CN115236812B - Optical device, optical power adjusting method thereof and optical module - Google Patents
Optical device, optical power adjusting method thereof and optical module Download PDFInfo
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- CN115236812B CN115236812B CN202211095598.8A CN202211095598A CN115236812B CN 115236812 B CN115236812 B CN 115236812B CN 202211095598 A CN202211095598 A CN 202211095598A CN 115236812 B CN115236812 B CN 115236812B
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- temperature
- deformation body
- optical
- coupling lens
- adjusting
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
Abstract
The invention relates to the technical field of optical communication, in particular to an optical device, an optical power adjusting method thereof and an optical module, wherein the optical device comprises a light-emitting chip, a coupling lens, a temperature adjusting component and a deformation body made of thermal expansion materials, the coupling lens is installed on the surface of the deformation body, and the temperature adjusting component is used for adjusting the temperature of the deformation body so as to enable the deformation body to deform. The coupling efficiency between the light emitting chip and the coupling lens is adjusted by the deformation of the deformation body, and then the optical power is adjusted. The invention is a new breakthrough in the optical power adjusting technology, not only can realize optical power adjustment, but also can not change the wavelength of light, so that the optical wavelength is always kept consistent in the using process.
Description
Technical Field
The invention relates to the technical field of optical communication, in particular to an optical device, an optical power adjusting method thereof and an optical module.
Background
An Optical component or an Optical device OSA (Optical Sub Assembly) is an important component of an Optical communication apparatus. The optical device comprises a light emitting device and a light receiving device, wherein the light emitting device comprises a light emitting chip, a coupling lens and an optical fiber, the light emitting chip emits a light signal, and the light signal is coupled to the optical fiber through the coupling lens and emitted by the optical fiber. The output optical power of the optical device can be adjusted as required. At present, the adjustment of the optical power is generally realized by adjusting the driving current of a light-emitting chip, so that the adjustment precision of the output optical power depends on the precision of the driving current, the high-precision driving power supply has high cost and extreme capability, and the requirement cannot be met if the higher-precision optical power output control exceeding the power supply precision is realized; on the other hand, the variation of the driving current of the light emitting chip can bring about the variation of the wavelength of the light emitting chip, which leads to the inconsistency of the wavelength in the using process.
Disclosure of Invention
The present invention is directed to overcoming the above-mentioned drawbacks of the prior art, and provides an optical device and an optical power adjusting method thereof, which can not only achieve optical power adjustment, but also have low cost without changing wavelength.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
a light device comprises a light emitting chip, a coupling lens, a temperature adjusting component and a deformation body made of thermal expansion materials, wherein the coupling lens is installed on the surface of the deformation body, and the temperature adjusting component is used for adjusting the temperature of the deformation body to enable the deformation body to deform.
In the scheme, the coupling lens is arranged on the surface of the deformation body, the temperature of the deformation body is adjusted by the temperature adjusting component, the deformation body is deformed, the position of the coupling lens is changed after the deformation, then, the relative displacement is generated between the coupling lens and the light emitting chip, the coupling efficiency between the coupling lens and the light emitting chip is changed, and then, the purpose of adjusting the optical power is achieved.
The temperature adjusting part is a semiconductor refrigerator. The semiconductor refrigerator can realize the temperature regulation effect and is convenient to install, and meanwhile, the semiconductor refrigerator can also be used as a supporting part to support the deformation body and the coupling lens, so that the mounting and fixing of the coupling lens are facilitated, the use of a cushion block can be reduced, the mounting space for the temperature regulation part can be prevented from being additionally provided, the whole size is reduced, and the miniaturization design is facilitated.
The light-emitting chip emits light signals, and the light signals are coupled to the optical fibers through the coupling lens.
The thermal expansion material is stainless steel, copper or aluminum. There are many such thermally expandable materials, with stainless steel, copper or aluminum being preferred materials, particularly for use in optical devices.
The temperature control device further comprises a temperature detection component, wherein the temperature detection component is used for detecting the temperature of the temperature adjusting component and feeding back the temperature to the controller of the temperature adjusting component. In the scheme, the temperature detection part is arranged for temperature detection, and the output temperature of the temperature adjusting part is controlled according to the detected temperature, so that the temperature change of the shape-changing body adjusted by the temperature adjusting part is more accurate, more accurate optical power adjustment can be realized, and the accuracy of optical power adjustment is improved.
An optical module comprising the optical device of any embodiment of the present invention.
An optical power adjusting method of an optical device including a light emitting chip and a coupling lens, the optical power adjusting method comprising the steps of:
step 1, mounting a coupling lens on the surface of a deformation body made of a thermal expansion material;
step 2, connecting the deformation body with a temperature adjusting component;
and 3, adjusting the temperature of the deformation body through the temperature adjusting part to deform the deformation body, then adjusting the coupling efficiency between the light-emitting chip and the coupling lens, and realizing optical power adjustment through the change of the coupling efficiency.
The temperature adjusting part is a semiconductor refrigerator, and the connection of the deformation body and the temperature adjusting part means that the deformation body is installed on a heat conducting surface of the semiconductor refrigerator.
