CN201994553U - Mounting base and laser using same - Google Patents
Mounting base and laser using same Download PDFInfo
- Publication number
- CN201994553U CN201994553U CN201020657966XU CN201020657966U CN201994553U CN 201994553 U CN201994553 U CN 201994553U CN 201020657966X U CN201020657966X U CN 201020657966XU CN 201020657966 U CN201020657966 U CN 201020657966U CN 201994553 U CN201994553 U CN 201994553U
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- Prior art keywords
- mount pad
- loam cake
- nonlinear crystal
- crystal
- following
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Abstract
The utility model relates to a mounting base and a laser using the mounting base. The mounting base is provided with a crystal mounting groove used for mounting a nonlinear crystal; and groove walls of the crystal mounting groove are in contact with the side surfaces of the nonlinear crystal. The four surfaces of the nonlinear crystal are in contact with the groove walls when the nonlinear crystal is installed inside the crystal mounting groove, so that an indium film can be conveniently coated on the nonlinear crystal, the mounting base is easy to install and convenient to operate, and the heat exchange between the nonlinear crystal and the mounting base is facilitated; the nonlinear crystal and the mounting base are used as one system, so that thermal equilibrium can be achieved more rapidly, the laser output power is stable and can return to a power output value before power-off when restarting is carried out after power-off. Meanwhile, a thermal electrical refrigerator is connected with a base and a lower seat through thermal conductive adhesives, so that the contact of junction surfaces can be complete and tight, the heat quantity transmission can be facilitated, no retaining screws is adopted at the same time, stress action cannot be caused on the thermal electrical refrigerator, the damage risk of the thermal electrical refrigerator can be reduced, and the service life can be prolonged.
Description
[technical field]
The utility model relates to a kind of mount pad, relates in particular to a kind of nonlinear crystal mount pad and uses the laser of this mount pad.
[background technology]
At present, when nonlinear crystal is used in laser, be placed in the mount pad.
Shown in Figure 1 is conventional mounting holder structure cutaway view.The mount pad of tradition nonlinear crystal comprises base 10, semiconductor cooler 20 (being TEC), following 30 and the loam cake 40 that sets gradually.Wherein, 10 times seats 30 of base and loam cake 40 are the mechanical component of mount pad.Nonlinear crystal 50 is installed in the mounting groove 31 that is surrounded by following 30 and loam cake 40, and by loam cake 40 glands.
Simultaneously, the conventional mounting seat, being connected of semiconductor cooler 20 and base 10 and following 30 is to add the indium film by between the contact-making surface, adds with screw that the fixing method of heat insulating mattress connects again.This method of attachment can not ensure fully contact between each joint face, and is influential to the transmission of heat; Have in temperature difference under the situation of bigger variation, fixed screw has certain stress to occur, and can cause damage to semiconductor cooler 20, influences its useful life.
[utility model content]
Based on this, be necessary the mount pad that a kind of simple operation is provided, is beneficial to heat exchange.
In addition, also be necessary to provide a kind of laser that uses above-mentioned mount pad.
A kind of mount pad has the crystal mounting groove that is used to install nonlinear crystal on the described mount pad, the cell wall of described crystal mounting groove all contacts with described nonlinear crystal side.
Preferably, described mount pad comprises base, semiconductor cooler, following and the loam cake that sets gradually; Described loam cake surrounds described crystal mounting groove jointly with following.
Preferably, described loam cake and described following adaptive amalgamation.
Preferably, described upward cap surface caves in and forms the loam cake breach, and described seating face down caves in and forms a following breach that docks with described loam cake breach coupling, and described crystal mounting groove is surrounded jointly by a described loam cake breach and a following breach.
Preferably, described loam cake breach is identical right angle trigonometry v notch v with a described following breach.
Preferably, described loam cake has the diapire parallel with described base and constitutes the sidewall at obtuse angle with described diapire.
Preferably, the diapire of described loam cake and sidewall all with a described following amalgamation.
Preferably, described loam cake breach is opened on the sidewall of described loam cake.
Preferably, described semiconductor cooler and described base adopt heat-conducting glue to be connected with following at least one among both.
A kind of laser comprises nonlinear crystal and the mount pad of described nonlinear crystal is installed, and it is characterized in that described mount pad is above-mentioned mount pad.
