece sends refrigeration instruction, and crystal temperature effect is down into design temperature.By changing temperature value near design temperature, work as power output When reaching maximum, that is, determine that design temperature now is optimum temperature value.Two crystal are in into optimum phase matching state, Power conversion efficiency highest.Fix this temperature value, you can obtain the Ultra-Violet Laser output of efficient stable.With it, compensation The phase mismatch that angledetuning is caused during encapsulation, obtains the laser output of high efficiency, high stability.
It is separately adjustable to the temperature of frequency doubling nonlinear crystal, frequency tripling nonlinear crystal.
Fig. 1 is the applicable a kind of typical laser structure of this method for packing, it is adaptable to typical non-linear conversion process, But it is not unique applicable structure, the various conventional light channel structures such as average chamber, flat-concave cavity are suitable for this method for packing, The various common pumping configurations such as end pumping, profile pump are suitable for this method for packing, non-outside non-linear conversion in chamber, chamber The frequency conversion ways such as linear transformation are suitable for this method for packing.And can also include dichroscope, three-dimensional in laser cavity The optical elements such as Look mirror.Like this optical element is the expansion that those skilled in the art can be based in a kind of application of the present invention, is made With being to strengthen frequency doubled light and frequency tripling (or quadruple) light order of reflection, optical loss is reduced, further improve power output.
Although specifically showing and describing the present invention with reference to preferred embodiment, the technical staff in the field should be bright In vain, in the spirit and scope of the present invention limited without departing from appended claims, in the form and details can be right The present invention makes a variety of changes, and is protection scope of the present invention.

Claims (9)

1. a kind of packaging system of solid ultraviolet laser, it is characterised in that including laser base board and positioned at laser instrument bottom Crystal and fixture on plate, crystal includes frequency doubling nonlinear crystal, frequency tripling or quadruple nonlinear crystal, and fixture includes fixture Lid and clamp base, crystal is located between clamp cover and clamp base, and clamp base side is provided with blind hole, and temperature-sensitive is provided with blind hole Resistance, clamp base bottom is provided with TEC semiconductor temperature-control pieces, TEC semiconductor temperature-controls piece and thermistor with PID temperature controller phases Even.
2. the packaging system of solid ultraviolet laser according to claim 1, it is characterised in that thermistor is positive temperature One kind in coefficient thermal resistor, negative temperature thermosensitive resistor and critical temperature thermistor.
3. the packaging system of solid ultraviolet laser according to claim 1, it is characterised in that clamp base bottom is provided with Groove, TEC semiconductor temperature-controls piece is located in groove, and TEC semiconductor temperature-control piece outer surfaces are located at same with clamp base lower surface One horizontal plane.
4. the packaging system of solid ultraviolet laser according to claim 1, it is characterised in that clamp cover and clamp base Bolt connection, clamp base and laser base board bolt connection, clamp base is connected with thermistor by heat conductive silica gel, TEC Semiconductor temperature-control piece is connected by heat-conducting silicone grease with clamp base bottom.
5. the packaging system of solid ultraviolet laser according to claim 1, it is characterised in that clamp cover and clamp base Relative one side is step surface.
6. a kind of method for packing of solid ultraviolet laser, it is characterised in that as follows including step:
(1) first, make crystal temperature effect in factory-designed design temperature, crystal is put into fixture, fixture is placed in into laser In light path;
(2) secondly, collimation adjustment is carried out to frequency doubling nonlinear crystal, frequency tripling or quadruple nonlinear crystal, after the completion of collimation Obtain ultraviolet output;
(3) change temperature near initial value, when power output maximum, fix this temperature value.
7. the method for packing of solid ultraviolet laser according to claim 6, it is characterised in that in step (1), make crystal Temperature is in factory-designed design temperature, and crystal is placed in the right angle of the step surface of clamp base, placing clamp lid and spiral shell Bolt is fixed;TEC semiconductor temperature-control pieces are put into clamp base bottom, clamp base bolt is fixed on laser base board, Thermistor is placed in the blind hole of clamp base side, TEC semiconductor temperature-controls piece and thermistor is connected with PID temperature controllers, Fixture is placed in laser optical path.
8. the method for packing of solid ultraviolet laser according to claim 6, it is characterised in that in step (2), to including Frequency doubling nonlinear crystal, frequency tripling or quadruple nonlinear crystal carry out collimation adjustment in interior optical element, after the completion of collimation Pumping source is opened, outgoing mirror, bolt stationary fixture pedestal and laser base board is finely tuned, Ultra-Violet Laser is obtained after the completion of collimation defeated Go out.
9. the method for packing of solid ultraviolet laser according to claim 6, it is characterised in that in step (3), temperature-sensitive electricity Fixture temperature is fed back to PID temperature controllers, PID temperature controllers contrast feedback temperature and design temperature by resistance, is adjusted according to comparing result TEC semiconductor temperature-control piece power:When feedback temperature is less than design temperature, PID temperature controllers send to TEC semiconductor temperature-control pieces and add Heat instruction, by crystal temperature effect design temperature is risen to;When feedback temperature is higher than design temperature, PID temperature controllers are to TEC semiconductor temperature Control wafer sends refrigeration instruction, and crystal temperature effect is down into design temperature.
CN201611216072.5A 2016-12-26 2016-12-26 Package device and method of solid ultraviolet laser Pending CN106654815A (en)

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CN111740297A (en) * 2020-07-08 2020-10-02 浙江富春江环保科技研究有限公司 Double-beam laser system with laser energy monitoring and feedback and control method thereof
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Cited By (7)

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Publication number Priority date Publication date Assignee Title
CN107196181A (en) * 2017-08-02 2017-09-22 山东大学 A kind of C mount encapsulation semiconductor laser pumping Low threshold micro-slice lasers and its control method without coupled system
CN110429456A (en) * 2019-08-21 2019-11-08 中国人民解放军陆军工程大学 The combination KTP frequency doubling device and its method of adjustment of expansible Acclimation temperature range
CN110429456B (en) * 2019-08-21 2024-03-26 中国人民解放军陆军工程大学 Combined KTP frequency doubling device capable of expanding temperature adaptation range and adjusting method thereof
CN111740297A (en) * 2020-07-08 2020-10-02 浙江富春江环保科技研究有限公司 Double-beam laser system with laser energy monitoring and feedback and control method thereof
CN112636134A (en) * 2020-12-21 2021-04-09 北京遥测技术研究所 Space laser structure
CN115198375A (en) * 2022-07-19 2022-10-18 广东粤港澳大湾区硬科技创新研究院 Ultraviolet nonlinear crystal temperature control furnace and temperature control method and assembly method thereof
CN115198375B (en) * 2022-07-19 2024-04-19 广东卓劼激光科技有限公司 Ultraviolet nonlinear crystal temperature control furnace and temperature control method and assembly method thereof

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