CN106576422A - Circuit board and photoirradiation device using same - Google Patents
Circuit board and photoirradiation device using same Download PDFInfo
- Publication number
- CN106576422A CN106576422A CN201580038390.4A CN201580038390A CN106576422A CN 106576422 A CN106576422 A CN 106576422A CN 201580038390 A CN201580038390 A CN 201580038390A CN 106576422 A CN106576422 A CN 106576422A
- Authority
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- China
- Prior art keywords
- substrate
- soldering
- wiring substrate
- basal substrate
- basal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Abstract
The present invention is a circuit board that uses a base substrate formed from metal, wherein electronic components can be easily welded manually. The circuit board comprises a base substrate (21) formed from metal and a wiring conductor layer (23) formed on a top surface (21a) of the base substrate (21) via an insulating layer (22). The wiring conductor layer (23) has an individual soldering region (R2) for soldering electronic components of external leads. Moreover, all of or a part of a portion (21X) of the base substrate (21) corresponding to the individual soldering region (R2) is removed.
Description
Technical field
The present invention relates to a kind of be formed with distribution conductor layer across insulating barrier on the basal substrate being made up of metal
Wiring substrate, and using the light irradiation device of the wiring substrate.
Background technology
In the past, as the manufacture method of electronic circuit module, as Patent Document 1, it is known to for example including Reflow Soldering
Operation and manual soldering operation.Reflow Soldering operation is following operation：Solder(ing) paste (paste soldering is smeared on wiring substrate
Material), and electronic device is placed on above, melt solder(ing) paste using reflow stove heat wiring substrate, afterwards cooling soldering.This
Outward, manual soldering operation is the work of the electronic device that cannot be installed in the Reflow Soldering operation come soldering by manual work
Sequence.
Here, the basal substrate of wiring substrate is usually used the insulated substrate of such as glass epoxy resin etc..Due to so
Insulated substrate heat conductivity it is low, when soldering is carried out by manual work, brazed portion and scolding tin are sufficiently heated, therefore
Problem will not be especially produced in the manual soldering operation.
On the other hand, LED is being installed in that case of wiring substrate for example, it should disperse the heat that the LED is produced, should
Basal substrate is sometimes using outstanding metal basal boards of heat conductivity such as aluminum.In the case of using such metal basal board, by handss
When work industry carries out soldering, it is easy to the conduction of heat of brazed portion will be put on to its peripheral part.As a result, it is difficult to by soldering
Part and scolding tin are fully heated, and it is extremely difficult to carry out soldering by manual work.
Prior art literature
Patent documentation
Patent documentation 1：Japanese Patent Laid-Open 2003-229655 publication
The content of the invention
Invention technical problem to be solved
Therefore the present invention is made to solve the above problems, and its major subjects is, by manual work or pricker
When weldering robot etc. is brazed in electronic device etc. on the wiring substrate for used the basal substrate being made up of metal, its is improved
Operability.
The technological means of solve problem
That is, wiring substrate involved in the present invention is characterised by, including：Basal substrate, the basal substrate is by metal
Constitute；And distribution conductor layer, the distribution conductor layer is formed on a surface of the basal substrate across insulating barrier,
The distribution conductor layer is provided with soldering an individual solder region of electronic device or outer lead, the basal substrate with
The all or part of the corresponding part in the individual solder region is removed.
Here, " part corresponding with the individual solder region of the basal substrate " refer to the basal substrate
The part Chong Die with individual solder region during vertical view, as the mode for removing, does not only remove described with basal substrate
Individual solder region overlap Zone Full situation, or for example with the outer shape with the individual solder region
(contour shape) basically identical mode is removed, or is removed in the way of including the whole individual solder region, that is,
The outer shape ground in slightly more than described individual solder region is removed.Additionally, removal processing for example can by machining,
Etching and processing is carried out.
Indivedual prickers if such wiring substrate, as distribution conductor layer is eliminated and be arranged in basal substrate
The all or part of the corresponding part in welding zone domain, therefore the part of the heat heat transfer for putting on individual solder region is reduced, from
And the heat can be made to be difficult to escape.Therefore, it is possible to fully heat individual solder region and scolding tin such that it is able to by craft
Operation or soldering robot easily soldering electronic device or outer lead.Furthermore, it is possible to only remove basal substrate
The all or part of part corresponding with individual solder region, so as to simplify the structure of wiring substrate.Further, if due to
Outer lead is brazed on wiring substrate at that rate by manual work or soldering robot, then need not be by backflow
Weldering processes the adapter for carrying out soldering for connecting outer lead, therefore does not need the adapter such that it is able to seek wiring substrate
Densification.