The step 2 also comprises connecting the temperature detection component with a temperature regulation component; in the step 3, the output temperature of the temperature adjusting component is adjusted through the temperature feedback of the temperature detecting component, and then the temperature of the deformation body is adjusted to deform the deformation body.
Compared with the prior art, the invention has the following beneficial effects: the invention provides a brand-new optical power adjusting method, which is simple in implementation mode, low in cost and free from the influence of power supply precision on adjusting precision; on the other hand, the wavelength of the light-emitting chip cannot be changed by changing the displacement of the coupling lens, so that the light-emitting wavelength can be kept consistent all the time in the use process, and the application scene of the optical device is not changed.
Other technical advantages of the present invention will be explained in the examples section, which is also referred to in the examples section.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a light device in the prior art.
Fig. 2 is a schematic cross-sectional view of the structure of the optical device in the embodiment of the present invention.
Fig. 3 is a top view of an optical device in an embodiment of the invention.
Fig. 4 is a flowchart of an optical power adjusting method according to an embodiment of the present invention.
Fig. 5a, 5b and 5c are schematic structural diagrams of three variants listed in the examples respectively.
The labels in the figure are: 11-a light emitting chip; 12-cushion blocks; 13-a coupling lens; 14-morphic variant; 15-a semiconductor refrigerator; 16-an optical fiber; 17-a thermistor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, in the structure of the conventional optical device, a light emitting chip 11 and a coupling lens 13 are both mounted on a cushion block 12, the cushion block 12 plays a role of supporting and fixing, and keeps the positions of the light emitting chip 11, the coupling lens 13 and an optical fiber 16 unchanged, and an optical signal emitted by the light emitting chip enters the optical fiber after being coupled by the coupling lens. When the light power is adjusted, the driving current of the light-emitting chip is adjusted.
Referring to fig. 2 and 3, the optical device in the embodiment includes a light emitting chip 11, a coupling lens 13, a spacer 12, a semiconductor cooler 15, a deformable body 14 of a thermal expansion material, and an optical fiber 16. The light emitting chip 11 is mounted on the pad 12, and the pad 12 supports the light emitting chip 11 to be stable and fixed in position. The coupling lens 13 is mounted on the surface of the deformation body 14, and the deformation body 14 plays a role of supporting the coupling lens 13, and plays a role of changing the position of the coupling lens 13 in the vertical direction (with reference to the direction shown in the figure) through the deformation thereof. The deformation body 14 is arranged on a heat conducting surface of a semiconductor refrigerator 15, the semiconductor refrigerator 15 adjusts the temperature of the deformation body 14, and the deformation body 14 generates deformation after the temperature of the deformation body 14 changes.
The deformation body 14 is made of an expansion material that deforms with a change in temperature, for example, a metal material such as stainless steel, a thermoplastic material, or the like. In specific implementation, materials with different expansion coefficients are selected according to the requirement of adjustment precision. The smaller the material with the same temperature change and the smaller the expansion coefficient, the smaller the light power change adjusting range and the higher the adjusting precision. Stainless steel, copper, aluminum are preferred intumescent materials for use in optical devices.
Based on the optical device shown in fig. 2, when the optical power needs to be adjusted, the temperature of the deformation body 14 is adjusted through the semiconductor refrigerator 15, so that the deformation body 14 deforms due to thermal expansion and cold contraction after the temperature changes in the vertical direction (because the deformation displacement in the horizontal direction is not sensitive to the coupling efficiency, the deformation displacement in the vertical direction is considered in this embodiment), and then the coupling lens 13 is driven to displace in the vertical direction, because the position of the light emitting chip 11 is fixed and unchanged, after the coupling lens 13 generates a position in the vertical direction, the light emitting chip 11 and the coupling lens 13 generate a relative position, so that the coupling efficiency is changed, the proportion of the output optical signal coupled into the optical fiber 16 changes under the same current magnitude, so that the coupling efficiency is changed, and the optical power is changed.
In the scheme, the position of the coupling lens 13 is changed through the deformation of the temperature change deformation body 14, the coupling efficiency of the coupling lens 13 is changed to adjust the light power, and the mode of multiple times of indirect adjustment can avoid the limitation of a power chip and ensure that the wavelength cannot be changed compared with the mode of directly adjusting the current. In the scheme, the optical power adjustment precision can be influenced by temperature, but the realization of temperature adjustment is easier, so that the optical power adjustment precision is higher, and the cost is lower.
Further, in order to more easily realize accurate control of the temperature, as shown in fig. 3, a thermistor 17 (other components may be used as a temperature detection component for temperature detection) is mounted on the semiconductor refrigerator 15, and the thermistor 17 is used for detecting the temperature of the heat conduction surface of the semiconductor refrigerator 15 and then feeding back the detected temperature to the controller of the semiconductor refrigerator 15, so that the controller more accurately adjusts the output temperature of the semiconductor refrigerator 15 according to the optical power adjustment requirement.
