CN106550546B - Low-copper-consumption printed circuit board forming method - Google Patents
Low-copper-consumption printed circuit board forming method Download PDFInfo
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- CN106550546B CN106550546B CN201610960391.0A CN201610960391A CN106550546B CN 106550546 B CN106550546 B CN 106550546B CN 201610960391 A CN201610960391 A CN 201610960391A CN 106550546 B CN106550546 B CN 106550546B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a low-copper-consumption printed circuit board forming method, and creatively provides a baffle plate with an electric field shielding function, wherein in an area without an electrified through hole, an electric field can drive copper ions to penetrate through and attach to the surface of a copper-clad plate; while in the areas without the electrical through-holes the copper ions are blocked. The diameter of the electricity transmission hole is gradually increased from the center to the edge of the shielding baffle along the radial direction of the shielding baffle, so that the concentration of copper ions passing through a central area with a strong electric field is not more than that of an edge area with a weak electric field, the copper plating thickness of the surface of the copper-clad plate is uniform, and the phenomenon that the copper consumption is increased due to the fact that the copper layer in the central area is too thick is avoided.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a low-copper-consumption printed circuit board forming method.
Background
The conventional process flow of the printed circuit board is as follows: cutting the copper foil → mechanical drilling → black hole → dry film pressing → exposure → development → hole copper plating → dry film removing → chemical research → dry film pressing again → re-exposure → re-development → circuit etching → re-dry film removing. In order to avoid circuit defects (including open circuits, short circuits, circuit defects and residual copper), a thick copper layer needs to be formed on a substrate before production of the conventional circuit board, and the copper layer needs to be etched in subsequent processes, so that a large amount of copper raw materials are consumed. Especially, in the electroplating process, the copper layer in the center of the copper-clad plate is far thicker than the copper layer at the edge due to uneven distribution of electric field lines in the electroplating tank, and in order to ensure that the copper layer at the edge has enough thickness, the copper-clad plate needs to be continuously electroplated, so that unnecessary and excessive copper materials are plated in the center area, and the copper consumption is increased. In the prior art, an insulating baffle is often added in the center of a copper-clad plate to prevent excessive copper ions from migrating to a central area, but the baffle easily causes insufficient copper thickness in the central area.
Disclosure of Invention
In view of the above, the present invention provides a forming method capable of reducing copper loss.
The purpose of the invention is realized by the following technical scheme: a low-copper-consumption printed circuit board forming method comprises the following steps:
pressing a copper foil on a substrate, mechanically drilling a first through hole, black holes, chemically grinding, pressing a dry film for the first time, exposing for the first time, developing for the first time, electroplating a pattern, pressing a dry film for the second time, exposing for the second time, developing for the second time, etching a circuit, and removing the dry film; the pattern electroplating is to contact the copper-clad plate with electroplating solution, plate a copper layer between the first through hole which is not covered by the dry film and the circuit pattern thereof, and plate no copper layer on the surface of the circuit pattern which is covered by the dry film; the circuit etching is to contact the copper-clad plate with etching solution and etch a circuit pattern on the surface of the copper-clad plate; when the pattern is electroplated, a shielding baffle plate capable of shielding an electric field is covered above the copper surface of the copper-clad plate; the shielding baffle is provided with through electric holes which are radially distributed; the diameter of the through hole is gradually increased from the center to the edge of the shielding baffle along the radial direction of the shielding baffle.
The invention creatively provides a baffle with the function of shielding an electric field, wherein in an area without an electrified through hole, the electric field can drive copper ions to pass through and be attached to the surface of a copper-clad plate; while in the areas without the electrical through-holes the copper ions are blocked. The diameter of the electricity transmission hole is gradually increased from the center to the edge of the shielding baffle along the radial direction of the shielding baffle, so that the concentration of copper ions passing through a central area with a strong electric field is not more than that of an edge area with a weak electric field, the copper plating thickness of the surface of the copper-clad plate is uniform, and the phenomenon that the copper consumption is increased due to the fact that the copper layer in the central area is too thick is avoided. The copper layer is plated between the pattern electroplating part and the circuit pattern of the via hole and is directly contacted with the electroplating solution, the copper layer is deposited after the Cu2+ of the electroplating solution is separated out in the form of metal Cu after the electrons are obtained on the surface of the copper layer, the copper layers of the parts are relatively thick, particularly among the circuit patterns, so that the anti-crease property of the circuit board in the later manufacturing process can be improved, and the part of copper is removed through etching at last, thereby meeting the requirement on the thickness of the circuit board; the flexible parts, namely the surface of the circuit diagram, are protected by the dry film and isolated from the electroplating solution without depositing a copper layer, and the copper layers of the parts are relatively thin, so that the bending performance can be improved.
Further, the shielding baffle comprises a surface layer and a bottom layer which are made of insulating materials, and a metal mesh arranged between the surface layer and the bottom layer.
The metal mesh can effectively reduce the electric field intensity without completely blocking an electric field, and copper ions are uniformly attached to the surface of the copper-clad plate under the action of weak electric field force after passing through the electric through holes. The top and bottom layers of insulating material (e.g., ceramic, plastic) prevent the copper layer from adhering to the surface of the shield baffle.
Furthermore, the diameter of the through hole is 0.1-0.3 times of the distance between the center of the through hole and the center of the shielding baffle; the distance ratio of the shielding baffle to the anode and the copper-clad plate is (2-6): 1.
further, the pattern plating is carried out with a copper layer thickness of 28 to 35 μm and a current density of 1.7A/dm2～2.1A/dm2(ii) a The part of the first dry film pressing part further comprises a ground copper area, second through holes are uniformly formed in the dry film covering the ground copper area after the first exposure and the first development, the diameter of each second through hole is 0.1-0.15 mm, and the center distance between every two adjacent holes of each second through hole is 0.2-0.4 mm.
Furthermore, the thickness of the copper foil pressed on the substrate is 28-32 μm.
Preferably, the dry film is a photosensitive polymer film.
Preferably, the black hole is formed by adhering a conductive carbon powder layer to the inner wall surface of the first through hole.
Preferably, the first dry film pressing is to press and paste the dry film on the surface of the copper-clad plate; and the second dry film pressing is to press and paste the dry film on the surface of the copper-clad plate.
Preferably, the first exposure and the second exposure are to irradiate the ultraviolet photosensitive polymer film on the surface of the copper-clad plate by using ultraviolet light, so that a photosensitive functional group in the ultraviolet photosensitive polymer film is subjected to polymerization reaction under the action of a photoinitiator to form a polymer with a compact structure and a longer molecular chain; the first development and the second development are to melt and remove the ultraviolet photosensitive high polymer film which is not cured by light from the surface of the copper-clad plate in a developing solution. And exposing only the circuit pattern area and the copper part area during the first exposure, so that the dry films of the circuit pattern area and the copper part area are cured, and the dry films between the circuits and the first through hole area are not cured. And the dry film curing of the copper region is to form the second through hole in the copper region. Only the region of the first via hole is exposed at the time of the second exposure, and the dry film of the region that is the first via hole is cured to include the first via hole region not to be etched at the time of the line etching.
Preferably, the chemical grinding is to clean oxidized copper, oil stains and impurities on the surface of the copper-clad plate by using a chemical cleaning solution.
The circuit board is easy to be contaminated by impurities or the copper layer is oxidized in the processing process, and if the circuit board is not thoroughly cleaned, the problems of aging, short circuit and the like of the circuit are easily caused. Even during patterning, resulting in distortion of the developed image. The chemical cleaning agent preferably comprises 30-45 parts by weight of hydrogen peroxide with the concentration of 10wt%, 5-10 parts by weight of sulfuric acid solution with the concentration of 5wt%, 0.04-0.08 part by weight of isoprene, 0.07-0.23 part by weight of 2, 3-flavanone and 0.2-0.5 part by weight of 3, 7-dimethyl-1, 6-octadiene-3-ol.
The hydrogen peroxide solution and the sulfuric acid solution are common circuit board cleaning agents and can effectively remove dirt such as oil stain, oxide and the like. But the two have stronger corrosion action on the copper layer of the circuit board, so that the copper layer loses luster and the surface roughness is increased after cleaning. In addition, the cleaning agent often needs to be added with various ionic auxiliary agents, so that more residues are left after cleaning, and even the copper surface is oxidized. Therefore, the cleaning agent is added with the isoprene and the 2, 3-flavanone, and the isoprene and the 2, 3-flavanone can effectively keep the luster of the copper surface after cleaning and prevent the copper surface from becoming rough. 3, 7-dimethyl-1, 6-octadien-3-ol can avoid the generation of residues and oxides.
