CN106653932A - 一种SiC雪崩光电二极管及其制备方法 - Google Patents
一种SiC雪崩光电二极管及其制备方法 Download PDFInfo
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- CN106653932A CN106653932A CN201611225631.9A CN201611225631A CN106653932A CN 106653932 A CN106653932 A CN 106653932A CN 201611225631 A CN201611225631 A CN 201611225631A CN 106653932 A CN106653932 A CN 106653932A
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- sic avalanche
- avalanche photodides
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000005530 etching Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000007254 oxidation reaction Methods 0.000 claims description 26
- 230000003647 oxidation Effects 0.000 claims description 25
- 239000001301 oxygen Substances 0.000 claims description 18
- 238000000137 annealing Methods 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 230000003628 erosive effect Effects 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 4
- 229910001882 dioxygen Inorganic materials 0.000 claims description 4
- 238000002161 passivation Methods 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 claims description 4
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 238000005457 optimization Methods 0.000 abstract description 3
- 238000002360 preparation method Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005527 interface trap Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/107—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier working in avalanche mode, e.g. avalanche photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/035281—Shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611225631.9A CN106653932B (zh) | 2016-12-27 | 2016-12-27 | 一种SiC雪崩光电二极管及其制备方法 |
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---|---|---|---|
CN201611225631.9A CN106653932B (zh) | 2016-12-27 | 2016-12-27 | 一种SiC雪崩光电二极管及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN106653932A true CN106653932A (zh) | 2017-05-10 |
CN106653932B CN106653932B (zh) | 2020-11-10 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107611193A (zh) * | 2017-09-07 | 2018-01-19 | 南京大学 | 一种新型n‑i‑p‑n半台面垂直结构的碳化硅雪崩二极管及其制备方法 |
CN108133966A (zh) * | 2018-01-22 | 2018-06-08 | 北京世纪金光半导体有限公司 | 一种集成了周边RCsnubber结构的碳化硅SBD器件元胞结构 |
CN109244175A (zh) * | 2018-08-09 | 2019-01-18 | 镇江镓芯光电科技有限公司 | 一种注Al离子雪崩光电二极管及其制备方法 |
WO2019210659A1 (zh) * | 2018-05-04 | 2019-11-07 | 中国电子科技集团公司第十三研究所 | 碳化硅探测器及其制备方法 |
CN110690323A (zh) * | 2019-10-08 | 2020-01-14 | 中国电子科技集团公司第十三研究所 | 紫外光电探测器的制备方法及紫外光电探测器 |
CN113328007A (zh) * | 2021-06-04 | 2021-08-31 | 南京大学 | 一种新型碳化硅超薄n型欧姆接触层n-i-p型极深紫外探测器及其制备方法 |
US11342474B2 (en) * | 2018-05-04 | 2022-05-24 | The 13Th Research Institute Of China Electronics Technology Group Corporation | Method for preparing avalanche photodiode |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1203555C (zh) * | 2001-09-06 | 2005-05-25 | 住友电气工业株式会社 | ZnMgSSe系pin光电二极管以及ZnMgSSe系雪崩二极管 |
WO2008066696A2 (en) * | 2006-11-27 | 2008-06-05 | The Boeing Company | Sam avalanche photodiode detector with absorption region and multiplication region in individual isolated mesas |
CN101350378A (zh) * | 2007-07-18 | 2009-01-21 | Jds尤尼弗思公司 | 具有横向扩散结的台面型光电探测器 |
-
2016
- 2016-12-27 CN CN201611225631.9A patent/CN106653932B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1203555C (zh) * | 2001-09-06 | 2005-05-25 | 住友电气工业株式会社 | ZnMgSSe系pin光电二极管以及ZnMgSSe系雪崩二极管 |
WO2008066696A2 (en) * | 2006-11-27 | 2008-06-05 | The Boeing Company | Sam avalanche photodiode detector with absorption region and multiplication region in individual isolated mesas |
CN101350378A (zh) * | 2007-07-18 | 2009-01-21 | Jds尤尼弗思公司 | 具有横向扩散结的台面型光电探测器 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107611193A (zh) * | 2017-09-07 | 2018-01-19 | 南京大学 | 一种新型n‑i‑p‑n半台面垂直结构的碳化硅雪崩二极管及其制备方法 |
CN108133966A (zh) * | 2018-01-22 | 2018-06-08 | 北京世纪金光半导体有限公司 | 一种集成了周边RCsnubber结构的碳化硅SBD器件元胞结构 |
WO2019210659A1 (zh) * | 2018-05-04 | 2019-11-07 | 中国电子科技集团公司第十三研究所 | 碳化硅探测器及其制备方法 |
US11282977B2 (en) * | 2018-05-04 | 2022-03-22 | The 13th Research institute of China Electronics Technolegy Group Corporation | Silicon carbide detector and preparation method therefor |
US11342474B2 (en) * | 2018-05-04 | 2022-05-24 | The 13Th Research Institute Of China Electronics Technology Group Corporation | Method for preparing avalanche photodiode |
CN109244175A (zh) * | 2018-08-09 | 2019-01-18 | 镇江镓芯光电科技有限公司 | 一种注Al离子雪崩光电二极管及其制备方法 |
CN110690323A (zh) * | 2019-10-08 | 2020-01-14 | 中国电子科技集团公司第十三研究所 | 紫外光电探测器的制备方法及紫外光电探测器 |
CN110690323B (zh) * | 2019-10-08 | 2022-04-01 | 中国电子科技集团公司第十三研究所 | 紫外光电探测器的制备方法及紫外光电探测器 |
CN113328007A (zh) * | 2021-06-04 | 2021-08-31 | 南京大学 | 一种新型碳化硅超薄n型欧姆接触层n-i-p型极深紫外探测器及其制备方法 |
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CN106653932B (zh) | 2020-11-10 |
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Effective date of registration: 20231111 Address after: Room 203-1, North 2nd Floor, Building 2, Software Park, North Side of Cluster Road, Xuzhou City, Jiangsu Province, 221000 Patentee after: Jiangsu Zifeng Intellectual Property Service Co.,Ltd. Address before: 100176 courtyard 17, Tonghui Ganqu Road, Daxing Economic and Technological Development Zone, Beijing Patentee before: BEIJING CENTURY GOLDRAY SEMICONDUCTOR Co.,Ltd. |
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Effective date of registration: 20240118 Address after: 231200, 9th Floor, Building A12, Phase II of Gongtou Liheng Plaza, Intersection of Innovation Avenue and Fanhua Avenue, Economic Development Zone Expansion Zone, Feixi County, Hefei City, Anhui Province Patentee after: Xinhe Semiconductor (Hefei) Co.,Ltd. Address before: Room 203-1, North 2nd Floor, Building 2, Software Park, North Side of Cluster Road, Xuzhou City, Jiangsu Province, 221000 Patentee before: Jiangsu Zifeng Intellectual Property Service Co.,Ltd. |