For the electronic device (such as LED, resistance chip etc.) that soldering can be carried out by reflow process, by backflow
Weldering is processed and carries out soldering.As in the reflow process, whole basal substrate is heated, therefore without the concern for from quilt
The brazing area (reflow soldering region) of the electronic device of reflow process is to the heat conduction of surrounding.Therefore, substantially in the base
Part corresponding with reflow soldering region need not be removed in substrate.
On the other hand, for electronic device or outer lead that soldering cannot be carried out by reflow process, need logical
Crossing manual work or soldering robot carries out soldering.Due to soldering being carried out by manual work or soldering robot at this
In the case of, it is by local by the brazing area (individual solder region) of the electronic device or outer lead of manual work soldering
Ground heating, it is therefore desirable to consider the heat conduction from the individual solder region to surrounding.Therefore, need to remove in the basal substrate
The all or part of part corresponding with individual solder region.
Namely it is preferred that in the case of being to be refluxed weldering process and manual soldering process in the wiring substrate of the present invention,
The part corresponding with reflow soldering region of the basal substrate is not removed, and the basal substrate with individual solder area
The all or part of the corresponding part in domain is removed.But, the present invention is not at all prevented while removing reflow soldering region.
For the part corresponding with the individual solder region of the basal substrate vertical view when whole or one
Point, it is also possible to remove all parts on the thickness direction of the basal substrate.
Like this, due to can further reduce the part for putting on that the heat in individual solder region is conducted heat, therefore, it is possible to
Individual solder region is efficiently heated, and can more easily carry out the soldering of the manual work of electronic device.
Additionally, for the part corresponding with the individual solder region of the basal substrate vertical view when whole or
A part, it is also possible to remove the part on the thickness direction of the basal substrate.
If removing all parts on the thickness direction of basal substrate, there is the machinery of basal substrate (wiring substrate) strong
The worry that degree declines, but if if simply removing the part on thickness direction, mechanical strength is able to maintain that to a certain degree
More than.
Under the meaning, if pyroconductivity as the removal part filling such as epoxy resin in basal substrate is less than
The material of the basal substrate, then can make the heat for putting on individual solder region be difficult to escape, while being also prevented from wiring substrate
The decline of mechanical strength.
It is also preferred that, the basal substrate passes through aluminum or copper is constituted.Aluminum, copper pyroconductivity typically respectively
237W/mK (300K), 401W/mK (300K), due to becoming more with high-termal conductivity (high-cooling property), therefore the effect of the present invention
Plus significantly.
Preferably in individual solder region bending.Like this, except manual work or soldering can be passed through
Robot is easily beyond soldering electronic device or effect as outer lead, additionally it is possible to easily bending wiring substrate.
Moreover it is preferred that the distribution conductor layer is bent over, the whole of the dogleg section in the basal substrate or
A part is removed.Like this, due to the dogleg section in wiring substrate, all or part of basal substrate is gone
Remove, therefore, it is possible to easily bending wiring substrate.
Further, light irradiation device involved in the present invention is characterised by, including：Above-mentioned wiring substrate；Keep described
The keeping body of wiring substrate；It is installed at least one of wiring substrate LED；And it is brazed in the individual of the wiring substrate
The outer lead of other brazing area.And, it is preferred that the wiring substrate has makes the outer lead from the substrate base
One face side of plate extends to the notch part or through hole of another face side, the outer lead via the notch part or
Through hole described in person is directed to another face side of the basal substrate, and extends to the outside of the keeping body.
In existing wiring substrate, using the adapter connection outer lead by reflow process soldering, therefore by
Configuration space of adapter of outer lead side connected in the configuration space and the adapter of the adapter etc., it has to structure
Become the structure etc. for making outer lead extend to the side of wiring substrate, the process of outer lead has restriction.
However, according to the present invention, as manual work or soldering robot soldering outer lead, therefore energy can be passed through
Adapter is not needed enough.Vicinity thereby, it is possible to the part of the outer lead from soldering starts the another of for example basad substrate
Face side bending etc., so as to be easily handled outer lead, and the extension of outer lead that can be in appropriate design housing.