Drawings
Fig. 1 is a cross-sectional view of a shield baffle of the present invention.
Fig. 2 is a front view of the shielding baffle of the present invention.
Fig. 3 is an enlarged partial cross-sectional view of the shield baffle of the present invention.
Detailed Description
In order to facilitate understanding for those skilled in the art, the present invention will be described in further detail below with reference to examples:
example 1
The embodiment provides a low-copper-consumption printed circuit board forming method, which comprises the following steps:
pressing a copper foil on a substrate, mechanically drilling a first through hole, black holes, chemically grinding, pressing a dry film for the first time, exposing for the first time, developing for the first time, electroplating a pattern, pressing a dry film for the second time, exposing for the second time, developing for the second time, etching a circuit, and removing the dry film; the pattern electroplating is to contact the copper-clad plate with electroplating solution, plate a copper layer between the first through hole which is not covered by the dry film and the circuit pattern thereof, and plate no copper layer on the surface of the circuit pattern which is covered by the dry film; the circuit etching is to contact the copper-clad plate with etching solution and etch a circuit pattern on the surface of the copper-clad plate; when the pattern is electroplated, a shielding baffle 1 capable of shielding an electric field is covered above the copper surface of the copper-clad plate; as shown in fig. 1, the shielding baffle is provided with radially arranged through holes 2; as shown in fig. 2, the diameter of the electricity transmission pipe 2 gradually increases from the center to the edge of the shielding baffle along the radial direction of the shielding baffle.
Further, as shown in fig. 3, the shielding baffle includes a surface layer 1 (polycarbonate) made of an insulating material, a bottom layer 2 (polycarbonate), and a metal mesh 3 disposed between the surface layer and the bottom layer.
Example 2
The embodiment provides a low-copper-consumption printed circuit board forming method, which comprises the following steps:
pressing a copper foil on a substrate, mechanically drilling a first through hole, black holes, chemically grinding, pressing a dry film for the first time, exposing for the first time, developing for the first time, electroplating a pattern, pressing a dry film for the second time, exposing for the second time, developing for the second time, etching a circuit, and removing the dry film; the pattern electroplating is to contact the copper-clad plate with electroplating solution, plate a copper layer between the first through hole which is not covered by the dry film and the circuit pattern thereof, and plate no copper layer on the surface of the circuit pattern which is covered by the dry film; the circuit etching is to contact the copper-clad plate with etching solution and etch a circuit pattern on the surface of the copper-clad plate; when the pattern is electroplated, a shielding baffle plate capable of shielding an electric field is covered above the copper surface of the copper-clad plate; the shielding baffle is provided with through electric holes which are radially distributed; the diameter of the through hole is gradually increased from the center to the edge of the shielding baffle along the radial direction of the shielding baffle.
Further, the shielding baffle comprises a surface layer and a bottom layer which are made of insulating materials, and a metal mesh arranged between the surface layer and the bottom layer.
Further, the diameter of the through hole is 0.3 times of the distance between the center of the through hole and the center of the shielding baffle; the distance ratio of the shielding baffle to the anode and the copper-clad plate is (2): 1.
further, the copper layer plated by the pattern plating was 35 μm in thickness and 1.7A/dm in current density2(ii) a The part of the first dry film pressing further comprises a ground copper area, second through holes are uniformly formed in the dry film covering the ground copper area after the first exposure and the first development, the diameter of each second through hole is 0.1-0.15 mm, and the center distance between every two adjacent holes of each second through hole is 0.4 mm.
Further, the copper foil laminated on the substrate had a thickness of 28 μm.
Preferably, the dry film is a photosensitive polymer film.
Preferably, the black hole is formed by adhering a conductive carbon powder layer to the inner wall surface of the first through hole.
Preferably, the first dry film pressing is to press and paste the dry film on the surface of the copper-clad plate; and the second dry film pressing is to press and paste the dry film on the surface of the copper-clad plate.
