CN1065656C - 具有用于阳极和阴极分别再生的反馈通道的湿法处理设备 - Google Patents
具有用于阳极和阴极分别再生的反馈通道的湿法处理设备 Download PDFInfo
- Publication number
- CN1065656C CN1065656C CN95104078A CN95104078A CN1065656C CN 1065656 C CN1065656 C CN 1065656C CN 95104078 A CN95104078 A CN 95104078A CN 95104078 A CN95104078 A CN 95104078A CN 1065656 C CN1065656 C CN 1065656C
- Authority
- CN
- China
- Prior art keywords
- water
- anode
- activated water
- cathode
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/46115—Electrolytic cell with membranes or diaphragms
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/4612—Controlling or monitoring
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/4618—Supplying or removing reactants or electrolyte
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/4618—Supplying or removing reactants or electrolyte
- C02F2201/46185—Recycling the cathodic or anodic feed
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/46—Apparatus for electrochemical processes
- C02F2201/461—Electrolysis apparatus
- C02F2201/46105—Details relating to the electrolytic devices
- C02F2201/4619—Supplying gas to the electrolyte
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/04—Oxidation reduction potential [ORP]
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/06—Controlling or monitoring parameters in water treatment pH
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/42—Liquid level
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2301/00—General aspects of water treatment
- C02F2301/06—Pressure conditions
- C02F2301/066—Overpressure, high pressure
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Water Supply & Treatment (AREA)
- Environmental & Geological Engineering (AREA)
- Hydrology & Water Resources (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6056108A JP2743822B2 (ja) | 1994-03-25 | 1994-03-25 | 電解活性水処理装置 |
JP56110/94 | 1994-03-25 | ||
JP56108/94 | 1994-03-25 | ||
JP56110/1994 | 1994-03-25 | ||
JP6056110A JP2897637B2 (ja) | 1994-03-25 | 1994-03-25 | ウエット処理装置 |
JP56108/1994 | 1994-03-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1113034A CN1113034A (zh) | 1995-12-06 |
CN1065656C true CN1065656C (zh) | 2001-05-09 |
Family
ID=26397038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN95104078A Expired - Fee Related CN1065656C (zh) | 1994-03-25 | 1995-03-25 | 具有用于阳极和阴极分别再生的反馈通道的湿法处理设备 |
Country Status (5)
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10261687A (ja) * | 1997-03-18 | 1998-09-29 | Furontetsuku:Kk | 半導体等製造装置 |
WO1999033496A1 (fr) * | 1997-12-26 | 1999-07-08 | Morinaga Milk Industry Co., Ltd. | Procede de sterilisation d'articles et procede d'emballage d'articles |
JP2000040679A (ja) | 1998-07-24 | 2000-02-08 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JPWO2002101808A1 (ja) * | 2001-06-11 | 2004-09-30 | 株式会社つくばセミテクノロジー | 被処理体の洗浄処理装置と洗浄処理方法 |
JP4753596B2 (ja) * | 2004-05-19 | 2011-08-24 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4462146B2 (ja) * | 2004-09-17 | 2010-05-12 | 栗田工業株式会社 | 硫酸リサイクル型洗浄システムおよび硫酸リサイクル型過硫酸供給装置 |
JP2010205782A (ja) * | 2009-02-27 | 2010-09-16 | Renesas Electronics Corp | 半導体装置の製造方法 |
KR102355875B1 (ko) * | 2017-12-18 | 2022-02-08 | 세키스이가가쿠 고교가부시키가이샤 | 표면 처리 방법 및 장치 |
GB201804881D0 (en) * | 2018-03-27 | 2018-05-09 | Lam Res Ag | Method of producing rinsing liquid |
CN109013589B (zh) * | 2018-07-12 | 2021-07-30 | 芜湖慧宇商贸有限公司 | 一种家庭用水循环处理装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2237818A (en) * | 1989-11-10 | 1991-05-15 | Kolbe & Co Hans | Apparatus for the electrolytic regeneration of etching solutions |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4834850A (en) * | 1987-07-27 | 1989-05-30 | Eltech Systems Corporation | Efficient electrolytic precious metal recovery system |
US4891103A (en) * | 1988-08-23 | 1990-01-02 | Texas Instruments Incorporated | Anadization system with remote voltage sensing and active feedback control capabilities |
ATE127865T1 (de) * | 1988-11-24 | 1995-09-15 | Gerhard Gramm | Vorrichtung zum auf- und/oder abtragen von überzügen bei werkstücken. |
DE69312636T2 (de) * | 1992-11-09 | 1998-02-05 | Canon Kk | Anodisierungsapparat mit einer Trägervorrichtung für das zu behandelnde Substrat |
JP2859081B2 (ja) * | 1993-01-08 | 1999-02-17 | 日本電気株式会社 | ウェット処理方法及び処理装置 |
JPH06240499A (ja) * | 1993-02-12 | 1994-08-30 | Yamaha Corp | メッキ方法及びその装置 |
US5411652A (en) * | 1993-12-15 | 1995-05-02 | Allied-Signal Inc. | Optimum conversion chamber |
-
1995
- 1995-03-22 DE DE69533245T patent/DE69533245D1/de not_active Expired - Lifetime
- 1995-03-24 KR KR1019950006415A patent/KR0174107B1/ko not_active Expired - Fee Related
- 1995-03-24 US US08/409,306 patent/US5549798A/en not_active Expired - Fee Related
- 1995-03-25 CN CN95104078A patent/CN1065656C/zh not_active Expired - Fee Related
- 1995-04-07 TW TW084103299A patent/TW281785B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2237818A (en) * | 1989-11-10 | 1991-05-15 | Kolbe & Co Hans | Apparatus for the electrolytic regeneration of etching solutions |
Also Published As
Publication number | Publication date |
---|---|
DE69533245D1 (de) | 2004-08-19 |
US5549798A (en) | 1996-08-27 |
TW281785B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1996-07-21 |
KR950027973A (ko) | 1995-10-18 |
CN1113034A (zh) | 1995-12-06 |
KR0174107B1 (ko) | 1999-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1065656C (zh) | 具有用于阳极和阴极分别再生的反馈通道的湿法处理设备 | |
US5578193A (en) | Method and apparatus for wet treatment of solid surfaces | |
CN1080454C (zh) | 半导体基片的清洗方法、清洗系统和制造清洗液的方法 | |
CN1512515A (zh) | 放射性物质的化学净化系统和方法 | |
CN1163802A (zh) | 清洁方法及其所用的装置 | |
CN1278959C (zh) | 氮处理方法以及氮处理系统 | |
CN1463253A (zh) | 含氮化合物的水的处理方法和装置 | |
CN1195685C (zh) | 水处理装置 | |
JP2002206200A (ja) | 物体めっき方法およびシステム | |
US9142424B2 (en) | Cleaning system and cleaning method | |
CN101056734A (zh) | 加工液液质控制装置与方法、以及放电加工装置 | |
KR101278231B1 (ko) | 방사성 물질 부착 억제 방법 및 시스템 | |
CN1913956A (zh) | 废气处理方法以及废气处理装置 | |
EP0674026B1 (en) | Electrolytic processing apparatus | |
CN1218770A (zh) | 半导体器件制备中水处理系统的光氧化设备及方法 | |
JPH07263398A (ja) | ウエット処理装置 | |
CN112850857B (zh) | 一种用于处理微电子废水的电芬顿-自氧化装置及方法 | |
JP2581403B2 (ja) | ウェット処理方法及び処理装置 | |
CN1101058C (zh) | 半导体晶片的湿法处理方法及湿法处理装置 | |
CN1929930A (zh) | 循环式气体溶解水供给装置和该装置的运转方法 | |
JP2007059603A (ja) | 硫酸リサイクル型洗浄システム | |
CN1292768A (zh) | 含锰水的处理方法及装置 | |
TWI383957B (zh) | 一種氣液混合之常壓電漿廢水處理裝置 | |
CN1229283C (zh) | 水处理装置 | |
CN1943014A (zh) | 自洁式催化化学蒸镀装置及其清洁方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
FG4A | Grant of patent | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |