CN106543686B - 一种树脂组合物及使用其制作的半固化片、层压板和层间绝缘膜 - Google Patents
一种树脂组合物及使用其制作的半固化片、层压板和层间绝缘膜 Download PDFInfo
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- CN106543686B CN106543686B CN201611052224.2A CN201611052224A CN106543686B CN 106543686 B CN106543686 B CN 106543686B CN 201611052224 A CN201611052224 A CN 201611052224A CN 106543686 B CN106543686 B CN 106543686B
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- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
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- 238000010998 test method Methods 0.000 description 1
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- 230000008646 thermal stress Effects 0.000 description 1
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- 150000003918 triazines Chemical class 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
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- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明公开了一种树脂组合物,以固体重量计,包括:(a)聚苯醚:10~80份;(b)硅氧交联剂:10~80份;(c)引发剂:0.01~5份;(d)无机填料:0~60份;(e)阻燃剂:0~30份;本发明采用了硅氧交联剂,为聚苯醚树脂体系提供优异的介电性能的基础上,进一步解决了现有技术的聚丁二烯等碳氢树脂的粘结性不良、热膨胀性差、耐热不足以及与其他树脂的相容性差等问题;最终使得本发明的树脂组合物及其制备的半固化片和层压板兼具优异的介电性能、耐热性能、粘接性、阻燃性、弯曲强度、韧性,剥离强度高、吸水率低,加工工艺性能优异等特点,获得意想不到的技术效果。
Description
技术领域
本发明涉及一种树脂组合物及使用其制作的半固化片、层压板和层间绝缘膜,属于电子材料技术领域。
背景技术
近年来,以个人电脑、服务器为首的信息终端机器以及因特网路由器、光通信等通信机器以高速来处理大容量的信息,电信号的高速化、高频化正在推进,因此提高传输速度和保持信号的完整性是高速高频产品关注的重点。而印制电路板材料对高速信号完整性的影响主要体现在信号损耗上,包括反射、趋肤效应以及介质损耗。尤其近年来,随着半导体用封装基板的小型化、薄型化,在部件安装封装装配时,存在因芯片与基板的热膨胀率之差而产生的翘曲变大的问题,从而要求低热膨胀化。
针对上述问题,现有技术中都是通过增加无机填料的填充量,然而,本领域技术人员已知,大量无机填料会引起由吸湿所致的绝缘可靠性降低、树脂-布线层的密合不足、压制成形不良等问题。
