CN106535589A - Impact jet device for heat dissipation of electronic component - Google Patents
Impact jet device for heat dissipation of electronic component Download PDFInfo
- Publication number
- CN106535589A CN106535589A CN201710001263.8A CN201710001263A CN106535589A CN 106535589 A CN106535589 A CN 106535589A CN 201710001263 A CN201710001263 A CN 201710001263A CN 106535589 A CN106535589 A CN 106535589A
- Authority
- CN
- China
- Prior art keywords
- electronic element
- electronic component
- power electronic
- fixed substrate
- spout
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to an impact jet device for heat dissipation of an electronic component. The impact jet device comprises an air supply pipe, a nozzle, a fixed substrate, a high-power electronic component, a flow guide cover, an exhaust pipe and an air outlet, wherein the high-power electronic component is fixed on the upper surface of the fixed substrate; the nozzle is arranged in the lower surface of the fixed substrate; the nozzle is arranged on the air supply pipe to correspond to the position of the high-power electronic component on the fixed substrate; the flow guide cover with exhaust ducts in two sides is arranged on the nozzle; and the flow guide cover is connected to the air outlet through the exhaust pipe. The high-power electronic component is fixed on the substrate by using the fixed substrate; high-speed air jet from the nozzle takes away heat generated by the high-power electronic component in a jet impact heat exchange form, the heated air is guided through the flow guide cover and then is exhausted out of the device through the exhaust pipe, and the opening of an electromagnetic valve is controlled according to a temperature sensor on the electronic component, thereby meeting the requirements of heat dissipation and temperature control of high-power electronic equipment.
Description
Technical field
A kind of a kind of the present invention relates to great-power electronic element radiating, more particularly to the cooling dress of utilization jet impingement heat transfer
Put.
Background technology
At present, the development in global IT application epoch, electronic equipment are widely used in a variety of applications.Great-power electronic element is in fortune
Substantial amounts of heat can be produced during row, if heat cannot be discharged in time, can reduce work efficiency and the use of electronic component
Life-span.Suitable operating temperature can ensure that the operation of electronic component is more efficient, greatly improve its performance.
Conventional great-power electronic element cooling means has, free convection cooling, forced convertion cooling, liquid cooling, system
Energy in the cooling of cold mode or cooling procedure such as dredges at the mode.
The form of jet impingement heat transfer is：The high-speed gas sprayed from nozzle are directly impinging metal fin surface, can
Strong heat transfer effect is formed in regional area, take away substantial amounts of heat.
The content of the invention
The present invention is exactly for the heat dissipation problem of great-power electronic element, so as to provide one kind for electronic element radiating
Impact jet flow device, the heat of great-power electronic element taken away by the device using the impact jet flow of spout, the sky after intensification
Gas Jing after kuppe guiding by exhaust duct discharger, while the electromagnetic valve controlled by temperature sensor can adjust aperture,
Change the flow of lip jet, to guarantee that great-power electronic element is run at a temperature of setting.
To achieve these goals, the concrete technical scheme that the present invention takes is as follows：
A kind of impact jet flow device for electronic element radiating, including ajutage, spout, fixed substrate, great-power electronic unit
Part, kuppe, exhaust duct, exhaust outlet, the great-power electronic element are arranged on fixed thereon, and fixed substrate is arranged below
Spout, spout are arranged on ajutage corresponding in the position of fixed substrate with great-power electronic element, and both sides carry exhaust duct
Kuppe be arranged on spout on, kuppe connects exhaust outlet by exhaust duct.
Temperature sensor is installed on the great-power electronic element；The ajutage built with electromagnetic valve, the temperature
Contrasted with the temperature of setting after the temperature of sensor measurement great-power electronic element, and gone out controlling spout by electromagnetic valve
The size of air quantity, it is ensured that the temperature stabilization of electronic component.
Described great-power electronic element is arranged on fixed substrate with holes with screw.
Described kuppe is provided with symmetrical two exhaust duct, guides the exhaust duct from spout gas out along both sides
Discharge.
The material of described fixed substrate is copper, and the center hole of fixed substrate is more than electronic component, for transmitting portions
Heat.
Cryogenic air is entered by ajutage, and is ejected on great-power electronic element, with jet impingement heat transfer from spout
Form cooling down is carried out to great-power electronic element.
The invention has the beneficial effects as follows：The present invention can meet the cooling requirements of great-power electronic element, it is also possible to foundation
The different temperature requirements to electronic component carry out temperature control.Water conservancy diversion closure assembly can guide air-flow to be smoothly discharged out device, keep away
Exempt from interference of the turbulent flow to radiating.
Description of the drawings
Fig. 1 is the main sectional view of the impact jet flow device of the present invention；
Fig. 2 is the left sectional view of the impact jet flow device of the present invention；
Fig. 3 is the top view of the impact jet flow device of the present invention.
Specific embodiment
The invention will be further described with embodiment below in conjunction with the accompanying drawings.
As shown in Figure 1 to Figure 3, a kind of impact jet flow device for electronic element radiating, including ajutage 1, spout 2,
Electromagnetic valve 3, fixed substrate 4, great-power electronic element 5, temperature sensor 6, kuppe 7, exhaust duct 8, exhaust outlet 9.
Great-power electronic element 5 is arranged on above fixed substrate 4, and fixed substrate 4 is arranged below spout 2, and spout is arranged on
Corresponding in the position of fixed substrate 4 with great-power electronic element 5 on ajutage 1, kuppe 7 of the both sides with exhaust duct is installed
On spout 2, kuppe 7 connects exhaust outlet 9 by exhaust duct 8.Temperature sensor 6 is installed on great-power electronic element 5；
The ajutage 1 is built with electromagnetic valve 3, the temperature after the temperature of the measurement great-power electronic of the temperature sensor 6 element 5 with setting
Degree is contrasted, and by electromagnetic valve 3 controlling the size of 2 air output of spout, it is ensured that the temperature stabilization of electronic component 5.It is fixed
The material of substrate 4 is copper, and the center hole of fixed substrate 4 is more than electronic component, for transmitting portions heat.
In the case of being disposed with a powerful electronic component 5 inside impact jet flow device, by the electronics unit of power
Part 5 is screwed on fixed substrate 4 with holes, and in the 5 top mounting temperature sensor of electronic component of power
6.The Cryogenic air of high speed carries out jet punching by the spout 2 on ajutage 1 by the bottom of spray feed to great-power electronic element 5
Heat exchange is hit, substantial amounts of heat is taken away.After heat exchange, air themperature is raised, in the guiding of kuppe 7 of the both sides with exhaust duct
Discharged by exhaust duct 8 down.Installed on great-power electronic element 5 temperature sensor 6 measurement electronic component temperature after with set
Fixed temperature is contrasted, and using pid algorithm controlling the size of 2 air output of spout, it is ensured that the temperature of electronic component 5 is steady
It is fixed.
The present invention is easy to use, adjustability is strong, can meet radiating and the temperature control demand of great-power electronic element.The present invention is also
Different jet sizes, solenoid valve control mode, fixed baseplate material, electronic component and spray can be selected according to the actual requirements
Arrangement of mouth etc., can also design new water conservancy diversion hood shape etc..
Claims (6)
1. a kind of impact jet flow device for electronic element radiating, including ajutage (1), spout (2), fixed substrate (4), big
Power electronic element (5), kuppe (7), exhaust duct (8), exhaust outlet (9), it is characterised in that：The great-power electronic element
(5) fixed substrate (4) are arranged on above, fixed substrate (4) is arranged below spout (2), spout be arranged on ajutage (1) with it is big
Power electronic element (5) is corresponding in the position of fixed substrate (4), and kuppe (7) of the both sides with exhaust duct is arranged on spout
(2), on, kuppe (7) connects exhaust outlet (9) by exhaust duct (8).
2. the impact jet flow device for electronic element radiating according to claim 1, it is characterised in that：It is described high-power
Temperature sensor (6) is installed on electronic component (5)；Ajutage (1) is built with electromagnetic valve (3), the temperature sensor
(6) contrasted with the temperature of setting after measuring the temperature of great-power electronic element (5), and pass through electromagnetic valve (3) to control spray
The size of mouth (2) air output, it is ensured that the temperature stabilization of electronic component (5).
3. the impact jet flow device for electronic element radiating according to claim 1, it is characterised in that：Described big work(
Rate electronic component (5) is arranged on fixed substrate (4) with holes with screw.
4. the impact jet flow device for electronic element radiating according to claim 1, it is characterised in that：Described water conservancy diversion
Cover (7) is provided with symmetrical two exhaust duct, guides the gas from spout (2) out to discharge along the exhaust duct of both sides.
5. the impact jet flow device for electronic element radiating according to claim 1, it is characterised in that：Described fixation
The material of substrate (4) is copper, and the center hole of fixed substrate (4) is more than electronic component, for transmitting portions heat.
6. according to the arbitrary described impact jet flow device for electronic element radiating of claim 1-6, it is characterised in that：Low temperature
Air is entered by ajutage (1), and is ejected on great-power electronic element (5), with the shape of jet impingement heat transfer from spout (2)
Formula carries out cooling down to great-power electronic element (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710001263.8A CN106535589A (en) | 2017-01-03 | 2017-01-03 | Impact jet device for heat dissipation of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710001263.8A CN106535589A (en) | 2017-01-03 | 2017-01-03 | Impact jet device for heat dissipation of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106535589A true CN106535589A (en) | 2017-03-22 |
Family
ID=58336608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710001263.8A Pending CN106535589A (en) | 2017-01-03 | 2017-01-03 | Impact jet device for heat dissipation of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106535589A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0322596A (en) * | 1989-06-20 | 1991-01-30 | Fujitsu Ltd | Structure for and method of cooling integrated circuit device |
| JP2012248720A (en) * | 2011-05-30 | 2012-12-13 | Hitachi Ltd | Cooling structure of electronic apparatus |
| CN103153023A (en) * | 2012-10-14 | 2013-06-12 | 中国计量学院 | Pulse jet flow finned cooling device |
| CN103648256A (en) * | 2013-11-19 | 2014-03-19 | 中国计量学院 | Intermittent impact jet flow separately-shaped-fin cooling device |
| CN103648255A (en) * | 2013-11-19 | 2014-03-19 | 张蕾 | Square wave pulse jet flow generator |
-
2017
- 2017-01-03 CN CN201710001263.8A patent/CN106535589A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0322596A (en) * | 1989-06-20 | 1991-01-30 | Fujitsu Ltd | Structure for and method of cooling integrated circuit device |
| JP2012248720A (en) * | 2011-05-30 | 2012-12-13 | Hitachi Ltd | Cooling structure of electronic apparatus |
| CN103153023A (en) * | 2012-10-14 | 2013-06-12 | 中国计量学院 | Pulse jet flow finned cooling device |
| CN103648256A (en) * | 2013-11-19 | 2014-03-19 | 中国计量学院 | Intermittent impact jet flow separately-shaped-fin cooling device |
| CN103648255A (en) * | 2013-11-19 | 2014-03-19 | 张蕾 | Square wave pulse jet flow generator |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170322 |