Said fixing frame and use the laser of this fixed mount, the four sides all contacted with cell wall when nonlinear crystal was installed in the crystal mounting groove, thereby make nonlinear crystal be convenient to wrap the indium film, easy, simple operation are installed, help the heat exchange between nonlinear crystal and the mount pad, nonlinear crystal and mount pad are as a system, can reach heat balance faster, laser output power is stable, and start again after the outage can return to the preceding power output valve of outage.
Simultaneously, semiconductor cooler all is connected by heat-conducting glue with following with base, makes can contact fully closely between each joint face, be beneficial to the transmission of heat, do not have hold-down screw simultaneously, do not have stress on the semiconductor cooler, reduce its damage risk, prolonged useful life.
[description of drawings]
Shown in Figure 1 is conventional mounting holder structure cutaway view;
Fig. 2 is a mount pad structure cutaway view among the embodiment;
Fig. 3 is that an embodiment mount pad is installed the nonlinear crystal schematic diagram.
[embodiment]
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail.
Have the crystal mounting groove that is used to install nonlinear crystal on this mount pad, and four sides of the cell wall of crystal mounting groove and nonlinear crystal contact all.
Fig. 2 is a mount pad structure cutaway view among the embodiment.Fig. 3 is that an embodiment mount pad is installed the crystal schematic diagram.In conjunction with Fig. 2 and Fig. 3, this mount pad comprises base 100, semiconductor cooler 200, following 300 and the loam cake 400 that sets gradually.Semiconductor cooler 200 all is connected by heat-conducting glue 500 with following 300 with base 100.Loam cake 400 become to install nonlinear crystal 700 with following 300 one common peripheral and make nonlinear crystal 700 four sides respectively with loam cake 400 and following 300 crystal mounting groove 600 that contacts.
Among this embodiment, loam cake 400 and following 300 adaptive amalgamation.Crystal mounting groove 600 is caved in the loam cake breach that forms 410 and following 300 outer wall cave in and form mate a following breach 310 that docks with loam cake breach 410 and be put together by loam cake 400 outer walls.
In preferred embodiment, loam cake 400 is a parallelogram with the parallel cross section of laser entrance face (figure does not show, and is parallel with nonlinear crystal cross section 710) of nonlinear crystal 700, has the diapire parallel with base 100 and constitutes the sidewall at obtuse angle with diapire.This diapire and sidewall adjacent and all with following 300 amalgamations, and sidewall and nonlinear crystal 700 laser entrance faces or laser-emitting face (figure does not show, and is parallel with the nonlinear crystal cross section) are gone up parallel with the diagonal 720 at diapire formation obtuse angle.Loam cake breach 410 is arranged on the sidewall of loam cake 400.Loam cake breach 410 is identical right angle trigonometry v notch v with a following breach 310, forms crystal mounting groove 600 along the diagonal amalgamation of crystal mounting groove 600.When nonlinear crystal 700 was installed in the crystal mounting groove 600, following seat breach 310 contacted with nonlinear crystal 700 adjacent two sides, and loam cake breach 410 contacts with nonlinear crystal 700 all the other adjacent two sides.A loam cake breach 410 and a following breach 310 all with two contacts side surfaces of nonlinear crystal 700, when being installed, nonlinear crystal 700 can nonlinear crystal 700 be installed in the crystal mounting groove 600 because of crystal mounting groove 600 sizes and nonlinear crystal 700 are identical and very difficult, convenient easily, simple to operate, only need nonlinear crystal 700 to be installed in down in the seat breach 310 earlier, with following 300 amalgamations four sides of nonlinear crystal 700 are contacted with mount pad loam cake 400 again.Four sides of nonlinear crystal 700 all contact with mount pad, thereby make nonlinear crystal 700 be convenient to wrap the indium film, fitting operation is convenient, help the heat exchange between nonlinear crystal 700 and the mount pad, nonlinear crystal 700 and mount pad can reach heat balance faster as a system, and laser output power is stable, again start after the outage can return to the preceding power output valve of outage.
In other embodiments, loam cake 400 also can be connected by modes such as fastening or plug close with following 300, and crystal mounting groove 600 is caved in by following 300 surfaces separately and forms.Semiconductor cooler 200 adopts heat-conducting glue 500 to be connected with base 100 or with following 300.
