CN106571325A - Guide rail device with controllable inclined angle - Google Patents
Guide rail device with controllable inclined angle Download PDFInfo
- Publication number
- CN106571325A CN106571325A CN201510660347.3A CN201510660347A CN106571325A CN 106571325 A CN106571325 A CN 106571325A CN 201510660347 A CN201510660347 A CN 201510660347A CN 106571325 A CN106571325 A CN 106571325A
- Authority
- CN
- China
- Prior art keywords
- assembly
- sensor
- plate
- guide assembly
- guide rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a guide rail device with a controllable inclined angle, and the device comprises a bottom plate, a motor assembly, a guide rail assembly, a right rotating shaft, a left rotating shaft, a left supporting plate assembly, a sensor frame, a turning sensor, a sensor message sending board, tension springs, and a button box assembly. The number of tension springs is two. The sensor message sending board is a semicircular thin plate with a light-transmitting narrow groove. The button box assembly comprises a zero returning button, a forwarding rotation button, and a reverse rotation button. The motor assembly, the left supporting plate assembly and the button box assembly are disposed on the bottom plate. The right rotating shaft is disposed on a right side plate of the guide rail assembly, and is connected with a bearing hole of the motor assembly and a shaft coupler. The left rotating shaft is disposed on a left side plate of the guide rail assembly, and is connected with a bearing hole of the left supporting plate assembly. The turning sensor is disposed on the left supporting plate assembly through the sensor frame. The sensor message sending board is disposed on an end face of the left rotating shaft, and is located at the center of a notch of the turning sensor. The tension springs are installed at the left and right sides of the rear part of the guide rail assembly, wherein one end of each tension spring is fixed on the guide rail assembly, and the other end of each tension spring is fixed on the bottom plate.
Description
Technical field
The present invention relates to a kind of track-type facilities, more particularly, to a kind of controllable track-type facilities in angle of inclination.
Background technology
In semiconductor packaging industry, it is by many detached crystal grain to glue brilliant purpose（Die）It is placed on lead frame（lead frame）Or substrate（PCB）And use elargol（epoxy）Adhesion is fixed.Lead frame or substrate provide the position of one adhesion of crystal grain（Die pad Die pad）, and it is preset with the extending pin or weld pad of extensible IC die circuits（pad）.And the purpose of bonding wire is with superfine gold thread by the contact on crystal grain（18~50μm）Pin within being connected on lead frame or substrate, during so as to the circuit signal of IC crystal grain being transferred to into extraneous bonding wire, with crystal grain upper contact as the first solder joint, the solder joint on interior pin is the second solder joint.The end points of gold thread is sintered into bead first, then by little ball bond on the first solder joint（Referred to herein as first weldering, first bond）.Then according to the path lashing wire line for designing, finally by gold thread pressure welding on the second solder joint.
The stickup quality of chip and the welding quality of bonding wire have conclusive impact to the electrical characteristic of semiconductor product and the stability of electronic device, therefore, semiconductor packages enterprise suffers from strict control device to the quality of packaging technology.Wherein it is directed to as many as up to tens of items of detection project of welding quality of stickup situation and bonding wire of chip.The optics visual inspection platform of specialty, the surface of chip is amplified by optical microscope, checked in real time with reaching many quality determiners such as the surface quality to chip, the stickup situation of chip, the situation of bonding wire, so as to adjust the parameter of paster, welding equipment operation in time, the problem that quality abnormal is caused in production is excluded.
Detection to chip first takes out the semiconductor lead frame for carrying chip from magazine, it is then placed on the track-type facilities of a specialty, move semiconductor lead frame on track-type facilities again, and successively under an optical microscope detected the chip placement in each region on lead frame by the size of light microscopy field.
Traditional track-type facilities can only realize the left and right of semiconductor lead frame, move in parallel in front and back, in the process track-type facilities are in all the time Realize, facing the optical microscope of chip upper surface cannot examine the side of chip, thus the real stickup situation of chip, bonding wire situation cannot be accurately judged to, when especially tilting occurs on semiconductor lead frame in chip.
The content of the invention
The invention aims to solve the defect of above-mentioned conventional guide rails device, there is provided a kind of controllable track-type facilities in angle of inclination.
The purpose of the present invention can be achieved through the following technical solutions：
The present invention includes：Base plate, motor sub-assembly, guide assembly, right-hand rotation axle, left gyroaxis, left support plate component, sensor frame, tilt sensor, sensor sender plate, extension spring, button case assembly.
Compared with prior art, the present invention has advantages below：
1. the slew gear of motor sub-assembly driving is employed, and guide assembly realizes controllable angle tip tilt, and optical microscope can examine the side of chip, and then be accurately judged to the real stickup situation of chip, bonding wire situation.
2. employ tilt sensor and sensor sender plate, guide assembly can by the maximum angle crawl tip tilt of setting, and can automatic returning horizontal level, optical microscope can be observed the side of guide assembly chip under differing tilt angles.Simultaneously zero compensation can also be accomplished, make up machining and the difference installed.
3. extension spring tension is employed so that guide assembly swag phenomenon will not occur because of the gap of the change of position of centre of gravity and motor sub-assembly drive system.
