CN106642897A - Refrigerator with semiconductor direct-cooling chambers - Google Patents
Refrigerator with semiconductor direct-cooling chambers Download PDFInfo
- Publication number
- CN106642897A CN106642897A CN201611220150.9A CN201611220150A CN106642897A CN 106642897 A CN106642897 A CN 106642897A CN 201611220150 A CN201611220150 A CN 201611220150A CN 106642897 A CN106642897 A CN 106642897A
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- CN
- China
- Prior art keywords
- compartment
- semiconductor
- cold end
- direct
- courage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 85
- 238000001816 cooling Methods 0.000 title claims abstract description 19
- 238000001704 evaporation Methods 0.000 claims abstract description 26
- 230000008020 evaporation Effects 0.000 claims abstract description 26
- 238000005057 refrigeration Methods 0.000 claims abstract description 23
- 238000004804 winding Methods 0.000 claims abstract description 10
- 230000000712 assembly Effects 0.000 claims description 15
- 238000000429 assembly Methods 0.000 claims description 15
- 238000005187 foaming Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 5
- 239000003507 refrigerant Substances 0.000 claims description 5
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a refrigerator with semiconductor direct-cooling chambers. The refrigerator comprises a plurality of chambers. The chambers include at least one semiconductor direct-cooling chamber. Each semiconductor direct-cooling chamber comprises a chamber container and a semiconductor refrigeration system arranged outside the chamber container, wherein the semiconductor refrigeration system comprises a semiconductor refrigeration assembly and an evaporator assembly, the semiconductor refrigeration assembly is provided with a cold end for refrigeration, and the evaporator assembly comprises a cold end heat pipe for performing heat exchange with the cold end and an evaporation pipe which is communicated with the cold end heat pipe to form a loop and arranged on the outer side of the chamber container in a winding mode for cooling the semiconductor direct-cooling chamber. The semiconductor refrigeration assembly does not need to be arranged inside the chamber container, so that the capacity of the chambers is increased; meanwhile, the container winding mode is adopted, the cooling capacity of the cold end of the semiconductor refrigeration assembly is transmitted to the chamber container, and the contact area between the evaporation pipe and the chamber container can be effectively increased.
Description
Technical field
The present invention relates to household appliance technical field, more particularly to a kind of refrigerator with the direct-cooled compartment of semiconductor.
Background technology
Semiconductor electronic refrigerating is also known as thermoelectric cooling, or thermoelectric cooling, and it is the one kind for utilizing " peltier effect "
Refrigerating method, with compression-type refrigeration and absorption refrigeration and the referred to as big refrigeration modes in the world three.Semiconductor electronic refrigerating is due to tool
Have simple structure, mechanical drive disk assembly, without abrasion, without the need for cold-producing medium environmental protection（Compression and absorption it is required for）The advantages of,
It is large range of to be applied to the refrigerating fields such as refrigerator.
Semiconductor refrigerating module involved in existing semiconductor freezer is as shown in figure 1, it includes the hot junction for setting gradually
Blower fan 11, hot junction 12, semiconductor chilling plate 13, cold end 14, cold end blower fan 15, semiconductor refrigerating module shown in Fig. 1 and refrigerator
With reference to shown in Fig. 2, its cold end 14 has the heat exchanging part being exposed to inside compartment 1 to the cooperation schematic diagram of compartment, and by cold end wind
The transfer cold of machine 15 realizes the internal refrigeration storage of compartment 1（Freezed using air cooling way）.So there is following asking in existing semiconductor freezer
Topic：The heat exchanging part and cold end blower fan 15 of cold end 14 is required to be arranged inside refrigerator compartment 1, so that reducing inside compartment 1
Capacity；Semiconductor refrigerating module is the face that the heat exchanging part of cold end 14 is exposed in compartment 1 with the heat exchange area inside compartment 1
Product, typically than relatively limited, i.e., the heat exchange area between semiconductor refrigerating module and compartment 1 is little, so that ice for its area size
Case refrigerating efficiency is low.
In view of this, it is necessary to provide a kind of improved refrigerator to solve the above problems.