In addition, also provide a kind of laser that uses the said fixing frame.This laser is a kind of micro laser.
Said fixing frame and use the laser of this fixed mount, four sides all contacted with cell wall when nonlinear crystal was installed in the crystal mounting groove, thereby make nonlinear crystal be convenient to wrap the indium film, easy, simple operation are installed, help the heat exchange between nonlinear crystal and the mount pad, nonlinear crystal and mount pad are as a system, can reach heat balance faster, laser output power is stable, and start again after the outage can return to the preceding power output valve of outage.
Simultaneously, semiconductor cooler all is connected by heat-conducting glue with following with base, makes can contact fully closely between each joint face, be beneficial to the transmission of heat, do not have hold-down screw simultaneously, do not have stress on the semiconductor cooler, reduce its damage risk, prolonged useful life.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. a mount pad is characterized in that, has the crystal mounting groove that is used to install nonlinear crystal on the described mount pad, and the cell wall of described crystal mounting groove all contacts with described nonlinear crystal side.
2. mount pad according to claim 1 is characterized in that, described mount pad comprises base, semiconductor cooler, following and the loam cake that sets gradually; Described loam cake surrounds described crystal mounting groove jointly with following.
3. mount pad according to claim 2 is characterized in that, described loam cake and described following adaptive amalgamation.
4. mount pad according to claim 3, it is characterized in that, described upward cap surface caves in and forms the loam cake breach, and described seating face down caves in and forms a following breach that docks with described loam cake breach coupling, and described crystal mounting groove is surrounded jointly by a described loam cake breach and a following breach.
5. mount pad according to claim 4 is characterized in that, described loam cake breach is identical right angle trigonometry v notch v with a described following breach.
6. mount pad according to claim 5 is characterized in that, described loam cake has the diapire parallel with described base and constitutes the sidewall at obtuse angle with described diapire.
7. mount pad according to claim 6 is characterized in that, the diapire of described loam cake and sidewall all with a described following amalgamation.
8. mount pad according to claim 7 is characterized in that, described loam cake breach is opened on the sidewall of described loam cake.
9. mount pad according to claim 2 is characterized in that, described semiconductor cooler and described base adopt heat-conducting glue to be connected with following at least one among both.
10. laser comprises nonlinear crystal and the mount pad of described nonlinear crystal is installed, and it is characterized in that described mount pad is aforesaid right requirement 1 to 9 arbitrary described mount pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020657966XU CN201994553U (en) | 2010-12-13 | 2010-12-13 | Mounting base and laser using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020657966XU CN201994553U (en) | 2010-12-13 | 2010-12-13 | Mounting base and laser using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201994553U true CN201994553U (en) | 2011-09-28 |
Family
ID=44671031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020657966XU Expired - Lifetime CN201994553U (en) | 2010-12-13 | 2010-12-13 | Mounting base and laser using same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201994553U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891422A (en) * | 2011-12-22 | 2013-01-23 | 清华大学 | Nonlinear crystal temperature control device |
| CN106654815A (en) * | 2016-12-26 | 2017-05-10 | 山东大学 | Package device and method of solid ultraviolet laser |
| CN113867448A (en) * | 2021-10-27 | 2021-12-31 | 北京工业大学 | Temperature control device of nonlinear optical crystal |
-
2010
- 2010-12-13 CN CN201020657966XU patent/CN201994553U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891422A (en) * | 2011-12-22 | 2013-01-23 | 清华大学 | Nonlinear crystal temperature control device |
| CN106654815A (en) * | 2016-12-26 | 2017-05-10 | 山东大学 | Package device and method of solid ultraviolet laser |
| CN113867448A (en) * | 2021-10-27 | 2021-12-31 | 北京工业大学 | Temperature control device of nonlinear optical crystal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: HAN'S LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. Free format text: FORMER NAME: DAZU LASER SCI. + TECH. CO., LTD., SHENZHEN |
|
| CP03 | Change of name, title or address |
Address after: Dazu laser Building No. 9 Nanshan District high tech Park North new road Shenzhen city Guangdong province 518055 Patentee after: HANS LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. Address before: 518000 Shenzhen Province, Nanshan District high tech park, North West New Road, No. 9 Patentee before: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110928 |