CN212931678U - Testing device of infrared thermopile sensor - Google Patents

Abstract

The utility model provides a testing arrangement of infrared thermopile sensor. The testing device comprises a black body which is used as a standard radiation source to provide a standard object temperature Tobj for testing; an insulator made of an insulating material having a cavity therethrough, the cavity including a first port proximate the black body and a second port distal from the black body; the heat carrier has placed infrared thermopile sensor in it, the heat carrier can get into and withdraw from the cavity of insulator, works as when the heat carrier is located standard test position, placed infrared thermopile sensor the heat carrier is located the cavity of insulator. Thus, the thermopile output voltage-environment temperature-object temperature matrix table can be measured efficiently, and high-precision measurement results can be obtained.

Description

Testing device of infrared thermopile sensor

[ technical field ] A method for producing a semiconductor device

The utility model belongs to MEMS (Micro-Electro-Mechanical System, Micro Electro Mechanical System) device test field especially relates to a testing arrangement of thermopile output voltage-ambient temperature-object temperature matrix table.

[ background of the invention ]

In the thermopile output voltage-environment temperature-object temperature matrix table test, the temperature of an object (a standard blackbody) is required to be changed from minus dozens of degrees to over 100 degrees, and the environment temperature is required to be changed from near minus 20-100 degrees. The working temperature of most blackbodies is between 0 and 40 ℃, the testing requirements cannot be met, and some blackbodies which can work in the environment of-20 to 100 ℃ are very expensive and have a value of tens of thousands of yuan. And provide the high low temperature experimental box of ambient temperature for test equipment, the temperature stabilization takes longer, and generally single-point temperature stabilization time is few then needs 30 minutes, is very unfavorable for the test of intensive ambient temperature point. The table quantity of the actual measurement matrix in the existing test is insufficient, most of the actual measurement matrix is obtained by interpolation, and the application of high precision of a client side is not facilitated.

Therefore, it is necessary to provide a technical solution to overcome the above problems.

[ Utility model ] content

An object of the utility model is to provide an infrared thermopile sensor's testing arrangement, it can realize low-cost, high accuracy, high efficiency in thermopile output voltage-ambient temperature-object temperature matrix table test.

According to an aspect of the utility model, the utility model provides a testing arrangement of infrared thermopile sensor, it includes: a black body as a standard radiation source providing a standard object temperature Tobj for the test; an insulator made of an insulating material having a cavity therethrough, the cavity including a first port proximate the black body and a second port distal from the black body; the heat carrier has placed infrared thermopile sensor in it, the heat carrier can get into and withdraw from the cavity of insulator, works as when the heat carrier is located standard test position, placed infrared thermopile sensor the heat carrier gets into the cavity of insulator.

Compared with the prior art, the utility model discloses a distribution of hot current flow direction, temperature field in the control testing arrangement to carry out efficient measurement to thermopile output voltage-ambient temperature-object temperature matrix table, and obtain the measuring result of high accuracy.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor. Wherein:

fig. 1 is a schematic structural diagram of an infrared thermopile sensor testing apparatus according to an embodiment of the present invention in an initial state;

fig. 2 is a schematic structural diagram of a testing device of an infrared thermopile sensor according to an embodiment of the present invention in an operating state;

FIG. 3 is an exploded view of the heat carrier of FIGS. 1 and 2 in one embodiment;

FIG. 4 is a cross-sectional view of the infrared thermopile sensor shown in FIG. 3 in one embodiment;

FIG. 5 is a flow chart of a method of testing the infrared thermopile sensor testing device of FIGS. 1 and 2 of the present invention in one embodiment;

FIG. 6 is a graph of the temperature difference between the thermistor and the thermopile chip of the infrared thermopile sensor testing apparatus according to one embodiment of the present invention, as a function of the heat dissipation power of the heat sink;

FIG. 7 is a graph comparing the temperature of heat carrier with time variation under two different heat dissipation control modes for the testing device of the infrared thermopile sensor.