In this embodiment, the semiconductor refrigerator 15 is used as a temperature adjustment component, and the semiconductor refrigerator 15 is used as a support component to support the deformation body 14, the thermistor 17 and the coupling lens 13, so that the usage of the spacer 12 can be reduced, an additional installation space for the temperature adjustment component can be avoided, the overall size is reduced, and the miniaturization design is facilitated. Of course, the temperature adjusting component may also be implemented in other ways as long as it can change the temperature of the deformation body 14, such as a fan, a heater, etc.
Referring to fig. 4, based on the optical device shown in fig. 2, the optical power adjusting method includes the following steps:
step 1, mounting a coupling lens on the surface of the deformation body of the thermal expansion material.
And 2, mounting the deformation body on a heat-conducting surface of the semiconductor refrigerator.
It should be noted that, since the temperature adjustment component in this embodiment is a semiconductor refrigerator, the deformation body is installed on the heat conduction surface of the semiconductor refrigerator, and if the temperature adjustment component is another device, the installation manner may be slightly different, for example, if the temperature adjustment component is a heater, the deformation body is connected with the heating wire of the heater, or is adjacent to the heat radiation surface of the heater. In order to facilitate understanding of the relationship between the two, it can be described that the deformation body is connected with a temperature adjustment member for the purpose of temperature adjustment of the deformation body by the temperature adjustment member.
And 3, adjusting the temperature of the deformation body through a semiconductor refrigerator to deform the deformation body, then adjusting the coupling efficiency between the light-emitting chip and the coupling lens, and adjusting the optical power through the coupling efficiency.
In this step, if there is a specific requirement for adjusting the optical power, the coupling efficiency needs to be determined in advance, then the required deformation amount and the corresponding temperature variation amount are determined according to the correlation among the expansion coefficient, the temperature and the coupling efficiency of the deformation body, and finally the temperature is adjusted according to the calculated temperature variation amount.
Table 1: (calculation of Power Change with stainless Steel as deformation)
Table 2: (calculation of Power Change with stainless Steel as deformation)
To achieve more precise control of the temperature, the output temperature and start/stop of the semiconductor refrigerator can be controlled here by temperature feedback of the thermistor 17. That is, the thermistor 17 is mounted on the semiconductor cooler 15, the temperature of the heat-conducting surface of the semiconductor cooler is detected by the thermistor 17 and then fed back to the controller of the semiconductor cooler 15, thereby controlling the output temperature of the semiconductor cooler based on this, and thus achieving accurate temperature control.
In the structure shown in fig. 2, the deformation body is a rectangular body structure, but there is no specific limitation on the structure of the deformation body in practice, and there may be a variety of deformations as long as the deformation is realized to drive the coupling lens to generate displacement in the vertical direction. For example, as an example of several possible embodiments, the structure shown in fig. 5a, 5b, 5c may also be adopted in the variation.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and shall cover the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (5)
1. An optical device comprises a light emitting chip, a coupling lens, and a package
Comprising a temperature regulating member and a deformable body made of a thermally expansive material, said coupling lens being mounted on
A surface of the deformation body, and a temperature regulating member for regulating a temperature of the deformation body to
Deforming the plate;
the temperature adjusting part is a semiconductor refrigerator;
temperature detecting means for detecting the temperature adjusting means
And the temperature is fed back to the controller of the temperature adjusting part.
2. The optical device of claim 1, further comprising an optical fiber,
the light emitting chip emits light signals, and the light signals are coupled to the light emitting chip through the coupling lens
The optical fiber.
3. The optical device according to claim 1, wherein the thermal expansion material
The material is stainless steel, copper or aluminum.
4. A light module comprising the light according to any one of claims 1 to 3
A device.
5. An optical power adjusting method of an optical device including a light emitting chip and
a coupling lens, characterized in that the optical power adjusting method includes:
step 1, mounting a coupling lens on the surface of a deformation body made of a thermal expansion material;
step 2, connecting the deformation body with a temperature adjusting component;
step 3, adjusting the temperature of the deformation body through the temperature adjusting part to deform the deformation body, and then adjusting the coupling efficiency between the light-emitting chip and the coupling lens
The optical power is adjusted by changing the overcoupling efficiency;
the temperature regulating component is a semiconductor refrigerator, and the deformation body and the temperature are regulated
The joint part connection means that the deformation body is arranged on a heat conduction surface of the semiconductor refrigerator;
the step 2 also comprises connecting the temperature detection component with a temperature regulation component;
in the step 3, the temperature adjusting part is adjusted by the temperature feedback of the temperature detecting member
The output temperature of the element, and in turn the temperature of the deformation body is adjusted to cause deformation thereof.
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| CN202211095598.8A CN115236812B (en) | 2022-09-08 | 2022-09-08 | Optical device, optical power adjusting method thereof and optical module |
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| CN202211095598.8A CN115236812B (en) | 2022-09-08 | 2022-09-08 | Optical device, optical power adjusting method thereof and optical module |
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| CN115236812A CN115236812A (en) | 2022-10-25 |
| CN115236812B true CN115236812B (en) | 2022-12-13 |
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| CN117111235B (en) * | 2023-10-17 | 2023-12-19 | 成都光创联科技有限公司 | Compensation system, manufacturing and compensation method for high-low temperature power drop of optical device |
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