CN106574389B - Copper foil, copper clad laminate and substrate - Google Patents

Copper foil, copper clad laminate and substrate Download PDF

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Publication number
CN106574389B
CN106574389B CN201580032041.1A CN201580032041A CN106574389B CN 106574389 B CN106574389 B CN 106574389B CN 201580032041 A CN201580032041 A CN 201580032041A CN 106574389 B CN106574389 B CN 106574389B
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copper foil
protrusion
mentioned
copper
frequency
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CN106574389A (en
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井上大辅
奥野裕子
宇野岳夫
鸟光悟
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a kind of copper foils, and multiple protrusions, skin depth d (m)=√ (1/ (σ μ π f)) (wherein, σ are formed on surface：Conductivity (S/m), μ：Magnetic conductivity (H/m), f：Included frequency (Hz) in electric signal) when, f >=5GHz, the height of above-mentioned protrusion is set as h (μm), when width at the h/2 height and positions of the protrusion is set as w (μm), the above-mentioned mean number for being projected on every 5 μm of length of h/d >=1 is 1 or more, and 80% or more above-mentioned protrusion meets w >=0.1 μm and w/d in the above-mentioned protrusion of h/d >=1<‑0.1h/d+1.4.

Description

Copper foil, copper clad laminate and substrate
Technical field
The present invention relates to a kind of with resin base material excellent adhesion, the transmission characteristic of high-frequency signal also excellent copper foil Deng.
Background technology
In recent years, with the miniaturization of electronic building brick and high performance, small-sized and highdensity printing electricity can generally be used Road plate.Such printed circuit board be in insulative resin substrate surface configuration circuit formation copper foil, integration and formed and cover copper Laminate is fabricated by the copper clad laminate.By imposing mask pattern to copper foil and etching, on copper clad laminate Form circuit pattern.
Copper foil is integrated with resin base material by heating, being pressed to form, but needs the adaptation of regulation or more.As ensuring The method of such adaptation, it is general using surface roughening treatment as defined in implementing to copper foil method (such as patent document 1~ 3)。
Existing technical literature
Patent document
Patent document 1：Japanese Patent Laid-Open 7-231152 bulletins
Patent document 2：Japanese Patent Laid-Open 2006-210689 bulletins
Patent document 3：No. 5204908 bulletins of Japanese Patent No.
Invention content
(1) problems to be solved by the invention
The method of patent document 1 is ensured closely sealed by fixed effect (the Anchor Effect) relative to resin base material Property, therefore, the fine copper tumor shape to being formed in copper foil surface is provided.
And, for the linearity of the baseline (Bottom Line) of raising copper foil, patent document 2 implements low roughness processing again, To ensure adaptation, heat-resisting antirust coat, chromate skin membrane and silane coupling agent layer are formed.
In addition, patent document 3 specifies the surface roughness etc. of copper foil, copper particle residual leads to insulation not after preventing etching Good generation, and ensure adaptation.
But Patent Documents 1 to 3 only ensure adaptation, do not fully take into account frequency transfer characteristic.High-frequency signal passes Defeated to use in copper foil, great problem is to ensure that the adaptation with resin base material and transmission when taking into account as copper clad laminate is special Property.
Herein, it is however generally that, the i.e. shaggy degree of height for being roughened protrusion is bigger, and transmission characteristic is poorer.Patent text 2 explanations are offered the reason for this is that roughing in surface causes conveying length to increase, but not quantitative are illustrated.In addition, passing through about taking into account Fixed effect such as ensures adaptation and ensures transmission characteristic at the countermeasure that should be secured permission, and there is no made based on specific mechanism at present It illustrates.
The height for increasing roughening protrusion if it is the adaptation for ensuring copper foil and resin base material, as its exchange (trade-off), it is possible to create other problems.For example, if protrusion is long, etch residue is easy tod produce.To avoid this from asking The generation of topic, thus it is speculated that may take up longer etching period.Again and, if protrusion have certain length in the state of refine Spout width, then the problem of may losing powder.To avoid the generation of the problem, thus it is speculated that operation that may be in manufacturing copper foil The physical contact to copper foil is reduced in.However, no matter which kind of evasion game used, it is likely to result in manufacturing cost increase And quality reduces.
The present invention develops in view of the above problems, and its purpose is to provide a kind of with resin base material excellent adhesion, Frequency transfer characteristic also excellent copper foil etc..
(2) technical solution
To achieve the above object, the 1st invention is a kind of copper foil, is high frequency electrical signal transmission copper foil, which is characterized in that It is formed with multiple protrusions, skin depth d (μm)=10 on surface6× √ (1/ (σ μ π f)) (wherein, σ：Conductivity (S/ M), μ：Magnetic conductivity (H/m), f：Included frequency (Hz) in above-mentioned high frequency electrical signal) when, f >=5GHz, by the height of above-mentioned protrusion Degree is set as h (μm), and when the width at the h/2 height and positions of the protrusion is set as w (μm), the above-mentioned of h/d >=1 is projected on every 5 μm The mean number of length is 1 or more, also, 80% or more above-mentioned protrusion meets w >=0.1 μm in the above-mentioned protrusion of h/d >=1 And w/d<-0.1h/d+1.4.
In addition, the 1st invention is a kind of copper foil, it is high frequency electrical signal transmission copper foil, which is characterized in that formed on surface There are multiple protrusions, skin depth d (μm)=106× √ (1/ (σ μ π f)) (wherein, σ：Conductivity (S/m), μ：Magnetic conductivity (H/m), f：Included frequency (Hz) in above-mentioned high frequency electrical signal) when, the height of above-mentioned protrusion is set as h (μ by f >=5GHz M), when the width at the h/2 height and positions of the protrusion being set as w (μm), the above-mentioned of h/d >=2 is projected on being averaged for every 5 μm of length Number is 1 or more, also, 80% or more above-mentioned protrusion meets w >=0.1 μm and w/d in the above-mentioned protrusion of h/d >=2<- 0.1h/d+1.4。
Preferably h is 0.4 μm or more.