[ detailed description ] embodiments

In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.

Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with at least one implementation of the invention is included. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Unless otherwise specified, the terms connected, and connected as used herein mean electrically connected, directly or indirectly.

Fig. 1 is a schematic structural diagram of an infrared thermopile sensor testing apparatus (or testing system) in an initial state according to an embodiment of the present invention; fig. 2 is a schematic structural diagram of a testing apparatus (or testing system) of an infrared thermopile sensor according to an embodiment of the present invention in an operating state. The test device of the infrared thermopile sensor shown in fig. 1 and 2 includes a black body 110, an insulator 120, and a heat carrier 130.

The black body 110, which serves as a standard radiation source, provides a standard object temperature source for thermopile testing.

The insulator 120, which is made of an insulating material, is positioned adjacent the black body 110, and the insulator 120 has a cavity 122 extending through the insulator 120, the cavity 122 including a first port proximate the black body 110 and a second port distal from the black body 110.

The heat carrier 130 has a heat conduction function, and an infrared thermopile sensor 140 is located in the heat carrier 130, and the heat carrier 130 can enter or exit the cavity 122 of the insulator 120. When the heat carrier 130 is in the initial position, as shown in fig. 1, the heat carrier 130 with the infrared thermopile sensor 140 placed thereon is located outside the heat insulator 120 and away from the black body 110; when the heat carrier 130 is located at the working position (or the standard test position), as shown in fig. 2, the heat carrier 130 on which the infrared thermopile sensor 140 is placed is located in the cavity 122 of the heat insulator 120 and is close to the black body 110.

In the embodiment shown in fig. 1 and 2, the heat insulator 120 includes a heat insulating frame 124, the heat insulating frame 124 has a hollow structure, the cavity 122 is located in the heat insulating frame 124, and a hollow area 126 surrounding the cavity 122 is located between the heat insulating frame 124 and the cavity 122.

The heat insulation frame 124 is made of a material with low thermal conductivity, such as teflon, PPS (polyphenylene sulfide), bakelite, etc., and is mainly used for isolating heat exchange between the heat carrier 130 located in the cavity 122 and the black body 110; the blackbody 110 is a high-precision temperature source, the fluctuation of the temperature of the radiation surface of the blackbody 110 can be influenced by the change of the environmental temperature, and the stability of the temperature of the blackbody 110 can be increased by placing the heat insulation frame 124 between the heat carrier 130 and the blackbody 110.

The void region 126 around the cavity 122 may be filled with a high thermal resistance material, such as foam or the like. The empty region 126 is mainly used to isolate the heat exchange between the heat carrier 130 located in the cavity 122 and the surrounding environment.

In the embodiment shown in fig. 1 and 2, the testing apparatus for an infrared thermopile sensor further includes a slide rail 150 and a slide base (which may be a placement table) 160 disposed on the slide rail 150. During the test, the heat carrier 130 with the infrared thermopile sensor 140 placed thereon is placed on the sliding base 160, so that the heat carrier 130 is located at an initial position outside the thermal insulator 120, as shown in fig. 1, the slide rail 150 extends from the outside of the cavity 122 to the inside of the cavity 122, and the heat carrier 130 is placed on the sliding base 160 and away from the black body 110 and the thermal insulator 120; the slide base 160 is then pushed along the slide rail 150 to slide into the cavity 122 of the insulator 120 and into a standard testing position, as shown in FIG. 2.

In the embodiment shown in fig. 1 and 2, the testing apparatus for the infrared thermopile sensor further includes an optical platform 170 and a small fan 180, and the heat insulation frame 124 and the slide rail 150 are fixed on the optical platform 170 to ensure that the heat carrier 130 is in the same standard testing position during each test; a small fan 180 is installed above the heat insulation frame 124, and the temperature change rate of the heat carrier 130 is controlled by adjusting the air volume.

Reference is made to fig. 3, which is an exploded view of heat carrier 130 of fig. 1 and 2 in one embodiment. The heat carrier shown in fig. 3 includes a front heat insulating plate 131, a pressing plate 132, an infrared thermopile sensor 140, a bottom plate 133, a device mount 134, a circuit board 135, a heat sink 137, and a heat conductive column 136 between the bottom plate 133 and the heat sink 137, which are sequentially stacked. When the heat carrier 130 is in the standard test position, the front insulation board 131 is located at the first port of the cavity 122 of the insulator 120; the heat sink 137 is located at a second port of the cavity 122 of the insulator 120.

The front heat insulation board 131 is made of low-heat-conductivity and temperature-resistant materials, such as PPS, Teflon and other engineering plastics; the pressing plate 132 and the bottom plate 133 are made of materials with high thermal conductivity, such as red copper, silver, aluminum, and the like, and are mainly used for reducing the temperature gradient of the infrared thermopile sensor 140 and improving the measurement accuracy; and by applying a pre-stress to the platen 132, the infrared thermopile sensor 140 can be closely attached to the upper surface 1332 of the base plate 133 (or a surface close to the platen 132). The device base 134 is used for placing the infrared thermopile sensor 140 closely attached to the bottom plate 133 and making a good electrical connection between the infrared thermopile sensor 140 and the circuit board 135; the positional relationship between the infrared thermopile sensor 140, the base plate 133 and the device mount 134 may be secured by positioning pins 138 mounted on the base plate 133. The heat-conducting columns 136 are located between the pressing plate 132 and the heat sink 137, and the heat-conducting columns 136 are used for controlling the direction of the heat flow of the heat carrier 130 located in the heat insulator 120, so that most of the heat stored in the heat carrier 130 is conducted to the heat sink 137 through the heat-conducting columns 136 for dissipation, and the heat exchange between the heat carrier 130 and other objects or environments is reduced to the greatest extent. Meanwhile, the temperature change rate of the heat carrier 130 can be accurately controlled by controlling the convection heat transfer coefficient of the radiator 137 through the fan 180.

Please refer to fig. 4, which is a schematic cross-sectional view of the infrared thermopile sensor shown in fig. 3 according to an embodiment. The infrared thermopile sensor shown in fig. 4 includes a thermopile chip 142 and a thermistor 144 packaged together, the thermopile chip 142 being configured to detect a temperature of the black body 110 (i.e., an object temperature) and output a thermopile output voltage reflecting the temperature of the black body 110; the thermistor 144 is used to detect the ambient temperature (or ambient temperature) at which the thermopile chip 142 is located.

In another embodiment, the small fan 180 may be modified to other control modules, such as a water heat exchange module. The control module may be adapted to control the convective heat transfer coefficient of the heat carrier radiator. Specifically, the control module adjusts the convective heat transfer coefficient of the heat carrier radiator based on the temperature difference between the ambient temperature and the room temperature, which is obtained by the temperature detection unit of the infrared thermopile sensor, so that the product of the temperature difference between the current ambient temperature and the room temperature T0 and the convective heat transfer coefficient of the radiator is a set value.

Fig. 5 is a flow chart illustrating a testing method of the testing apparatus of the infrared thermopile sensor of the present invention in one embodiment, which is shown in fig. 1 and fig. 2. The testing method of the testing device of the infrared thermopile sensor shown in fig. 5 is a dynamic testing method, which includes the following steps.

Step 510, the temperature detection unit corrects.

In one embodiment, the temperature sensing unit is a thermistor 144. In order to obtain a high-precision ambient temperature value Tamb, the thermistor 144 packaged in the infrared thermopile sensor 140 needs to be temperature-corrected, and if the thermistor 144 is not temperature-corrected, the precise ambient temperature value of the thermopile chip 142 cannot be obtained due to the existence of a temperature gradient in the test system. In the test method, the temperature value corresponding to the thermistor 144 is used as the ambient temperature of the thermopile chip 142.