Preferably, the first exposure and the second exposure are to irradiate the ultraviolet photosensitive polymer film on the surface of the copper-clad plate by using ultraviolet light, so that a photosensitive functional group in the ultraviolet photosensitive polymer film is subjected to polymerization reaction under the action of a photoinitiator to form a polymer with a compact structure and a longer molecular chain; the first development and the second development are to melt and remove the ultraviolet photosensitive high polymer film which is not cured by light from the surface of the copper-clad plate in a developing solution.
Preferably, the chemical grinding is to clean oxidized copper, oil stains and impurities on the surface of the copper-clad plate by using a chemical cleaning solution.
In this embodiment, the chemical cleaner includes 45 parts by weight of hydrogen peroxide solution having a concentration of 10wt% and 10 parts by weight of sulfuric acid solution having a concentration of 5 wt%.
Example 3
The embodiment provides a low-copper-consumption printed circuit board forming method, which comprises the following steps:
pressing a copper foil on a substrate, mechanically drilling a first through hole, black holes, chemically grinding, pressing a dry film for the first time, exposing for the first time, developing for the first time, electroplating a pattern, pressing a dry film for the second time, exposing for the second time, developing for the second time, etching a circuit, and removing the dry film; the pattern electroplating is to contact the copper-clad plate with electroplating solution, plate a copper layer between the first through hole which is not covered by the dry film and the circuit pattern thereof, and plate no copper layer on the surface of the circuit pattern which is covered by the dry film; the circuit etching is to contact the copper-clad plate with etching solution and etch a circuit pattern on the surface of the copper-clad plate; when the pattern is electroplated, a shielding baffle plate capable of shielding an electric field is covered above the copper surface of the copper-clad plate; the shielding baffle is provided with through electric holes which are radially distributed; the diameter of the through hole is gradually increased from the center to the edge of the shielding baffle along the radial direction of the shielding baffle.
Further, the shielding baffle comprises a surface layer and a bottom layer which are made of insulating materials, and a metal mesh arranged between the surface layer and the bottom layer.
Further, the diameter of the through hole is 0.1 time of the distance between the center of the through hole and the center of the shielding baffle; the distance ratio of the shielding baffle to the anode and the copper-clad plate is 6: 1.
further, the copper layer plated by the pattern plating was 28 μm in thickness and 2.1A/dm in current density2(ii) a The part of the first dry film pressing further comprises a ground copper area, second through holes are uniformly formed in the dry film covering the ground copper area after the first exposure and the first development, the diameter of each second through hole is 0.1 mm, and the center distance between every two adjacent holes of the second through holes is 0.4 mm.
Further, the copper foil laminated on the substrate had a thickness of 28 μm.
Preferably, the dry film is a photosensitive polymer film.
Preferably, the black hole is formed by adhering a conductive carbon powder layer to the inner wall surface of the first through hole.
Preferably, the first dry film pressing is to press and paste the dry film on the surface of the copper-clad plate; and the second dry film pressing is to press and paste the dry film on the surface of the copper-clad plate.
Preferably, the first exposure and the second exposure are to irradiate the ultraviolet photosensitive polymer film on the surface of the copper-clad plate by using ultraviolet light, so that a photosensitive functional group in the ultraviolet photosensitive polymer film is subjected to polymerization reaction under the action of a photoinitiator to form a polymer with a compact structure and a longer molecular chain; the first development and the second development are to melt and remove the ultraviolet photosensitive high polymer film which is not cured by light from the surface of the copper-clad plate in a developing solution.
Preferably, the chemical grinding is to clean oxidized copper, oil stains and impurities on the surface of the copper-clad plate by using a chemical cleaning solution. The chemical cleaning agent comprises the following raw materials, by weight, 36 parts of hydrogen peroxide with the concentration of 10wt%, 8 parts of sulfuric acid solution with the concentration of 5wt%, 0.06 part of isoprene, 0.11 part of 2, 3-flavanone and 0.4 part of 3, 7-dimethyl-1, 6-octadiene-3-ol.
Example 4
The embodiment provides a low-copper-consumption printed circuit board forming method, which comprises the following steps:
pressing a copper foil on a substrate, mechanically drilling a first through hole, black holes, chemically grinding, pressing a dry film for the first time, exposing for the first time, developing for the first time, electroplating a pattern, pressing a dry film for the second time, exposing for the second time, developing for the second time, etching a circuit, and removing the dry film; the pattern electroplating is to contact the copper-clad plate with electroplating solution, plate a copper layer between the first through hole which is not covered by the dry film and the circuit pattern thereof, and plate no copper layer on the surface of the circuit pattern which is covered by the dry film; the circuit etching is to contact the copper-clad plate with etching solution and etch a circuit pattern on the surface of the copper-clad plate; when the pattern is electroplated, a shielding baffle plate capable of shielding an electric field is covered above the copper surface of the copper-clad plate; the shielding baffle is provided with through electric holes which are radially distributed; the diameter of the through hole is gradually increased from the center to the edge of the shielding baffle along the radial direction of the shielding baffle.
Further, the shielding baffle comprises a surface layer and a bottom layer which are made of insulating materials, and a metal mesh arranged between the surface layer and the bottom layer.
Preferably, the chemical grinding is to clean oxidized copper, oil stains and impurities on the surface of the copper-clad plate by using a chemical cleaning solution. The chemical cleaning agent comprises 45 parts of hydrogen peroxide with the concentration of 10wt%, 5 parts of sulfuric acid solution with the concentration of 5wt%, 0.08 part of isoprene, 0.07 part of 2, 3-flavanone and 0.5 part of 3, 7-dimethyl-1, 6-octadiene-3-alcohol.
Example 5
The embodiment provides a low-copper-consumption printed circuit board forming method, which comprises the following steps:
pressing a copper foil on a substrate, mechanically drilling a first through hole, black holes, chemically grinding, pressing a dry film for the first time, exposing for the first time, developing for the first time, electroplating a pattern, pressing a dry film for the second time, exposing for the second time, developing for the second time, etching a circuit, and removing the dry film; the pattern electroplating is to contact the copper-clad plate with electroplating solution, plate a copper layer between the first through hole which is not covered by the dry film and the circuit pattern thereof, and plate no copper layer on the surface of the circuit pattern which is covered by the dry film; the circuit etching is to contact the copper-clad plate with etching solution and etch a circuit pattern on the surface of the copper-clad plate; when the pattern is electroplated, a shielding baffle plate capable of shielding an electric field is covered above the copper surface of the copper-clad plate; the shielding baffle is provided with through electric holes which are radially distributed; the diameter of the through hole is gradually increased from the center to the edge of the shielding baffle along the radial direction of the shielding baffle.
Further, the shielding baffle comprises a surface layer and a bottom layer which are made of insulating materials, and a metal mesh arranged between the surface layer and the bottom layer.
Preferably, the chemical grinding is to clean oxidized copper, oil stains and impurities on the surface of the copper-clad plate by using a chemical cleaning solution. The chemical cleaning agent comprises the following raw materials, by weight, 30 parts of hydrogen peroxide with the concentration of 10wt%, 10 parts of sulfuric acid solution with the concentration of 5wt%, 0.04 part of isoprene, 0.23 part of 2, 3-flavanone and 0.2 part of 3, 7-dimethyl-1, 6-octadiene-3-ol.
Example 6
The embodiment provides a low-copper-consumption printed circuit board forming method, which comprises the following steps:
pressing a copper foil on a substrate, mechanically drilling a first through hole, black holes, chemically grinding, pressing a dry film for the first time, exposing for the first time, developing for the first time, electroplating a pattern, pressing a dry film for the second time, exposing for the second time, developing for the second time, etching a circuit, and removing the dry film; the pattern electroplating is to contact the copper-clad plate with electroplating solution, plate a copper layer between the first through hole which is not covered by the dry film and the circuit pattern thereof, and plate no copper layer on the surface of the circuit pattern which is covered by the dry film; the circuit etching is to contact the copper-clad plate with etching solution and etch a circuit pattern on the surface of the copper-clad plate; when the pattern is electroplated, a shielding baffle plate capable of shielding an electric field is covered above the copper surface of the copper-clad plate; the shielding baffle is provided with through electric holes which are radially distributed; the diameter of the through hole is gradually increased from the center to the edge of the shielding baffle along the radial direction of the shielding baffle.
Further, the shielding baffle comprises a surface layer and a bottom layer which are made of insulating materials, and a metal mesh arranged between the surface layer and the bottom layer.
Preferably, the chemical grinding is to clean oxidized copper, oil stains and impurities on the surface of the copper-clad plate by using a chemical cleaning solution. The chemical cleaning agent comprises 45 parts of hydrogen peroxide with the concentration of 10wt%, 10 parts of sulfuric acid solution with the concentration of 5wt%, 0.08 part of dicyclopentadiene, 0.23 part of 2, 3-flavanone and 0.2-0.5 part of 3, 7-dimethyl-1, 6-octadiene-3-alcohol.
Example 7
The embodiment provides a low-copper-consumption printed circuit board forming method, which comprises the following steps:
pressing a copper foil on a substrate, mechanically drilling a first through hole, black holes, chemically grinding, pressing a dry film for the first time, exposing for the first time, developing for the first time, electroplating a pattern, pressing a dry film for the second time, exposing for the second time, developing for the second time, etching a circuit, and removing the dry film; the pattern electroplating is to contact the copper-clad plate with electroplating solution, plate a copper layer between the first through hole which is not covered by the dry film and the circuit pattern thereof, and plate no copper layer on the surface of the circuit pattern which is covered by the dry film; the circuit etching is to contact the copper-clad plate with etching solution and etch a circuit pattern on the surface of the copper-clad plate; when the pattern is electroplated, a shielding baffle plate capable of shielding an electric field is covered above the copper surface of the copper-clad plate; the shielding baffle is provided with through electric holes which are radially distributed; the diameter of the through hole is gradually increased from the center to the edge of the shielding baffle along the radial direction of the shielding baffle.
Further, the shielding baffle comprises a surface layer and a bottom layer which are made of insulating materials, and a metal mesh arranged between the surface layer and the bottom layer.
Preferably, the chemical grinding is to clean oxidized copper, oil stains and impurities on the surface of the copper-clad plate by using a chemical cleaning solution. The chemical cleaning agent comprises 45 parts of hydrogen peroxide with the concentration of 10wt%, 10 parts of sulfuric acid solution with the concentration of 5wt%, 0.08 part of isoprene and 0.23 part of 5, 7-dihydroxyflavone.
Experimental example 1
And (4) a copper layer protection effect.
The copper-clad plate is soaked in the cleaning agent of the embodiment 2-7 for 30min at the temperature of 30 ℃. And testing the friction coefficient of the copper surface of the copper-clad plate. The results are shown in Table 1.
Table 1.
| Experimental group | Coefficient of friction (Steel, no lubrication) |
| Example 2 | 0.33 |
| Example 3 | 0.19 |
| Example 4 | 0.18 |
| Example 5 | 0.15 |
| Example 6 | 0.30 |
| Example 7 | 0.32 |
Example 2
Copper surface residue, degree of oxidation.
The copper-clad plate is soaked in the cleaning agent of the embodiment 2-7 for 60min at 40 ℃. And testing the quality change of the copper-clad plate. The results are shown in Table 2.
Table 2.
| Experimental group | Mass gain (. mu.g/cm)2） |
| Example 2 | 3.1 |
| Example 3 | 0.4 |
| Example 4 | 0.6 |
| Example 5 | 0.5 |
| Example 6 | 0.9 |
| Example 7 | 2.6 |
The foregoing is a detailed description of the invention, which is described in greater detail and not intended to limit the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (9)
1. A low-copper-consumption printed circuit board forming method comprises the following steps:
pressing a copper foil on a substrate, mechanically drilling a first through hole, black holes, chemically grinding, pressing a dry film for the first time, exposing for the first time, developing for the first time, electroplating a pattern, pressing a dry film for the second time, exposing for the second time, developing for the second time, etching a circuit, and removing the dry film; the pattern electroplating is to contact the copper-clad plate with electroplating solution, plate a copper layer between the first through hole which is not covered by the dry film and the circuit pattern thereof, and plate no copper layer on the surface of the circuit pattern which is covered by the dry film; the circuit etching is to contact the copper-clad plate with etching solution and etch a circuit pattern on the surface of the copper-clad plate; when the pattern is electroplated, a shielding baffle plate capable of shielding an electric field is covered above the copper surface of the copper-clad plate; the shielding baffle is provided with through electric holes which are radially distributed; the diameter of the through hole is gradually increased from the center to the edge of the shielding baffle along the radial direction of the shielding baffle; the shielding baffle comprises a surface layer and a bottom layer which are made of insulating materials, and a metal net arranged between the surface layer and the bottom layer.
2. The method of claim 1, wherein: the diameter of the through hole is 0.1-0.3 times of the distance between the center of the through hole and the center of the shielding baffle; the distance ratio of the shielding baffle to the anode and the copper-clad plate is (2-6): 1.
3. the method of claim 1, wherein: the thickness of the copper layer plated by the pattern electroplating is 28-35 mu m, and the current density is 1.7A/dm2～2.1A/dm2(ii) a The part of the first dry film pressing part further comprises a ground copper area, second through holes are uniformly formed in the dry film covering the ground copper area after the first exposure and the first development, the diameter of each second through hole is 0.1-0.15 mm, and the center distance between every two adjacent holes of each second through hole is 0.2-0.4 mm.
4. The method of claim 1, wherein: the thickness of the copper foil pressed on the substrate is 28-32 μm.
5. The method according to any one of claims 1 to 4, wherein: the dry film is a photosensitive polymer film.
6. The method according to any one of claims 1 to 4, wherein: the black hole is formed by adhering a conductive carbon powder layer on the surface of the inner wall of the first through hole.
7. The method according to any one of claims 1 to 4, wherein: the first dry film pressing is to press and paste the dry film on the surface of the copper-clad plate; and the second dry film pressing is to press and paste the dry film on the surface of the copper-clad plate.
8. The method according to any one of claims 1 to 4, wherein: the first exposure and the second exposure are to irradiate the ultraviolet photosensitive polymer film on the surface of the copper-clad plate by using ultraviolet light, so that a photosensitive functional group in the ultraviolet photosensitive polymer film is subjected to polymerization reaction under the action of a photoinitiator to form a polymer with a compact structure and a longer molecular chain; the first development and the second development are to melt and remove the ultraviolet photosensitive high polymer film which is not cured by light from the surface of the copper-clad plate in a developing solution.
9. The method according to any one of claims 1 to 4, wherein: and the chemical grinding is to clean oxidized copper, oil stains and impurities on the surface of the copper-clad plate by using a chemical cleaning solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610960391.0A CN106550546B (en) | 2016-11-04 | 2016-11-04 | Low-copper-consumption printed circuit board forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610960391.0A CN106550546B (en) | 2016-11-04 | 2016-11-04 | Low-copper-consumption printed circuit board forming method |
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| Publication Number | Publication Date |
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| CN106550546A CN106550546A (en) | 2017-03-29 |
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| CN112888169B (en) * | 2020-12-30 | 2022-11-08 | 深圳市迅捷兴科技股份有限公司 | Current shunting method for pattern electroplating |
| TWI804174B (en) * | 2022-01-24 | 2023-06-01 | 健鼎科技股份有限公司 | Electroplating method of through holes of circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10321632A (en) * | 1997-05-19 | 1998-12-04 | Matsushita Electron Corp | Bump forming device and bump formation |
| CN204491014U (en) * | 2014-12-24 | 2015-07-22 | 昆山元茂电子科技有限公司 | The uniform anode baffle of a kind of plating |
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| JP2000101231A (en) * | 1998-09-22 | 2000-04-07 | Hitachi Aic Inc | Manufacture of printed wiring board |
| CN201016123Y (en) * | 2007-03-06 | 2008-02-06 | 厦门弘信电子科技有限公司 | Cathode guard board structure for flexible circuit board plating technology |
| CN201424517Y (en) * | 2009-03-10 | 2010-03-17 | 深圳大学反光材料厂 | Improved electroplating device |
| CN102316677B (en) * | 2010-06-30 | 2013-05-08 | 比亚迪股份有限公司 | Electroplating method for double-side and multilayer flexible printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10321632A (en) * | 1997-05-19 | 1998-12-04 | Matsushita Electron Corp | Bump forming device and bump formation |
| CN204491014U (en) * | 2014-12-24 | 2015-07-22 | 昆山元茂电子科技有限公司 | The uniform anode baffle of a kind of plating |
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