Preferably w is 0.2 μm or more.
Further preferably frequency f included in above-mentioned high frequency electrical signal is 20GHz or more.
The bivariate table area for the three-dimensional table area and the roughening treatment face that further preferably light interfering microscope measures The ratio between be less than 3 times.
According to the 1st invention, by according to skin depth as defined in transmission frequency, being standardized to shape for lugs, to It can get copper foil as described below：There is sufficient adaptation with resin base material, and can obtain suitable for use condition Higher transmission characteristic.Specifically, if averagely forming the protrusion of 1 or more h/d >=1 in every 5 μm of length, it can ensure that and set The adhesion of aliphatic radical material.Further, since meeting w/d<The protrusion of -0.1h/d+1.4 reaches 80% or more, therefore, even if protrusion is high Degree is higher, also can get good electrical characteristic.
If averagely forming the protrusion of 1 or more h/d >=2 in every 5 μm of length, and meet w/d<-0.1h/d+1.4 Protrusion reach 80% or more, further effectively to make adaptation good, then can guarantee and adaptation and can get into one Walk good electrical characteristic.
Especially, if h is 0.4 μm or more, the adaptation with resin base material can more effectively be obtained.In addition, such as Fruit w is 0.2 μm or more, also can inhibit the generation of dusting problems.
And, when frequency is 20GHz or more, utilize the three-dimensional table area of light interfering microscope three-dimensional measurement and roughening treatment again The bivariate table area ratio in face is less than 3 times, can obtain further good electrical characteristic.
2nd invention is a kind of copper clad laminate, which is characterized in that be laminated the copper foil described in the 1st invention with resin base material, Fitting, the dielectric constant of above-mentioned resin base material is 4 hereinafter, dielectric loss angle tangent tan δ are 0.006 or less.
Above-mentioned resin base material is preferably by liquid crystal polymer, fluororesin, polyetherimide, polyether-ether-ketone, polyphenylene oxide, poly- What any one of cycloolefin, bimaleimide resin, low dielectric coefficient polyimide or their hybrid resin were constituted.
According to the 2nd invention, low-loss copper clad laminate can be effectively obtained.In general, high frequency resin under most situations It is poor with the adaptation of copper foil.As such high frequency resin, the dielectric constants such as resinous polymer is used to be 4 or less, be situated between Matter losstangenttanδ is 0.006 below.The present invention is by being suitable for such resin, to can get higher effect.
3rd invention is a kind of substrate, which is characterized in that relative to the copper clad laminate described in the 2nd invention, to above-mentioned copper foil Pattern processing is carried out, forms circuit, the length of the wavelength of the frequency f defineds relative to high frequency electrical signal, above-mentioned circuit is 10 It is more than times effective wavelength.
According to the 3rd invention, the effect for more efficiently reducing transmission loss can get.The reason is that longer circuit Its loss value showed as effect becomes larger, if line length is too short, effect is smaller.
(3) invention effect
According to the present invention, it is possible to provide the excellent adhesion with resin base material, frequency transfer characteristic also excellent copper foil etc..
Description of the drawings
Fig. 1 is the figure for indicating substrate 1 (copper clad laminate 2).
Fig. 2 is the figure of itself and the relationship of equivalent conductivity after indicating to standardize surface roughness with skin depth.
Fig. 3 is the profile of copper foil 7.
Fig. 4 is to indicate apparent conductivity relative to the distribution of the height h and width w of the standardized protrusion of skin depth 9 Figure.
Fig. 5 is the concept map for indicating protrusion current density distribution nearby, and Fig. 5 (a) is the figure for the protrusion for indicating wider width, Fig. 5 (b) is the figure for the protrusion for indicating narrower width.
Fig. 6 is to indicate apparent conductivity relative to the distribution of the height h and width w of the standardized protrusion of skin depth 9 Figure.
Fig. 7 is to indicate apparent conductivity relative to the distribution of the height h and width w of the standardized protrusion of skin depth 9 The figure of middle the scope of the present invention, Fig. 7 (a) are figures when indicating 20GHz, and Fig. 7 (b) is figure when indicating 80GHz.
Fig. 8 is the figure for indicating the transmission characteristic relative to frequency, and Fig. 8 (a) is to indicate the dielectric loss angle of resin base material just The figure of the situation of δ=0.01 tan is cut, Fig. 8 (b) is the figure for the situation for indicating δ=0.004 tan.
Specific implementation mode
(substrate 1)
Hereinafter, with reference to Figure of description, description of specific embodiments of the present invention.Fig. 1 is to indicate phase of the present invention The figure of the substrate 1 of pass.Substrate 1 carries out pattern to circuit 5 on resin base material 3 and is process.Circuit 5 passes through 7 shape of copper foil At.That is, fitting copper foil 7 and resin base material 3 form circuit 5 by sheltering and etching.In addition, by before etching copper foil 7 with tree Aliphatic radical material 3 is bonded, and is formed as one, copper clad laminate 2 is made.As fitting resin base material 3 and copper foil 7, copper clad layers pressure is formed Well-known method, such as hot pressing mode, continuous rolling laminar manner, continuous mode with pressure etc. can be used in the method for plate 2.
Copper foil 7 can be electrolytic copper foil, electrolysis copper alloy foil, rolled copper foil, calendering any one of copper alloy foil, can basis Purposes of copper clad laminate 2 etc. suitably selects.In addition, the detailed content of copper foil 7 is as described below.
As resin base material 3, it is generally desirable to which dielectric constant is 4 hereinafter, dielectric loss angle tangent tan δ are 0.006 or less. As such material, liquid crystal polymer can be used.