In step 520, the temperature of black body 110 is set to provide a standard object temperature Tobj for thermopile testing, heating heat carrier 130 to the highest temperature point or/and cooling heat carrier 130 to the lowest temperature point.

In one embodiment, heat carrier 130 is heated to a maximum temperature point, or cooled to a minimum temperature point, within a high and low temperature tank (not shown). Specifically, the heat carrier 130 with the infrared thermopile sensor 140 placed therein is placed in a high-low temperature chamber to be heated or cooled to a certain temperature. Thereafter, heat carrier 130 is removed and placed on a stage (e.g., slide base 160) and slid to a standard test position, see in particular fig. 2.

And step 530, starting a thermopile test, namely sampling the output of the temperature detection unit at preset time intervals to obtain an ambient temperature and the output of the thermopile chip to obtain a thermopile output voltage, and storing the obtained ambient temperature and the thermopile output voltage to form an output voltage-ambient temperature-object temperature matrix table.

In one embodiment, the predetermined time may be set as desired. Reading the thermistor value R (Tamb) of the thermistor 144, and converting the read thermistor value R into the ambient temperature Tamb according to the calibrated data. And storing the read thermopile output voltage V into Tamb, Tobj of a thermopile output-environment temperature-object temperature matrix table.

And 540, judging whether the obtained ambient temperature Tamb is close to the room temperature T0. The approach here may be that the temperature difference between ambient temperature Tamb and room temperature T0 is less than or equal to a predetermined temperature threshold. If yes, go back to step 520 until the temperature of the black body 110 covers the standard object temperature range, such as from 0-40 degrees; if not, go to step 550.

In step 550, the control module adjusts the convective heat transfer coefficient of the heat sink of the heat carrier according to the difference between the current ambient temperature and the room temperature T0. Thereafter, the test is continued by returning to step 530.

In one embodiment, the rotation speed of the fan 4 may be adjusted to adjust the product of the convective heat transfer coefficient h of the heat sink 137 and Tamb-T0 (the temperature difference between ambient temperature Tamb and room temperature T0) to a set value, and the process returns to step 530. Therefore, because the utility model discloses the convective heat transfer coefficient of active adjustment radiator for ambient temperature Tamb increases to room temperature T0 from minimum temperature point, and the speed of falling to room temperature T0 from the maximum temperature point accelerates greatly, can guarantee that measurement accuracy can shorten test time again greatly, improves efficiency of software testing.

It should be noted that, in order to enable the ambient temperature Tamb to cover from the highest temperature point to the lowest temperature point, the heat carrier 130 needs to be heated to the highest temperature point, after steps 530, 540, and 550 are performed, the heat carrier 130 is cooled to the highest temperature point, and then steps 530, 540, and 550 are performed again.

The utility model discloses can realize the control to measurement accuracy. The temperature difference between the thermistor 144 and the thermopile chip 142 is related to the heat dissipation power of the heat sink 137, and the temperature gradients of the pressing plate 132 and the bottom plate 133, the utility model discloses an improve the temperature uniformity greatly reduced the temperature difference between the thermistor 144 and the thermopile chip 142, the simulation result is as shown in fig. 6. Fig. 6 is a graph showing the temperature difference between the thermistor 144 and the thermopile chip 142 of the testing device of the infrared thermopile sensor according to an embodiment of the present invention, and the heat dissipation power of the heat sink 137. The thermopile chip 142 may also be referred to as a thermocouple, and the thermistor 144 may be an NTC (negative temperature coefficient). The heat dissipation power of the heat sink 137 needs to be set according to the measurement accuracy, for example, under the premise that the ambient temperature Tamb changes by 1 degree, 99% of the measurement accuracy is required, that is, the temperature difference between the thermistor 144 and the thermopile chip 142 is required to be less than 0.01 degree, and the heat dissipation power of the testing device of the present invention should not be greater than 11W.

