CN106556603A - Check device and article manufacturing method - Google Patents
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- CN106556603A CN106556603A CN201610871047.4A CN201610871047A CN106556603A CN 106556603 A CN106556603 A CN 106556603A CN 201610871047 A CN201610871047 A CN 201610871047A CN 106556603 A CN106556603 A CN 106556603A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000005286 illumination Methods 0.000 claims abstract description 62
- 238000003384 imaging method Methods 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims abstract description 38
- 238000007689 inspection Methods 0.000 claims abstract description 21
- 238000012937 correction Methods 0.000 claims description 15
- 230000007547 defect Effects 0.000 description 42
- 239000003344 environmental pollutant Substances 0.000 description 12
- 231100000719 pollutant Toxicity 0.000 description 12
- 238000010586 diagram Methods 0.000 description 7
- 230000002950 deficient Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 230000008033 biological extinction Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 231100000241 scar Toxicity 0.000 description 3
- 238000007790 scraping Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 2
- 230000010415 tropism Effects 0.000 description 2
- 108010022579 ATP dependent 26S protease Proteins 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
- 238000010626 work up procedure Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T5/00—Image enhancement or restoration
- G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T5/00—Image enhancement or restoration
- G06T5/90—Dynamic range modification of images or parts thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8812—Diffuse illumination, e.g. "sky"
- G01N2021/8816—Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8835—Adjustable illumination, e.g. software adjustable screen
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
- G01N2021/8924—Dents; Relief flaws
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10141—Special mode during image acquisition
- G06T2207/10152—Varying illumination
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20212—Image combination
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
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- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
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Abstract
The invention discloses check device and article manufacturing method.Check device for performing the inspection of object includes：Luminaire, the luminaire perform anisotropic illumination and iso illumination for object；Imaging device, the imaging device are imaged to the object illuminated by the luminaire；And processor, the processor performs the process of inspection based on the image obtained by the imaging device.The processor based on multiple first images obtained when luminaire performs multiple anisotropic illuminations respectively by the imaging device and by the imaging device when luminaire performs iso illumination the second image for obtaining generating check image, and based on the check image performing process.
Description
Technical field
The present invention relates to be used to check the check device of object and article manufacturing method.
Background technology
The outward appearance (appearance) of object (for example, object (work)) is checked recently for example using check device based on logical
Cross to the image acquired in illuminated image objects rather than check the conventional inspecting method of object to perform using human eye.With
Illuminator and can be applicable to detection means, (Japanese Patent Publication No.7-294442) proposes a kind of wherein individually controllable
Light source is by with the system of dome (dome) arrangements.
Additionally, (Japanese Patent Publication No.2014-215217) proposes a kind of check device, the check device is by only
On the spot connection is arranged on the multiple light sources around object to obtain multiple images, and based on by synthesizing the plurality of image institute
The check image of acquisition is checking object.
Illuminator disclosed in Japanese Patent Publication No.7-294442 can obtain the image under various lighting conditions,
But as it needs to spend more process time to obtain and process substantial amounts of image, so it is being checked required for object
Time on be probably it is unfavorable.
Check device disclosed in Japanese Patent Publication No.2014-215217 illuminates object to obtain from multiple azimuths
Multiple images, generate check image based on the maximum or minima of the pixel value for each pixel number, and are directed to
The damage inspection check image.However, in the check device, because the difference of illumination orientations is not in the signal with regard to defect
Clearly, thus such as inhomogeneities (unevenness) and light absorptive pollutant (contaminant) (foreign body) (which is not wire
Damage (linear flaw) or defect (scraping)) defect be likely difficult to detection.
The content of the invention
The present invention provides for example favourable on various defects are checked check device.
The aspect of the present invention is performed for the check device of the inspection of object, and described device includes：Luminaire, the photograph
Bright equipment is configured to for object performs the illumination of anisotropy (anisotropic) and waits the illumination of tropism (isotropic)；
Imaging device, the imaging device are configured to be imaged the object illuminated by the luminaire；And processor, at this
The process that reason device is configured to based on the image obtained by the imaging device perform inspection, wherein, the processor is matched somebody with somebody
It is set to based on multiple first images obtained when luminaire performs multiple anisotropic illuminations respectively by the imaging device
Check image is generated with the second image obtained when luminaire performs iso illumination by the imaging device, and
Process is performed based on the check image.