The effect of invention
According to such present invention for constituting, due to the part corresponding with individual solder region of basal substrate whole or
A part is removed, therefore the manual work for electronic device or outer lead, the soldering of soldering robot, its operability
Can greatly improve.
The explanation of symbol
100 light irradiation devices
2 wiring substrates
4 housings (keeping body)
6 outer leads
21 basal substrates
21X parts corresponding with individual solder region
22 insulating barriers
23 distribution conductor layers
R2 individual solders region
Description of the drawings
Fig. 1 is the axonometric chart for illustrating the light irradiation device involved by one embodiment of the present invention.
Fig. 2 is the top view of the light irradiation device for illustrating identical embodiment.
Fig. 3 is the part A amplification plan view of the light irradiation device for illustrating identical embodiment.
Fig. 4 is the top view and upward view of the wiring substrate for illustrating identical embodiment.
Fig. 5 is the enlarged partial sectional figure of the removal part of the wiring substrate for illustrating identical embodiment.
Fig. 6 is that the part amplification stereogram of the removal part of the wiring substrate for illustrating identical embodiment and part are amplified
Top view.
Fig. 7 is the schematic diagram of the heat-transfer path in the wiring substrate for illustrate existing and present embodiment.
Fig. 8 is the figure of the variation for illustrating wiring substrate.
Fig. 9 is the figure of the variation for illustrating wiring substrate.
Figure 10 is the axonometric chart of the light irradiation device for illustrating variant embodiment.
Figure 11 is the axonometric chart of the confined state for illustrating the wiring substrate in variant embodiment.
Figure 12 is the top view and upward view of the deployed condition for illustrating the wiring substrate in variant embodiment.
Specific embodiment
Referring to the drawings an embodiment of light irradiation device involved in the present invention is illustrated.
As shown in Figures 1 and 2, the light irradiation device 100 of present embodiment includes：The wiring substrate of multiple LED3 is installed
2；And accommodate the housing (keeping body) 4 of the wiring substrate 2.The light irradiation device 100 of present embodiment is that so-called annular is shone
Bright device.The light irradiation device 100 is applied to appearance inspecting system, and the appearance inspecting system is via being formed at light irradiation device
The peristome of 100 central part, is imaged by the workpiece illuminated to the light irradiation device 100 by the image pickup parts such as ccd video camera, from
And carry out the visual examination of workpiece.
Housing 4 includes：It is fixed with the body element 41 of wiring substrate 2；And be installed on the body element 41, with will
Project from the light of the LED3 to the cap member (not shown) of outside light transmissive region.
The body element 41 of present embodiment is set to substantially toroidal, outer perimeter wall 41a with radial outside and footpath
To the inner side perisporium 41b of inner side, the substrate receiving space content formed between outer perimeter wall 41a and inner side perisporium 41b
Receiving has wiring substrate 2.Additionally, cap member is set to substantially toroidal, its clog by outer perimeter wall 41a of body element 41 with
And the peristome that perisporium 41b in inner side is formed, and possess the light spread from LED3 and the light pervasion component for projecting and constitute.
As shown in Figures 2 and 4, wiring substrate 2 be set to be contained in very close to each otherly outer perimeter wall 41a of body element 41 with
And the substantially toroidal between the perisporium 41b of inner side, and be fixed in body element 41 by screw etc..
Specifically as shown in Fig. 4～Fig. 6, wiring substrate 2 is so-called single layer substrate, and which includes：Basal substrate 21, it is described
Basal substrate 21 is made up of metal；And distribution conductor layer 23, the distribution conductor layer 23 is formed in institute across insulating barrier 22
State on surface (upper surface) 21a of basal substrate 21.Additionally, the upper surface of distribution conductor layer 23 forms matcoveredn 24.
In addition, in the present embodiment, single insulating barrier 22 is only formed between basal substrate 21 and distribution conductor layer 23, but also may be used
To form other multiple layers.
Basal substrate 21 be for example, by aluminum, copper etc. formed with the metal of high-termal conductivity in substantially toroidal
Part.Insulating barrier 22 is formed throughout the whole upper surface 21a of basal substrate 21.The insulating barrier 22 is with to metal substrate
The function of insulating between substrate 21 and distribution conductor layer 23.
Distribution conductor layer 23 makes to be installed on various electronic devices and the outer leads such as the LED3 of wiring substrate 2, resistance chip 5
6 conductings, and be formed as the Wiring pattern for specifying.Also, be provided with the distribution conductor layer 23 for soldering electronic device or
Brazing area R1, R2 of person's outer lead 6.
Specifically, especially as shown in figure 4, distribution conductor layer 23 is provided with：By reflow process (reflow soldering apparatus) pricker
The reflow soldering region R1 of weldering electronic device；And the individual solder of the manual work soldering outer lead by using flatiron
Region, i.e. manual soldering region R2.In addition, reflow soldering region R1 and manual soldering region R2 are consisted of pad.
Reflow soldering region R1 is following region：Solder(ing) paste (paste soldering material) is smeared, and the electronic device of regulation is put
On the reflow soldering region R1, melt solder(ing) paste using reflow oven, and cool down afterwards, thus carry out electricity described in soldering
Sub- device.In the present embodiment, LED3 and resistance chip 5 etc. are brazed to reflow soldering region in the lump as electronic device
R1。
Manual soldering region R2 is following region：By the electronic device of regulation be brazed in the reflow soldering region R1 it
Afterwards, by using flatiron manual work by the reflow process cannot soldering the soldering one by one such as electronic device.At this
In embodiment, the R2 solderings of manual soldering region have outer lead 6.In addition, can also use in the R2 of the manual soldering region
Outer lead 6 etc. described in the soldering of soldering robot.Here, as soldering robot, it may be considered that carry out soldering using flatiron
Soldering robot carries out the soldering robot of soldering using semiconductor laser.
Also, especially as shown in Figures 2 and 3, wiring substrate 2 possesses notch part 2K, notch part 2K is used to make soldering
Another surface (lower surface) 21b sides of basal substrate 21 are extended in the outer lead 6 of manual soldering region R2.Notch part 2K
Be the outer edge that the wiring substrate 2 adjacent with manual soldering region R2 is removed to inside cutting a part after shape.In this enforcement
In mode, wiring substrate 2 is set to substantially circular plate shape, and notch part 2k is formed at the radial outside of manual soldering region R2
Peripheral part.Thereby, it is possible to the neighbouring bending of the coupling part of the outer lead 6 by manual soldering region R2 is brazed in, so as to
The lower surface 21b sides of basal substrate 21 are extended to enough.Also, the outer lead 6 passes through housing 4 (particularly body element 41)
Inside, and the side wall via the body element 41 extends to outside.In addition, as shown in figure 4, the peripheral part of wiring substrate 2 is removed
Multiple notch part 2L for being screwed in body element 41 are also formed with beyond notch part 2K.
But in the wiring substrate 2 of present embodiment, as shown in Fig. 4～Fig. 6, basal substrate 21 with brazing area pair
The whole of the part answered is removed.Specifically, as, in basal substrate 21, part corresponding with reflow soldering region R1 does not have
It is removed, and all parts on the thickness direction of part 21X corresponding with manual soldering region R2 is removed, therefore constitutes
It is the basal substrate 21 of the not part, only possesses insulating barrier 22 and distribution conductor layer 23.In addition, the part 21X is handss
The lower portion (just descending part) of work brazing area R2, and include whole manual soldering region in the vertical view of basal substrate 21
R2, i.e., with the slightly more than outer shape of manual soldering region R2 (referring particularly to the part amplification plan view of Fig. 6).
Then, simply to outer lead 6 is brazed in craft by manual work in such wiring substrate 2 for constituting
The heat-transfer path of heat during brazing area R2 is illustrated.In addition, (A) of Fig. 7 shows the heat of the wiring substrate of existing structure
Heat-transfer path, (B) show the heat-transfer path of the heat of the wiring substrate 2 of present embodiment.
As shown in (A) of Fig. 7, in the wiring substrate of existing structure, due to the base of the underface of manual soldering region R2
Substrate 21 is not removed, therefore puts on the conduction of heat of manual soldering region R2 to manual soldering region R2's by flatiron
Immediately below and its around.As a result, the temperature of manual soldering region R2 does not fully rise, scolding tin is difficult to melt, pricker
Weldering becomes difficult.
On the other hand, shown in (B) of such as Fig. 7, in the wiring substrate 2 of present embodiment, due to manual soldering region R2
The basal substrate 21 of underface be removed, therefore the heat for putting on manual soldering region R2 by flatiron is not conducted to handss
The underface of work brazing area R2, and be difficult to conduct to around removal part.As a result, the temperature of manual soldering region R2
Fully can rise, scolding tin is easy to fusing, soldering becomes easy.
Then, the manufacture method of such wiring substrate 2 for constituting is illustrated.
First, dielectric film 22 is formed on the surface of basal substrate 21, and on the surface of the dielectric film 22 with patterned fashion
Form distribution conductor layer 23.Additionally, the surface portion in removal brazing area R1, R2 of wiring substrate 23 forms protecting film 24.
Also, from the beginning of the lower surface 21b of basal substrate 21, added by machining (such as fluting processing) or etching
Work removes the whole of the part corresponding with manual soldering region R2 of basal substrate 21.
Effect ＞ of ＜ present embodiments
Light irradiation device 100 according to involved by such present embodiment for constituting, due in basal substrate 21, and sets
The corresponding part 21X of manual soldering region R2 for being placed in distribution conductor layer 23 are removed, therefore can make to put on manual soldering
The part of the heat heat transfer of region R2 diminishes.Therefore, the heating of manual soldering region R2 fully can be carried out such that it is able to by handss
Work industry soldering outer lead 6 easily.Furthermore, it is possible to only remove the portion corresponding with manual soldering region R2 of basal substrate 21
Divide the whole of 21X such that it is able to simplify the structure of wiring substrate 2.
Further, it is used to connect the adapter of outer lead 6 as reflow process soldering need not be passed through, and can passes through
Manual work soldering outer lead 6, therefore, it is possible to not need adapter such that it is able to by wiring substrate 2 and light irradiation device
100 densifications.On its basis, can be from soldering from the beginning of the vicinity of the part of outer lead 6 because adapter is not needed
The lower surface 21b side bendings of basad substrate 21, therefore, it is possible to the extension of the outer lead 6 on appropriate design housing 4.
In addition, the present invention is not limited to the embodiment.
For example, in said embodiment, the part 21X corresponding with manual soldering region R2 of basal substrate 21 is from upper table
Face 21a is removed to lower surface 21b, but it is also possible to opened from the lower surface 21b of basal substrate 21 using (A) such as Fig. 8 is shown
Begin towards upper surface 21a to remove the structure of a part.Now, the working depth for starting as the lower surface 21b of basal substrate 21,
The thickness of such as basal substrate 21 after considering to cause processing is changed into below 0.3mm.In addition it is also possible to using from basal substrate 21
Upper surface 21a initially towards lower surface 21b remove a part structure.In addition, as shown in (B) of Fig. 8, it is also possible in substrate
Substrate 21 remove part filling pyroconductivity less than basal substrate 21 material 21Y (such as epoxy resin etc.) (material 21Y's
Filling thickness is not by any restriction), like this, the heat for being applied in manual soldering region R2 can be made to be difficult to escape, together
When prevent wiring substrate 23 (basal substrate 21) mechanical strength decline.
Additionally, in said embodiment, be basal substrate 21 part 21X corresponding with manual soldering region R2
The removed structure of whole during vertical view is but it is also possible to be a part of removed when overlooking of the corresponding part 21X
Structure.
For example, can be as shown in (A) of Fig. 9, using the outer peripheral portion that the corresponding part 21X is only removed when overlooking
Structure.Now, when overlooking, the profile of the outer peripheral portion comprising manual soldering region R2 of the corresponding part 21X.Even if
In the structure, heat is also difficult to the peripheral part conducted to the corresponding part 21X, and manual soldering region R2 fully can add
Heat.
On the other hand, it is also possible to as shown in (B) of Fig. 9, the corresponding part 21X is partly removed using when overlooking
It is multiple place structures.In (B) of Fig. 9, part is removed along the prescribed direction equally spaced structure of manual soldering region R2
Into the structure being irregularly arranged but it is also possible to be removal part.Now, when overlooking, the removal part includes manual pricker
A part for the profile of welding zone domain R2.In the structure shown here, although the effect compared with the situation of whole corresponding part 21X is eliminated
Diminish, but the part of the heat heat transfer for putting on manual soldering region R2 can be made to diminish.
Further, in said embodiment, it is set to outer lead 6 is brazed in the structure of manual soldering region R2, but
The electronic devices such as LED3, resistance chip 5 can be brazed in the structure of manual soldering region R2.In addition, LED3 is being brazed in
In the case of the R2 of manual soldering region, it is believed that fully radiate without the heat to being produced by the LED3, but can be to a certain extent
Guarantee the thermal diffusivity of heat produced by the LED3, as long as also, removed with the degree that can fully heat in soldering it is described right
Answer part 21X.
