CN106607320B - Thermal vacuum drying device suitable for flexible base board - Google Patents
Thermal vacuum drying device suitable for flexible base board Download PDFInfo
- Publication number
- CN106607320B CN106607320B CN201611200169.7A CN201611200169A CN106607320B CN 106607320 B CN106607320 B CN 106607320B CN 201611200169 A CN201611200169 A CN 201611200169A CN 106607320 B CN106607320 B CN 106607320B
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- supporting pin
- diameter
- vacuum drying
- drying device
- heating plate
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- 238000001291 vacuum drying Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000012546 transfer Methods 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 43
- 230000007704 transition Effects 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 24
- 239000011368 organic material Substances 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000007665 sagging Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 4
- 239000011112 polyethylene naphthalate Substances 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000007630 basic procedure Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
Abstract
The present invention provides a kind of thermal vacuum drying device suitable for flexible base board, by by the first supporting pin (5) in thermal vacuum drying device, second supporting pin (6) is improved to mosaic texture or layer nested structure respectively, it can speed up heat transfer, so that the contact portion of substrate (7) and the first supporting pin (5) or the second supporting pin (6), and the temperature difference between substrate (7) and the first supporting pin (5) or the non-contact part of the second supporting pin (6) reduces, it is heated evenly, trace is supported as caused by supporting pin to reduce, and allow the appropriate supporting pin quantity for increasing intermediate region, mitigate because substrate it is sagging caused by film thickness uneven phenomenon.
Description
Technical field
The present invention relates to display device processing procedure field more particularly to a kind of dry dresses of thermal vacuum suitable for flexible base board
It sets.
Background technique
Organic light emitting diode display (Organic Light Emitting Diode, OLED) has self-luminous, drives
Dynamic voltage is low, luminous efficiency is high, the response time is short, clarity and contrast are high, nearly 180 ° of visual angles, use temperature ranges are wide, can
Many advantages, such as realizing Flexible Displays and large area total colouring, is known as most having development potentiality by industry.
Flexible Displays are the general orientation of the following OLED development.Flexible base board production is the preceding processing procedure for making flexibility OLED, directly
It connects association and influences the quality of subsequent entire flexibility OLED processing procedure.Flexible base board production, the Organic coating materials mainly used
It is that (industry is commonly referred to as PI Solution to liquid polyimide amide sour (Polyimide Amic Acid, PAA), referred to as
PI), polyethylene terephthalate (Polyethylene Terephthalate, PET) and polyethylene naphthalate
(PEN Polyethylene Naphthalate, PEN) etc., PI use is than wide.Flexible base board makes basic procedure successively
It include: dry (the HVCD process) → baking → optical detection → reparation of base-plate cleaning → organic material coating → thermal vacuum
Deng.Thermal vacuum drying process, which is mainly vacuumized using thermal vacuum drying device, reduces sealed chamber pressure, and auxiliary heating accelerates
The solvent-laden evaporation rate of the organic materials such as PI medical fluid institute, the solvent composition of the organic materials medical fluid such as removal PI, reaches precuring
Organic material, the effect for shortening subsequent baking processing time.
As shown in Figures 1 and 2, include a sealed chamber 1 ' suitable for the thermal vacuum drying device of flexible base board, be fixed on
The lower heating plate 2 ' of the 1 ' lower part of sealed chamber, the upper heating plate 3 ' for being fixed on the 1 ' top of sealed chamber, be set to it is described
Lifter 4 ' below sealed chamber 1 ', be fixed on the lifter 4 ' and pass through 1 ' bottom plate of sealed chamber and lower heating plate 2 ' by
Lifter 4 ' driving and go up and down several first supporting pins (Support Pin) 5 ' and be fixed in the lower heating plate 2 '
Several second supporting pins 6 '.
In thermal vacuum drying process, organic material medicine is coated with using the first supporting pin 5 ' or the support of the second supporting pin 6 '
The substrate 7 ' of liquid is placed between lower heating plate 2 ' and upper heating plate 3 ' and is toasted, first supporting pin, 5 ' control base board 7 ' and
The distance of lower heating plate 2 ', the upper end of second supporting pin 6 ' about 0.3mm at a distance from lower heating plate 2 ', cannot be adjusted.Such as
Fig. 3, with shown in Fig. 4, existing first supporting pin 5 ' and the second supporting pin 6 ' are the filled circles pin of monoblock type.
