CN106550546A - A kind of printed wiring panel forming method of low consumption copper - Google Patents
A kind of printed wiring panel forming method of low consumption copper Download PDFInfo
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- CN106550546A CN106550546A CN201610960391.0A CN201610960391A CN106550546A CN 106550546 A CN106550546 A CN 106550546A CN 201610960391 A CN201610960391 A CN 201610960391A CN 106550546 A CN106550546 A CN 106550546A
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- copper
- hole
- clad plate
- dry film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention discloses a kind of printed wiring panel forming method of low consumption copper, and the present invention creatively proposes a kind of baffle plate with shielding electric field function, and in the region of the through hole that is not powered, electric field can drive copper ion to pass through and be attached to copper-clad plate surface；And in the region without saturating electric through-hole, copper ion is then blocked.Its diameter of electric through-hole is radially gradually increased from shielding baffle center to edge along shielding baffle plate thoroughly, guarantee the copper ion concentration that the stronger central area of electric field the passes through marginal area weaker less than electric field, make copper-clad plate copper coating thickness uniform, it is to avoid central area layers of copper it is blocked up and cause consume copper raise.
Description
Technical field
The present invention relates to printed wiring board production technical field, and in particular to a kind of printed wiring sheet metal forming side of low consumption copper
Method.
Background technology
The conventional technological process of printed wiring board is：Copper Foil severing → machine drilling → black holes → press dry film → exposure →
Film → expose again → develop again → circuit etching → remove dry film again is ground → press dry again in development → hole plating copper → go dry film → change.In order to
Circuit bad (including open circuit, short circuit, circuit defect and remaining copper) is avoided, existing wiring board is needed before manufacture in substrate
Upper to form thicker layers of copper, layers of copper is in subsequent handling, in addition it is also necessary to be etched, and causes the loss of a large amount of copper raw materials.Especially
In electroplating process, due to the electric field line distribution in electroplating bath it is uneven, the layers of copper at copper-clad plate center by the layers of copper much thicker than edge,
And in order that the layers of copper at edge has enough thickness, it is necessary to copper-clad plate is persistently electroplated, plating central area need not
Will, excessive copper material, cause consume copper increase.In prior art, often increase the baffle plate of insulation at copper-clad plate center, to prevent
Many copper ion migrations are to central area, but baffle plate is easily caused the thick deficiency of central area copper.
The content of the invention
In view of this, a kind of forming method that can reduce copper loss of the present invention.
The purpose of the present invention is achieved through the following technical solutions：A kind of printed wiring panel forming method of low consumption copper, including
Following operation：
Press on substrate Copper Foil, power auger first through hole, black holes, chemical grinding, press dry for the first time film, for the first time exposure, the
Once development, graphic plating, press dry film, second exposure for the second time, second development, circuit etching, remove dry film；Figure electricity
Plating is the plating layers of copper between the first through hole and its line pattern for not having dry film to cover by copper-clad plate and plating solution contacts, and
The non-plating layers of copper in line pattern surface for having dry film to cover；Circuit etching is that copper-clad plate is contacted with etching solution, is lost on its surface
Carve line pattern；During the graphic plating, the shielding baffle plate of maskable electric field is coated with above copper-clad plate copper face；The screen
Cover the saturating electric through-hole that baffle plate is provided with radial arrangement；Thoroughly its diameter of electric through-hole along shielding baffle plate radially from shielding baffle center to
Edge gradually increases.
The present invention creatively proposes a kind of baffle plate with shielding electric field function, in the region of the through hole that is not powered, electricity
Field can drive copper ion to pass through and be attached to copper-clad plate surface；And in the region without saturating electric through-hole, copper ion is then blocked.Thoroughly
Its diameter of electric through-hole is radially gradually increased from shielding baffle center to edge along shielding baffle plate, it is ensured that the stronger central area of electric field
The copper ion concentration for the passing through marginal area weaker less than electric field, makes copper-clad plate copper coating thickness uniform, it is to avoid center
Domain layers of copper it is blocked up and cause consume copper raise.The position of the graphic plating includes plated copper between via and its line pattern
Layer, and electroplate liquid directly contact, the Cu2+ of electroplate liquid sink after being separated out in the form of Ni metal after its surface obtains electronics
Product layers of copper, the layers of copper at these positions are relatively thick, particularly between line pattern, can so improve system of the wiring board in the later stage
Anti-crease property during work, finally by being etched with removing this part copper, meets the requirement of the thickness to wiring board；And
Can to be line pattern surface protected by dry film at flexing position, completely cut off and non-copper layer, the layers of copper phase at these positions with electroplate liquid
To relatively thin, bending performance can be improved.
Further, the shielding baffle plate it include surface layer, bottom by made by insulant, and be arranged on surface layer,
Wire netting between bottom.
Wire netting can be effectively reduced electric field intensity, and will not intercept electric field completely, and copper ion passes through saturating electric through-hole
Copper-clad plate surface is uniformly adhered under faint electric field force effect afterwards.Insulant（Such as ceramics, plastics）Made by surface layer
Layers of copper can be avoided in shielding baffle surface attachment with bottom.
Further, its a diameter of its center of the electric through-hole and shielding 0.1-0.3 times of baffle center distance；It is described
Which with anode, copper-clad plate ratio of distances constant is to shield baffle plate（2-6）：1.
Further, the copper layer thickness of graphic plating institute plating is 28-35 μm, and electric current density is 1.7A/dm2
～2.1A/dm2；The first time press dry the position of film also includes Di Tong areas, is covering through first time exposure, after developing for the first time
It is formed uniformly the second through hole on the dry film in Gai Ditong areas, a diameter of 0.1-0.15 millimeters of second through hole, described
Centre distance between the adjacent holes of two through holes is 0.2-0.4 millimeters.
Further, the copper thickness for pressing on substrate is 28 μm -32 μm.
Preferably, the dry film is photosensitive high polymer thin film.
Preferably, the black holes is to adhere to conductive carbon bisque in first through hole inner wall surface.
Preferably, it is dry film to be overlayed on the surface of copper-clad plate that the first time press dry film；The film that press dry for the second time is
Dry film is overlayed again on the surface of copper-clad plate.
Preferably, the first time exposure, exposure for the second time are the ultraviolet photosensitive height with ultraviolet light copper-clad plate surface
Molecular film so as in photosensitive functional group there is polyreaction in the presence of light trigger, form compact structure, strand
Longer macromolecule；The first time development, second development are by not by the ultraviolet photosensitive high score of photocuring in developer solution
Sub- thin film dissolves removing from copper-clad plate surface.Only to line pattern region and the subregion of ground copper when exposing first time
It is exposed, makes the dry film solidification of the subregion of line pattern region and ground copper, it is dry with first through hole region between circuit
Film is uncured.The dry film solidification of the subregion of ground copper is to make ground copper region form above-mentioned second through hole.In second exposure
When only the region of first through hole is exposed, be the dry film solidification in the region of first through hole, to include in circuit etching
First through hole region is not etched by.
Preferably, the chemical grinding is that copper, greasy dirt and the impurity that copper-clad plate surface is oxidized is cleaned with chemical cleaning solution.
Wiring board becomes easily infected by magazine in process or layers of copper is oxidized, if thoroughly do not removed, easily causes line
The bad problem such as aging, short-circuit on road.Even in graphic procedure, cause the anamorphose developed.It is currently preferred, it is described
Chemical cleaning dosage its raw material include concentration by weight for hydrogen peroxide 30-45 parts of 10wt%, concentration for 5wt% sulfuric acid solution
5-10 parts, isoprene 0.04-0.08 parts, 2,3- flavanone 0.07-0.23 parts, 3,7- dimethyl -1,6- octadiene -3-
Alcohol 0.2-0.5 parts.