另一方面,聚丁二烯作为热塑性树脂,具有优异的介电性能(低的介电常数和低的损耗角正切),因此,高频高性能印制线路板领域中采用聚丁二烯是理想选择。然而,在使用过程中发现,聚丁二烯存在以下问题:(1)半固化片(预浸料)的粘性高,不利于储存和使用;(2)和热固性树脂的相容性差,在层压过程中出现相分离,并从层压板中渗出,从而导致聚丁二烯的优异介电性能不能充分体现以及板材的耐热性、刚性及粘结性严重下降。
为了解决聚丁二烯的使用问题,专利JP2014101398中采用了聚苯醚改性聚丁二烯,改善了树脂组合物相容性问题,因此在树脂组合物中可以添加大量的无机填料,提高板材的刚性和热膨胀性能,但是大量的无机填料的加入严重影响了板材的粘结性和后续PCB的钻孔加工性。专利US6569943中使用了分子末端带有乙烯基的胺基改性的液体聚丁二烯树脂,添加大量的低分子量的单体二溴苯乙烯作为固化剂和稀释剂,浸渍玻璃纤维布制作成的电路基板,虽然介电性能很好,但是因为树脂体系在常温下是液体,不能制作成不粘手的半固化片,因此在板材的压制成型时,很难采用通用的半固化片叠卜工艺,工艺操作比较困难。中国专利CN1280337中使用分子末端带有不饱和双键的聚苯醚树脂,采用低分子量的乙烯基单体作为固化剂,但由于这些低分子量的单体沸点低,在浸渍玻璃纤维布制作半固化片的烘干过程中会挥发掉,很难保证充分的固化剂用量。
因此,开发一种树脂组合物,以及使用其制作的半固化片、层压板和层间绝缘膜,使其兼具优异的介电性能、耐热性、强度、韧性、低热膨胀率以及高粘结性,显然具有积极的现实意义。
发明内容
本发明的发明目的是提供一种树脂组合物及使用其制作的半固化片、层压板和层间绝缘膜。
为达到上述发明目的,本发明采用的技术方案是:一种树脂组合物,以固体重量计,包括:
(a)聚苯醚:10~80份;
(b)硅氧交联剂:10~80份;
(c)引发剂:0.01~5份;
(d)无机填料:0~60份;
(e)阻燃剂:0~30份;
所述聚苯醚的末端含有碳碳不饱和双键;
所述硅氧交联剂的结构式为:其中:
n为1~10的整数,
R1,R2,R3,R4,R5,R6相同或不同,分别选自-H、-CH3、-CH2-CH3、-CH2-CH2-CH3、-O-R7、且其中至少一个基团为
其中,R7、R8、R9、R10相同或不同,分别选自-CH3、-CH2-CH3、-CH2-CH2-CH3、
所述聚苯醚的数均分子量为1000~5000g/mol。
上文中,硅氧交联剂的含量例如为10重量份、20重量份、25重量份、30重量份、35重量份、40重量份、45重量份、50重量份、55重量份、60重量份、65重量份、70重量份、75重量份、80重量份。优选为40~60重量份。
当树脂组合物中使用相容性较差的组分时,本发明中聚苯醚和硅氧交联剂可以制备预聚物后再与其他树脂或填料混合使用,所述预聚物的反应率为10~90%,优选为40~60%。
优选的,以摩尔计,所述硅氧交联剂中硅元素的含量为5~30%。优选10~23%。
优选的,所述聚苯醚的结构式为:
其中,
a和b分别为0~30,且a和b中至少有一个不为0,
M选自其中:X选自R1,R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R12,R13,R14,R15,R16相同或不同,分别选自氢基或C1~10的烷基。
上文中,所述聚苯醚的数均分子量范围为1000~5000g/mol。所述聚苯醚的含量例如为10重量份、20重量份、25重量份、30重量份、35重量份、40重量份、45重量份、50重量份、55重量份、60重量份、65重量份、70重量份、75重量份、80重量份;优选为20~40重量份。
优选的,以固体重量计,包括:
(a)聚苯醚:50~80份;