The utility model discloses an initiative heat dissipation control shortens measuring time. To the utility model discloses a testing arrangement, cooling process transient state heat-conduction equation can be expressed as:

wherein Q is the heat rate, and there is no heat source inside the heat carrier 130, thus Q is 0; rho VC_pFor the heat capacity of the whole heat carrier 130, h is the convective heat transfer coefficient of the heat sink 137, a is the surface area of the heat sink 137, T is the instant temperature of the heat carrier 130 substantially identical to the ambient temperature Tamb of the thermopile chip 142, and T0 is the temperature of the air in the test environment (i.e., room temperature).Solving equation 1 yields the heat dissipation power of the heat sink 137:

as can be seen from equation 2, the heat dissipation power consumption is a time-varying quantity, and has a maximum value when t is 0, and in order to ensure the measurement accuracy in the full temperature range, it is necessary to select an appropriate temperature characteristic of the heat sink 137 and the heat carrier 130, and the heat dissipation power when t is 0 is smaller than the set power. If natural convection temperature regulation is adopted, although the measurement precision can be ensured, the whole temperature reduction process needs 3 to 5 times of system thermal time constant, and the whole test time is very long. The utility model discloses a test method keeps heat dissipation power hA (T-T0) fixed through initiative heat dissipation control, perhaps is less than the heat dissipation power that needs set for all the time, and this heat dissipation power can be adjusted at different temperature sections according to the demand. Therefore, the testing time can be minimized on the premise of ensuring the measuring precision. The temperature change after active heat dissipation control is shown in fig. 7. FIG. 7 is a graph comparing the temperature of heat carrier with time variation under two different heat dissipation control modes for the testing device of the infrared thermopile sensor. The solid line represents a curve of the temperature of the heat carrier changing along with time in a natural convection heat exchange temperature-regulating heat-radiating mode; the dotted line represents the profile of the heat carrier temperature over time in the active heat dissipation control mode. As can be seen from fig. 7, on the premise of ensuring that the temperature difference between the thermistor 144 and the thermopile chip 142 is less than 0.01 degrees, the time required for adjusting the temperature to T0 by natural convection is 140 minutes, and the time after the main heat dissipation control is 50 minutes, which shortens the test time by 64%.

To sum up, the utility model provides an infrared thermopile sensor's testing arrangement and test method have following advantage:

1. the utility model separates the black body from the high-low temperature box in the test process, so that the common black body radiation source can meet the test requirement, and the test system cost is greatly reduced;

2. the utility model discloses can obtain higher measurement accuracy, as shown in FIG. 6, under the prerequisite of object temperature transform 1 degree, this test system can obtain 99% measurement accuracy.

3. The utility model discloses an initiative heat dissipation control method can shorten test time by about 64%, and to a great extent has improved efficiency of software testing.

4. The utility model discloses a dynamic test method does not need high low temperature test box to reach stably, can shorten conventional heat time about 30 minutes to 15 minutes. And enough data points can be collected, the nonlinear characteristics of the device can be excavated, and the method has certain significance for basic research analysis and analysis.

5. The utility model discloses can be among the strict control testing arrangement thermal current, temperature field distribution in the test procedure, the minimum measuring time is adopted to the initiative control temperature variation gradient under the prerequisite of guaranteeing measurement accuracy.

The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiment, but all equivalent modifications or changes made by those skilled in the art according to the present invention should be included in the protection scope of the claims.

Claims (12)

1. A testing device of an infrared thermopile sensor, comprising:

a black body as a standard radiation source providing a standard object temperature Tobj for the test;

an insulator made of an insulating material having a cavity therethrough, the cavity including a first port proximate the black body and a second port distal from the black body;

the heat carrier has placed infrared thermopile sensor in it, the heat carrier can get into and withdraw from the cavity of insulator, works as when the heat carrier is located standard test position, placed infrared thermopile sensor the heat carrier gets into the cavity of insulator.