On the basis of which, in said embodiment, the removal form of corresponding part 21X is, in the thickness of basal substrate 21
It is same cross-sectional shape that part is removed on direction, but is not limited only to this, and the cross sectional shape of part is removed on the thickness direction
With diminishing from lower surface 21b to upper surface 21a or can also become big.
Additionally, as shown in figs.10 and 11, light irradiation device 100 can also possess the keeping body 4 for being set to square tube shape, should
The inside of keeping body 4 possesses the wiring substrate 2 that bending is substantially square tube shape.
As shown in figure 12, the wiring substrate 2 includes：Installation portion 2a；And can be powered and with flexible connecting portion 2b.
Specifically, wiring substrate 2 includes：4 installation portion 2a；And mutually neighbour installation portion 2a, 2a can be connected with being powered each other
With flexible connecting portion 2b.Installation portion 2a includes：It is connected with the rectangular-shaped rectangular substrate portion 2a1 of connecting portion 2b；And
Start the trapezoidal baseplate part 2a2 of extended trapezoidal shape from one side of rectangular substrate portion 2a1.Additionally, rectangular substrate portion 2a1
And trapezoidal baseplate part 2a2 is provided with light source 3.
Also, wiring substrate 2 is configured to square tube shape by bending connecting portion 2b.Additionally, passing through bending rectangular substrate portion
Between 2a1 and trapezoidal baseplate part 2a2, the hypotenuse of mutually adjacent trapezoidal baseplate part 2a2 is adjacent to each other or close, and
Top is formed with opening 2H.In addition, in the structure shown here, the light of light source 3 is projected from the bottom of the wiring substrate 2 of square tubular.
Here, in dogleg section 21Y between connecting portion 2b and rectangular substrate portion 2a1 and trapezoidal baseplate part 2a2, base
The all or part of substrate 21 is removed.Thus, the bending operation of portion 2b, and rectangular substrate portion are easily attached
The bending operation of 2a1 and trapezoidal baseplate part 2a2.
Additionally, 1 installation portion 2a is formed through the indivedual prickers for having used the manual work soldering of flatiron to have outer lead
Welding zone domain R2.Specifically, inner surfacies of the individual solder region R2 in installation portion 2a, is formed at rectangular substrate portion 2a1 and ladder
Between shape baseplate part 2a2.Here, the whole of the part corresponding with individual solder region R2 of basal substrate 21 is removed.That is, should
Installation portion 2a is configured to the structure in the R2 bendings of individual solder region.Thus, performance can pass through manual work or solderer
The effect of device people easily soldering electronic device or structure as outer lead, and it is readily able to bending wiring substrate.
In addition, the present invention is not limited to the embodiment, can carry out in the range of without departing from the main contents each
Plant the deformation of various kinds.
Industrial applicability
According to the present invention, use by gold being brazed in electronic device etc. by manual work or soldering robot etc.
When on the wiring substrate of the basal substrate that category is constituted, it is possible to increase its operability.
Claims (9)
1. a kind of wiring substrate, it is characterised in that include：
Basal substrate, the basal substrate are made up of metal；And
Distribution conductor layer, the distribution conductor layer are formed on a surface of the basal substrate across insulating barrier,
The distribution conductor layer is provided with individually soldering the individual solder region of electronic device or outer lead,
The all or part of the part corresponding with the individual solder region of the basal substrate is removed.
2. wiring substrate according to claim 1, it is characterised in that
For the part corresponding with the individual solder region of the basal substrate vertical view when all or part,
All parts on the thickness direction of the basal substrate are removed.
3. wiring substrate according to claim 1, it is characterised in that
For the part corresponding with the individual solder region of the basal substrate vertical view when all or part,
A part on the thickness direction of the basal substrate is removed.
4. wiring substrate according to claim 1, it is characterised in that
Material of the pyroconductivity less than the basal substrate is filled with the removal part of the basal substrate.
5. wiring substrate according to claim 1, it is characterised in that
The distribution conductor layer is provided with reflow process soldering the reflow soldering region of the electronic device, Yi Jisuo
State individual solder region.
6. wiring substrate according to claim 1, it is characterised in that
It is bent in the individual solder region.
7. wiring substrate according to claim 1, it is characterised in that
The distribution conductor layer is bent over,
The all or part of the dogleg section in the basal substrate is removed.
8. a kind of light irradiation device, it is characterised in that include：
Wiring substrate according to claim 1；
Keep the keeping body of the wiring substrate；
It is installed at least one of wiring substrate LED；And
It is brazed in the outer lead in the individual solder region of the wiring substrate.
9. light irradiation device according to claim 8, it is characterised in that
The wiring substrate has makes the outer lead extend to another face side from a face side of the basal substrate
Notch part or through hole,
The outer lead is directed to another face side of the basal substrate via the notch part or the through hole,
And extend to the outside of the keeping body.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-144709 | 2014-07-15 | ||
| JP2014144709 | 2014-07-15 | ||
| PCT/JP2015/068946 WO2016009830A1 (en) | 2014-07-15 | 2015-07-01 | Circuit board and photoirradiation device using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106576422A true CN106576422A (en) | 2017-04-19 |
| CN106576422B CN106576422B (en) | 2020-01-31 |
Family
ID=55078328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580038390.4A Expired - Fee Related CN106576422B (en) | 2014-07-15 | 2015-07-01 | Wiring board and light irradiation device using the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6683610B2 (en) |
| CN (1) | CN106576422B (en) |
| WO (1) | WO2016009830A1 (en) |
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| CN201787386U (en) * | 2010-08-19 | 2011-04-06 | 苏州科医世凯半导体技术有限责任公司 | Metal substrate LED module for illumination |
| CN102032477A (en) * | 2009-09-25 | 2011-04-27 | 东芝照明技术株式会社 | Luminescence module, bulb-like light, and illuminator |
| CN102056401A (en) * | 2009-10-28 | 2011-05-11 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| US20110303440A1 (en) * | 2010-06-15 | 2011-12-15 | Samsung Electro-Mechanics Co., Ltd. | Hybrid heat-radiating substrate and method of manufacturing the same |
| CN203057680U (en) * | 2012-12-31 | 2013-07-10 | 深圳东志器材有限公司 | Low heat-dissipation circuit board of double welding structures |
| CN103298242A (en) * | 2012-03-02 | 2013-09-11 | 佳能元件股份有限公司 | Flexible circuit board |
| CN103702515A (en) * | 2013-12-26 | 2014-04-02 | 广州市德晟照明实业有限公司 | High-power LED (light emitting diode) lamp bead metal substrate structure and manufacturing method thereof |
-
2015
- 2015-07-01 JP JP2016534358A patent/JP6683610B2/en not_active Expired - Fee Related
- 2015-07-01 WO PCT/JP2015/068946 patent/WO2016009830A1/en active Application Filing
- 2015-07-01 CN CN201580038390.4A patent/CN106576422B/en not_active Expired - Fee Related
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| JPH03136291A (en) * | 1989-10-20 | 1991-06-11 | Matsushita Electric Ind Co Ltd | Thick film mounting circuit |
| JP2006222182A (en) * | 2005-02-09 | 2006-08-24 | Shin Kobe Electric Mach Co Ltd | Rigid flexible board |
| CN101448371A (en) * | 2008-12-26 | 2009-06-03 | 深圳华为通信技术有限公司 | Welding method for preventing scaling powder from entering into surface mounting component and circuit wafer thereof |
| CN102032477A (en) * | 2009-09-25 | 2011-04-27 | 东芝照明技术株式会社 | Luminescence module, bulb-like light, and illuminator |
| CN102056401A (en) * | 2009-10-28 | 2011-05-11 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| US20110303440A1 (en) * | 2010-06-15 | 2011-12-15 | Samsung Electro-Mechanics Co., Ltd. | Hybrid heat-radiating substrate and method of manufacturing the same |
| CN201787386U (en) * | 2010-08-19 | 2011-04-06 | 苏州科医世凯半导体技术有限责任公司 | Metal substrate LED module for illumination |
| CN103298242A (en) * | 2012-03-02 | 2013-09-11 | 佳能元件股份有限公司 | Flexible circuit board |
| CN203057680U (en) * | 2012-12-31 | 2013-07-10 | 深圳东志器材有限公司 | Low heat-dissipation circuit board of double welding structures |
| CN103702515A (en) * | 2013-12-26 | 2014-04-02 | 广州市德晟照明实业有限公司 | High-power LED (light emitting diode) lamp bead metal substrate structure and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106576422B (en) | 2020-01-31 |
| WO2016009830A1 (en) | 2016-01-21 |
| JPWO2016009830A1 (en) | 2017-04-27 |
| JP6683610B2 (en) | 2020-04-22 |
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