From the description of the exemplary embodiment below with reference to accompanying drawing, further characteristic of the invention will be clear from.
Description of the drawings
Fig. 1 illustrates the exemplary configuration of check device.
Fig. 2A and 2B illustrate the exemplary configuration of luminaire.
Fig. 3 illustrates the handling process of inspection.
Fig. 4 illustrates illumination and the handling process being imaged.
Fig. 5 A to 5H illustrate the lighting condition of luminaire.
Fig. 6 A to 6H are to illustrate the schematic diagram with regard to having the image that defective object is obtained for each lighting condition.
Fig. 7 A and 7B are the schematic diagrams for illustrating intermediate image.
Fig. 8 is the schematic diagram for illustrating check image.
Specific embodiment
Hereinafter, embodiments of the invention have been described with reference to the drawings.In the accompanying drawings, (unless stated otherwise) is general by identical
Reference represents identical component and eliminates its repetitive description.
First embodiment
Fig. 1 illustrates the exemplary configuration of check device 10.The check device 10 is checked as object (object to be checked)
Object 11 outward appearance.However, object to be checked is not limited to the outward appearance of object 11, and can be the thing being invisible to human eyes
The characteristic (for example, surface roughness) of body.Here, check device 10 can be checked and be transmitted by the conveyer 12 as delivery unit
Object 11.Object 11 can for example be used for metal parts, resin component of industrial products etc..On the surface of object 11
On, it is understood that there may be defect, such as wire damage (scraping), inhomogeneities (for example, on surface depending on surface roughness, into
Point, the two-dimentional inhomogeneities of the reflective character of film thickness etc., non-linear shape or iso damage, indenture etc.) and extinction
Contact scar thing (foreign body).Check device 10 checks this defect and processes object 11 and (object 11 is categorized as zero defect thing for example,
Body or defective object).Can be replaced by robot, manual operation etc. as the conveyer 12 of delivery unit.
Check device 10 can include luminaire 101, imaging device 102, processor 103 (which can be made up of PC),
Control unit 104, display unit 105, input block (not shown) etc..Control unit 104 is based on for example advance by processor 103
The light illumination mode (pattern) of setting and imaging pattern control luminaire 101 and imaging device 102 is synchronized with each other.In illumination
Opening 110 is formed at the top of equipment 101 so that object 11 can be imaged by imaging device 102.Imaging device 102 is by taking a picture
Body, for constituting to the optical system etc. of the imaging of object 11 on the image pick up equipment in camera body, and by into
As the image for obtaining is passed (transmit) processor 103.The processor 103 is not necessarily universal PC, and can be special equipment.
Processor 103 and control unit 104 can be formed integrally as each other.Processor 103 is based on the image transmitted from imaging device 102
(that is, data) carry out the process (for example, detecting the defect on the surface (that is, outward appearance) of object 11) of the inspection for object 11.
Processor 103 can be based on the admissible condition (tolerable of the pixel value relative to the check image being described later on
Condition) processed.Display unit 105 is shown from the transmission of processor 103 including image and the information of inspection result.
Input block is made up of such as keyboard and mouse, and input information by user input etc. is transferred to processor 103.
Fig. 2A and 2B illustrate the exemplary configuration of luminaire 101.Fig. 2A is the sectional view of luminaire 101, and is schemed
2B is the perspective view of luminaire 101 seen from above.Luminaire 101 include 20 light emission parts altogether or light source (with
Under, " LED ") 111.Light emission part is not limited to LED, and can be other light sources, such as fluorescent lamp and mercury-arc lamp etc.Can lead to
Cross and multiple shell moulds (shell type) or surface mounting LED element are arranged on planar substrates to configure LED 111, the configuration
And it is nonrestrictive.Alternately, for example, LED element can be disposed on flexible board.The configuration can be conducive in dome
Increase light-emitting area in the luminaire 101 of shape.LED 111 can pass through 104 independently controlled light quantity of control unit and light
Transmitting timing.LED 111 is arranged on the three different elevation angle (elevation) places.LED 111a are in lighting at low elevation angles
Part 11, LED 111b illuminating articles 11 at the middle elevation angle, and the LED 111c illuminating article 11 at the high elevation angle.Along illumination
The circumferencial direction of equipment 101, there is provided eight LED 111a, eight LED 111b and four LED 111c.By sequentially
(sequentially) connect predetermined LED 111 and imaging device 102 and the connection of LED 111 is synchronously carried out into
Picture, can obtain image while illuminating article 11 under various lighting conditions (that is, the elevation angle, azimuth).The quantity and cloth of LED
Put and be not limited to those described above.Only need LED to be arranged on luminaire 101 with required quantity and arrangement, institute
The quantity and arrangement of needs depends on the type of object to be checked, type of characteristic (defect) of object to be checked etc..
Fig. 3 illustrates the handling process of the inspection of check device 10.In figure 3, object 11 is illuminated first and is imaged (step
S101).With reference to Fig. 4, Fig. 5 A to 5H, and Fig. 6 A to 6H describe in detail step S101 process.Fig. 4 illustrates what is illuminated and be imaged
Handling process.In the diagram, anisotropic illumination is sequentially carried out primarily with respect to multiple orientation and be imaged (step S201).Herein, art
Language " anisotropy " is used with regard to " elevation angle " but with regard to " orientation ".Specifically, luminaire 101 and imaging device 102
Control via control unit 104 so that be arranged on each azimuth and sequentially connected with the LED 111 at the elevation angle, and pass through
Imaging device 102 is synchronously imaged to object 11 with the connection of LED 111 in a predefined manner.
Fig. 5 A to 5H illustrate the lighting condition of luminaire 101.With the LED of filled black in illuminating state, and with
The LED of white filling is not at illuminating state.Fig. 5 A to 5D illustrate the light illumination mode in step S201.With regard to being arranged on minimum facing upward
LED 111a at angle, two LED for facing each other are simultaneously switched on sequentially from four different orientation (angle) illuminating articles
11.Thus obtain total of four image.The azimuth of illumination is 0 ° in fig. 5, is 45 ° in figure 5b, is 90 ° in figure 5 c,
And it is 135 ° in figure 5d.Although two opposed facing LED being arranged at minimum elevations here are simultaneously switched on,
This configuration is simultaneously nonrestrictive, and is adjacent to the LED of these LED and further can be simultaneously switched on.By this way, close
Anisotropic illumination and imaging are carried out sequentially in multiple orientation.
Fig. 6 A to 6H are to illustrate the schematic diagram with regard to having image of the defective object acquired in each lighting condition.
The image obtained under the lighting condition of Fig. 5 A to 5H corresponds respectively to Fig. 6 A to 6H.Fig. 6 A to 6H illustrate that wherein wire is damaged
(scraping), inhomogeneities or light absorptive pollutant (foreign body) be present on the surface of object 11 as defect in the case of figure
Picture.If wire is damaged be present in object 11, as shown in Fig. 6 A to 6D, then outward appearance (that is, the contrast) basis of damage
Illumination orientations (angle) and change.If wire is damaged by orientation (azimuth basically in parallel：0 °) illumination, then damage
Wound is not clearly visualized (visualize) on image.If wire is damaged by from perpendicular orientation (azimuth：
90 °) illumination, then damage is clearly visualized on image.This is because, the cross sectional shape that wire is damaged is according to orientation
It is dramatically different, and when wire is damaged and illuminated from perpendicular orientation, from the larger amount of reflected light damaged or scattered
Penetrate light and advance (proceed) to imaging device 102.In the case of inhomogeneities or light absorptive pollutant, damage different from wire
Wound, the shape in section distinguish less big according to orientation.Therefore, as shown in Fig. 6 A to 6D, the outward appearance of the defect on image
(that is, contrast) changes less big according to illumination orientations.
Next, sequentially carrying out iso illumination with regard to multiple elevations angle and being imaged (step S202).Herein, it is such as " incorgruous
Property " in like that, term " etc. tropism " is used with regard to " elevation angle " but with regard to " orientation ".Specifically, 101 He of luminaire
Imaging device 102 is controlled via control unit 104 so that is arranged on the LED 111 at multiple elevations angle and is sequentially connected, and leads to
The connection that imaging device 102 is crossed with LED 111 is synchronously imaged to object 11.Fig. 5 E to 5G illustrate the illumination mould in step S202
Formula.With regard to LED 111a, LED 111b and LED 111c, the LED at the identical elevation angle is simultaneously switched on, and object 11 is sequentially at three
It is illuminated at the different elevations angle, and obtain total of three image.With regard to the elevation angle for illuminating, Fig. 5 E illustrate that low angle, Fig. 5 F show
Go out intermediate angle, and Fig. 5 G illustrate high angle.The amount for proceeding to the reflected light or scattered light of imaging device 102 depends on object
11 surface can scattering, and with illumination the elevation angle change.Therefore, LED 111a, LED 111b and LED 111c can
To be arranged to mutually different light value so that the pixel value of optimized image can be acquired.
The image obtained under the lighting condition of Fig. 5 E to 5G corresponds respectively to Fig. 6 E to 6G.If object 11 has wire
Damage, as shown in Fig. 6 E to 6G, then the outward appearance (that is, feature) of damage changes according to the elevation angle of illumination.If damaged
It is illuminated at low angle, then damage is visualized as brighter (bright) than background level (level) on image.If
Damage illuminated at high angle, then damage is visualized as (dark) dimer than background level on image.However, such as
Fruit damages illuminated at intermediate angle, then damage is not clearly visualized.Compared with the surface of zero defect part, formed
The surface of the object 11 of damage inclines.Therefore, in low angle illumination, bigger than the amount of the scattered light from zero defect part comes
Imaging device 102 is proceeded to from the scattered light damaged.It is in high angle illumination, less than the amount of the scattered light from zero defect part
From damage scattered light proceed to imaging device 102.In the case of as damaged in wire, the inhomogeneities on image
Outward appearance with illumination the elevation angle change.Damage different from wire or inhomogeneities, when being illuminated from any elevation angle, light absorptive
(that is, light absorption) pollutant (foreign body) absorbing light.Therefore, light absorptive pollutant are visualized as dimness on image, and
And its outward appearance changes less big according to the elevation angle.
Next, carry out iso illumination with regard to whole elevations angle and be imaged (S203) simultaneously.Fig. 5 H illustrate step S203
In light illumination mode.Image is obtained in the case where whole LED are simultaneously switched on.The light quantity of each LED can be with identical or not
Together.Connect need not whole LED, or the LED that relatively small number need not be connected.The figure obtained under the lighting condition of Fig. 5 H
As corresponding to Fig. 6 H.In due to illuminating in low angle and high angle illumination in, wire damage and inhomogeneities lightness and
Dim degree conversely, so when low angle illumination is carried out and high angle is illuminated simultaneously, wire damage and both inhomogeneities not by
Fully visualize.Due to the light absorptive pollutant absorbing light when being illuminated from any elevation angle, even if so whole LED is by simultaneously
Connect light absorptive pollutant and be also visualized as dimness.
Fig. 3 is returned to, in step s 102, processor 103 pairs carries out shade by the image that imaging device 102 is obtained
(shading) correction and gray scale (gradation) are corrected.Shadow correction causes pixel value widely uniform (uniform), and
The even level of pixel value is set to predetermined value by gray correction.Therefore, image becomes suitable for the inspection being described later in generation
The image of image.As shown in Fig. 6 E to 6G, can be with by the uniformity (uniformity) and level that are imaged the image for obtaining
Changed according to the elevation angle of illumination.The uniformity and level are corrected by shadow correction and gray correction.
The feelings by the result that fitting of a polynomial is obtained ahead of time in reference picture can be divided by original image
Shadow correction is carried out under condition.It is possible to further be divided by the meansigma methodss being obtained ahead of time with regard to multiple images in original image
In the case of carry out shadow correction, the plurality of image is by each in multiple zero defect objects 11 (zero defect object)
What individual imaging was obtained.Gray correction can be carried out so that with the predetermined portions in original image (for example, corresponding to object 11
Part) related pixel value (representative value (for example, meansigma methodss)) is changed into predetermined value.
Next, processor 103 generates intermediate image (step from the multiple images obtained by shadow correction and gray correction
Rapid S103).Fig. 7 A and 7B are the schematic diagrams for illustrating intermediate image.Fig. 7 A are via shadow correction and gray scale school by processor 103
The intermediate image for just generating from four images of Fig. 6 A to 6D.By obtaining with regard to each pixel (pixel number or pixel ID)
The difference between max pixel value and minimum pixel value in the pixel groups (4 pixels) related to four images is generating centre
Image.Pixel value in the area free from defect of object 11 changes less big according to illumination orientations.As shown in Fig. 6 A to 6D, line
Pixel value in the region that shape is damaged is significantly changed according to illumination orientations.Therefore, as shown in Figure 7A, damage in intermediate image
It is visualized as bright.Reduce centre by obtaining the difference between max pixel value and minimum pixel value in four images
The noise of image.Damage with regard to the wire that its outward appearance is significantly changed according to illumination orientations, intermediate image is with than four images
S/N than improve S/N ratios.
As shown in Fig. 6 A to 6D, the outward appearance (that is, pixel value) of inhomogeneities or light absorptive pollutant on image such as exists
Change less big according to the azimuth of illumination like that in area free from defect.Therefore, inhomogeneities and light absorptive pollutant are in figure
Clearly do not visualized in the intermediate image of 7A.
Can simply use between max pixel value or minimum pixel value rather than max pixel value and minimum pixel value
Difference generating intermediate image.If defect is visualized as bright, then max pixel value can be used, and if lacked
Fall into and be visualized as dimness, then minimum pixel value can be used.If defect is visualized as this of bright or dimness
Both, then are preferably using the difference between max pixel value and minimum pixel value.
Next, Fig. 7 B are three images by processor 103 based on Fig. 6 E to 6G via shadow correction and gray correction
The intermediate image of generation.By obtaining the pixel related to three images with regard to each pixel (pixel number or pixel ID)
The difference between max pixel value and minimum pixel value in group (3 pixels) is generating intermediate image.The nondefective zone of object 11
Pixel value in domain changes less big according to the elevation angle of illumination.As shown in Fig. 6 E to 6G, wire is damaged and inhomogeneities have
The elevation angle of with good grounds illumination and the pixel value that significantly changes.Therefore, as shown in fig.7b, wire is damaged and inhomogeneities are in centre
It is visualized as in image bright.
As shown in Fig. 6 E to 6G, the outward appearance (pixel value) of the light absorptive pollutant on image with phase in area free from defect
Same mode changes less big according to the elevation angle of illumination.Therefore, light absorptive pollutant are not clear in the intermediate image of Fig. 7 B
Visualize clearly.
Can simply use between max pixel value or minimum pixel value rather than max pixel value and minimum pixel value
Difference generating intermediate image.Can based on the image illuminated in high angle and low angle illumination image rather than with
Three images at three upper described elevations angle are generating intermediate image.Illuminate in due to illuminating in high angle and in low angle
Middle lightness and dimness degree are conversely, so wire is damaged and inhomogeneities are based between max pixel value and minimum pixel value
Visualized with high contrast in the intermediate image that difference is generated.
Next, processor 103 generates check image (step S104).Two intermediate images illustrated in Fig. 7 A and 7B with
And the image illustrated in Fig. 6 H (is imaged obtained image (" all in the case of by being simultaneously switched in whole LED 111
The image that light source is switched on ")) it is used for generating check image.Processor 103 is by obtaining with regard to each pixel (pixel number
Or pixel ID) the pixel groups related to these three images (3 pixels) in max pixel value and minimum pixel value between
Differ to generate check image.Fig. 8 is the schematic diagram for illustrating check image.
The image that the outward appearance (pixel value) of the area free from defect of object 11 is switched in two intermediate images and whole light sources
Any one in change less big.As shown in fig. 7 a or fig. 7b, wire is damaged and is visualized as in two intermediate images
Bright, and as shown in fig. 6h, clearly do not visualized in the image that whole light sources are switched on.Therefore, as in Fig. 8
It is shown, wire damage be visualized as in the check image generated using these three images it is bright (that is, with relatively large
Pixel value).
Be visualized as in the intermediate image that inhomogeneities are illustrated in figure 7b it is bright, and in the intermediate image of Fig. 7 A
In and clearly do not visualized in the image that is switched on of whole light sources of Fig. 6 H.Therefore, as shown in Figure 8, inhomogeneities
It is visualized as bright (that is, with relatively large pixel value).
Dimness is visualized as in the image that the whole light sources that light absorptive pollutant are illustrated in Fig. 6 H are switched on, and
Clearly do not visualized in two intermediate images illustrated in Fig. 7 A and 7B.Therefore, as shown in Figure 8, extinction contact scar
Thing is visualized as bright (that is, with relatively large pixel value).
In the check image generated based on three images described above, such as wire damage, inhomogeneities and extinction
The various defects of contact scar thing etc are visualized (that is, with relatively large pixel value).
Can simply use max pixel value or minimum pixel value rather than with regard to each pixel three images most
Big difference between pixel value and minimum pixel value is generating check image.If defect is visualized as bright, then can be with
Using max pixel value, and if defect is visualized as dimness, then minimum pixel value can be used.If defect quilt
Be visualized as bright or dimness both, then preferably using the difference between max pixel value and minimum pixel value.
Next, processor 103 carries out defects detection (that is, defect determines) based on check image to the outward appearance of object 11
(step S105).As various defects clearly can be visualized (i.e., it is possible to have relatively large pixel in check image
Value), so for example by binaryzation (binarization) process, various defects are detectable.Due to as defects detection
The quantity of check image of target be one, so it is possible to check at a high speed.
Defects detection (that is, defect determines) can arrange suitable by the result relative to binaryzation described above
Determine standard (for example, threshold value) to carry out, or by learning multiple check images and from its eigenvalue calculation fraction carrying out.
If user is each the defective/zero defect of setting in various defects determines that standard needs considerable time and technical ability,
It is desirable so to be calculated based on the automatic fraction of study described above.
The generation of check image is not limited to using three images described above.For example, wherein wire damage be not
In the object generated as defect, can be switched on based on the whole light sources illustrated in the intermediate image and Fig. 6 H illustrated in Fig. 7 B
Two images of image generate check images.
Further, the image for replacing whole light sources to be switched on, for example, can use the image at only intermediate angle illumination.
That is, inspection can be generated based on the image of the iso illumination acquisition by imaging device 102 by particular elevation
Look into image.Further, it is, for example possible to use based on the image illuminated in high angle, intermediate angle illumination image and
Low angle illumination image and or meansigma methodss image.The situation on the review time be it is favourable must because not having
Imaging device 102 is passed through and is obtained the image that whole light sources are switched on.
Further, do not have defective zero defect image to be added to for generating multiple figures of check image
Picture.In the image that the whole light sources of Fig. 6 H are switched on, wire is damaged and inhomogeneities in some cases can be by with a certain
The contrast visualization of degree.In this case, the contrast of damage may become not enough in check image.Even if this
In the case of, wire damage or the inspection figure of inhomogeneities of relatively high contrast can be obtained by adding zero defect image
Picture.If the reflective character on the surface of zero defect object is uniform, then can use and possess constant pixel value with having
Region the related artificial image of zero defect object, rather than the zero defect image of reality.
As described above, according to this embodiment, it can provide the check device for for example facilitating work-up various defects.
The embodiment related to article manufacturing method
The check device of embodiment as described above can be used in article manufacturing method.The article manufacturing method
The step of the step of checking object using check device can be included and checked object is processed in checking process.The process
Can include it is for example following at least any one：Measure, process, cutting, transmitting, setting up (assembling), inspection and classification.Root
According to the present embodiment manufacture article method in the following at least one in compared with related art method be favourable：
The performance of article, quality, productivity ratio and production cost.
While the invention has been described with reference to exemplary embodiments thereof, it is to be understood that, it is public that the present invention is not limited to institute
The exemplary embodiment opened.The scope of appended claims will be endowed most wide explanation, to include all such modifications
And the 26S Proteasome Structure and Function of equivalent.
Claims (13)
1. a kind of check device for performing the inspection of object, it is characterised in that described device includes：
Luminaire, the luminaire are configured to perform anisotropic illumination and iso illumination for object；
Imaging device, the imaging device are configured to be imaged the object illuminated by the luminaire；And
Processor, the process that the processor is configured to based on the image obtained by the imaging device perform inspection,
Wherein, the processor is configured to respectively perform multiple anisotropic photographs in luminaire based on by the imaging device
Multiple first images obtained when bright and obtained when luminaire performs iso illumination by the imaging device second
Image generating check image, and based on the check image performing process.
2. device according to claim 1, wherein, the processor is configured to for being obtained by the imaging device
Image performs shadow correction and gray correction.
3. device according to claim 1, wherein, the processor is configured to distinguish Jing based on by the imaging device
Middle graph is generated by the plurality of first image of the plurality of anisotropic illumination acquisition from corresponding multiple orientation
Picture, and based on the intermediate image generating check image.
4. device according to claim 1, wherein, the processor is configured to distinguish Jing based on by the imaging device
Intermediate image is generated by the multiple iso multiple images for illuminating acquisition at corresponding multiple elevations angle, and based on described
Intermediate image is generating check image.