The content of the invention
It is contemplated that one of technical problem that prior art is present at least is solved, for achieving the above object, this
It is bright there is provided a kind of refrigerator with the direct-cooled compartment of semiconductor, its specific design mode is as follows.
A kind of refrigerator with the direct-cooled compartment of semiconductor, wherein, the refrigerator includes some compartments, wherein between described in some
At least one is the direct-cooled compartment of semiconductor for room, and the direct-cooled compartment of the semiconductor includes compartment courage body and is arranged at the compartment
The semiconductor refrigeration system of courage external body, the semiconductor refrigeration system includes semiconductor refrigerating component and evaporator assemblies,
The semiconductor refrigerating component has the cold end to freeze, and the evaporator assemblies include cold with what the cold end was exchanged heat
End heat pipe and connecting with the cool side heat pipes to form loop and winding to be arranged at the external side of the compartment courage described to realize
The evaporation tube of the direct-cooled compartment cooling of semiconductor.
Further, the evaporator assemblies also include being arranged between the cool side heat pipes and the evaporation tube to drive
The transfer tube of refrigerant flowing.
Further, the cool side heat pipes are embedded inside the cold end.
Further, the cool side heat pipes are arranged inside the cold end with serpentine fashion.
Further, the cool side heat pipes are made up of aluminum material.
Further, the compartment courage body front portion is provided with the compartment door for covering the compartment courage body, the compartment door
During closing, on the direction of the compartment door, the evaporation tube is in the external side uniform winding distribution of the compartment courage.
Further, the evaporation tube is made up of aluminum material.
Further, the semiconductor refrigerating component is arranged at the outside of the compartment courage body sidewall relative with the compartment door.
Further, the direct-cooled compartment of the semiconductor is also coated on the foaming layer of the compartment courage external body, and described half
Conductor cooling assembly and the evaporator assemblies are embedded in the foaming layer.
Further, the semiconductor refrigerating component also includes realizing the hot junction of the semiconductor refrigerating assembly radiating,
The hot junction is exposed to outside the foaming layer.
The invention has the beneficial effects as follows：Refrigerator provided by the present invention, the direct-cooled compartment of its semiconductor is by the way of direct-cooled
Freezed, and unconventional air cooling way, semiconductor refrigerating component need not be arranged at portion in compartment courage body, so can be relative
Chamber vol between increase；In addition, semiconductor refrigeration system involved in the present invention to be arranged at the compartment courage with winding external
The evaporation tube of side, i.e., the cold of semiconductor refrigerating component cold end is transferred into compartment courage body by the way of courage using twining, and it can be effective
Increase evaporation tube and compartment courage body contact area, so as to improve the refrigerating efficiency of semiconductor refrigeration system.
Description of the drawings
Fig. 1 show semiconductor refrigerating modular structure schematic diagram in prior art；
Fig. 2 show the cooperation schematic diagram of semiconductor refrigerating module and refrigerator compartment in prior art；
Fig. 3 show the direct-cooled compartment schematic cross-section of semiconductor involved by refrigerator of the present invention；
Fig. 4 show the direct-cooled compartment refrigeration principle schematic diagram of semiconductor；
Fig. 5 show the direct-cooled compartment overall schematic of semiconductor；
Fig. 6 show distribution schematic diagram of the cool side heat pipes in cold end；
Fig. 7 show A-A ' directions schematic cross-section in Fig. 6.
In figure,
1 be prior art in refrigerator compartment, 11 be hot junction blower fan of the prior art, 12 be hot junction of the prior art, 13
For semiconductor chilling plate of the prior art, 14 is cold end of the prior art, and 15 is cold end blower fan of the prior art；
In the present invention, 2 is the direct-cooled compartment of semiconductor, and 20 is compartment courage body, and 21 is semiconductor refrigerating component, and 211 is cold end, 212
For semiconductor chilling plate, 213 is hot junction, and 214 is hot junction blower fan, and 22 is evaporator assemblies, and 221 is cool side heat pipes, and 222 are evaporation
Pipe, 223 is transfer tube, and 224 is connecting pipe.
