CN106625244A - 铜cmp在线测量点实时定位方法及系统 - Google Patents
铜cmp在线测量点实时定位方法及系统 Download PDFInfo
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- CN106625244A CN106625244A CN201610867097.5A CN201610867097A CN106625244A CN 106625244 A CN106625244 A CN 106625244A CN 201610867097 A CN201610867097 A CN 201610867097A CN 106625244 A CN106625244 A CN 106625244A
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- Prior art keywords
- wafer
- rotation
- polishing disk
- current vortex
- anglec
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610867097.5A CN106625244B (zh) | 2016-09-29 | 2016-09-29 | 铜cmp在线测量点实时定位方法及系统 |
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CN201610867097.5A CN106625244B (zh) | 2016-09-29 | 2016-09-29 | 铜cmp在线测量点实时定位方法及系统 |
Publications (2)
Publication Number | Publication Date |
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CN106625244A true CN106625244A (zh) | 2017-05-10 |
CN106625244B CN106625244B (zh) | 2018-11-02 |
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CN201610867097.5A Expired - Fee Related CN106625244B (zh) | 2016-09-29 | 2016-09-29 | 铜cmp在线测量点实时定位方法及系统 |
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CN (1) | CN106625244B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109159019A (zh) * | 2018-09-28 | 2019-01-08 | 大连理工大学 | 一种楔形基片研磨装置及其工作方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1927535A (zh) * | 2006-07-21 | 2007-03-14 | 上海大学 | 跟踪式在线测量圆度误差和机床主轴误差的方法 |
EP2040028A2 (en) * | 2003-09-24 | 2009-03-25 | Renishaw PLC | Measuring method for use on machine tools |
CN103050427A (zh) * | 2012-12-27 | 2013-04-17 | 上海交通大学 | 一种晶圆预对准方法 |
CN103677832A (zh) * | 2013-12-13 | 2014-03-26 | 清华大学 | 晶圆铜膜厚度的绘图方法及系统 |
CN104637850A (zh) * | 2013-11-08 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | 一种晶圆动态对中方法 |
-
2016
- 2016-09-29 CN CN201610867097.5A patent/CN106625244B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2040028A2 (en) * | 2003-09-24 | 2009-03-25 | Renishaw PLC | Measuring method for use on machine tools |
CN1927535A (zh) * | 2006-07-21 | 2007-03-14 | 上海大学 | 跟踪式在线测量圆度误差和机床主轴误差的方法 |
CN103050427A (zh) * | 2012-12-27 | 2013-04-17 | 上海交通大学 | 一种晶圆预对准方法 |
CN104637850A (zh) * | 2013-11-08 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | 一种晶圆动态对中方法 |
CN103677832A (zh) * | 2013-12-13 | 2014-03-26 | 清华大学 | 晶圆铜膜厚度的绘图方法及系统 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109159019A (zh) * | 2018-09-28 | 2019-01-08 | 大连理工大学 | 一种楔形基片研磨装置及其工作方法 |
CN109159019B (zh) * | 2018-09-28 | 2020-06-02 | 大连理工大学 | 一种楔形基片研磨装置及其工作方法 |
Also Published As
Publication number | Publication date |
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CN106625244B (zh) | 2018-11-02 |
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Effective date of registration: 20171013 Address after: 100084 Beijing City, Haidian District Tsinghua Yuan Applicant after: TSINGHUA University Applicant after: HWATSING TECHNOLOGY Co.,Ltd. Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Applicant before: HWATSING TECHNOLOGY Co.,Ltd. Applicant before: Tsinghua University |
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GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100084 Beijing City, Haidian District Tsinghua Yuan Co-patentee after: Huahaiqingke Co.,Ltd. Patentee after: TSINGHUA University Address before: 100084 Beijing City, Haidian District Tsinghua Yuan Co-patentee before: HWATSING TECHNOLOGY Co.,Ltd. Patentee before: TSINGHUA University |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181102 Termination date: 20210929 |
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CF01 | Termination of patent right due to non-payment of annual fee |