Herein, the length that the length of circuit 5 is removed in size is outside one's consideration, and can also show as transmission frequency, transmission wavelength sometimes.Example Such as, if the length of circuit 5 is 100mm, by effective wavelength (=in view of after the wavelength shortening caused by resin base material 3 wavelength, Line length is scaled wavelength) for, about close to the grade of 1 times of wavelength when frequency 2GHz, and it is about close when frequency 20GHz The grade of 10 times of wavelength of effective wavelength.Be about relative to effective wavelength 10 times of wavelength bins or more longer signal line in, pass Defeated loss is more notable, therefore suitable for the application present invention.That is, circuit 5 preferably length be high frequency electrical signal frequency f defineds Wavelength 10 times of effective wavelength more than.In addition, the substrate 1 of the present invention is used for transmission the high-frequency signal of 5GHz or more.If frequency Rate is less than 5GHz, then is unable to fully obtain the effect of the present invention.
(copper foil)
Next, being described in detail for copper foil 7.Fig. 3 is to indicate that high frequency electrical signal transmission is sticked together with the resin of copper foil 7 The profile in face.Copper foil 7 is in formation protrusion 9 in Copper base material 11.The high-frequency circuit of the present invention uses copper foil in as Metal Substrate The copper foil surface (surface roughness is not particularly limited, but Rz is preferably 5.0 μm or less) of material plates (burnt by burning Plating) roughening particle is set, roughening particle layer is formed.Roughening particle is preferably made of copper.In addition, in the present invention, it is " prominent Rise " include being formed by roughening particle.
In addition, although detailed description will be omitted, is made of it is desirable to being formed in above-mentioned roughening particle chromate epithelium Antirust coat.In turn, silane coupling processing can also be implemented on antirust coat.It, can be according to as product about silane coupling agent Resin base material 3 is suitably selected from epoxy, amido system, metha crylic, ethylene system, sulfydryl system etc..For high frequency base The especially excellent epoxy of compatibility, amido system, ethylene system coupling agent may be selected in resin base material 3 used in plate 1.
Herein, if there is high-frequency current flowing on copper foil, current distribution concentrates on copper foil surface to the area of skin depth d Domain generates current loss due to conductor resistance at the concentration position.Especially, if electric current is formed with protrusion on surface It is flowed in roughening conductor rather than smooth conductor, then current loss increases.Current loss increase caused by roughening can be with conduction Loss caused by rate reduces increases equivalencing.That is, can be carried out to the quality of high frequency characteristics under roughening state with apparent conductivity Assessment.In the following description, above-mentioned apparent conductivity is known as equivalent conductivity.
In the circuit 5 formed by copper clad laminate 2, since the equivalent conductivity of copper foil 7 reduces, transmission characteristic deterioration. About the reduction of such equivalent conductivity, in addition to surface roughness increases, high frequency influences it also more significantly.For a long time it Before, Hammarsted et al. just uses parameter list presentation surface roughness, and mould has been constructed to the loss increase caused by such roughening conductor Type.
Fig. 2 is the figure of itself and the relationship of equivalent conductivity after indicating to standardize surface roughness with skin depth. For example, the skin depth d of smooth copper foil is about 2.1 μm or so under 1GHz, rms surface roughness (being indicated with Rq) is fully small Under the situation of the numerical value, at for example, 0.4 μm, as shown in dotted line O, on the reduction of equivalent conductivity substantially without influence.It is square When root surface roughness Rq and skin depth d is same grade or is more than skin depth d, the reduction of equivalent conductivity can more Significantly.
On the other hand, it is with first-class by the skin depth d and rms surface roughness Rq of allocation with high frequency Grade or less than rms surface roughness Rq when, will also result in equivalent conductivity reduction.For example, skin depth is about when 1GHz 2.1 μm, and skin depth is about 0.9 μm when 5GHz, skin depth d is about 0.5um when 20GHz, even if such as dotted line O institutes when 1GHz It is shown as the surface roughness without influence substantially, when 5GHz as shown in dotted line P, when 20GHz as shown in dotted line Q, due to high frequency, etc. The reduction for imitating conductivity is also more notable.As described above, for example the roughening of the surface roughness without influence substantially is led when 1GHz In body, due to the high frequency of the frequency of use such as 5GHz or 20GHz, the reduction of equivalent conductivity is more notable, and high frequency can cause The signal line transmission characteristic of copper clad laminate reduces.
The sharp study repeatedly such as inventor, using skin depth d on this protrusion of surface shape that can influence equivalent conductivity Shape is standardized, and investigates the distribution of equivalent conductivity, it is found that there are equivalent conductivity regions jumpy.In addition, collection Skin depth d (μm) can pass through 106× √ (1/ (σ μ π f)) (wherein, σ：Conductivity (S/m), μ：Magnetic conductivity (H/m), f： Frequency (Hz)) it calculates.In copper foil, conductivity σ=5.82 × 107, π × 10 of magnetic permeability μ=4-7.Hereinafter, being directed to shape for lugs It is illustrated with the relationship of equivalent conductivity.
(relationship of shape for lugs and equivalent conductivity)
As shown in figure 3, the height of the protrusion 9 on the copper foil of the present invention is set as h, by the width of the protrusion 9 at h/2 height It is set as w.More specifically, in the copper foil width direction section measured using HR-SEM, (untreated copper is equivalent to from base material 11 The part of foil) with the boundary line of protrusion 9 towards the overhead vertical score of protrusion 9, the length h of the line is set as rising height. In addition, the spout width at 1/2 position of rising height h is set as w.Relative to so defined shape for lugs, calculate equivalent Conductivity.
Hereinafter, being illustrated for computation model.To the copper foil vertical irradiation frequency electromagnetic waves with arbitrary roughening shape Plane wave, its reflection characteristic is observed, it is possible thereby to calculate above-mentioned equivalent conductivity.In addition, in computation model, by protrusion Shape is set as simple cone shape.In addition, numerous same projection occurs periodically on copper foil surface, by copper foil surface It fills up, is calculated with such model.It is considered to may consequently contribute to the surface roughness Rz of transmission characteristic all the time in the mould Rising height h can be regarded as in type.Similarly, the width w at conical projection h/2 height is also assumed that as parameter, is calculated arbitrary The equivalent conductivity of the combination of rising height h and spout width w.
Herein, when material being set as fine copper, unique skin depth d is calculated according to frequency of use.As described above, of the invention Dimensional parameters h, w are defined as to use the standardized sizes of skin depth d.
Fig. 4 is to indicate to standardize each rising height h and spout width w with skin depth, each shape for lugs etc. Imitate the figure of the result of calculation of conductivity.Specifically, Fig. 4 is standardized respectively at horizontally and vertically expression skin depth d H/d and w/d indicates the figure of the result of calculation of equivalent conductivity distribution.In Fig. 4, with from lower left region to right regions It advances, equivalent conductivity continuously decreases.
It can also be derived according to traditional model, equivalent conductivity can change according to the longitudinal axis, that is, h/d.That is, if protrusion Height h is smaller, and equivalent conductivity will not be greatly reduced, and can meet the transmission characteristic as copper foil.All the time, it is known that surface is thick Rugosity is smaller, and transmission characteristic is higher, and to ensure that adhesion designs roughening shape, increasing the height of protrusion makes it be skin depth More than, transmission characteristic can be caused to reduce, therefore, the past is to obtain especially good transmission characteristic, is higher than the protrusion of skin depth Height is that characteristic starts to deteriorate in the regions h/d >=1, and in turn, 2 times of the regions rising height, that is, h/d >=2 are difficult to be used.
On the other hand, equivalent conductivity is sent out for the first time in the research of the present invention the phenomenon that change dramatically due to horizontal axis w/d Existing event.Specifically, when w/d is 1 or less, observe that the improvement of equivalent conductivity makes w/d in turn in nonlinear change When being 0.5 or less, observes and make above-mentioned rising height h improvement identical less than 2 times of skin depths.Especially such as the institutes of h/d >=1 Show, when rising height higher (surface roughness is thicker), the equivalent conductivity improvement which brings is more notable. That is, when to ensure that the adhesion with resin base material 3 needs fully to increase rising height h, above-mentioned improvement is particularly effective.
By the variation with the standardized spout widths of skin depth d, equivalent conductivity this phenomenon base jumpy In principle as described below.
(spout width and current density)
Fig. 5 is shown on copper foil section and flows at this time along paper level direction applying high frequency electric field in analysis of Electromagnetic The concept map of dynamic high-frequency conduction current density.Dotted line is uniform current density line in figure.Fig. 5 (a) is to indicate standardized width The figure of the situation of relatively thick protrusion, Fig. 5 (b) are the figures for indicating the relatively narrow situation of standardized width.In addition, scheming In 5 (a), A points are the smaller point of current density, and B points are the higher point of current density.And, in Fig. 5 (b), E points are electric current again The smaller point of density, F points are the higher point of current density.
In general, with the high frequency of conduction electric current, kelvin effect is further notable, and this phenomenon can be construed to electric current more Concentrate on copper foil surface flowing.Such phenomenon is premised on copper foil is smooth structure, compared with the smooth situation, such as present invention The density situation of the electric current when surface has shape for lugs is very special.Specifically, in Fig. 5 (a), Fig. 5 (b) Confirm：It is difficult to the situation (A points, E points) flowed in the protrusion front end side electric current that can be referred to as more surface side.Fore-end institute Such phenomenon occurred can be understood as conduction electric current and offset, this is characteristic characteristic of the invention.
The occurrence cause of this phenomenon is as described below.Most of current convergence is within the skin depth of copper foil surface, the collection In current segment it is noiseless each other when, as conduct electric current.On the other hand, as shown in the front end of protrusion, skin depth It when part below interferes with each other (coincidence), in interference sections reverse direction current flow, cancels out each other, conduction electric current no longer flows. For example, if the electric current towards extreme direction before protrusion is interfered with each other with the electric current flowed from front end to bottom side, electric current is mutual It offsets, conductive current does not flow, and will not become current loss source.This studies the phenomenon that finding for the first time for the present invention.
Hereinafter, the difference to Fig. 5 (a) and Fig. 5 (b) is illustrated in further detail.Compared to Fig. 5 (a), dash forward in Fig. 5 (b) Rise width it is narrower, the current density in protrusion is relatively small.For example, in the case of Fig. 5 (a), protrusion surface position (D points) compared with Rising height h 1/2 height more to raised front end side deviate, the current density of the protrusion surface position (D points) with link protrusion The current density of the protrusion center of inside point (C points) of bottom is equivalent.That is, the current density on the central portion surface of rising height is higher than The current density of protrusion bottom center.
In contrast, in the case of Fig. 5 (b), 1/2 height of protrusion surface position (I points) compared with rising height h is more to prominent Play bottom side offset, the current density of the protrusion surface position (I points) and the protrusion center of inside point (G points) for linking protrusion bottom Current density it is equivalent.That is, the current density on the central portion surface of rising height is less than the current density of protrusion bottom center. That is, in Fig. 5 (b), there are trend as described below：It tails off in the electric current of protrusion internal flow, in the electricity of protrusion bottom side flowing Rheology is more.In this way, by selection relative to the electric current flowed about in protrusion bottom, reduce inside protrusion (especially relatively prominent Rise height h/2 be more biased towards front end side) flowing this raised structures of the magnitude of current, the current loss caused by protrusion can be reduced.
(design of shape for lugs)
Next, being illustrated to especially preferred shape for lugs in the present invention.Fig. 6 is figure identical with Fig. 4.Fig. 6 Cathetus J is the straight line of h/d=1.As described above, such as h/d<Shown in 1, it can ensure that in the lower region of rising height sufficient etc. Imitate conductivity.Therefore, the present invention especially significant effect at h/d >=1, rising height higher (surface roughness is thicker).This Outside, Fig. 6 cathetus K is the straight line of w/d=-0.1h/d+1.4.As shown in fig. 6, in w/d<The region of -0.1h/d+1.4 is (that is, straight The left area of line K) in, regardless of rising height, it can ensure that perfect condition (equivalent conductivity of smooth state) about 50% or more equivalent conductivity.Herein, straight line K is linear function, equivalent to ensure in h/d is such as 7 regions below Conductivity is at least 50% of perfect condition or more, almost the same with the tangent line of h/d substantially 5~7.In figure 6, special from transmitting Property with adaptation from the perspective of, straight line K, J can be formed by region and are known as ideal range.