Specific embodiment
Describe the present invention below with reference to each embodiment shown in the drawings, refer to Fig. 3 to Fig. 7 institutes
Show, be some better embodiments of the present invention.
The refrigerator of the direct-cooled compartment of involved semiconductor includes some compartments in the present invention, and its compartment particular number can basis
Real needs are adjusted, wherein in some compartments, at least one compartment is the direct-cooled compartment of semiconductor, with reference to Fig. 3-Fig. 5 institutes
Show, the direct-cooled compartment 2 of semiconductor includes compartment courage body 20 and the semiconductor refrigeration system being arranged at outside compartment courage body 20, partly leads
System cooling system includes semiconductor refrigerating component 21 and evaporator assemblies 22, and semiconductor refrigerating component 21 has to freeze
Cold end 211, evaporator assemblies 22 include the cool side heat pipes 221 exchanged heat with cold end 211 and connect shape with cool side heat pipes 221
Into loop and winding is arranged at the outside of compartment courage body 20 to realize the evaporation tube 222 of the direct-cooled compartment cooling of semiconductor.
More specifically, semiconductor refrigerating component 21 also includes being set in turn in the half of the side of cold end 211 in the present embodiment
Conductor cooling piece 212, hot junction 213, hot junction blower fan 214, the concrete refrigeration modes of semiconductor refrigerating component 21 are known in the art
General knowledge, here does not make concrete expansion；Additionally, hot junction blower fan 214 is used to radiate hot junction 213 in the present embodiment, at other
In some embodiments, the hot junction 213 of semiconductor refrigerating component 21 can also be radiated using alternate manner.
With reference to Fig. 4, Fig. 5, evaporator assemblies 22 also include being arranged at cool side heat pipes 221 and evaporation tube 222 in the present embodiment
Between to drive refrigerant flow transfer tube 223, semiconductor refrigeration system run when, transfer tube 223 drive evaporator assemblies
The flowing of refrigerant in 22, so as to realize that, by the cold fast transfer at cool side heat pipes 221 to evaporation tube 222, evaporation tube 222 will be cold
Amount is delivered to inside compartment courage body 20, so as to realize the fast-refrigerating process of the direct-cooled compartment 2 of semiconductor.
In order to preferably realize for the cold of cold end 211 being transferred to cool side heat pipes 221, in the present embodiment, cool side heat pipes 221
It is embedded inside cold end 211, i.e., cold end 211 is formed to cool side heat pipes 221 and coated, and is made with specific reference to the mode shown in Fig. 7, being embedded
Obtain cold end 211 to maximize with the heat exchange area of cool side heat pipes 221；In addition, in order to further increase cold end 211 and cool side heat pipes
221 heat exchange area, the cool side heat pipes 221 in the present embodiment are arranged inside cold end 211 with serpentine fashion, with specific reference to Fig. 6
It is shown.
Certainly, in some other embodiment, cool side heat pipes 221 partly can also contact with cold end 211, i.e. cold end
211 need not completely coat cool side heat pipes 221；Cool side heat pipes 221 can also otherwise be set inside cold end 211
Put.
Cool side heat pipes 221 are made up of aluminum material in the present embodiment, and aluminum material shaping is easy, transcalent advantage, when
So, cool side heat pipes can also be using other materials such as copper pipes.
With reference to shown in Fig. 3, in the present embodiment, the front portion of compartment courage body 20 is provided with to cover the compartment door of compartment courage body
23, when compartment door closes 23, on the direction of compartment door 23, i.e., X-direction shown in Fig. 3, evaporation tube 222 is in compartment courage
The outside uniform winding distribution of body 20, evaporation tube 222 is uniformly distributed so that compartment courage 20 interior temperature distributions of body are uniform.Further join
Examine shown in Fig. 3, semiconductor refrigerating component 21 is arranged at the outside of the compartment courage body 20 side wall relative with compartment door 23, is so designed that
Mainly consider the cooperation demand of the direct-cooled compartment 2 of semiconductor and refrigerator other compartments in the present embodiment.
Evaporation tube 222 can be with identical with the material of cool side heat pipes 221 in the present embodiment, naturally it is also possible to using different materials
Matter is made.In addition, in specific implementation process of the present invention, evaporator assemblies also include being arranged at cool side heat pipes 221 and evaporation tube
Connecting pipe 224 between 222, connecting pipe 224 is used to connect cool side heat pipes 221 and evaporation tube 222, drives valve 223 to arrange
On connecting pipe 224 and drive refrigerant in cool side heat pipes 221, evaporation tube 222, the loop of the public composition of connecting pipe 224
Circulate.In certain embodiments, connecting pipe 224 and cool side heat pipes 221 be integrally formed or with the one of evaporation tube 222 into
Type.
As shown in figure 3, the direct-cooled compartment 2 of semiconductor involved by refrigerator of the present invention is also coated on outside compartment courage body 20
Foaming layer 24, semiconductor refrigerating component 21 and evaporator assemblies 22 are embedded in foaming layer 24, and foaming layer 24 can be having
Effect prevents the loss of the inside cold of compartment courage body 20, and to a certain extent to semiconductor cooling assembly 21 and evaporator assemblies
22 form fixation.
Because foaming layer 24 has preferable heat insulating effect, dissipate to realize semiconductor refrigerating component 21 in the present invention
The hot junction 213 of heat is exposed to outside foaming layer, is beneficial to radiating.
Refrigerator provided by the present invention, the direct-cooled compartment of its semiconductor is freezed by the way of direct-cooled, and unconventional
Air cooling way, semiconductor refrigerating component need not be arranged at portion in compartment courage body, chamber vol between so relative can increasing；In addition,
There is involved semiconductor refrigeration system winding to be arranged at the evaporation tube of the external side of the compartment courage in the present invention, that is, adopt and twine
The cold of semiconductor refrigerating component cold end is transferred to compartment courage body by the mode of courage, and it can effectively increase evaporation tube and compartment courage
The contact area of body, so as to improve the refrigerating efficiency of semiconductor refrigeration system.
It should be understood that, although this specification is been described by according to embodiment, but not each embodiment only includes one
Individual independent technical scheme, this narrating mode of specification is only that for clarity those skilled in the art will should say
Bright book as an entirety, the technical scheme in each embodiment can also Jing it is appropriately combined, forming those skilled in the art can
With the other embodiment for understanding.
The a series of detailed description of those listed above is only for the feasibility embodiment of the present invention specifically
Bright, they simultaneously are not used to limit the scope of the invention, all equivalent implementations made without departing from skill spirit of the present invention
Or change should be included within the scope of the present invention.
Claims (10)
1. a kind of refrigerator with the direct-cooled compartment of semiconductor, it is characterised in that the refrigerator includes some compartments, wherein some institutes
At least one is the direct-cooled compartment of semiconductor to state compartment, and the direct-cooled compartment of the semiconductor includes compartment courage body and is arranged at described
The semiconductor refrigeration system of compartment courage external body, the semiconductor refrigeration system includes semiconductor refrigerating component and evaporimeter group
Part, the semiconductor refrigerating component has the cold end to freeze, and the evaporator assemblies include being exchanged heat with the cold end
Cool side heat pipes and connecting with the cool side heat pipes to form loop and winding is arranged at the external side of the compartment courage to realize
The evaporation tube of the direct-cooled compartment cooling of the semiconductor.
2. refrigerator according to claim 1, it is characterised in that the evaporator assemblies also include being arranged at the cold end heat
Transfer tube between pipe and the evaporation tube to drive refrigerant to flow.
3. refrigerator according to claim 1 and 2, it is characterised in that the cool side heat pipes are embedded inside the cold end.
4. refrigerator according to claim 3, it is characterised in that the cool side heat pipes are inside the cold end with serpentine fashion
Arrange.
5. refrigerator according to claim 3, it is characterised in that the cool side heat pipes are made up of aluminum material.
6. refrigerator according to claim 1 and 2, it is characterised in that the compartment courage body front portion is provided with to cover institute
The compartment door of compartment courage body is stated, when the compartment door is closed, on the direction of the compartment door, the evaporation tube is in institute
State the external side uniform winding distribution of compartment courage.
7. refrigerator according to claim 6, it is characterised in that the evaporation tube is made up of aluminum material.
8. refrigerator according to claim 6, it is characterised in that the semiconductor refrigerating component is arranged at and the compartment door
The outside of relative compartment courage body sidewall.
9. refrigerator according to claim 1 and 2, it is characterised in that the direct-cooled compartment of the semiconductor is also coated on institute
The foaming layer of compartment courage external body is stated, the semiconductor refrigerating component and the evaporator assemblies are embedded at the foaming layer
It is interior.
10. refrigerator according to claim 9, it is characterised in that the semiconductor refrigerating component also includes realizing institute
The hot junction of semiconductor refrigerating assembly radiating is stated, the hot junction is exposed to outside the foaming layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611220150.9A CN106642897A (en) | 2016-12-26 | 2016-12-26 | Refrigerator with semiconductor direct-cooling chambers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611220150.9A CN106642897A (en) | 2016-12-26 | 2016-12-26 | Refrigerator with semiconductor direct-cooling chambers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106642897A true CN106642897A (en) | 2017-05-10 |
Family
ID=58826713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611220150.9A Pending CN106642897A (en) | 2016-12-26 | 2016-12-26 | Refrigerator with semiconductor direct-cooling chambers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106642897A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107883652A (en) * | 2017-10-13 | 2018-04-06 | 江苏捷帝机器人股份有限公司 | A kind of entirety for metalwork and local cooler bin |
| CN107975998A (en) * | 2017-10-13 | 2018-05-01 | 江苏捷帝机器人股份有限公司 | A kind of quick cooler bin for metal machinery part |
| CN108870865A (en) * | 2018-06-26 | 2018-11-23 | 青岛海尔特种电冰柜有限公司 | Refrigeration equipment |
| CN110671859A (en) * | 2018-07-02 | 2020-01-10 | 青岛海尔股份有限公司 | Refrigerator with a door |
| CN112747521A (en) * | 2019-10-30 | 2021-05-04 | 青岛海尔电冰箱有限公司 | Semiconductor refrigerator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004340404A (en) * | 2003-05-13 | 2004-12-02 | Matsushita Electric Ind Co Ltd | Heat radiator for electronic refrigerator |
| CN1705113A (en) * | 2004-05-27 | 2005-12-07 | 杨洪武 | Split integrated heat pipe radiator for heating electronic component |
| CN105556222A (en) * | 2013-09-16 | 2016-05-04 | 弗诺尼克设备公司 | Enhanced heat transport systems for cooling chambers and surfaces |
-
2016
- 2016-12-26 CN CN201611220150.9A patent/CN106642897A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004340404A (en) * | 2003-05-13 | 2004-12-02 | Matsushita Electric Ind Co Ltd | Heat radiator for electronic refrigerator |
| CN1705113A (en) * | 2004-05-27 | 2005-12-07 | 杨洪武 | Split integrated heat pipe radiator for heating electronic component |
| CN105556222A (en) * | 2013-09-16 | 2016-05-04 | 弗诺尼克设备公司 | Enhanced heat transport systems for cooling chambers and surfaces |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107883652A (en) * | 2017-10-13 | 2018-04-06 | 江苏捷帝机器人股份有限公司 | A kind of entirety for metalwork and local cooler bin |
| CN107975998A (en) * | 2017-10-13 | 2018-05-01 | 江苏捷帝机器人股份有限公司 | A kind of quick cooler bin for metal machinery part |
| CN108870865A (en) * | 2018-06-26 | 2018-11-23 | 青岛海尔特种电冰柜有限公司 | Refrigeration equipment |
| CN110671859A (en) * | 2018-07-02 | 2020-01-10 | 青岛海尔股份有限公司 | Refrigerator with a door |
| CN112747521A (en) * | 2019-10-30 | 2021-05-04 | 青岛海尔电冰箱有限公司 | Semiconductor refrigerator |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |