CN106591903A - Heat-conducting film graphite composite suitable for electronic equipment - Google Patents

Heat-conducting film graphite composite suitable for electronic equipment Download PDF

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Publication number
CN106591903A
CN106591903A CN201611050209.4A CN201611050209A CN106591903A CN 106591903 A CN106591903 A CN 106591903A CN 201611050209 A CN201611050209 A CN 201611050209A CN 106591903 A CN106591903 A CN 106591903A
Authority
CN
China
Prior art keywords
copper
graphite
plated
film
electronic equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611050209.4A
Other languages
Chinese (zh)
Inventor
王举
孙益民
芮定文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUI RUIYAN NEW MATERIAL TECHNOLOGY RESEARCH INSTITUTE Co Ltd
Original Assignee
ANHUI RUIYAN NEW MATERIAL TECHNOLOGY RESEARCH INSTITUTE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANHUI RUIYAN NEW MATERIAL TECHNOLOGY RESEARCH INSTITUTE Co Ltd filed Critical ANHUI RUIYAN NEW MATERIAL TECHNOLOGY RESEARCH INSTITUTE Co Ltd
Priority to CN201611050209.4A priority Critical patent/CN106591903A/en
Publication of CN106591903A publication Critical patent/CN106591903A/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive

Abstract

The invention discloses a heat-conducting film graphite composite suitable for electronic equipment. The heat-conducting film graphite composite suitable for the electronic equipment comprises copper-plated graphite films, glue-coated layers and UV ink films, wherein the copper-plated graphite films are stacked, one glue-coated layer is arranged between every two adjacent copper-plated graphite films, and the UV ink films are arranged on the upper end face and the lower end face of the graphite composite. The copper-plated graphite films are stacked, one glue-coated layer is arranged between every two adjacent copper-plated graphite films, and the UV ink films are arranged on the upper end face and the lower end face of the graphite composite so that the thickness of the composite can be effectively increased, and the heat-conducting and heat dissipating effects are improved. A flat and smooth copper-plated layer with the thickness being about 10 microns is electroplated to the surface of each copper-plated graphite film, and thus the axial heat conducting coefficient of the heat-conducting film graphite composite is made to reach 60 W/mK.

Description

A kind of heat conducting film graphite composite material for being suitable for electronic equipment
Technical field
The present invention relates to a kind of heat conduction and heat radiation material, more particularly to a kind of heat conducting film graphite composite wood for being suitable for electronic equipment Material.
Background technology
As the fast development of electron trade, electronic product integrated level are improved constantly, power is continuously increased, and volume constantly contracts Little, the heat that chip is produced also is increased considerably, and heat density steeply rises, and the temperature of electronic equipment increases rapidly, due to radiating It is bad caused by electronic equipment failure it is also more and more, how effectively to solve electronic device heat dissipation problem have become it is whole Key technology urgently to be resolved hurrily in individual electronic industry development.Graphite film because of the thermal conductivity factor and good specific heat capacity of its superelevation, into For the preferable heat conduction and heat radiation material of present electronic product.Because graphite easily forms layered crystal structure, and interlayer not there are The structure of sequence, so there is significant anisotropy, i.e. graphite film horizontal direction thermal conductivity up to 800-2500W/mK, but vertically Direction is only 5-10W/mK, and this characteristic have impact on graphite heat radiation fin application radiating effect on an electronic device, is especially non- Effect in the electronic apparatus application of metal shell.Also there is prior art that the graphite flake of PI film graphitizations is opened up into number Individual perforation, strengthens radiating effect, but the radiating efficiency of longitudinal direction is not still high.Therefore how to increase graphite film under existence conditions to indulge To radiating efficiency be this area technical problem urgently to be resolved hurrily.
The content of the invention
The invention aims to shortcoming present in prior art is solved, and a kind of applicable electronic equipment for proposing Heat conducting film graphite composite material.
To achieve these goals, present invention employs following technical scheme：
A kind of heat conducting film graphite composite material for being suitable for electronic equipment, including copper-plated graphite film, rubberised layer and UV ink films, it is described The electroplating surface of copper-plated graphite film has the copper plate of 10 micron thickness, and the copper-plated graphite film is overlapped mutually, per adjacent two-layer A rubberised layer, up and down two end face of the UV ink films located at graphite composite material are both provided between copper-plated graphite film.
The preparation method of the copper-plated graphite film is comprised the following steps：
S1, electro-coppering：Plating Copper treatment, concentration 2mol/l of sulfuric acid, concentration 0.7mol/ of copper sulphate are carried out to graphite basement membrane L, adds a small amount of hydrochloric acid and leveling agent, and current density is 0.02A/cm2, in electroplating process, note the material that supplement is consumed；
S2, washing：Deionized water is used to copper-plated graphite film, is rinsed repeatedly；
S3, dry：Copper-plated graphite film is placed at shady and cool drying, natural air drying；
S4, washing：Reuse deionized water rinsing copper-plated graphite film；
S5, drying：Copper-plated graphite film is placed in infrared baking oven and is processed 30 minutes.
Preferably, the number of plies of the graphite basic layer is 3 layers, and the number of plies of the rubberised layer is 2 layers.
Preferably, the thickness of the rubberised layer is 5-10 microns.
Preferably, the thickness of the UV ink films is 3-20 microns.
Compared with prior art, the invention has the beneficial effects as follows：
1st, the present invention is overlapped mutually by copper-plated graphite film, and between every adjacent two-layer copper-plated graphite film rubberised layer is provided with, on Lower two end faces are additionally provided with UV graphite films, can be effectively increased the thickness of composite, increased the effect of heat conduction and radiating.
2nd, plating Copper treatment is carried out to graphite basement membrane, in graphite membrane surface the flat smooth of 10 microns can be obtained Copper plate, make the present invention axial thermal conductivity coefficient reach 60W/mK.
Specific embodiment
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement Example is only a part of embodiment of the invention, rather than the embodiment of whole.
A kind of heat conducting film graphite composite material for being suitable for electronic equipment, including copper-plated graphite film, rubberised layer and UV ink films, The electroplating surface of the copper-plated graphite film has the copper plate of 10 micron thickness, and the copper-plated graphite film is overlapped mutually, per adjacent A rubberised layer is both provided between two-layer copper-plated graphite film, the UV ink films are located at two ends up and down of graphite composite material Face.It is overlapped mutually by copper-plated graphite film, between every adjacent two-layer copper-plated graphite film rubberised layer, upper and lower two end faces is provided with UV graphite films are additionally provided with, the thickness of composite can be effectively increased, increased the effect of heat conduction and radiating.
The preparation method of the copper-plated graphite film is comprised the following steps：
S1, electro-coppering：Plating Copper treatment, concentration 2mol/l of sulfuric acid, concentration 0.7mol/ of copper sulphate are carried out to graphite basement membrane L, adds a small amount of hydrochloric acid and leveling agent, and current density is 0.02A/cm2, in electroplating process, note the material that supplement is consumed；
S2, washing：Deionized water is used to copper-plated graphite film, is rinsed repeatedly；
S3, dry：Copper-plated graphite film is placed at shady and cool drying, natural air drying；
S4, washing：Reuse deionized water rinsing copper-plated graphite film；
S5, drying：Copper-plated graphite film is placed in infrared baking oven and is processed 30 minutes.
Preferably, the number of plies of the graphite basic layer is 3 layers, and the number of plies of the rubberised layer is 2 layers.
Preferably, the thickness of the rubberised layer is 5-10 microns.
Preferably, the thickness of the UV ink films is 3-20 microns.
Plating Copper treatment is carried out to graphite basement membrane, the flat smooth of 10 microns can be obtained in graphite membrane surface Copper plate, the axial thermal conductivity coefficient for making the present invention reaches 60W/mK.
The above, the only present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto, Any those familiar with the art the invention discloses technical scope in, technology according to the present invention scheme and its Inventive concept equivalent or change in addition, all should be included within the scope of the present invention.

Claims (5)

1. a kind of heat conducting film graphite composite material for being suitable for electronic equipment, including copper-plated graphite film, rubberised layer and UV ink films, its It is characterised by, the electroplating surface of the copper-plated graphite film has the copper plate of 10 micron thickness, and the copper-plated graphite film is overlapped mutually, A rubberised layer is both provided between per adjacent two-layer copper-plated graphite film, the UV ink films are upper and lower located at graphite composite material Two end faces.
2. a kind of heat conducting film graphite composite material for being suitable for electronic equipment according to claim 1, it is characterised in that described The preparation method of copper-plated graphite film is comprised the following steps：
S1, electro-coppering：Plating Copper treatment, concentration 2mol/l of sulfuric acid, concentration 0.7mol/ of copper sulphate are carried out to graphite basement membrane L, adds a small amount of hydrochloric acid and leveling agent, and current density is 0.02A/cm2, in electroplating process, note the material that supplement is consumed；
S2, washing：Deionized water is used to copper-plated graphite film, is rinsed repeatedly；
S3, dry：Copper-plated graphite film is placed at shady and cool drying, natural air drying；
S4, washing：Reuse deionized water rinsing copper-plated graphite film；
S5, drying：Copper-plated graphite film is placed in infrared baking oven and is processed 30 minutes.
3. a kind of heat conducting film graphite composite material for being suitable for electronic equipment according to claim 1, it is characterised in that described The number of plies of graphite basic layer is 3 layers, and the number of plies of the rubberised layer is 2 layers.
4. a kind of heat conducting film graphite composite material for being suitable for electronic equipment according to claim 1, it is characterised in that described The thickness of rubberised layer is 5-10 microns.
5. a kind of heat conducting film graphite composite material for being suitable for electronic equipment according to claim 1, it is characterised in that described The thickness of UV ink films is 3-20 microns.
CN201611050209.4A 2016-11-25 2016-11-25 Heat-conducting film graphite composite suitable for electronic equipment Pending CN106591903A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611050209.4A CN106591903A (en) 2016-11-25 2016-11-25 Heat-conducting film graphite composite suitable for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611050209.4A CN106591903A (en) 2016-11-25 2016-11-25 Heat-conducting film graphite composite suitable for electronic equipment

Publications (1)

Publication Number Publication Date
CN106591903A true CN106591903A (en) 2017-04-26

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107779925A (en) * 2017-10-26 2018-03-09 杨晓艳 A kind of preparation method of copper graphite film carbon/carbon-copper composite material
WO2019033839A1 (en) * 2017-08-14 2019-02-21 苏州格优碳素新材料有限公司 Preparation method for graphite and copper composite heat conduction material
CN111593388A (en) * 2020-06-18 2020-08-28 江苏格优碳素新材料有限公司 Preparation method of copper-plated graphite film
CN112040722A (en) * 2020-08-17 2020-12-04 苏州鸿凌达电子科技有限公司 High-heat-flux graphite heat-conducting film module stacking method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030096116A1 (en) * 2001-11-21 2003-05-22 Shin-Etsu Chemical Co., Ltd. Heat dissipating structure
CN103864067A (en) * 2014-03-26 2014-06-18 苏州格优碳素新材料有限公司 Preparation method of high thermal conductivity graphite membrane-copper composite material
CN105235307A (en) * 2015-09-01 2016-01-13 山东安诺克新材料有限公司 Heat-conductive film graphite composite material
CN105479833A (en) * 2015-12-09 2016-04-13 南通海嘉复合材料有限公司 Graphite composite material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030096116A1 (en) * 2001-11-21 2003-05-22 Shin-Etsu Chemical Co., Ltd. Heat dissipating structure
CN103864067A (en) * 2014-03-26 2014-06-18 苏州格优碳素新材料有限公司 Preparation method of high thermal conductivity graphite membrane-copper composite material
CN105235307A (en) * 2015-09-01 2016-01-13 山东安诺克新材料有限公司 Heat-conductive film graphite composite material
CN105479833A (en) * 2015-12-09 2016-04-13 南通海嘉复合材料有限公司 Graphite composite material

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019033839A1 (en) * 2017-08-14 2019-02-21 苏州格优碳素新材料有限公司 Preparation method for graphite and copper composite heat conduction material
CN107779925A (en) * 2017-10-26 2018-03-09 杨晓艳 A kind of preparation method of copper graphite film carbon/carbon-copper composite material
CN111593388A (en) * 2020-06-18 2020-08-28 江苏格优碳素新材料有限公司 Preparation method of copper-plated graphite film
CN112040722A (en) * 2020-08-17 2020-12-04 苏州鸿凌达电子科技有限公司 High-heat-flux graphite heat-conducting film module stacking method
CN112040722B (en) * 2020-08-17 2021-05-18 苏州鸿凌达电子科技有限公司 High-heat-flux graphite heat-conducting film module stacking method

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Application publication date: 20170426