(b)硅氧交联剂:10~40份;
(c)引发剂:0.01~5份;
(d)无机填料:20~40份;
(e)阻燃剂:5~20份。
优选的,以固体重量计,包括:
(a)聚苯醚:10~50份;
(b)硅氧交联剂:50~70份;
(c)引发剂:0.01~5份;
(d)无机填料:20~40份;
(e)阻燃剂:5~20份。
优选的,所述硅氧交联剂的结构式选自下面10个结构式中的一个:
其中,n为1~10的整数。
所述引发剂为是指受热能分解成自由基的化合物,可用于引发烯类、双烯类单体的自由基聚合和共聚合反应,也可用于不饱和聚酯的交联固化和高分子交联反应。
上述技术方案中,所述引发剂选自过氧化苯甲酰、过氧化月桂酰、过氧化新戊酸叔己酯、间甲苯酰基过氧化物、双丁基过氧化异丙基苯、双(4-叔丁基环己基)过氧化二碳酸酯中的一种或几种。引发剂的含量优选为0.05~5重量份。
所述阻燃剂为含溴阻燃剂、含磷阻燃剂或氮系阻燃剂。所述含溴阻燃剂选自十溴二苯醚、十溴二苯乙烷、八溴联苯醚、五溴甲苯、六溴环十二烷、乙撑双四溴邻苯二甲酰亚胺、溴化聚碳酸酯、溴化聚苯乙烯、溴化三嗪、乙撑二五溴苯、乙撑双四溴酰亚胺、十四溴二苯氧基苯、双(三溴苯氧基)乙烷、四溴双酚A中的至少一种;所述含磷阻燃剂选自三(2,6-二甲基苯基)膦、10-(2,5-二羟基苯基)-9,10-二氢-9-氧杂-10-膦菲-10-氧化物、2,6-二(2,6-二甲基苯基)膦基苯或10-苯基-910-二氢-9-氧杂-10-膦菲-10-氧化物、磷腈、苯氧基膦氰化合物、磷酸酯、聚磷酸三聚氰胺、偏磷酸铝、磷酸三苯酯、双酚联苯磷酸盐、聚磷酸铵、、磷氮基化合物、偶磷氮化合物、双酚A双(二苯基磷酸酯)、三(2,6二甲基苯基)膦、间苯二酚双[二(2,6-二甲基苯基)磷酸酯]中的至少一种;所述含氮阻燃剂选自三嗪化合物、氰尿酸化合物、异氰酸化合物、吩噻嗪中一种;阻燃剂的含量优选为10~50重量份。
上述技术方案中,所述无机填料选自含二氧化硅(熔融态或非熔融态与多孔质)、氧化铝、氧化镁、氢氧化镁、碳酸钙、氮化铝、氮化硼、氢氧化铝、碳化铝硅、碳化硅、碳酸钠、二氧化钛、氧化锌、氧化锆、石英、钻石粉、类钻石粉、玻璃粉、石墨、碳酸镁、钛酸钾、陶瓷纤维、云母、勃姆石(boehmite,ALOOH)、钼酸锌、钼酸铵、硼酸锌、磷酸钙、硅酸钙、碳酸钙、煅烧滑石、滑石、氮化硅、段烧高岭土、黏土、硫酸镁、硫酸钡、钛酸锶、钛酸钡中至少一种;以固体重量100份计,无机填料的含量优选为10~30%。
上述无机填料的形状没有特别限制,可以为球状、板状、针状、角状或无定型状或其混合形状。上述无机填料可以使用硅烷偶联剂进行表面处理,提高树脂组合物中的分散性。在使用时上述无机填料可以直接投入或预先制备填料分散液或制成膏体投入树脂组合物中。
上述技术方案中,所述树脂组合物还进一步包括1~100重量份的组分(f):苯并噁嗪树脂、双马来酰亚胺树脂、氰酸酯树脂、环氧树脂中的一种或任意几种的混合物。
所述组分(f)苯并噁嗪树脂可以是双酚A型苯并噁嗪、双酚F型苯并噁嗪、双酚S型苯并噁嗪、双酚二胺型苯并噁嗪、双环戊二烯酚型苯并噁嗪或其改性苯并噁嗪中的一种或任意几种的混合物。优选的,所述组分(f)苯并噁嗪树脂的添加比例为1~20重量份。添加适量的组分(f)苯并噁嗪树脂可以进一步优化耐热性能和粘接性能,但是添加过多会对树脂体系的介电性能和韧性造成不良影响。
所述组分(f)双马来酰亚胺树脂可以是由烯丙基化合物和马来酰亚胺树脂预聚合产生的预聚物,所述烯丙基化合物选自烯丙基醚化合物、烯丙基酚氧树脂、烯丙基酚醛树脂、二烯丙基双酚A、二烯丙基双酚S中的一种或几种;所述马来酰亚胺树脂选自4,4’-二苯甲烷双马来酰亚胺树脂、4,4’-二苯醚双马来酰亚胺树脂、4,4’-二苯异丙基双马来酰亚胺树脂、4,4’-二苯砜双马来酰亚胺树脂中的一种或几种。优选的,所述组分(f)双马来酰亚胺的数均分子量为2000~5000g/mol。
所述组分(f)环氧树脂是指含有环氧基的化合物,可以是双酚A环氧树脂、双酚F环氧树脂、含磷环氧树脂、含氮环氧树脂、邻甲酚醛环氧树脂、双酚A酚醛环氧树脂、苯酚酚醛环氧树脂、甲酚酚醛环氧树脂、三苯基甲烷环氧树脂、四苯基乙烷环氧树脂、联苯型环氧树脂、萘环型环氧树脂、双环戊二烯型环氧树脂、异氰酸酯型环氧树脂、芳烷基线型酚醛环氧树脂、聚苯醚改性环氧树脂、脂环族类环氧树脂、缩水甘油胺型环氧树脂、缩水甘油酯型环氧树脂中一种或任意几种的混合物,同时可以配合固化剂和固化促进剂。
所述组分(f)氰酸酯树脂指结构中含有氰酸酯基的化合物,可以是双酚A型氰酸酯树脂、双酚F氰酸酯树脂、双酚M氰酸酯树脂、双环戊二烯型氰酸酯树脂、邻甲基酚醛型环氧树脂、苯酚型氰酸酯树脂、聚苯醚改性氰酸酯树脂中的一种或几种。优选的,所述组分(f)氰酸酯树脂的添加比例为20~50重量份。添加该比例的组分(f)氰酸酯树脂可以进一步优化树脂体系的耐热性、粘接性和介电性能,添加过多会导致树脂体系的耐湿热性能的下降。
优选地,一种树脂组合物,以固体重量计,包括:
(a)聚苯醚:50~80份;
(b)硅氧交联剂:10~40份;
(c)引发剂:0.01~5份;
(d)无机填料:10~60份;
(e)阻燃剂:10~30份;
(f)环氧树脂:20~60份。
本发明同时请求保护采用上述树脂组合物制作的半固化片,将上述树脂组合物用溶剂溶解制成胶液,然后将增强材料浸渍在上述胶液中;将浸渍后增强材料加热干燥后,即可得到所述半固化片。所述加热干燥条件为在50~170℃下烘烤1~10分钟。
所述的溶剂选自丙酮、丁酮、甲苯、甲基异丁酮、N、N-二甲基甲酰胺、N、N-二甲基乙酰胺、乙二醇甲醚、丙二醇甲醚中的一种或几种。
所述的增强材料可采用天然纤维、有机合成纤维、有机织物或者无机织物,如D玻璃、E玻璃、NE玻璃、S玻璃及T玻璃。这里对玻纤布的厚度没有特别限制,但对于生产厚度0.01~0.02mm的层压板,一般使用开纤布、扁平布。此外,为了改善树脂与玻纤布的界面结合,玻纤布一般都需要进行化学处理,主要方法是偶联剂处理,所用偶联剂如环氧硅烷,氨基硅烷。
本发明同时请求保护采用上述树脂组合物制作的层压板,在一张由上述的半固化片的单面或双面覆上金属箔,或者将至少2张由上述半固化片叠加后,在其单面或双面覆上金属箔,热压成形,即可得到所述层压板。所述热压成形条件为在0.2~2MPa压力和180~250℃温度下压制2~4小时。
所述半固化片的数量是根据客户要求的层压板厚度来确定,可用一张或多张。所述金属箔,可以是铜箔,也可以是铝箔,它们的厚度没有特别限制。
本发明同时请求保护一种层间绝缘膜,采用上述树脂组合物加入溶剂溶解制成胶液,将载体膜上涂覆所述胶液,将涂覆胶液的载体膜加热干燥后,即可得到所述层间绝缘膜。所述加热干燥条件为在50~170℃下烘烤1~10分钟。所述的溶剂选自丙酮、丁酮、甲苯、甲基异丁酮、N、N-二甲基甲酰胺、N、N-二甲基乙酰胺、乙二醇甲醚、丙二醇甲醚中的一种或几种。
上述技术方案中,所述载体膜可为聚乙烯对苯二甲酸酯(PET)膜、离型膜、铜箔、铝箔等,载体膜优选为PET膜。为了保护层间绝缘膜,在其另一面覆盖保护膜,所述保护膜可以与载体膜相同材料。
本发明的工作机理是:以聚苯醚和硅氧交联剂作为主体,在引发剂的作用下发生交联反应,引发剂分解出活性自由基,在活性自由基的作用下聚苯醚和硅氧交联剂的双键按照自由基聚合的机理生成交联的网状交联固化物;在树脂组合物中除了上述自由基聚合反应以外,还发生硅氧交联剂的自聚反应,生成硅氧基含量较高的聚合物,从而进一步提高固化物的耐热性、热膨胀性能及粘结性,但树脂体系中硅含量过高的话,与其他树脂的相容性变差、并严重影响固化物的吸水率,同时降低玻璃化转变温度。