In addition, it is especially desirable to when ensuring adhesion, need to increase h, therefore, the copper foil under the signal frequency of 5GHz or so There are also problems for loss.But in the present invention, by w/d<Shape for lugs is designed in the region of -0.1h/d+1.4, to The transmission loss of copper foil can be reduced.In addition, to ensure adhesion, it is generally desirable to which h is 0.4 μm or more.
As described above, all the time, it is known that the smaller copper foil of rising height has no larger problem in terms of transmission loss.Especially It is the chemically combination by using silane coupling agent etc., and low roughening copper foil also can be improved under the smaller situation of rising height Magnitude is sticked together with resin.
On the other hand, the material chemically combined is difficult to for liquid crystal polymer etc., needs to ensure to stick by physical form Put forth effort.Namely, it is possible to will appear the base material situation that must improve rising height.
It is existing that rising height h is made to be the example of 1um or more about conventional liquid crystal polymer copper foil.It is such especially It is necessary to ensure that in the case of adhesion, it is also desirable to reduce copper foil loss.For example, skin depth d is about 0.9um when 5GHz.At this Under situation, if the present invention meets the relationship of h/d >=1, and meet w/d<- 0.1h/d+1.4 then makes copper foil transmission 5GHz's When signal frequency, copper foil loss can be also reduced.
Furthermore, it is assumed that the high frequency of transmission frequency is more than number GHz grades.For example, if to transmit the height more than 10Gbps Speed digital signal then requires the characteristic for reaching 20GHz or so grades or more, if it is millimetre-wave radar, it is required that reaching 80GHz The characteristic of left and right grade.In this way, if it is the submillimeter waves such as 20GHz, 80GHz, the frequency of millimere-wave band, skin depth d meetings Become smaller, therefore h/d can further become larger.Equivalent conductivity can reduce.When therefore, to ensure that adhesion ensures rising height, i.e., Just there is no problem when several GHz, but as the high frequency more than 20GHz or more develops, can lead to transmission loss, it is possible to can not neglect Depending on the presence of the problem.It is wide by designing protrusion even if rising height is skin depth 2 times or more but according to the present invention Degree, makes w/d according to frequency of use<- 0.1h/d+1.4, so as to reduce transmission loss.
On the other hand, if spout width is narrow, it is possible that problem in terms of quality.For example, if spout width Extremely narrow, it is likely that cause to lose powder in processing procedure.Therefore, it is necessary to select to can ensure that the protrusion that will not be lost powder is wide Degree.Specifically, if the w of protrusion be less than 0.1 μm, avoid picking possibility improve, therefore preferably w be 0.1 μm with On, further preferably w is 0.2 μm or more.
Fig. 7 is the figure for indicating the especially significant region of effect in present invention when w is 0.1 μm or more.In Fig. 7 (a), straight line K, J is identical as Fig. 6.When the straight line L of Fig. 7 (a) indicates w=0.1 μm, with the skin depth d of the high-frequency signal relative to 20GHz (about 0.47 μm) standardized w/d (=about 0.2).
Equally, in Fig. 7 (b), straight line K, J are identical as Fig. 6.When the straight line M of Fig. 7 (b) indicates w=0.1 μm, with relative to Skin depth d (about 0.23 μm) standardized w/d (=about 0.4) of the high-frequency signal of 80GHz.
In the present invention, it is generally desirable to h/d >=1 and w >=0.1, and w/d<-0.1h/d+1.4.Therefore, as 20GHz High-frequency signal used in copper foil, including copper foil quality, it may be said that Fig. 7 (a) cathetus K, L, J areas encompassed are Ideal range.In addition, copper foil used in high-frequency signal as 80GHz, including copper foil quality, it may be said that in Fig. 7 (b) Straight line K, L, M area encompassed is ideal range.
In addition, as described above, from from the perspective of adhesion, it is generally desirable to h >=0.4 μm, if it is special to take into account transmission Property, h biggers are preferably made in the range of etch residue is not in problem.
By setting shape for lugs in region shown in Fig. 7, can get excellent with the adaptation of copper foil 7 and resin base material 3 It is different, transmission characteristic also excellent substrate.In addition, if keeping rising height h extremely high, the production of etch residue may result in It is raw.Therefore, it is necessary to make rising height h be the degree that not will produce etch residue.As described above, be contemplated that in quality can by the present invention The range of substantive the rising height h and spout width w of selection, and the transmission characteristic that frequency considers copper foil 7 is used in combination, selection, Design the parameter of shape for lugs.In addition, from from the perspective of reducing etch residue, it is assumed that protrusion is relative to copper-clad surface substantially along vertical Histogram is to elongation.
In addition, for the homogeneity of shape for lugs and height, it is equal not need all protrusions yet without especially uniform by the present invention In the area.For example, in arbitrary section, if being formed as the height for possessing h/d >=1 (further preferably h/d >=2) The mean number being projected in every 5 μm be 1 or more, also, 80% or more of such protrusion meets w >=0.1 μm and w/d<- 0.1h/d+1.4 then can get the effect of the present invention.
It, can be micro- by the interference of light in order to further improve transmission characteristic but in the high-frequency region of 20GHz or more The ratio of the three-dimensional table area that mirror measures and the bivariate table area in roughening treatment face is less than 3 times, to more effectively improve transmission Characteristic.
In addition, spout width and highly usable such as HR-SEM (high resolution scanning electron microscope) are with 3000 times or more Measurement multiplying power (such as 10,000 times) observed, to acquire.And, possess being projected in every 5 μm for the height of h/d >=1 again and put down There is 1 or more, can be acquired by mean number when observing any part more than at minimum 20.Also can lead to It crosses with the method observation spout width other than HR-SEM with height to acquire.
(effect)
Next, being illustrated using the effect of the substrate of above-mentioned copper foil to the present invention.As shown in Figure 1, substrate 1 makes copper foil 7 are bonded with resin base material 3, form copper clad laminate 2, and then process by pattern, form circuit 5.The transmission of known line 5 is damaged Consumption show as the conductor losses of copper foil 7 and the loss of substrate 1 (resin base material 3) dielectric body dB and.Therefore, to ensure substrate 1 Transmission characteristic, do not require nothing more than the characteristic for ensuring copper foil 7, require to ensure the characteristic of resin base material 3 yet.
For example, FR4 is used as conventional general resin base material by most of electronic equipment, but its dielectric loss angle is just It is not fully good to cut tan δ.On the other hand, it is the low damage that 4 or less, tan δ are less than 0.006 that each company, which is provided with dielectric constant, Resin base material is consumed, to ensure that the transmission characteristic of substrate 1, such low-loss resin base material are more suitable.As such low-loss base Material, above-mentioned resin base material can enumerate liquid crystal polymer, fluororesin, polyetherimide, polyether-ether-ketone, polyphenylene oxide, polycyclic alkene, double Any one of maleimide resin, low dielectric coefficient polyimide or their hybrid resin can be enumerated as concrete example MEGTRON6, BT resin etc..
The analysis examples of transmission characteristic when changing Fig. 8 shows the shape for lugs of resin base material and copper foil.Fig. 8 (a) is indicated Using the example for the resin base material that dielectric constant is 3.7, tan δ are 0.01, Fig. 8 (b) indicates that using dielectric constant be 3.7, tan δ For the situation of 0.004 resin base material.In addition, line length is 100mm.Figure center line S is the feelings of h/d=4.3, w/d=1.6 Shape, line T are the situation of h/d=3.2, w/d=1.6, and line R is the situation of h/d=3.2, w/d=0.4.That is, only line R meets w/d <-0.1h/d+1.4。
It is found after being compared to line S, T, R, the loss of line R is smaller.In addition, the improvement for investigating line T to line R with ratio is imitated It is about 10% or so in the example of Fig. 8 (a) when fruit, and is about 20% or so in the example of Fig. 8 (b).That is, with When low-loss resin base material combines, copper foil shape for lugs is larger to improved help.In addition, by using the further high frequency of frequency Change, line length further extend, and the effect obtained by the present invention can further increase.
In addition, as circuit 5, show the example of simple microstrip transmission line, but not limited to this.About circuit 5 Type, three printed line roads and differential line also show same effect.In addition, about pattern, in addition to straight line, be also applied for include The variously-shaped circuit of bending, branch, filter, antenna etc..To sum up, as described above, suitable at least in significant wave It is about the position that high-frequency signal is transmitted in the longer section of 10 times of wavelength or more.
(the preferred frequency applications for being applicable in the present invention)
Frequency applications suitable for implementing the present invention are broadly divided into following purposes：High frequency analog signals transmit purposes and height Speed digital signal transmits purposes.It is transmitted about high frequency analog signals, when being applied to such as electronic radio equipment product, according to its purposes, Workable upper limiting frequency is determined by various countries' electric wave relevant laws and regulations.It is determined according to purposes and the upper limiting frequency transmitted in the line is Substrate it is ensured that frequency.
On the other hand, about the transmission of high-speed digital signal, from from the perspective of signal quality, although it is desirable to for as far as possible High radio-frequency component, but there is also the limit, it should be ensured that high frequency characteristics important document include the important document part determined according to purposes.It is practical Situation is to carry out high frequency guarantee design sometimes, it is ensured that frequency reaches the situation of 3 times of waves or 5 times of waves including frequency fundamental wave.For Realize that the frequency of at least 3 times waves of frequency fundamental wave is considered as in high frequency electrical signal the frequency it is ensured that including by high frequency characteristics, the present invention. In addition, in the high-speed digital signal transmission more than 10Gbps, the high frequency to be also discussed below sometimes guarantee design：According to Digital signal rising edge (10%-90%) the time t (second) being input in the transmission line on substrate, can behave as f=0.35/ The frequency of t.As a result, transmission line in actual use, the present invention is by the frequency of at least 3 times waves of frequency fundamental wave or by rising edge The frequency for the f=0.35/t that time determines be considered as in high frequency electrical signal it is included, it is ensured that frequency.It is presently believed that logical Offer suitable copper foil of characteristic under this quefrency is crossed, to realize good signal transmission.
Specifically, the former is suitable for, millimetre-wave attenuator, the high-frequency applications of millimetre-wave radar and base station etc. are large-scale to be used On the way；The latter is suitable for the high-speed transfer etc. of the signal transmission of work station and the backboard of server.
Embodiment
Hereinafter, being directed to various roughening treatment copper foils, the assessment result of transmission loss and adaptation is illustrated.
<Examples 1 to 5, comparative example 1~3>
The smooth untreated copper foil that preparation surface roughness Rz is 0.5 μm or so, thickness is 18 μm is right as metal base The untreated copper foil is implemented to burn plating, forms roughening particle layer (protrusion).Burning plating refers in acidic copper slot by copper foil It is set as cathode, is electrolysed near limiting current density, to adhere to the micro crowning group of granulated copper.It burns used in plating Solution is as described in Table 1.
Table 1
In table 1, solution A can uniformly be roughened, and solution B is that roughening particle shape is rounded, is thicker, and solution C is thick Change what shape of particle attenuated.It is also desirable to according to roughening height, distinguish and use solution, such as roughening particle height is higher When (frequency is low), to make the rugosity of roughening particle attenuate, solution C should be selected；When roughening particle height relatively low (frequency is high), it is necessary to Ensure that roughening particle has a degree of rugosity, therefore solution B should be selected etc..
Using above-mentioned metal base, burning plating is carried out.The treatment conditions for burning plating are as described in Table 2.
Table 2
In turn, implement capsule on burning the roughening particle layer that plating is formed and plate (capsule plating).Capsule plating is with normal Rule plating copper lamina (so-called " capsule layer ") covers the micro crowning group for the granulated copper that the by of being plated by burning is formed, and makes the granulated copper Micro crowning group is fixed on copper foil surface.The condition of capsule plating is as described below.
80~120g/L of sulfuric acid concentration
Copper sulphate (is calculated) 40~60g-Cu/L by Cu concentration
45~60 DEG C of bath temperature
10~20A/dm after current density value stream rectification2
After implementing above-mentioned capsule plating, Examples 1 to 3, comparative example 1 are again carried out burning plating and capsule plating.
In addition, after implementing above-mentioned capsule plating, with known chromate treating solution (CrO3Concentration is equivalent to 3.0g/L) to copper Implement antirust treatment in foil two sides.
<Section is observed>
It is each to what is made as described above in the width direction using ion grinder (Hitachi Hightech corporation IM4000) Copper foil implements section processing, using HR-SEM (Hitachi Hightech corporation SU8020), with 3kV accelerating potential (secondary electrons Image, low angle backscattering electronics image), 20,000 times of multiplying power carry out section observation, measure copper foil section 5 at arbitrary 20 Roughening particle height and the width in μ m.
In addition, the copper foil of copper clad laminate made of being bonded with resin base material to copper foil carries out pattern processing, circuit is made Substrate can also carry out above-mentioned section observation to the circuit board.Under the situation, the length direction along circuit pattern (circuit) is implemented Section is processed, and the roughening particle measured near the center of circuit pattern (circuit) at arbitrary 20 in 5 μ m of copper foil section is high Degree and width, so that the interface of copper foil and resin base material can be observed.
<Measure surface area ratio>
Using 3 dimension white light interference microscopes (BRUKER Wyko Contour GT-K), three are measured to made copper foil (determination condition is 10 times of measurement multiplying powers, using high resolution CCD video camera, after measurement for dimension table area and bivariate table area ratio Without using rectangular window, it is converted directly into numerical value), "○" will be considered as less than 3, by 3 or more, be considered as " Δ " less than 4.5, it will 4.5 or more are considered as "×".
<Transmission characteristic is assessed>
By hot pressing mode, made copper foil is laminated on resin base material, micro-strip shown in FIG. 1 is made by etching Transmission line is as transmission characteristic assessment signal line.As resin base material, Polyphony Ether resin (ProductName is used：Panasonic's strain Formula commercial firm MEGTRON6：Dielectric constant is 3.7,0.002) dielectric loss angle tangent tan δ are.For the microstrip transmission line, use Network Analyzer measures the transmission loss relative to the up to high-frequency signal of 40GHz.Characteristic impedance is 50 Ω.
Assess transmission characteristic when, by transmission loss be -0.7dB/100mm@5GHz or less, -1.8dB/100mm@15GHz with Under, -4.7dB/100mm@40GHz or less persons be considered as zero, by more than -0.7dB/100mm@5GHz, be more than -1.8dB/100mm@ 15GHz, more than being considered as of -4.7dB/100mm@40GHz ×.In addition, above-mentioned boundary value is according to relative to perfect condition The conductivity of copper (untreated copper), with by roughening treatment, equivalent conductivity reaches the transmission loss of untreated copper under each frequency It the dB of transmission loss when 75% and is calculated.
<Disbonded test>
By hot pressing mode, made copper foil is laminated on resin base material (Panasonic Co. Ltd. system MEGTRON6), Make copper clad laminate.The copper foil section of the copper clad laminate is sheltered with the adhesive tape of 10mm wide, after carrying out copper chloride etching Adhesive tape is removed, the wiring of 10mm wide is made.Using Toyo Seiki manufacturing company tensile testing machine, with 50mm/ minutes Speed along 90 degree of direction stripper circuits wirings, calculate stripping magnitude.About stripping magnitude determinating reference, by 0.5kN/m with On be considered as zero, will be less than 0.5kN/m be considered as ×.The results are shown in Table 3.
Table 3
In section observation, 1~embodiment of embodiment 5, comparative example 1,3 meet h/d >=1 (hereinafter referred to as under any conditions For condition A) every 5 μm of protrusion in averagely exist 1 or more.The rising height of comparative example 2 is relatively low, meets item at any frequency Smaller than averagely 1 in every 5 μm of the protrusion of part A.
In addition, in the protrusion of eligible A, meet w/d<The protrusion of -0.1h/d+1.4 conditions (hereinafter referred to as condition B) Ratio is assessed.Herein, even if as described above, shape for lugs is identical (h and w), d can also become according to use condition (frequency) It is dynamic, therefore, judge above-mentioned condition according to each frequency.
Specifically, embodiment 1, in 5GHz in the protrusion of eligible A, the protrusion of eligible B is 80% or more, But it is less than 80% in 15GHz or more.Equally, embodiment 2,3 is in 15GHz in the protrusion of eligible A, eligible B's Protrusion is 80% or more, but is less than 80% in 30GHz or more.The protrusion of the eligible A under all frequencies of embodiment 4,5 In, the protrusion of eligible B is 80% or more.
In addition, as described above, the rising height of comparative example 2 is relatively low, the protrusion of eligible A is ineligible less than 1 B.Comparative example 1,3 repeats to burn plating and capsule plating is multiple, therefore eligible A, but the w/d of comparative example 1 becomes larger, eligible The protrusion of B is less than 80%.The w/d of comparative example 3 becomes smaller, and the protrusion for meeting w >=0.1 is less than 80%.
About transmission loss assessment as a result, the shape for lugs eligible B at each frequency of 1~embodiment of embodiment 5 Protrusion is 80% or more, and transmission loss is evaluated as zero.In addition, 1~embodiment of embodiment 5 all meets desired stripping magnitude.