Description of the drawings
Fig. 1 is the structural representation of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawings 1 and specific embodiment being described in further detail to the present invention：
As seen from Figure 1, the present invention includes：Base plate 1, motor sub-assembly 2, guide assembly 3, right-hand rotation axle 4, left gyroaxis 5, left support plate component 6, sensor frame 7, tilt sensor 8, sensor sender plate 9, extension spring 10, button case assembly 11；Described extension spring 10 is 2；Described sensor sender plate 9 is the thin semicircular plate for being provided with printing opacity narrow slot；Described button case assembly 11 includes the functional keyss such as back to zero, rotating forward, reversion；Motor sub-assembly 2, left support plate component 6 and button case assembly 11 are arranged on base plate 1；Right-hand rotation axle 4 is arranged on the right plate of guide assembly 3 and with the brearing bore and shaft coupling of motor sub-assembly 2 and is connected；Left gyroaxis 5 is arranged on the left plate of guide assembly 3 and with the brearing bore of left support plate component 6 and is connected；Tilt sensor 8 is arranged on left support plate component 6 and through the hole on the left plate of guide assembly 3 by sensor frame 7；Sensor sender plate 9 is arranged on the end face of left gyroaxis 5 and is in the middle of the notch of tilt sensor 8；Extension spring 11 is arranged on the left and right sides below of guide assembly 3, and one end is fixed on guide assembly 3, and the other end is fixed on base plate 1.
Originally it is that the course of work invented is as follows：
1. equipment initialization：The horizontal level offset of input guide assembly 3, maximum tilt angle, upset crawl step pitch, the horizontal level offset of guide assembly 3 is the corner dimension of the position of guide assembly 3 when the horizontal level of guide assembly 3 overlaps with the optical axis of tilt sensor 8 and the printing opacity narrow slot of sensor sender plate 9, and the maximum tilt angle and upset crawl step pitch of guide assembly 3 can be arranged arbitrarily on demand within the specific limits.
2. back to zero：Press the button the back to zero knob on component 11, motor sub-assembly 2 drives guide assembly 3 to invert by right-hand rotation axle 4, the optical axis of tilt sensor 8 and 9 printing opacity narrow slot coincidence rear rail component of sensor sender plate 3 stop reversion, motor sub-assembly 2 drives guide assembly 3 to rotate forward and reaches horizontal level by right-hand rotation axle 4 again, in the process with subsequent detection process in, extension spring 10 is unilateral all the time to tense guide assembly 3, the upset of guide assembly 3 is in fixed side gapless state, ensure that guide assembly 3 swag phenomenon will not occur because of the gap of the change of position of centre of gravity and the drive system of motor sub-assembly 2.
3. start：Semiconductor lead frame is placed on guide assembly 3, under being moved to optical microscope, crawl presses the button the rotating forward button on box 11, motor sub-assembly 2 drives guide assembly 3 to rotate forward by the crawl step pitch stepping of setting by right-hand rotation axle 4, crawl presses the button the reversion button on box 11, motor sub-assembly 2 drives the crawl step pitch stepping reversion of the setting of guide assembly 3 by right-hand rotation axle 4, and the side of chip under differing tilt angles is observed one by one, checks stickup situation, the bonding wire situation of chip.
When guide assembly 3 is horizontal, presses the button the reversion button inactive on box 11 and report to the police, when guide assembly 3 is in maximum tilt angle, presses the button the rotating forward button inactive on box 11 and report to the police.
The rotating forward button that length touches the button on box 11, the rotating forward always of guide assembly 3 is until maximum inclining position；The reversion button that length touches the button on box 11, the reversion always of guide assembly 3 is until horizontal level.
4. the material returned：All after the completion of detection, guide assembly 3 returns to horizontal level to chip on semiconductor lead frame, removes the semiconductor lead frame on guide assembly 3.
5. the step of repeating 3 ~ 4, until the detection of all of semiconductor lead frame is completed.
Claims (1)
1. a kind of controllable track-type facilities in angle of inclination, is characterized in that the device includes：Base plate, motor sub-assembly, guide assembly, right-hand rotation axle, left gyroaxis, left support plate component, sensor frame, tilt sensor, sensor sender plate, extension spring, button case assembly；Described extension spring is 2；Described sensor sender plate is the thin semicircular plate for being provided with printing opacity narrow slot；Described button case assembly includes the functional keyss such as back to zero, rotating forward, reversion；Motor sub-assembly, left support plate component and button case assembly are arranged on base plate；Right-hand rotation axle is arranged on the right plate of guide assembly and with the brearing bore and shaft coupling of motor sub-assembly and is connected；Left gyroaxis is arranged on the left plate of guide assembly and with the brearing bore of left support plate component and is connected；Tilt sensor is arranged on left support plate component and through the hole on guide assembly left plate by sensor frame；Sensor sender plate is arranged on the end face of left gyroaxis and is in the middle of the notch of tilt sensor；Extension spring is arranged on the left and right sides behind guide assembly, and one end is fixed on guide assembly, and the other end is fixed on base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510660347.3A CN106571325A (en) | 2015-10-13 | 2015-10-13 | Guide rail device with controllable inclined angle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510660347.3A CN106571325A (en) | 2015-10-13 | 2015-10-13 | Guide rail device with controllable inclined angle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106571325A true CN106571325A (en) | 2017-04-19 |
Family
ID=58508861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510660347.3A Pending CN106571325A (en) | 2015-10-13 | 2015-10-13 | Guide rail device with controllable inclined angle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106571325A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109768187A (en) * | 2017-12-04 | 2019-05-17 | 常州市知豆信息科技有限公司 | A kind of automated production oled panel manufacturing equipment |
-
2015
- 2015-10-13 CN CN201510660347.3A patent/CN106571325A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109768187A (en) * | 2017-12-04 | 2019-05-17 | 常州市知豆信息科技有限公司 | A kind of automated production oled panel manufacturing equipment |
| CN109768187B (en) * | 2017-12-04 | 2021-06-18 | 深圳市柯达科电子科技有限公司 | Automatic change production and use OLED panel manufacture equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170419 |
|
| WD01 | Invention patent application deemed withdrawn after publication |