Hydrogen peroxide, sulfuric acid solution are conventional pcb cleaning agents, effectively can go to degrease, the dirt such as oxide.But
The two layers of copper to wiring board has stronger corrosiveness, and after making cleaning, layers of copper tarnishes, surface roughness increases.This
Outward, above-mentioned abluent generally requires to add various ion-type auxiliary agents, and the residue after cleaning is more, or even causes copper face to aoxidize.
Therefore, the present invention adds isoprene, 2,3- flavanones in abluent, and the two can effectively keep copper face after cleaning
Gloss, prevent copper face roughening.3,7- dimethyl -1,6- octadiene -3- alcohol can then avoid the product of residue and oxide
It is raw.
Description of the drawings
Fig. 1 is the profile of present invention shielding baffle plate.
Fig. 2 is the front view of present invention shielding baffle plate.
Fig. 3 is the section partial enlarged drawing of present invention shielding baffle plate.
Specific embodiment
For the ease of it will be appreciated by those skilled in the art that being described in further detail to the present invention below in conjunction with embodiment：
Embodiment 1
The present embodiment provides a kind of printed wiring panel forming method of low consumption copper, including following operation：
Press on substrate Copper Foil, power auger first through hole, black holes, chemical grinding, press dry for the first time film, for the first time exposure, the
Once development, graphic plating, press dry film, second exposure for the second time, second development, circuit etching, remove dry film；Figure electricity
Plating is the plating layers of copper between the first through hole and its line pattern for not having dry film to cover by copper-clad plate and plating solution contacts, and
The non-plating layers of copper in line pattern surface for having dry film to cover；Circuit etching is that copper-clad plate is contacted with etching solution, is lost on its surface
Carve line pattern；During the graphic plating, the shielding baffle plate 1 of maskable electric field is coated with above copper-clad plate copper face；As schemed
1, the shielding baffle plate is provided with the saturating electric through-hole 2 of radial arrangement；Such as Fig. 2, electricity is logical thoroughly, and 2 its diameters edge shielding baffle plate are radially
Gradually increased from shielding baffle center to edge.
Further, such as Fig. 3, the shielding baffle plate it include surface layer 1 by made by insulant（Merlon）, bottom
Layer 2（Merlon）, and the wire netting 3 being arranged between surface layer, bottom.
Embodiment 2
The present embodiment provides a kind of printed wiring panel forming method of low consumption copper, including following operation：
Press on substrate Copper Foil, power auger first through hole, black holes, chemical grinding, press dry for the first time film, for the first time exposure, the
Once development, graphic plating, press dry film, second exposure for the second time, second development, circuit etching, remove dry film；Figure electricity
Plating is the plating layers of copper between the first through hole and its line pattern for not having dry film to cover by copper-clad plate and plating solution contacts, and
The non-plating layers of copper in line pattern surface for having dry film to cover；Circuit etching is that copper-clad plate is contacted with etching solution, is lost on its surface
Carve line pattern；During the graphic plating, the shielding baffle plate of maskable electric field is coated with above copper-clad plate copper face；The screen
Cover the saturating electric through-hole that baffle plate is provided with radial arrangement；Thoroughly its diameter of electric through-hole along shielding baffle plate radially from shielding baffle center to
Edge gradually increases.
Further, the shielding baffle plate it include surface layer, bottom by made by insulant, and be arranged on surface layer,
Wire netting between bottom.
Further, its a diameter of its center of the electric through-hole and shielding 0.3 times of baffle center distance；The shielding
Baffle plate its with anode, copper-clad plate ratio of distances constant be（2）：1.
Further, the copper layer thickness of graphic plating institute plating is 35 μm, and electric current density is 1.7A/dm2；Institute
The position for pressing dry film for the first time is stated also including Di Tong areas, Di Tong areas is being covered in through first time exposure, after developing for the first time
The second through hole, a diameter of 0.1-0.15 millimeters of second through hole, second through hole adjacent two are formed uniformly on dry film
Centre distance between hole is 0.4 millimeter.
Further, the copper thickness for pressing on substrate is 28 μm.
Preferably, the dry film is photosensitive high polymer thin film.
Preferably, the black holes is to adhere to conductive carbon bisque in first through hole inner wall surface.