由于上述技术方案运用,本发明与现有技术相比具有下列优点:
1.本发明采用了硅氧交联剂,为聚苯醚树脂体系提供优异的介电性能的基础上,进一步解决了现有技术的聚丁二烯等碳氢树脂的粘结性不良、热膨胀性差、耐热不足以及与其他树脂的相容性差等问题;最终使得本发明的树脂组合物及其制备的半固化片和层压板兼具优异的介电性能、耐热性能、粘接性、韧性,剥离强度高、吸水率低,加工工艺性能优异等特点,获得意想不到的技术效果;
2.本发明的树脂组合物中聚苯醚和硅氧交联剂中均包含碳碳双键,固化反应过程中在热的作用下,引发剂分解出活性自由基,在活性自由基的作用下各组分树脂的双键按照自由基聚合的机理生成交联的大分子聚合物,其聚合物中的Si-O分子柔韧性较好(由于Si-O键键角大,容易自由旋转),因此可以改善高聚物的韧性;
3.本发明的树脂组合物中,当硅氧交联剂略有多余时,多余的硅氧交联剂中发生自聚反应,生成硅氧基含量较高的聚合物,从而进一步提高固化物的耐热性、刚性及粘结性;而当聚苯醚树脂略有多余时,多余的聚苯醚可以与其他树脂(如环氧树脂)发生固化反应,从而进一步提高固化物的介电性能和粘结性。
具体实施方式
下面结合实施例对本发明作进一步描述:
一种树脂组合物,采用如下表1和表2的组分和配比制得:(表1为实施例1至8,表2为对比例1至6)
表1
表2
注:在表1和2中各组分的具体结构及物性参数如下:
聚苯醚1:末端含乙烯基,分子量为1000~1500g/mol;
聚苯醚2:末端含乙烯基,分子量为2000~3500g/mol;
聚苯醚3:末端含乙烯基,分子量为6000g/mol以上;
硅氧交联剂1:SiO-1,进口,结构式为
硅氧交联剂2:SiO-2,进口,结构式为
硅氧交联剂3:SiO-3,进口,结构式为
硅氧交联剂4:SiO-4,进口,结构式为
硅氧交联剂5:SiO-5,进口,结构式为
上述结构中n为1~3的整数。
碳氢树脂1:聚丁二烯;
碳氢树脂2:环氧聚丁二烯:
引发剂:过氧化苯甲酰;
阻燃剂:十溴二苯醚;
无机填料:二氧化硅;
环氧树脂:双酚A型环氧树脂;
固化剂:酚醛树脂;
固化促进剂:2-甲基咪唑。
胶液的混制:根据表中的配方,将配方中所有组分配制成固含量为60%的热固性树脂组合物胶液。接着,在下述条件下制成半固化片和层压板:
基材:普通电子级2116玻纤布;预浸渍半固化条件:170℃/5min;层数:8;成型后板材厚度:1.0mm;固化条件:150℃/60min+220℃/150min。
表1和2中各性能的测试方法如下,各性能的测试结果显示于表1和表2中:
玻璃化转变温度(Tg):根据差示扫描量热法,按照IPC-TM-650 2.4.25所规定的DSC方法进行测定。
相容性:观测热固性树脂组合物胶液中各组分是否分层、析出,如果没有分层、析出现象则表明组分间相容性较好,用“良好”表示。
剥离强度(PS):按照IPC-TM-650 2.4.8方法中的“热应力后”实验条件,测试金属盖层的剥离强度。
介电常数:按照IPC-TM-650 2.5.5.9使用平板法,测定10GHz下的介电常数。
介质损耗正切:按照IPC-TM-650 2.5.5.9使用平板法,测定10GHz下的介电损耗因子。
浸锡耐热性(T-288):使用50×50mm的两面带铜样品,浸入288℃的焊锡中,记录样品分层起泡的时间。
热膨胀系数Z轴CTE(TMA):按照IPC-TM-6502.4.24.方法进行测定。
落锤冲击韧性(层压板脆性):使用冲击仪,冲击仪落锤高度45cm,下落重锤重量1kg。
韧性好与差的评判:十字架清晰,说明产品的韧性越好,以字符◎表示;十字架模糊,说明产品的韧性差、脆性大,以字符◇表示。
