CN101448371A - Welding method for preventing scaling powder from entering into surface mounting component and circuit wafer thereof - Google Patents
Welding method for preventing scaling powder from entering into surface mounting component and circuit wafer thereof Download PDFInfo
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- CN101448371A CN101448371A CNA2008101873122A CN200810187312A CN101448371A CN 101448371 A CN101448371 A CN 101448371A CN A2008101873122 A CNA2008101873122 A CN A2008101873122A CN 200810187312 A CN200810187312 A CN 200810187312A CN 101448371 A CN101448371 A CN 101448371A
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- surface mounting
- mounting component
- circuit board
- zone
- scaling powder
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- 239000000843 powder Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000003466 welding Methods 0.000 title claims abstract description 29
- 238000009434 installation Methods 0.000 claims abstract description 27
- 230000008901 benefit Effects 0.000 abstract description 3
- 230000035515 penetration Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 11
- 230000004907 flux Effects 0.000 description 9
- 238000004021 metal welding Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000008030 elimination Effects 0.000 description 4
- 238000003379 elimination reaction Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
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- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
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- 239000012467 final product Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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Abstract
The invention relates to a welding method for preventing scaling powder from entering surface mounting component. The method is as follows: before the surface mounting component is welded to a circuit wafer, the region of the circuit wafer which a slit on the surface mounting component is corresponding to is removed. According to the method, the invention also provides the circuit wafer which is provided with the surface mounting component. The circuit wafer comprises an installation region used for installing the surface mounting component. The installation region is provided with the removed region which is corresponding to the slit on the surface mounting component. The invention has the advantages of reducing or even eliminating the residual scaling powder caused by welding the surface mounting component by reducing the region of the circuit wafer on which the scaling powder can be remained, thus preventing that the inner bodies of the surface mounting component loose effectiveness because of scaling powder penetration.
Description
Technical field
The present invention relates to the welding method in a kind of circuit board manufacturing process, especially a kind of scaling powder that prevents enters the welding method of surface mounting component.The invention still further relates to a kind of scaling powder that prevents and enter the circuit board of surface mounting component.
Background technology
In the primary stage that electronic circuit board is produced, via hole assembles fully by manually finishing.After first batch of automatic machinery was released, they can assemble some simple pin elements, but complicated element still need carry out wave-soldering with manual the placement.But development along with electronics industry, surface mounting component (Surface Mounted Devices particularly, abbreviation SMD) appearance makes traditional dress connection technology can't satisfy the needs of industry development, so people have researched and developed a kind of new dress connection technology: surface mounting technology.So-called surface mounting technology, English is referred to as " Surface MountTechnology ", is called for short SMT, and it is that a kind of circuit that surface mounting component is pasted, is soldered on the surperficial assigned position of printed circuit board (PCB) (PrintCircuit Board is called for short PCB) is adorned the connection technology.Specifically, as shown in Figure 1, at first on printed circuit board (PCB) 2, be coated with scaling powder, such as solder(ing) paste, again surface mounting component 5 is put on the pad that scribbles solder(ing) paste exactly, melt until solder(ing) paste by the pad of heating on the printed circuit board (PCB) 2, just realized interconnected between surface mounting component 5 and the printed circuit board (PCB) 2 after the cooling.SMT is widely used in the electronic product dress connection of every field such as Aeronautics and Astronautics, mobile communication, computer, medical electronics, automobile, office automation, household electrical appliance as circuit assembly technology of new generation.
But existing circuit dress connection technology some problems occur easily in the process that surface mounting component is welded on the circuit board.With the sensitive switch is example.Sensitive switch is a kind of surface mounting component that can conveniently realize multiple functions such as mobile phone volume control, camera function triggering, menu selection, because it is easy to assembling, with low cost, therefore is applied in more and more on the various mobile communication terminal products.But owing to this type of device has kept certain stroke space of pushing for realizing pressing function, cause device architecture not tight, to such an extent as to there is the structure slit in device, slit (as the slit A among Fig. 2), sensitive switch bottom for example.If pass through scaling powder, such as solder(ing) paste itself and circuit board welding can be made that remaining in the volatile substances such as rosin that contain in the solder(ing) paste on the circuit board penetrates into sensitive switch inside from the structure slit, these volatile substances solidify posterior synechia on the part of sensitive switch inside, thereby cause switch failure easily, can't realize pressing function.And the method that existing solution scaling powder enters surface mounting components such as sensitive switch mainly contains two kinds.A kind of is to change the switch external structure, promotes height between switch and circuit board, is beneficial to scaling powder and overflows; But this method cost is higher, and can not eliminate the slit in the structure; Another kind is a control scaling powder consumption, thereby reduces the scaling powder that remains in the switch bottom.The inventor is in realizing process of the present invention, and find to have following problem at least in the prior art: the first method cost is higher, and can not eliminate the slit in the structure; Second method can only be alleviated the residual quantity of scaling powder to a certain extent, can not thoroughly solve the problem of welding assisted agent residuals switch bottom.
Summary of the invention
The purpose of the embodiment of the invention is, provides a kind of scaling powder that prevents to enter the welding method and the circuit board of surface mounting component, makes surface mounting component no longer cause losing efficacy because of the residual flux influence.
In order to realize the foregoing invention purpose, the embodiment of the invention provides a kind of scaling powder that prevents to enter the welding method of surface mounting component, and described method is for before surface mounting component is soldered to circuit board, and remove in the circuit board zone that place, the slit on the described surface mounting component is corresponding.
The present invention also provides a kind of circuit board that surface mounting component is installed, described circuit board comprises the installation region that is used to install described surface mounting component, be provided with removed zone in the described installation region, described removed zone is corresponding with the place, slit on the described surface mounting component.
The embodiment of the invention has following beneficial effect: by reducing the circuit board zone of possibility residual flux; minimizing even elimination are because of the residual scaling powder of welding surface mounting component; thereby prevented that the surface mounting component inner body from infiltrating the result who lost efficacy because of scaling powder, and then effectively protected the function and the structure of surface mounting component.
Description of drawings
Fig. 1 is the dress connection schematic diagram of available circuit plate and sensitive switch.
Fig. 2 is the structural representation in slit, existing sensitive switch bottom.
Fig. 3 is that the scaling powder that prevents of the embodiment of the invention one enters the schematic flow diagram of the welding method of sensitive switch.
Fig. 4 is the printed circuit board (PCB) of the embodiment of the invention one and embodiment two and the dress connection schematic diagram of sensitive switch.
Fig. 5 is the elevational schematic view after the embodiment of the invention one and embodiment two sensitive switches and the amplification of printed circuit board (PCB) dress connection.
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
The embodiment of the invention is that a kind of scaling powder that prevents enters surface mounting component method and a kind of circuit board that surface mounting component is installed, described surface mounting component is example with the sensitive switch, remove by the circuit board zone that structure slit place on the sensitive switch is corresponding, make described structure slit around do not have residual scaling powder to exist the space.Circuit board in the embodiment of the invention is example with the printed circuit board (PCB).
Embodiment one,
Fig. 3 is that the scaling powder that prevents of the embodiment of the invention enters the schematic flow diagram of the welding method of sensitive switch.As shown in Figure 3, before the method for implementing present embodiment, on printed circuit board (PCB), to delimit earlier the installation region of sensitive switch.As shown in Figure 4, because sensitive switch 5 is multiple function operations buttons such as a kind of realization mobile phone volume control, camera function triggering, menu selection, so for the ease of operation, operated by rotary motion is near printed circuit board (PCB) one lateral edges, thereby delimit certain zone according to the size of described sensitive switch 5 it is installed in the described zone, promptly the installation region 1.The pin pad 3.1 that can be electrically connected with described switch and the electrical connection pad of other necessity are set in the described installation region 1.The position of these pads all be with described switch 5 on the position of pin weldering end 4 and other metal welding ends corresponding.In the installation region 1 except these necessary welding regions, the remaining printed circuit board (PCB) zone 2 that is.For example the sensitive switch two bottom sides has a pin weldering end 4 respectively, and the installation region 1 on the corresponding printed circuit board (PCB) just is provided with two pin pads 3.1, and the zone in the middle of the two pins pad is exactly the printed circuit board (PCB) zone 2 of sensitive switch 5 bottom correspondences.
Method in the present embodiment may further comprise the steps:
Step 12: remove in the printed circuit board (PCB) zone that the A place, slit on the sensitive switch 5 is corresponding.
Because the weldering of the two pins on the described sensitive switch 5 end 4 is arranged on the Switch main body two bottom sides, so in the installation region 1 with the corresponding pad locations of pin also 1 both sides in the installation region, like this when using scaling powder welding sensitive switch 5, more or less scaling powder can residually be arranged on the printed circuit board (PCB) in the described installation region 1 between the two pins pad 3.1, and the metal welding end on the described sensitive switch 5 also be arranged on the bottom, residual on the printed circuit board (PCB) like this have scaling powder then inevitable.Because the structure slit A on the described sensitive switch 5 is the bottom that also is positioned at Switch main body, corresponding zone, the A place, slit on the promptly described sensitive switch 5 is the printed circuit board (PCB) that residual flux is arranged again.So the printed circuit board (PCB) that slit A place is corresponding is removed, such as the printed circuit board (PCB) zone of diging up A position, structure slit correspondence, so just, make the position of slit, sensitive switch 5 bottom A correspondence not have the existence of printed circuit board (PCB), thus should the zone just can't residual flux.
Step 13: weld described sensitive switch.
After the printed circuit board (PCB) zone of easy residual flux hollowed out, dress connection sensitive switch in described installation region 1.Be about to the necessary weld welding such as pin pad 3.1, metal pad 3.2 on pin weldering end 4, metal welding end etc. and the installation region 1 on the sensitive switch.Welding effect as shown in Figure 5.
The advantage of the embodiment of the invention is to increase the processing step that remove in the printed circuit board (PCB) zone that place, the slit on the described micro-control switch is corresponding in the technology of existing welding micro-control switch.Reduce the printed circuit board (PCB) zone of possibility residual flux by this method; minimizing even elimination are because of the residual scaling powder of welding micro-control switch; thereby prevented that micro-control switch inner body from infiltrating the result who lost efficacy because of scaling powder, and then effectively protected the function and the structure of micro-control switch.
It should be noted that, removing the method in the printed circuit board (PCB) zone of place, the slit correspondence on the micro-control switch should carry out reasonable operation according to complexity in the actual process, such as locating corresponding printed circuit board (PCB) zone with the slit on the corresponding cutting tool excision micro-control switch after the justifying circuit board making is finished.And removed zone described in the present embodiment is meant the printed circuit board (PCB) zone excision that place, the slit on the micro-control switch is corresponding of the method utilized in the existing technology, cuts out the remaining that part of structure in back, and this structure can be regarded as half through hole or a kind of breach.
Embodiment two,
The embodiment of the invention also provides a kind of printed circuit board (PCB) that surface mounting component is installed, and as shown in Figure 4, before being installed in sensitive switch on the printed circuit board (PCB), to delimit earlier the installation region of sensitive switch on printed circuit board (PCB).Because sensitive switch 5 is multiple function operations buttons such as a kind of realization mobile phone volume control, camera function triggering, menu selection, so for the ease of operation, operated by rotary motion is near printed circuit board (PCB) one lateral edges, thereby delimit certain zone according to the size of described sensitive switch 5 it is installed in the described zone, promptly the installation region 1.The pin pad 3.1 that can be electrically connected with described switch and the electrical connection pad of other necessity are set in the described installation region 1.The position of these pads all be with described switch 5 on the position of pin weldering end 4 and other metal welding ends corresponding.In the installation region 1 except these necessary welding regions, the remaining printed circuit board (PCB) zone 2 that is.For example the sensitive switch two bottom sides has a pin weldering end 4 respectively, and the installation region 1 on the corresponding printed circuit board (PCB) just is provided with two pin pads 3.1, and the zone in the middle of the two pins pad is exactly the printed circuit board (PCB) zone 2 of sensitive switch 5 bottom correspondences.
Because the weldering of the two pins on the described sensitive switch 5 end 4 is arranged on the Switch main body two bottom sides, so in the installation region 1 with the corresponding pad locations of pin also 1 both sides in the installation region, like this when using scaling powder welding sensitive switch 5, more or less scaling powder can residually be arranged on the printed circuit board (PCB) in the described installation region 1 between the two pins pad 3.1, and the metal welding end on the described sensitive switch 5 also is arranged on the bottom, then unavoidably understands the residual scaling powder that have like this on the printed circuit board (PCB).Because the structure slit A on the described sensitive switch 5 is the bottom that also is positioned at Switch main body, corresponding zone, the A place, slit on the promptly described sensitive switch 5 is the printed circuit board (PCB) that residual flux is arranged again.So in order to address this problem, the corresponding printed circuit board (PCB) in slit A place has been removed in the present embodiment, promptly uses A place, a slit to the printed circuit board (PCB) that is removed the printed circuit board (PCB) zone should be arranged.This set have the printed circuit board (PCB) that is removed the printed circuit board (PCB) zone can be in advance when the designing printed circuit board structure, slit A place correspondence position vacated or the manufacture process at printed circuit board (PCB) in increase the printed circuit board (PCB) zone removal that A place, described slit is corresponding processing step (as: diging up the printed circuit board (PCB) zone of A position, structure slit correspondence) realize.Dress joins sensitive switch in described installation region 1 so again.Be about to the necessary weld welding such as pin pad 3.1, metal pad 3.2 on pin weldering end 4, metal welding end etc. and the installation region 1 on the sensitive switch.The position of slit, the sensitive switch 5 bottom A correspondence after dress connection finishes does not so just have the existence of printed circuit board (PCB), thus should the zone can't residual flux in the process of welding.Effect as shown in Figure 5.
The advantage of present embodiment is to avoid the residual circuit board that the scaling powder zone is arranged by use; minimizing even elimination are because of the residual scaling powder of welding micro-control switch; thereby prevented that micro-control switch inner body from infiltrating the result who lost efficacy because of scaling powder, and then effectively protected the function and the structure of micro-control switch.
In foregoing invention embodiment one and embodiment two, but as long as the position of the slit A correspondence of sensitive switch bottom does not have the printed circuit board (PCB) of residual flux.Be the length value that the length of described area of knockout 6 is not less than described slit A, the width of described area of knockout 6 is not less than the width value of described slit A.The slit A of in the present embodiment because sensitive switch bottom is between two pins pad 3.1, so the length value of described area of knockout 6 is not more than distance between the 1 interior two pins pad of described installation region, width value is not more than printed circuit board edge and gets final product to distance between the metal pad.But because the rosin that contains in the scaling powder is a kind of volatile substances, reach effect preferably, will reduce the residual printed circuit board (PCB) zone that scaling powder is arranged as much as possible if want the embodiment of the invention.The length in the described zone that for example cuts out can be distance between the two pins pad; And owing to consider the problem of printed circuit plate thickness and intensity, width is generally between 1.2mm～1.5mm.Be preferably 1.5mm, described like this printed circuit board (PCB) zone is hollowed out substantially.By reducing the residual printed circuit board (PCB) zone that scaling powder is arranged as much as possible; minimizing even elimination are because of the residual scaling powder of welding sensitive switch; thereby prevented that the sensitive switch inner body from infiltrating the result who lost efficacy because of scaling powder, and then effectively protected the function and the structure of sensitive switch.
It should be noted that, removed zone described in the present embodiment is meant the printed circuit board (PCB) zone excision that place, the slit on the micro-control switch is corresponding of the method utilized in the existing technology, cuts out the remaining that part of structure in back, and this structure can be regarded as half through hole or a kind of breach.
Certainly, what more than select for use is that sensitive switch and printed circuit board (PCB) are as preferred implementation of the present invention, should be understood that, above-mentioned embodiment is exemplary, and it is also nonrestrictive, concerning the one of ordinary skilled in the art, can be without departing from the inventive concept of the premise the present invention be carried out multiple change and or or revises this kind change and or or revise and must think in the application scope of disclosure.
Claims (8)
1, a kind of scaling powder that prevents enters the welding method of surface mounting component, it is characterized in that, comprises the processing step that remove in the circuit board zone that place, the slit on the described surface mounting component is corresponding before being welded to surface mounting component on the circuit board.
2, the scaling powder that prevents according to claim 1 enters the welding method of surface mounting component, it is characterized in that: the described length of removing the zone is not less than the length value in described slit, and the width in described removal zone is not less than the width value in described slit.
3, the scaling powder that prevents according to claim 2 enters the welding method of surface mounting component, it is characterized in that: the described length of removing the zone equals on the described circuit board distance between the pin pad, and described width value is between 1.2mm～1.5mm.
4, the scaling powder that prevents according to claim 3 enters the welding method of surface mounting component, it is characterized in that: the described width value of removing the zone is 1.5mm.
5, a kind of circuit board that surface mounting component is installed, it is characterized in that, described circuit board comprises the installation region that is used to install described surface mounting component, is provided with removed zone in the described installation region, and described removed zone is corresponding with the place, slit on the described surface mounting component.
6, the circuit board that surface mounting component is installed according to claim 5 is characterized in that, the described length that is removed the zone is not less than the length value in described slit, and the described width that is removed the zone is not less than the width value in described slit.
7, the circuit board that surface mounting component is installed according to claim 6 is characterized in that, the described length that is removed the zone equals on the described circuit board distance between the pin pad, and described width value is between 1.2mm～1.5mm.
8, the circuit board that surface mounting component is installed according to claim 7 is characterized in that, the described width value that is removed the zone is 1.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101873122A CN101448371B (en) | 2008-12-26 | 2008-12-26 | Welding method for preventing scaling powder from entering into surface mounting component and circuit board thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101873122A CN101448371B (en) | 2008-12-26 | 2008-12-26 | Welding method for preventing scaling powder from entering into surface mounting component and circuit board thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101448371A true CN101448371A (en) | 2009-06-03 |
| CN101448371B CN101448371B (en) | 2011-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101873122A Expired - Fee Related CN101448371B (en) | 2008-12-26 | 2008-12-26 | Welding method for preventing scaling powder from entering into surface mounting component and circuit board thereof |
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| Country | Link |
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| CN (1) | CN101448371B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106576422A (en) * | 2014-07-15 | 2017-04-19 | Ccs株式会社 | Circuit board and photoirradiation device using same |
-
2008
- 2008-12-26 CN CN2008101873122A patent/CN101448371B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106576422A (en) * | 2014-07-15 | 2017-04-19 | Ccs株式会社 | Circuit board and photoirradiation device using same |
| CN106576422B (en) * | 2014-07-15 | 2020-01-31 | Ccs株式会社 | Wiring board and light irradiation device using the same |
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| Publication number | Publication date |
|---|---|
| CN101448371B (en) | 2011-01-05 |
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Effective date of registration: 20171113 Address after: Metro Songshan Lake high tech Industrial Development Zone, Guangdong Province, Dongguan City Road 523808 No. 2 South Factory (1) project B2 -5 production workshop Patentee after: Huawei terminal (Dongguan) Co.,Ltd. Address before: 518129 Longgang District, Guangdong, Bantian HUAWEI base B District, building 2, building No. Patentee before: HUAWEI DEVICE Co.,Ltd. |
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Address after: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee after: HUAWEI DEVICE Co.,Ltd. Address before: 523808 Southern Factory Building (Phase I) Project B2 Production Plant-5, New Town Avenue, Songshan Lake High-tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: Huawei terminal (Dongguan) Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110105 |
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| CF01 | Termination of patent right due to non-payment of annual fee |