Preferably, it is dry film to be overlayed on the surface of copper-clad plate that the first time press dry film；The film that press dry for the second time is
Dry film is overlayed again on the surface of copper-clad plate.
Preferably, the first time exposure, exposure for the second time are the ultraviolet photosensitive height with ultraviolet light copper-clad plate surface
Molecular film so as in photosensitive functional group there is polyreaction in the presence of light trigger, form compact structure, strand
Longer macromolecule；The first time development, second development are by not by the ultraviolet photosensitive high score of photocuring in developer solution
Sub- thin film dissolves removing from copper-clad plate surface.
Preferably, the chemical grinding is that copper, greasy dirt and the impurity that copper-clad plate surface is oxidized is cleaned with chemical cleaning solution.
In the present embodiment, described its raw material of Chemical cleaning dosage by weight include concentration for 10wt% 45 parts of hydrogen peroxide,
Sulfuric acid solution 10 part of the concentration for 5wt%.
Embodiment 3
The present embodiment provides a kind of printed wiring panel forming method of low consumption copper, including following operation：
Press on substrate Copper Foil, power auger first through hole, black holes, chemical grinding, press dry for the first time film, for the first time exposure, the
Once development, graphic plating, press dry film, second exposure for the second time, second development, circuit etching, remove dry film；Figure electricity
Plating is the plating layers of copper between the first through hole and its line pattern for not having dry film to cover by copper-clad plate and plating solution contacts, and
The non-plating layers of copper in line pattern surface for having dry film to cover；Circuit etching is that copper-clad plate is contacted with etching solution, is lost on its surface
Carve line pattern；During the graphic plating, the shielding baffle plate of maskable electric field is coated with above copper-clad plate copper face；The screen
Cover the saturating electric through-hole that baffle plate is provided with radial arrangement；Thoroughly its diameter of electric through-hole along shielding baffle plate radially from shielding baffle center to
Edge gradually increases.
Further, the shielding baffle plate it include surface layer, bottom by made by insulant, and be arranged on surface layer,
Wire netting between bottom.
Further, its a diameter of its center of the electric through-hole and shielding 0.1 times of baffle center distance；The shielding
Baffle plate itself and anode, copper-clad plate ratio of distances constant are 6：1.
Further, the copper layer thickness of graphic plating institute plating is 28 μm, and electric current density is 2.1A/dm2；Institute
The position for pressing dry film for the first time is stated also including Di Tong areas, Di Tong areas is being covered in through first time exposure, after developing for the first time
It is formed uniformly the second through hole on dry film, a diameter of 0.1 millimeter of second through hole, between the adjacent holes of second through hole
Centre distance be 0.4 millimeter.
Further, the copper thickness for pressing on substrate is 28 μm.
Preferably, the dry film is photosensitive high polymer thin film.
Preferably, the black holes is to adhere to conductive carbon bisque in first through hole inner wall surface.
Preferably, it is dry film to be overlayed on the surface of copper-clad plate that the first time press dry film；The film that press dry for the second time is
Dry film is overlayed again on the surface of copper-clad plate.
Preferably, the first time exposure, exposure for the second time are the ultraviolet photosensitive height with ultraviolet light copper-clad plate surface
Molecular film so as in photosensitive functional group there is polyreaction in the presence of light trigger, form compact structure, strand
Longer macromolecule；The first time development, second development are by not by the ultraviolet photosensitive high score of photocuring in developer solution
Sub- thin film dissolves removing from copper-clad plate surface.
Preferably, the chemical grinding is that copper, greasy dirt and the impurity that copper-clad plate surface is oxidized is cleaned with chemical cleaning solution.
Described its raw material of Chemical cleaning dosage includes that the sulphuric acid that concentration is 36 parts of the hydrogen peroxide of 10wt%, concentration is 5wt% is molten by weight
8 parts of liquid, 0.06 part of isoprene, 0.11 part of 2,3- flavanones, 0.4 part of 3,7- dimethyl -1,6- octadiene -3- alcohol.
Embodiment 4
The present embodiment provides a kind of printed wiring panel forming method of low consumption copper, including following operation：
Press on substrate Copper Foil, power auger first through hole, black holes, chemical grinding, press dry for the first time film, for the first time exposure, the
Once development, graphic plating, press dry film, second exposure for the second time, second development, circuit etching, remove dry film；Figure electricity
Plating is the plating layers of copper between the first through hole and its line pattern for not having dry film to cover by copper-clad plate and plating solution contacts, and
The non-plating layers of copper in line pattern surface for having dry film to cover；Circuit etching is that copper-clad plate is contacted with etching solution, is lost on its surface
Carve line pattern；During the graphic plating, the shielding baffle plate of maskable electric field is coated with above copper-clad plate copper face；The screen
Cover the saturating electric through-hole that baffle plate is provided with radial arrangement；Thoroughly its diameter of electric through-hole along shielding baffle plate radially from shielding baffle center to
Edge gradually increases.
Further, the shielding baffle plate it include surface layer, bottom by made by insulant, and be arranged on surface layer,
Wire netting between bottom.
Preferably, the chemical grinding is that copper, greasy dirt and the impurity that copper-clad plate surface is oxidized is cleaned with chemical cleaning solution.
Described its raw material of Chemical cleaning dosage includes that the sulphuric acid that concentration is 45 parts of the hydrogen peroxide of 10wt%, concentration is 5wt% is molten by weight
5 parts of liquid, 0.08 part of isoprene, 0.07 part of 2,3- flavanones, 0.5 part of 3,7- dimethyl -1,6- octadiene -3- alcohol.
Embodiment 5
The present embodiment provides a kind of printed wiring panel forming method of low consumption copper, including following operation：
Press on substrate Copper Foil, power auger first through hole, black holes, chemical grinding, press dry for the first time film, for the first time exposure, the
Once development, graphic plating, press dry film, second exposure for the second time, second development, circuit etching, remove dry film；Figure electricity
Plating is the plating layers of copper between the first through hole and its line pattern for not having dry film to cover by copper-clad plate and plating solution contacts, and
The non-plating layers of copper in line pattern surface for having dry film to cover；Circuit etching is that copper-clad plate is contacted with etching solution, is lost on its surface
Carve line pattern；During the graphic plating, the shielding baffle plate of maskable electric field is coated with above copper-clad plate copper face；The screen
Cover the saturating electric through-hole that baffle plate is provided with radial arrangement；Thoroughly its diameter of electric through-hole along shielding baffle plate radially from shielding baffle center to
Edge gradually increases.
Further, the shielding baffle plate it include surface layer, bottom by made by insulant, and be arranged on surface layer,
Wire netting between bottom.
Preferably, the chemical grinding is that copper, greasy dirt and the impurity that copper-clad plate surface is oxidized is cleaned with chemical cleaning solution.
Described its raw material of Chemical cleaning dosage includes that the sulphuric acid that concentration is 30 parts of the hydrogen peroxide of 10wt%, concentration is 5wt% is molten by weight
10 parts of liquid, 0.04 part of isoprene, 0.23 part of 2,3- flavanones, 0.2 part of 3,7- dimethyl -1,6- octadiene -3- alcohol.
Embodiment 6
The present embodiment provides a kind of printed wiring panel forming method of low consumption copper, including following operation：
Press on substrate Copper Foil, power auger first through hole, black holes, chemical grinding, press dry for the first time film, for the first time exposure, the
Once development, graphic plating, press dry film, second exposure for the second time, second development, circuit etching, remove dry film；Figure electricity
Plating is the plating layers of copper between the first through hole and its line pattern for not having dry film to cover by copper-clad plate and plating solution contacts, and
The non-plating layers of copper in line pattern surface for having dry film to cover；Circuit etching is that copper-clad plate is contacted with etching solution, is lost on its surface
Carve line pattern；During the graphic plating, the shielding baffle plate of maskable electric field is coated with above copper-clad plate copper face；The screen
Cover the saturating electric through-hole that baffle plate is provided with radial arrangement；Thoroughly its diameter of electric through-hole along shielding baffle plate radially from shielding baffle center to
Edge gradually increases.
