CN105828515A - Thermoelectrically separated combined type circuit board photoelectric engine - Google Patents
Thermoelectrically separated combined type circuit board photoelectric engine Download PDFInfo
- Publication number
- CN105828515A CN105828515A CN201610227076.7A CN201610227076A CN105828515A CN 105828515 A CN105828515 A CN 105828515A CN 201610227076 A CN201610227076 A CN 201610227076A CN 105828515 A CN105828515 A CN 105828515A
- Authority
- CN
- China
- Prior art keywords
- combined type
- thermoelectricity
- separates
- substrate
- led chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a thermoelectrically separated combined type circuit board photoelectric engine, the upper part is provided with semiconductor LED chips and drive circuit electronic components, the lower part can be directly matched with a radiator and includes a substrate, lamination layers and ceramic layers, a plurality of metal protrusions are arranged on the substrate, the ceramic layers are arranged on the metal protrusions, and the semiconductor LED chips are arranged on the ceramic layers; and upper surfaces of non-protrusion positions of the substrate are provided with the lamination layers, the lamination layers and the metal protrusions are equal in height, and the drive circuit electronic components are arranged above a laminating layer circuit. The ceramic layers are arranged between the semiconductor LED chips and the substrate, thus photoelectric isolation can be effectively performed and excellent thermal conductivity is achieved, and heat of the semiconductor LED chips located on the ceramic substrate can be transmitted to the radiator directly through the metal protrusions; and the lamination layers are arranged in non-protrusion positions of the substrate, the drive circuit electronic components are connected with the semiconductor LED chips through the circuit, and photoelectric control can be effectively performed, thereby realizing thermoelectrical separation.
Description
Technical field
The present invention relates to a kind of wiring board, particularly relate to a kind of not only can Phototube Coupling but also there is the combined type circuit plate photoelectricity engine that the thermoelectricity of superior thermal conductivity separates.
Background technology
It is required to utilize heat conducting material to conduct heat for optics and/or the device of electronics, such as integrated circuit or laser diode.Need for this to use metallic matrix, such as Copper substrate, and between described optics and/or the device of electronics and metallic matrix, it is frequently necessary to electric isolution.And some ceramic material has higher heat conduction efficiency and is insulation to electricity.Often use the ceramic material of high heat conduction as providing electric isolution and still maintaining the intermediate materials of heat conductivity between optics and/or the device of electronics and metallic matrix for this.
Summary of the invention
In order to overcome the deficiencies in the prior art, the present invention provide a kind of not only can Phototube Coupling but also there is the combined type circuit plate photoelectricity engine that the thermoelectricity of superior thermal conductivity separates.
To this end, the invention discloses a kind of thermoelectricity separate combined type circuit plate photoelectricity engine, its top is provided with semi-conductor LED chips and drive circuit electronic devices and components, its underpart can directly with radiator threaded engagement, including substrate, pressing layer and ceramic layer.
Described substrate is provided with multiple metal bump, and described ceramic layer is located at above described metal bump, and described semi-conductor LED chips is located at above described ceramic layer；The upper surface of the non-high spot of described substrate is provided with pressing layer, and described pressing layer is contour with described metal bump.
Preferably, described pressing layer is made up of insulating barrier and Copper Foil；The material of described insulating barrier is the one in resin, FR4, BT.
Further, carry out described metal bump spraying stannum or heavy stannum.
Further, heat conduction and the conductive region of described ceramic layer is respectively welded in described metal bump and circuit by the way of Reflow Soldering or eutectic weldering.
Preferably, the material of described ceramic layer is AL2O3, one in ALN, ALON, SiC.
Preferably, described ceramic layer is that through hole runs through setting, so that described semi-conductor LED chips connects with described base plate line.
Described drive circuit electronic devices and components are located at above described pressing layer circuit；And drive circuit electronic devices and components electronic devices and components include driving IC chip, electric capacity, resistance, bridge rectifier, electric fuse, mos pipe, TVS, mov pipe.
Further, described drive circuit electronic devices and components are combined with pressing layer circuit by Reflow Soldering, eutectic weldering, and are connected with semi-conductor LED chips by circuit.
The combined type circuit plate photoelectricity engine that the described thermoelectricity that the present invention provides separates is by arranging ceramic layer between semi-conductor LED chips and substrate, excellent heat conductivity can be possessed again so that the heat of the semi-conductor LED chips being positioned on ceramic substrate directly can be delivered to radiator by metal bump while effectively carrying out Phototube Coupling；Non-high spot at substrate arranges pressing layer, and drive circuit electronic devices and components are connected with semi-conductor LED chips by circuit, can effectively carry out photo-electric control, it is achieved thermoelectricity separates.
Accompanying drawing explanation
The sectional view of the combined type circuit plate photoelectricity engine that a kind of thermoelectricity that Fig. 1 provides for the present invention separates；
Fig. 2 is the upward view of ceramic layer in the present invention, wherein:
1-substrate, 2-pressing layer, 3-ceramic layer, 4-semi-conductor LED chips, 11-metallized metal is protruding, 21-insulating barrier, 22-Copper Foil, and 31, the Part I at the 33-ceramic layer back side, the Part II at the 32-ceramic layer back side.
Detailed description of the invention
Below in conjunction with the accompanying drawings embodiments of the invention are described in detail.
Referring to Fig. 1, the present invention provides the combined type circuit plate photoelectricity engine that a kind of thermoelectricity separates, and its top is provided with semi-conductor LED chips 4, and its underpart can directly coordinate with radiator, including substrate 1, pressing layer 2 and ceramic layer 3.
Described substrate 1 is provided with multiple metal bump 11, and described ceramic layer 3 is located at above described metal bump 11, and described semi-conductor LED chips 4 is located at above described ceramic layer 3；Upper surface at non-protruding the 11 of described substrate 1 is provided with pressing layer 2, and described pressing layer 2 is contour with described metal bump 11.
Described pressing layer 2 is used for the shielding on substrate 1 between multiple semi-conductor LED chips circuit 4, is made up of insulating barrier 21 and Copper Foil 22；The material of described insulating barrier is the one in resin, FR4, BT.
Carry out described metal bump 11 spraying stannum or heavy stannum.
Referring to Fig. 2, described ceramic layer 3 includes that two parts, Part I 31,33 engage with Copper Foil, and Part II 32 is welded in described metal bump 11 by the way of Reflow Soldering or eutectic weldering.
The material of described ceramic layer is AL2O3, one in ALN, ALON, SiC；And described ceramic layer can run through setting in through hole, so that described semi-conductor LED chips connects with described base plate line.
Described drive circuit electronic devices and components are located at above described pressing layer 2 circuit；And drive circuit electronic devices and components electronic devices and components include driving IC chip, electric capacity, resistance, bridge rectifier, electric fuse, mos pipe, TVS, mov pipe.Described drive circuit electronic devices and components are combined with pressing layer circuit by Reflow Soldering, eutectic weldering, and are connected with semi-conductor LED chips by circuit.
To sum up, the combined type circuit plate photoelectricity engine that the described thermoelectricity that the present invention provides separates is by by arranging ceramic layer between semi-conductor LED chips and substrate, excellent heat conductivity can be possessed again so that the heat of the semi-conductor LED chips being positioned on ceramic substrate directly can be delivered to radiator by metal bump while effectively carrying out Phototube Coupling；Non-high spot at substrate arranges pressing layer, and drive circuit electronic devices and components are connected with semi-conductor LED chips by circuit, can effectively carry out photo-electric control, it is achieved thermoelectricity separates.
The above; it is only the present invention preferably detailed description of the invention; but protection scope of the present invention is not limited thereto; any those familiar with the art is in the technical scope that the invention discloses; according to technical scheme and inventive concept equivalent or change in addition thereof, all should contain within protection scope of the present invention.
Claims (9)
1. the combined type circuit plate photoelectricity engine that thermoelectricity separates, its top is provided with semi-conductor LED chips and drive circuit electronic devices and components, and its underpart can directly coordinate with radiator, it is characterised in that include substrate, pressing layer and ceramic layer, wherein:
Described substrate is provided with multiple metal bump, and described ceramic layer is located at above described metal bump, and described semi-conductor LED chips is located at above described ceramic layer；The upper surface of the non-high spot of described substrate is provided with pressing layer, and described pressing layer is contour with described metal bump.
The combined type circuit plate photoelectricity engine that a kind of thermoelectricity the most according to claim 1 separates, it is characterised in that described pressing layer is made up of insulating barrier and Copper Foil；The material of described insulating barrier is the one in resin, FR4, BT.
The combined type circuit plate photoelectricity engine that a kind of thermoelectricity the most according to claim 1 separates, it is characterised in that carry out described metal bump spraying stannum or heavy stannum.
The combined type circuit plate photoelectricity engine that a kind of thermoelectricity the most according to claim 1 separates, it is characterised in that heat conduction and the conductive region of described ceramic layer are respectively welded in described metal bump and circuit by the way of Reflow Soldering or eutectic weldering.
The combined type circuit plate photoelectricity engine that a kind of thermoelectricity the most according to claim 1 separates, it is characterised in that the material of described ceramic layer is AL2O3, one in ALN, ALON, SiC.
The combined type circuit plate photoelectricity engine that a kind of thermoelectricity the most according to claim 1 separates, it is characterised in that described ceramic layer is that through hole runs through setting, so that described semi-conductor LED chips circuit connects with Metal Substrate on-board circuitry.
The combined type circuit plate photoelectricity engine that a kind of thermoelectricity the most according to claim 1 separates, it is characterised in that described drive circuit electronic devices and components are located at above described pressing layer circuit.
The combined type circuit plate photoelectricity engine that a kind of thermoelectricity the most according to claim 1 separates, it is characterized in that, described drive circuit electronic devices and components electronic devices and components include driving IC chip, electric capacity, resistance, bridge rectifier, electric fuse, mos pipe, TVS, mov pipe.
The combined type circuit plate photoelectricity engine that a kind of thermoelectricity the most according to claim 1 separates, it is characterised in that described drive circuit electronic devices and components are combined with pressing layer circuit by Reflow Soldering, eutectic weldering, and are connected with semi-conductor LED chips by circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610227076.7A CN105828515A (en) | 2016-04-13 | 2016-04-13 | Thermoelectrically separated combined type circuit board photoelectric engine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610227076.7A CN105828515A (en) | 2016-04-13 | 2016-04-13 | Thermoelectrically separated combined type circuit board photoelectric engine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105828515A true CN105828515A (en) | 2016-08-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610227076.7A Pending CN105828515A (en) | 2016-04-13 | 2016-04-13 | Thermoelectrically separated combined type circuit board photoelectric engine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105828515A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106122837A (en) * | 2016-08-10 | 2016-11-16 | 苏州晶品新材料股份有限公司 | A kind of LED projection lamp source using ceramic substrate |
| CN107645839A (en) * | 2017-10-23 | 2018-01-30 | 广东冠锋科技股份有限公司 | A kind of preparation method of thermoelectricity separate circuit boards |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005191102A (en) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | Wiring board and its manufacturing method |
| CN101517760A (en) * | 2006-09-29 | 2009-08-26 | 奥斯兰姆奥普托半导体有限责任公司 | Optoelectronic component |
| CN101888740A (en) * | 2010-06-02 | 2010-11-17 | 苏州科医世凯半导体技术有限责任公司 | Convex metal printed circuit board and manufacturing method thereof |
| CN203167425U (en) * | 2013-01-18 | 2013-08-28 | 深圳市鼎燊电子有限公司 | Metal printed circuit board |
| CN103517542A (en) * | 2012-06-14 | 2014-01-15 | 欧司朗股份有限公司 | Circuit board, electronic module comprising the same, lighting device, and circuit board manufacturing method |
| US20140185312A1 (en) * | 2012-12-29 | 2014-07-03 | Duane Louderback | Method and apparatus for implementing optical modules in high temperatures |
-
2016
- 2016-04-13 CN CN201610227076.7A patent/CN105828515A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005191102A (en) * | 2003-12-24 | 2005-07-14 | Kyocera Corp | Wiring board and its manufacturing method |
| CN101517760A (en) * | 2006-09-29 | 2009-08-26 | 奥斯兰姆奥普托半导体有限责任公司 | Optoelectronic component |
| CN101888740A (en) * | 2010-06-02 | 2010-11-17 | 苏州科医世凯半导体技术有限责任公司 | Convex metal printed circuit board and manufacturing method thereof |
| CN103517542A (en) * | 2012-06-14 | 2014-01-15 | 欧司朗股份有限公司 | Circuit board, electronic module comprising the same, lighting device, and circuit board manufacturing method |
| US20140185312A1 (en) * | 2012-12-29 | 2014-07-03 | Duane Louderback | Method and apparatus for implementing optical modules in high temperatures |
| CN203167425U (en) * | 2013-01-18 | 2013-08-28 | 深圳市鼎燊电子有限公司 | Metal printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106122837A (en) * | 2016-08-10 | 2016-11-16 | 苏州晶品新材料股份有限公司 | A kind of LED projection lamp source using ceramic substrate |
| CN107645839A (en) * | 2017-10-23 | 2018-01-30 | 广东冠锋科技股份有限公司 | A kind of preparation method of thermoelectricity separate circuit boards |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160803 |
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| RJ01 | Rejection of invention patent application after publication |