Object because of the contact portion of 7 ' bottom surface of substrate and the first supporting pin 5 ' or the second supporting pin 6 ' by respective support pin
Barrier effect is managed, lower heating plate 2 ' adds 7 ' bottom surface of substrate and supporting pin contact portion, bottom surface and supporting pin non-contact part
Hot degree is inconsistent, causes temperature difference, leads to that the organic material precuring degree in the two regions is inconsistent, film thickness is uneven, produces
Raw uneven color causes to support trace (Pin Mura).In addition, causing to support trace quantity to avoid supporting pin quantity more
Increase, general existing thermal vacuum drying device reduces the quantity of supporting pin, is especially the reduction of the supporting pin number of intermediate region
Amount, so that perimeter support pin is exacerbated to the load-bearing effect of substrate 7 ', therefore the substrate 7 ' coated with organic material medical fluid is sagging
Amount increases, and the organic material medical fluid also center flow sagging to substrate 7 ' due to gravity causes film thickness more uneven, exacerbate
Support the severity of trace.
Summary of the invention
The purpose of the present invention is to provide a kind of thermal vacuum drying devices suitable for flexible base board, enable to be coated with
The substrate bottom surface and supporting pin contact portion and substrate bottom surface of organic material medical fluid are heated relatively equal with supporting pin non-contact part
It is even, support trace is reduced, film thickness uneven phenomenon is mitigated.
To achieve the above object, the present invention provides a kind of thermal vacuum drying device suitable for flexible base board, including one close
Envelope chamber, the upper heating plate for being fixed on the sealed chamber top, is set to the lower heating plate for being fixed on the sealed chamber lower part
Lifter below the sealed chamber, be fixed on the lifter and driven by lifter and several first supports for going up and down
Pin and several second supporting pins being fixed in the lower heating plate；
First supporting pin or the second supporting pin support be coated with organic material medical fluid substrate be placed in lower heating plate with
It is toasted between upper heating plate；Mosaic texture or layer nested structure is respectively adopted in first supporting pin and the second supporting pin,
To accelerate heat transfer so that the contact portion and substrate and the first supporting pin of substrate and the first supporting pin or the second supporting pin or
The temperature difference between the non-contact part of second supporting pin reduces.
First supporting pin uses mosaic texture, including basal part, transition part and top；
The basal part includes elongated cylinder and protrudes from elongated cylinder upper end and coaxial small cylinder；It is described
The diameter of small cylinder is less than the diameter of elongated cylinder；The transition part is nested on the outside of the small cylinder and in elongated cylinder
End, the top is nested on the transition part；The basal part, transition part and top select different materials to make top
Capacity of heat transmission be higher than transition part, the capacity of heat transmission of transition part is higher than basal part.
The material of the basal part is aluminum or aluminum alloy, and the material of the transition part is ceramics, and the material at the top is
Silver alloy.
The top upper end is hemispherical.
The diameter of the elongated cylinder of the basal part is 3mm~10mm；The diameter of small cylinder is elongated cylinder diameter
1/5, it is highly 2mm~5mm；The diameter of transition part and the diameter of elongated cylinder are equal, with a thickness of 0.5mm~1mm；Top it is straight
Diameter is equal with the diameter of elongated cylinder.
First supporting pin uses layer nested structure, the first cylindrical outer layer jacket including upper end closed, intermediate hollow out
The the first solid internal layer heater manage, being placed in first outer layer sleeve and one end are electrically connected the first internal layer heater
The first conducting wire；
Through-hole is opened up on the tube wall of first outer layer sleeve to pass through for the first conducting wire；First outer layer sleeve is selected exhausted
Edge Heat Conduction Material, the first internal layer heater select material identical with lower heating plate；The other end electricity of first conducting wire
Property be connected as the power supply of lower heating plate power supply.
Second supporting pin uses layer nested structure, the second cylindrical outer layer jacket including upper end closed, intermediate hollow out
The the second solid internal layer heater manage, being placed in second outer layer sleeve and one end are electrically connected the second internal layer heater
The second conducting wire；
Second outer layer sleeve selects insulating heat-conduction material, and the second internal layer heater is selected identical as lower heating plate
Material；The other end of second conducting wire is electrically connected lower heating plate.
The upper end of first outer layer sleeve and the second outer layer sleeve is hemispherical, the first internal layer heater and
The upper end of two internal layer heaters is hemispherical.
The outer diameter of first outer layer sleeve is 3mm~10mm；The diameter of first internal layer heater is the first outer layer sleeve
The 3/5~3/4 of outer diameter.
The outer diameter of second outer layer sleeve is 2mm~5mm, and lower end is embedded in lower heating plate 2mm~3mm；Second internal layer
The diameter of heater is the 3/5~3/4 of the second outer layer sleeve outer diameter.
Beneficial effects of the present invention: a kind of thermal vacuum drying device suitable for flexible base board provided by the invention passes through
The first supporting pin, the second supporting pin in thermal vacuum drying device is improved to mosaic texture or layer nested structure respectively, it can
Accelerate heat transfer, so that the contact portion and substrate and the first supporting pin of substrate and the first supporting pin or the second supporting pin or the
The temperature difference between the non-contact part of two supporting pins reduces, is heated evenly, and trace is supported as caused by supporting pin to reduce, and
Allow the appropriate supporting pin quantity for increasing intermediate region, mitigate because substrate it is sagging caused by film thickness uneven phenomenon.
Detailed description of the invention
For further understanding of the features and technical contents of the present invention, it please refers to below in connection with of the invention detailed
Illustrate and attached drawing, however, the drawings only provide reference and explanation, is not intended to limit the present invention.
In attached drawing,
Fig. 1 is the stereoscopic schematic diagram for being suitable for the thermal vacuum drying device of flexible base board in the prior art；
Fig. 2 is the cross-section structure simplified schematic diagram for being suitable for the thermal vacuum drying device of flexible base board in the prior art；
Fig. 3 is the section signal of the first supporting pin suitable for the thermal vacuum drying device of flexible base board in the prior art
Figure；
Fig. 4 is the vertical view and section of the second supporting pin suitable for the thermal vacuum drying device of flexible base board in the prior art
Schematic diagram；
Fig. 5 is the stereoscopic schematic diagram of the thermal vacuum drying device suitable for flexible base board of the invention；
Fig. 6 is the cross-section structure simplified schematic diagram of the thermal vacuum drying device suitable for flexible base board of the invention；
Fig. 7 is the first structure shape of the first supporting pin the thermal vacuum drying device suitable for flexible base board of the invention
The diagrammatic cross-section of formula；
Fig. 8 is second of structure shape of the first supporting pin the thermal vacuum drying device suitable for flexible base board of the invention
The plane simplified schematic diagram of formula；
Fig. 9 is that the plane of the second supporting pin the thermal vacuum drying device suitable for flexible base board of the invention illustrates letter
Figure.
Specific embodiment
Further to illustrate technological means and its effect adopted by the present invention, below in conjunction with preferred implementation of the invention
Example and its attached drawing are described in detail.
Please refer to Fig. 5 to Fig. 9, the present invention provides a kind of thermal vacuum drying device suitable for flexible base board.Such as Fig. 5
With shown in Fig. 6, the thermal vacuum drying device suitable for flexible base board of the invention include a sealed chamber 1, be fixed on it is described close
The lower heating plate 2 for sealing 1 lower part of chamber, is set under the sealed chamber 1 the upper heating plate 3 for being fixed on 1 top of sealed chamber
The lifter 4 of side is fixed on the lifter 4 and is driven and risen by lifter 4 across 1 bottom plate of sealed chamber and lower heating plate 2
Several first supporting pins 5 of drop and several second supporting pins 6 being fixed in the lower heating plate 2.
In thermal vacuum drying process, first supporting pin 5 or the support of the second supporting pin 6 are coated with organic material medical fluid
Substrate 7 be placed between lower heating plate 2 and upper heating plate 3 and toasted.Specifically, first supporting pin 5 can control base
The distance of plate 7 and lower heating plate 2, the upper end of second supporting pin 6 are fixed at a distance from lower heating plate 2, be cannot be adjusted；Work as liter
When drop device 4 drives several first supporting pins 5 to rise to higher than the second 6 upper end of supporting pin, had by the support of the first supporting pin 5
The substrate 7 of machine material medical fluid, when lifter 4 drives several first supporting pins 5 to be decreased below the second 6 upper end of supporting pin, by
The support of second supporting pin 6 is coated with the substrate 7 of organic material medical fluid.
The present invention focus on in thermal vacuum drying device the first supporting pin 5 and the second supporting pin 6 carried out structure improvement:
Mosaic texture or layer nested structure is respectively adopted in first supporting pin 5 and the second supporting pin 6.
As shown in fig. 7, mosaic texture, including basal part 51, transition part 52 and top can be used in first supporting pin 5
53.The basal part 51 is including elongated cylinder 511 and protrudes from 511 upper end of elongated cylinder and coaxial small cylinder
512；The diameter of the small cylinder 512 is less than the diameter of elongated cylinder 511；The transition part 52 is nested in the small cylinder
512 outside and 511 upper end of elongated cylinder, the top 53 is nested on the transition part 52.
Specifically, the diameter of the elongated cylinder 511 of the basal part 51 is 3mm~10mm, and the lower end of the basal part 51 is solid
Due to lifter 4；The diameter of small cylinder 512 is the 1/5 of 511 diameter of elongated cylinder, is highly 2mm~5mm；Transition part 52
Diameter is equal with the diameter of elongated cylinder 511, with a thickness of 0.5mm~1mm；The diameter at top 53 and the diameter of elongated cylinder 511
Equal, 53 upper end of top is hemispherical, to reduce the contact area with substrate 7.
Further, each section of the first supporting pin 5 selects different materials so that the capacity of heat transmission of each section is different:
The basal part 51 selects the gold of capacity of heat transmission height, organic solvent-resistant (such as methyl pyrrolidone (NMP)) corrosion
Belong to, preferably aluminum or aluminum alloy, casts.The basal part 51 mainly plays support, fixed transition part 52 and top 53 and heat transfer
Effect.
The transition part 52 select capacity of heat transmission be higher than strong basal part 51, insulation, thermal expansion coefficient and metallic aluminium,
The close insulating materials of silver, preferably ceramic.The transition part 52 plays the role of heat transfer, heat-insulated, antistatic conduction.
The top 53 selects capacity of heat transmission higher than the metal of transition part 52, preferably silver alloy.Play heat in the top 53
The effect of conduction and contact supporting substrate 7.Since the basal part 51, transition part 52 and top 53 of first supporting pin 5 select
The capacity of heat transmission at top 53 is made to be higher than transition part 52 with different materials, the capacity of heat transmission of transition part 52 is higher than basal part
51, when the first supporting pin 5 using the mosaic texture, which carrys out supporting substrate 7, is toasted, the speed of heat transfer is accelerated, and can make
The temperature difference obtained between the contact portion and substrate 7 of substrate 7 and the first supporting pin 5 and the non-contact part of the first supporting pin 5 subtracts
It is small, facilitate substrate 7 and be heated evenly, supports trace as caused by the first supporting pin 5 to reduce, while also can allow for suitably
Increase intermediate region the first supporting pin 5 quantity, mitigate because substrate 7 it is sagging caused by film thickness uneven phenomenon.
As shown in figure 8, a layer nested structure also can be used in first supporting pin 5.
First supporting pin 5 include upper end closed, intermediate hollow out the first cylindrical outer layer sleeve 54, be placed in it is described
The first solid internal layer heater 55 in first outer layer sleeve 54 and one end are electrically connected the first internal layer heater 55, another
End is electrically connected the first conducting wire 56 of the power supply for the power supply of lower heating plate 2.
Specifically:
Through-hole 541 is opened up on the tube wall of first outer layer sleeve 54 to pass through for the first conducting wire 56.
Each section of first supporting pin 5 selects different materials so that the capacity of heat transmission of each section is different: described first
The material that outer layer sleeve 54 selects good insulating, capacity of heat transmission strong, it is preferably quartzy；The first internal layer heater 55 select with
The identical material of lower heating plate 2.
The outer diameter of first outer layer sleeve 54 is 3mm~10mm；The diameter of first internal layer heater 55 is the first outer layer
The 3/5~3/4 of 54 outer diameter of casing.
The upper end of first outer layer sleeve 54 is hemispherical, to reduce the contact area with substrate 7；First internal layer
The upper end of heater 55 follows the upper end of the first outer layer sleeve 54, also hemispherical.
When be coated with organic material medical fluid substrate 7 be placed in thermal vacuum drying equipment, support is responsible for by the first supporting pin 5
When, because the first internal layer heater 55 of the first supporting pin 5 shares the same power supply with lower heating plate 2, temperature control is consistent, and heat is logical
Cross the first internal layer heater 55, the first outer layer sleeve 54 is transmitted to rapidly the upper end of the first outer layer sleeve 54, the first outer layer sleeve
54 upper end is heated rapidly, and conducts heat to the part of itself and the contact of substrate 7, can substantially reduce or even eliminate substrate 7
The temperature difference between the contact portion and substrate 7 of the first supporting pin 5 and the non-contact part of the first supporting pin 5, facilitates substrate
7 are heated evenly, and support trace as caused by the first supporting pin 5 to decrease or even eliminate, while also can allow for suitably increasing
The quantity of first supporting pin 5 of intermediate region, mitigate because substrate 7 it is sagging caused by film thickness uneven phenomenon.
As shown in figure 9, second supporting pin 6 uses layer nested structure, including upper end closed, intermediate hollow out it is cylindrical
Second outer layer sleeve 61, solid the second internal layer heater 62 and one end being placed in second outer layer sleeve 61 electrically connect
Connect the second conducting wire 63 that the second internal layer heater 62, the other end are directly electrically connected lower heating plate 2.
Specifically, each section of the second supporting pin 6 selects different materials so that the capacity of heat transmission of each section is different: institute
The material that the second outer layer sleeve 61 selects good insulating, capacity of heat transmission strong is stated, it is preferably quartzy；The second internal layer heater 62
Select material identical with lower heating plate 2.
The outer diameter of second outer layer sleeve 61 is 2mm~5mm, and lower end is embedded in lower heating plate 22mm~3mm；In second
The diameter of layer heater 62 is the 3/5~3/4 of 61 outer diameter of the second outer layer sleeve.
The upper end of second outer layer sleeve 61 is hemispherical, to reduce the contact area with substrate 7；Second internal layer
The upper end of heater 62 follows the upper end of the second outer layer sleeve 61, also hemispherical.
When be coated with organic material medical fluid substrate 7 be placed in thermal vacuum drying equipment, support is responsible for by the second supporting pin 6
When, because the second internal layer heater 62 and the lower heating plate 2 of the second supporting pin 6 are electrically connected, temperature control is consistent, and heat passes through second
Internal layer heater 62, the second outer layer sleeve 61 are transmitted to rapidly the upper end of the second outer layer sleeve 61, the second outer layer sleeve 61 it is upper
End is heated rapidly, and conducts heat to the part of itself and the contact of substrate 7, can substantially reduce or even eliminate substrate 7 and second
It is heated to facilitate substrate 7 for the temperature difference between the contact portion and substrate 7 of supporting pin 6 and the non-contact part of the second supporting pin 6
Uniformly, trace is supported as caused by the second supporting pin 6 to decrease or even eliminate, while also can allow for suitably increasing middle area
The quantity of second supporting pin 6 in domain, mitigate because substrate 7 it is sagging caused by film thickness uneven phenomenon.
In conclusion the thermal vacuum drying device suitable for flexible base board of the invention, by by thermal vacuum drying device
Interior the first supporting pin, the second supporting pin are improved to mosaic texture or layer nested structure respectively, can speed up heat transfer, so that base
The non-contact portion of the contact portion and substrate and the first supporting pin or the second supporting pin of plate and the first supporting pin or the second supporting pin
/ the temperature difference reduce, be heated evenly, support trace as caused by supporting pin to reduce, and allow appropriate to increase middle area
The supporting pin quantity in domain, mitigate because substrate it is sagging caused by film thickness uneven phenomenon.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology
Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the appended right of the present invention
It is required that protection scope.
Claims (7)
1. a kind of thermal vacuum drying device suitable for flexible base board, which is characterized in that including a sealed chamber (1), be fixed on
The lower heating plate (2) of sealed chamber (1) lower part, is set to the upper heating plate (3) for being fixed on the sealed chamber (1) top
Lifter (4) below the sealed chamber (1), be fixed on the lifter (4) and driven by lifter (4) and the number that goes up and down
A first supporting pin (5) and several second supporting pins (6) being fixed on the lower heating plate (2)；
First supporting pin (5) or the second supporting pin (6) are to support the substrate (7) for being coated with organic material medical fluid to be placed in down
It is toasted between heating plate (2) and upper heating plate (3)；Edge is respectively adopted in first supporting pin (5) and the second supporting pin (6)
Embedding structure and layer nested structure, to accelerate heat transfer, so that the contact of substrate (7) and the first supporting pin (5) or the second supporting pin (6)
The temperature difference partially and between substrate (7) and the first supporting pin (5) or the non-contact part of the second supporting pin (6) reduces；
First supporting pin (5) uses mosaic texture, including basal part (51), transition part (52) and top (53)；
The basal part (51) includes elongated cylinder (511) and protrudes from elongated cylinder (511) upper end and coaxial roundlet
Cylinder (512)；The diameter of the small cylinder (512) is less than the diameter of elongated cylinder (511)；The transition part (52) is nested in
It is nested on the transition part (52) on the outside of the small cylinder (512) with elongated cylinder (511) upper end, the top (53)；
The capacity of heat transmission that the basal part (51), transition part (52) and top (53) select different materials to make top (53) is high
In transition part (52), the capacity of heat transmission of transition part (52) is higher than basal part (51).
2. being suitable for the thermal vacuum drying device of flexible base board as described in claim 1, which is characterized in that the basal part
(51) material is aluminum or aluminum alloy, and the material of the transition part (52) is ceramics, and the material of the top (53) is silver alloy.
3. being suitable for the thermal vacuum drying device of flexible base board as described in claim 1, which is characterized in that the top (53)
Upper end is hemispherical.
4. being suitable for the thermal vacuum drying device of flexible base board as claimed in claim 3, which is characterized in that the basal part
(51) diameter of elongated cylinder (511) is 3mm~10mm；The diameter of small cylinder (512) is elongated cylinder (511) diameter
1/5, it is highly 2mm~5mm；The diameter of transition part (52) is equal with the diameter of elongated cylinder (511), with a thickness of 0.5mm~
1mm；The diameter at top (53) is equal with the diameter of elongated cylinder (511).
5. being suitable for the thermal vacuum drying device of flexible base board as described in claim 1, which is characterized in that second support
Sell (6) and use layer nested structure, including upper end closed, intermediate hollow out cylindrical the second outer layer sleeve (61), be placed in described the
The second solid internal layer heater (62) and one end in two outer layer sleeves (61) are electrically connected the second internal layer heater (62)
Second conducting wire (63)；
Second outer layer sleeve (61) selects insulating heat-conduction material, and the second internal layer heater (62) is selected and lower heating plate
(2) identical material；The other end of second conducting wire (63) is electrically connected lower heating plate (2).
6. being suitable for the thermal vacuum drying device of flexible base board as claimed in claim 5, which is characterized in that second outer layer
The upper end of casing (61) is hemispherical, and the upper end of the second internal layer heater (62) is hemispherical.
7. being suitable for the thermal vacuum drying device of flexible base board as claimed in claim 6, which is characterized in that second outer layer
The outer diameter of casing (61) is 2mm~5mm, and lower end is embedded in lower heating plate (2) 2mm~3mm；Second internal layer heater (62) it is straight
Diameter is the 3/5~3/4 of the second outer layer sleeve (61) outer diameter.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611200169.7A CN106607320B (en) | 2016-12-22 | 2016-12-22 | Thermal vacuum drying device suitable for flexible base board |
| PCT/CN2016/113030 WO2018113015A1 (en) | 2016-12-22 | 2016-12-29 | Thermal vacuum drying device for flexible substrate |
| US15/506,238 US10446417B2 (en) | 2016-12-22 | 2016-12-29 | Hot vacuum drying device applied for flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611200169.7A CN106607320B (en) | 2016-12-22 | 2016-12-22 | Thermal vacuum drying device suitable for flexible base board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106607320A CN106607320A (en) | 2017-05-03 |
| CN106607320B true CN106607320B (en) | 2019-10-01 |
Family
ID=58636739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611200169.7A Active CN106607320B (en) | 2016-12-22 | 2016-12-22 | Thermal vacuum drying device suitable for flexible base board |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10446417B2 (en) |
| CN (1) | CN106607320B (en) |
| WO (1) | WO2018113015A1 (en) |
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| JP6215426B1 (en) * | 2016-09-21 | 2017-10-18 | オリジン電気株式会社 | Heating device and method for manufacturing plate-like member |
| US20200028125A1 (en) * | 2018-07-23 | 2020-01-23 | Kateeva, Inc. | Systems and Methods for Drying Patterned OLED Formulations |
| CN111192839B (en) * | 2020-01-07 | 2023-05-12 | 贵州振华风光半导体股份有限公司 | Method for controlling internal water vapor content of black ceramic low-melting glass shell integrated circuit |
| CN113122826B (en) * | 2020-01-16 | 2023-11-07 | 中国电子科技集团公司第四十八研究所 | Heating device of PECVD (plasma enhanced chemical vapor deposition) equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2018113015A1 (en) | 2018-06-28 |
| US20180218923A1 (en) | 2018-08-02 |
| CN106607320A (en) | 2017-05-03 |
| US10446417B2 (en) | 2019-10-15 |
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