Further, the shielding baffle plate it include surface layer, bottom by made by insulant, and be arranged on surface layer,
Wire netting between bottom.
Preferably, the chemical grinding is that copper, greasy dirt and the impurity that copper-clad plate surface is oxidized is cleaned with chemical cleaning solution.
Described its raw material of Chemical cleaning dosage includes that the sulphuric acid that concentration is 45 parts of the hydrogen peroxide of 10wt%, concentration is 5wt% is molten by weight
10 parts of liquid, 0.08 part of dicyclopentadiene, 0.23 part of 2,3- flavanones, 3,7- dimethyl -1,6- octadiene -3- alcohol 0.2-0.5
Part.
Embodiment 7
The present embodiment provides a kind of printed wiring panel forming method of low consumption copper, including following operation：
Press on substrate Copper Foil, power auger first through hole, black holes, chemical grinding, press dry for the first time film, for the first time exposure, the
Once development, graphic plating, press dry film, second exposure for the second time, second development, circuit etching, remove dry film；Figure electricity
Plating is the plating layers of copper between the first through hole and its line pattern for not having dry film to cover by copper-clad plate and plating solution contacts, and
The non-plating layers of copper in line pattern surface for having dry film to cover；Circuit etching is that copper-clad plate is contacted with etching solution, is lost on its surface
Carve line pattern；During the graphic plating, the shielding baffle plate of maskable electric field is coated with above copper-clad plate copper face；The screen
Cover the saturating electric through-hole that baffle plate is provided with radial arrangement；Thoroughly its diameter of electric through-hole along shielding baffle plate radially from shielding baffle center to
Edge gradually increases.
Further, the shielding baffle plate it include surface layer, bottom by made by insulant, and be arranged on surface layer,
Wire netting between bottom.
Preferably, the chemical grinding is that copper, greasy dirt and the impurity that copper-clad plate surface is oxidized is cleaned with chemical cleaning solution.
Described its raw material of Chemical cleaning dosage includes that the sulphuric acid that concentration is 45 parts of the hydrogen peroxide of 10wt%, concentration is 5wt% is molten by weight
10 parts of liquid, 0.08 part of isoprene, 0.23 part of 5,7- 5,7-Dihydroxyflavones.
Experimental example 1
Layers of copper protected effect.
Copper-clad plate is immersed in the abluent of embodiment 2-7,30 DEG C, 30min.The friction system of test copper-clad plate copper face
Number.Its result is as shown in table 1.
Table 1.
| Experimental group | Coefficient of friction（Steel, it is unlubricated） |
| Embodiment 2 | 0.33 |
| Embodiment 3 | 0.19 |
| Embodiment 4 | 0.18 |
| Embodiment 5 | 0.15 |
| Embodiment 6 | 0.30 |
| Embodiment 7 | 0.32 |
Embodiment 2
Copper face residue, oxidizability.
Copper-clad plate is immersed in the abluent of embodiment 2-7,40 DEG C, 60min.Test copper-clad plate mass change.Its knot
Fruit is as shown in table 2.
Table 2.
| Experimental group | Quality increases（μg/cm2） |
| Embodiment 2 | 3.1 |
| Embodiment 3 | 0.4 |
| Embodiment 4 | 0.6 |
| Embodiment 5 | 0.5 |
| Embodiment 6 | 0.9 |
| Embodiment 7 | 2.6 |
It is the wherein specific implementation of the present invention above, its description is more concrete and detailed, but therefore can not be interpreted as
Restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from this
On the premise of bright design, some deformations and improvement can also be made, these obvious alternative forms belong to the present invention's
Protection domain.
Claims (10)
1. a kind of printed wiring panel forming method of low consumption copper, including following operation：
Press on substrate Copper Foil, power auger first through hole, black holes, chemical grinding, press dry for the first time film, for the first time exposure, the
Once development, graphic plating, press dry film, second exposure for the second time, second development, circuit etching, remove dry film；Figure electricity
Plating is the plating layers of copper between the first through hole and its line pattern for not having dry film to cover by copper-clad plate and plating solution contacts, and
The non-plating layers of copper in line pattern surface for having dry film to cover；Circuit etching is that copper-clad plate is contacted with etching solution, is lost on its surface
Carve line pattern；During the graphic plating, the shielding baffle plate of maskable electric field is coated with above copper-clad plate copper face；The screen
Cover the saturating electric through-hole that baffle plate is provided with radial arrangement；Thoroughly its diameter of electric through-hole along shielding baffle plate radially from shielding baffle center to
Edge gradually increases.
2. method according to claim 1, it is characterised in that：It is described shielding baffle plate it include the face by made by insulant
Layer, bottom, and the wire netting being arranged between surface layer, bottom.
3. method according to claim 2, it is characterised in that：Its a diameter of its center of the electric through-hole and shielding baffle plate
0.1-0.3 times of centre distance；It is described shielding baffle plate its with anode, copper-clad plate ratio of distances constant be（2-6）：1.
4. according to claim 1, it is characterised in that：The copper layer thickness of graphic plating institute plating is 28-35 μ
M, electric current density are 1.7A/dm2～2.1A/dm2；The first time press dry the position of film also includes Di Tong areas, exposes through first time
Light, develop for the first time after be formed uniformly the second through hole being covered on the dry film in Di Tong areas, second through hole it is a diameter of
0.1-0.15 millimeters, the centre distance between the adjacent holes of second through hole are 0.2-0.4 millimeters.
5. according to claim 1, it is characterised in that：The copper thickness pressed on substrate is 28 μm -32 μm.
6. the method according to claim 1-5 any one, it is characterised in that：The dry film is that photosensitive high polymer is thin
Film.
7. the method according to claim 1-5 any one, it is characterised in that：The black holes is in first through hole
Wall surface adheres to conductive carbon bisque.
8. the method according to claim 1-5 any one, it is characterised in that：It is to do that the first time press dry film
Mould is attached to the surface of copper-clad plate；The film that press dry for the second time is to overlay dry film on the surface of copper-clad plate again.
9. the method according to claim 1-5 any one, it is characterised in that：The first time exposure, second exposure
Just with the ultraviolet photosensitive macromolecule membrane on ultraviolet light copper-clad plate surface so as in photosensitive functional group in light trigger
Effect is lower to there is polyreaction, forms the longer macromolecule of compact structure, strand；The first time development, second development
It is that removing is not dissolved from copper-clad plate surface by the ultraviolet photosensitive macromolecule membrane of photocuring in developer solution.
10. the method according to claim 1-5 any one, it is characterised in that：The chemical grinding is clear with chemistry
Copper, greasy dirt and impurity that washing liquid cleaning copper-clad plate surface is oxidized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610960391.0A CN106550546B (en) | 2016-11-04 | 2016-11-04 | Low-copper-consumption printed circuit board forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610960391.0A CN106550546B (en) | 2016-11-04 | 2016-11-04 | Low-copper-consumption printed circuit board forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106550546A true CN106550546A (en) | 2017-03-29 |
| CN106550546B CN106550546B (en) | 2020-03-27 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888169A (en) * | 2020-12-30 | 2021-06-01 | 深圳市迅捷兴科技股份有限公司 | Current shunting method for pattern electroplating |
| TWI804174B (en) * | 2022-01-24 | 2023-06-01 | 健鼎科技股份有限公司 | Electroplating method of through holes of circuit board |
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| JP2000101231A (en) * | 1998-09-22 | 2000-04-07 | Hitachi Aic Inc | Manufacture of printed wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112888169A (en) * | 2020-12-30 | 2021-06-01 | 深圳市迅捷兴科技股份有限公司 | Current shunting method for pattern electroplating |
| TWI804174B (en) * | 2022-01-24 | 2023-06-01 | 健鼎科技股份有限公司 | Electroplating method of through holes of circuit board |
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