5. device according to claim 1, wherein, the processor be configured to based on by the imaging device via spy
The image that iso illumination at fixed angle of altitude is obtained is generating check image.
6. device according to claim 5, wherein, the processor be configured to based on by the imaging device via complete
The image that iso illumination at multiple elevations angle in portion is obtained is generating check image.
7. device according to claim 1, wherein, the processor is configured to based on for the picture of the check image
The admissible condition of plain value is performing process.
8. device according to claim 7, wherein, the processor is configured to be based further on each of which pixel value full
The image of the foot admissible condition is generating check image.
9. device according to claim 3, wherein, the processor be configured to based on relative in multiple images each other
At least one of max pixel value and minimum pixel value of corresponding every group of pixel, from described many including the intermediate image
Individual image is generating check image.
10. device according to claim 4, wherein, the processor be configured to based on relative in multiple images that
At least one of max pixel value and minimum pixel value of this corresponding every group of pixel, from including described in the intermediate image
Multiple images are generating check image.
A kind of 11. methods of manufacture article, it is characterised in that methods described comprises the following steps：
The inspection of object is performed using check device；With
Process executed its check the object to manufacture article,
Wherein, the check device includes：
Luminaire, the luminaire are configured to perform anisotropic illumination and iso illumination for object；
Imaging device, the imaging device are configured to be imaged the object illuminated by the luminaire；And
Processor, the process that the processor is configured to based on the image obtained by the imaging device perform inspection,
Wherein, the processor is configured to respectively perform multiple anisotropic photographs in luminaire based on by the imaging device
Multiple first images obtained when bright and obtained when luminaire performs iso illumination by the imaging device second
Image generating check image, and based on the check image performing process.
12. a kind of check devices for performing the inspection of object, it is characterised in that described device includes：
Luminaire, the luminaire are configured to perform from the illumination for limiting orientation and from non-limiting orientation for object
Illumination, the bearing range of the bearing range in the non-limiting orientation more than the restriction orientation；
Imaging device, the imaging device are configured to be imaged the object illuminated by the luminaire；And
Processor, the process that the processor is configured to based on the image obtained by the imaging device perform inspection,
Wherein, the processor is configured to based on being performed each from the side of restriction respectively in luminaire by the imaging device
Multiple first images for obtaining and performed from non-limiting orientation in luminaire by the imaging device during multiple illuminations of position
Illumination when the second image for obtaining performing process.
A kind of 13. methods of manufacture article, it is characterised in that methods described comprises the following steps：
The inspection of object is performed using check device；With
Process executed its check the object to manufacture article,
Wherein, the check device includes：
Luminaire, the luminaire are configured to perform from the illumination for limiting orientation and from non-limiting orientation for object
Illumination, the bearing range of the bearing range in the non-limiting orientation more than the restriction orientation；
Imaging device, the imaging device are configured to be imaged the object illuminated by the luminaire；And
Processor, the process that the processor is configured to based on the image obtained by the imaging device perform inspection,
Wherein, the processor is configured to based on being performed each from the side of restriction respectively in luminaire by the imaging device
Multiple first images for obtaining and performed from non-limiting orientation in luminaire by the imaging device during multiple illuminations of position
Illumination when the second image for obtaining performing process.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-194024 | 2015-09-30 | ||
| JP2015194024A JP2017067633A (en) | 2015-09-30 | 2015-09-30 | Checkup apparatus, and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
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| CN106556603A true CN106556603A (en) | 2017-04-05 |
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ID=58407025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610871047.4A Pending CN106556603A (en) | 2015-09-30 | 2016-09-30 | Check device and article manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20170089841A1 (en) |
| JP (1) | JP2017067633A (en) |
| CN (1) | CN106556603A (en) |
| TW (1) | TWI626438B (en) |
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| CN113194223A (en) * | 2021-03-18 | 2021-07-30 | 优尼特克斯公司 | Combined imaging method |
| CN117347383A (en) * | 2023-12-06 | 2024-01-05 | 中材新材料装备科技(天津)有限公司 | System and method for detecting and automatically repairing surface defects of calcium silicate plate |
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Also Published As
| Publication number | Publication date |
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| JP2017067633A (en) | 2017-04-06 |
| TW201712324A (en) | 2017-04-01 |
| US20170089841A1 (en) | 2017-03-30 |
| TWI626438B (en) | 2018-06-11 |
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