耐燃烧性(难燃性):依据UL94法测定。
从表1和表2可见,实施例1-8是采用本发明配方的树脂组合物,利用实施例1-8的配方制得的树脂组合物制成的层压板固化后的粘结性、耐热性、CTE和韧性显著的比对比例中聚丁二烯和环氧聚丁二烯的优异,特别是实施例6中添加较多的硅氧交联剂时不但对剥离强度和树脂相容性影响较小,还获得了优异的介电性能、耐热性和CTE。另外,采用100份硅含量较高的硅氧交联剂5的对比例6中可知,玻璃化转变温度和耐热性明显下降,这是因为当树脂组合物中硅含量较高时固化物的吸水率显著的上升,导致整体固化物的耐热性和Tg严重下降。
应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施方式中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。
上文所列出的一系列的详细说明仅仅是针对本发明的可行性实施方式的具体说明,它们并非用以限制本发明的保护范围,凡未脱离本发明技艺精神所作的等效实施方式或变更均应包含在本发明的保护范围之内。
Claims (9)
1.一种树脂组合物,其特征在于,以固体重量计,包括:
(a)聚苯醚:10~80份;
(b)硅氧交联剂:10~80份;
(c)引发剂:0.01~5份;
(d)无机填料:0~60份;
(e)阻燃剂:0~30份;
所述聚苯醚的末端含有碳碳不饱和双键;
所述硅氧交联剂的结构式选自下面10个结构式中的一个:
其中,n为1~10的整数;
所述聚苯醚的数均分子量为1000~5000g/mol。
2.根据权利要求1所述的树脂组合物,其特征在于:以摩尔计,所述硅氧交联剂中硅元素的含量为5~30%。
3.根据权利要求1所述的树脂组合物,其特征在于:所述聚苯醚的结构式为:
其中,
a和b分别为0~30,且a和b中至少有一个不为0,
M选自其中:X选自-CH2-、-O-或R1,R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R12,R13,R14,R15,R16相同或不同,分别选自氢或C1~10的烷基。
4.根据权利要求1所述的树脂组合物,其特征在于,以固体重量计,包括:
(a)聚苯醚:50~80份;
(b)硅氧交联剂:10~40份;
(c)引发剂:0.01~5份;
(d)无机填料:20~40份;
(e)阻燃剂:5~20份。
5.根据权利要求1所述的树脂组合物,其特征在于,以固体重量计,包括:
(a)聚苯醚:10~50份;
(b)硅氧交联剂:50~70份;
(c)引发剂:0.01~5份;
(d)无机填料:20~40份;
(e)阻燃剂:5~20份。
6.根据权利要求1所述的树脂组合物,其特征在于:所述引发剂选自过氧化苯甲酰、过氧化月桂酰、过氧化新戊酸叔己酯、间甲苯酰基过氧化物、双丁基过氧化异丙基苯、双(4-叔丁基环己基)过氧化二碳酸酯中的一种或几种。
7.一种采用如权利要求1~6所述的任意一种树脂组合物制作的半固化片,其特征在于:将权利要求1~6所述的任意一种热固性树脂组合物用溶剂溶解制成胶液,然后将增强材料浸渍在上述胶液中;将浸渍后增强材料加热干燥后,即可得到所述半固化片。
8.一种层压板,其特征在于:在一张由权利要求7所述的半固化片的单面或双面覆上金属箔,或者将至少2张由权利要求7所述的半固化片叠加后,在其单面或双面覆上金属箔,热压成形,即可得到所述层压板。
9.一种层间绝缘膜,其特征在于:将权利要求1~6所述的任意一种热固性树脂组合物用溶剂溶解制成胶液,然后在载体膜上涂覆上述胶液,将涂覆胶液的载体膜加热干燥后,即可得到所述层间绝缘膜。
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