On the other hand, the rising height of comparative example 2 is relatively low, and transmission loss is met the requirements, but it is insufficient to remove magnitude.In addition, The rising height of comparative example 1 is abundant, and stripping magnitude is met the requirements, but w/d is not inconsistent standardization, and transmission loss is equal under all frequencies For ×.In addition, the rising height of comparative example 3 is abundant, but w/d is very small, therefore removes magnitude deficiency, or roughening can occur and fall Powder.
As described above, according to the present invention it is possible to ensure the adaptation with resin base material simultaneously and ensure transmission characteristic, and Past is then difficult to take into account the two.It can provide and be particularly suitable for transmission 5GHz or more and then the high-frequency signal of 20GHz or more The copper foil of purposes and the transmission method of high-frequency signal.
More specifically, when will be subject to standardized height with the skin depth d of transmission frequency defined and being set as h/d, lead to Crossing makes height be h/d >=1, it can be ensured that the adaptation with resin base material.In addition, if h is 0.4um or more, then it can be more Effectively ensure the adaptation with resin base material.
Further, since spout width meets w/d<- 0.1h/d+1.4, thus can be relative to protrusion bottom near, reduce prominent Play the magnitude of current that front end flows about.So as to reduce the conductor losses of raised structures.As a result, it is possible to provide frequency of use The good copper foil of transmission characteristic of lower signal line.Especially under the high frequency of 20GHz or more, to ensure that adaptation is required Rising height may be more than skin depth d grades, it is possible to and cause transmission loss to increase, and the present invention is this for solving Adaptation and the situation that transmission characteristic is difficult to take into account are more effective.
In addition, by making spout width be the required i.e. 0.1um or more of minimum limit width in quality, picking can avoid Etc. quality reduce.By making protrusion get higher, adaptation can improve, but easy to produce etch residue, and there are such a exchange passes System, and the present invention is as shown in fig. 6, it can be achieved that the optimal design of each frequency lower process shape including transmission characteristic.
In addition, the copper foil of the present invention is fitted to, dielectric constant is 4 or less, tan δ are 0.006 or less this generally low The resin base material of loss, the ratio for helping to improve characteristic as a result, is more notable, suitable for high frequency low dielectric loss substrate.In addition, For this low-loss of liquid crystal polymer but the base material of chemically adhesion is difficult to ensure, as set forth above, it is possible to make rising height Fully, it is ensured that adhesion takes into account transmission characteristic on this basis.
The copper foil of the present invention is this longer applied to 10 times of wavelength of effective wavelength as defined in transmission frequency or more are possessed The substrate of line pattern, the improvement of transmission characteristic is notable as a result, helps to ensure in higher frequency, larger application In characteristic.
More than, with reference to attached drawing to the present invention specific implementation mode be illustrated, but the present invention technical scope not by Above-mentioned specific implementation mode influences.It is designed in the range of the technological thought that related practitioner can record in detail in the claims each Kind modification or fixed case, such content also belong to the technical scope of the present invention.
Reference sign
1 substrate
2 copper clad laminates
3 resin base materials
5 circuits
7 copper foils
9 protrusions
11 base materials

Claims (9)

1. a kind of copper foil, the copper foil is high frequency electrical signal transmission copper foil, it is characterised in that：
Surface has multiple protrusions,
Skin depth d (μm)=106× √ (1/ (σ μ π f)), wherein σ：Conductivity (S/m), μ：Magnetic conductivity (H/m), f： In above-mentioned high frequency electrical signal when included frequency (Hz),
F >=5GHz,
The height of above-mentioned protrusion is set as h (μm), when the width at the h/2 height and positions of the protrusion is set as w (μm),
The above-mentioned mean number for being projected on every 5 μm of length of h/d >=1 is 1 or more, also,
80% or more above-mentioned protrusion meets w >=0.1 μm and w/d in the above-mentioned protrusion of h/d >=1<-0.1h/d+1.4.
2. a kind of copper foil, the copper foil is high frequency electrical signal transmission copper foil, it is characterised in that：
Surface has multiple protrusions,
Skin depth d (μm)=106× √ (1/ (σ μ π f)), wherein σ：Conductivity (S/m), μ：Magnetic conductivity (H/m), f： In above-mentioned high frequency electrical signal when included frequency (Hz),
F >=5GHz,
The height of above-mentioned protrusion is set as h (μm), when the width at the h/2 height and positions of the protrusion is set as w (μm),
The above-mentioned mean number for being projected on every 5 μm of length of h/d >=2 is 1 or more, also,
80% or more above-mentioned protrusion meets w >=0.1 μm and w/d in the above-mentioned protrusion of h/d >=2<-0.1h/d+1.4.
3. copper foil according to claim 1 or 2, wherein h are 0.4 μm or more.
4. copper foil according to claim 1 or 2, wherein w are 0.2 μm or more.
5. copper foil according to claim 1 or 2, wherein frequency f included in above-mentioned high frequency electrical signal be 20GHz with On.
6. the three-dimensional table area that copper foil according to claim 5, wherein light interfering microscope measure and roughening treatment face Bivariate table area ratio is less than 3 times.
7. a kind of copper clad laminate, it is characterised in that：By copper foil according to claim 1 or 2 and resin base material lamination, patch It closes,
The dielectric constant of above-mentioned resin base material is 4 hereinafter, dielectric loss angle tangent tan δ are 0.006 or less.
8. copper clad laminate according to claim 7, wherein above-mentioned resin base material is by liquid crystal polymer, fluororesin, gathers Any in etherimide, polyether-ether-ketone, polyphenylene oxide, polycyclic alkene, bimaleimide resin, low dielectric coefficient polyimide What person or their hybrid resin were constituted.
9. a kind of substrate, it is characterised in that：With respect to the copper clad laminate described in claim 7, above-mentioned copper foil is carried out Pattern is processed, and circuit is formed,
The length of the wavelength of frequency f defineds relative to high frequency electrical signal, above-mentioned circuit is 10 times of effective wavelength or more.
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