2. The infrared thermopile sensor testing device according to claim 1, wherein the thermal insulator comprises a thermal insulation frame, the thermal insulation frame is a hollow structure, the cavity is located in the thermal insulation frame, a hollow area surrounding the cavity is located between the thermal insulation frame and the cavity, the thermal insulation frame is made of a low thermal conductivity material, and the hollow area is filled with a high thermal resistance material.

3. The infrared thermopile sensor testing device of claim 2, wherein the low thermal conductivity material is one of teflon, PPS (polyphenylene sulfide), bakelite; the high heat resistance material is one of foam, plastic and Teflon.

4. The infrared thermopile sensor testing device of claim 1, wherein the heat carrier comprises a front heat shield and a heat sink, the infrared thermopile sensor being located between the front heat shield and the heat sink, the front heat shield being located at the first port of the cavity of the insulator when the heat carrier is in the standard testing position; the heat sink is located at a second port of the cavity of the insulator.

5. The infrared thermopile sensor testing apparatus of claim 4, wherein the heat carrier further comprises a platen, a base plate, a device mount, a circuit board, and heat-conducting posts,

the front-mounted heat insulation plate, the pressing plate, the infrared thermopile sensor, the bottom plate, the device base, the circuit board and the radiator are sequentially stacked, and the heat conduction column is located between the bottom plate and the radiator.

6. The infrared thermopile sensor testing apparatus of claim 5,

the front heat insulation plate is made of low-heat-conductivity and temperature-resistant materials;

the pressing plate and the bottom plate are made of materials with high thermal conductivity and used for reducing the temperature gradient of the infrared thermopile sensor, and the infrared thermopile sensor can be tightly attached to the surface, close to the pressing plate, of the bottom plate by applying pre-pressure to the pressing plate;

the device base is used for placing the infrared thermopile sensor tightly attached to the bottom plate and enabling the infrared thermopile sensor and the circuit board to form good electrical connection;

the heat conduction column is used for controlling the guide of the heat flow of the heat carrier in the heat insulation body, so that most of the heat stored in the heat carrier is transferred to the radiator through the heat conduction column for dissipation.

7. The infrared thermopile sensor testing device of claim 1, further comprising a control module for controlling the convective heat transfer coefficient of the heat sink of the heat carrier.

8. The infrared thermopile sensor testing device of claim 7, wherein the control module comprises a fan that controls the convective heat transfer coefficient of the heat sink of the heat carrier by varying wind speed,

the control module adjusts the convective heat transfer coefficient of the heat carrier radiator based on the temperature difference between the ambient temperature and the room temperature obtained by the temperature detection unit of the infrared thermopile sensor, so that the product of the temperature difference between the current ambient temperature and the room temperature T0 and the convective heat transfer coefficient of the radiator is a set value.

9. The infrared thermopile sensor testing apparatus of claim 1, wherein the infrared thermopile sensor comprises a thermopile chip and a temperature detection unit packaged together,

the thermopile chip is used for detecting the temperature of an external object and outputting a thermopile output voltage reflecting the temperature of the external object;

the temperature detection unit is used for detecting the ambient temperature of the thermopile chip,

the testing device also comprises a memory for storing a tested thermopile output voltage-environment temperature-object temperature matrix table.

10. The infrared thermopile sensor testing apparatus of claim 9,

the temperature detection unit is a thermistor.

11. The infrared thermopile sensor testing apparatus of claim 1,

the heat carrier is placed on the sliding support, the sliding support slides on the sliding rail, so that the heat carrier enters or exits from the cavity of the heat insulator,

the testing device also comprises a high-low temperature box which heats the heat carrier to the highest temperature point or cools the heat carrier to the lowest temperature point,

the temperature of the black body can be controlled to vary over a range of temperatures.

12. The infrared thermopile sensor testing apparatus of claim 11,

the optical platform is further included, and the heat insulator and the sliding rail are fixed on the optical platform.

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