CN220397971U - Cooling device for circulating cooling water - Google Patents
Cooling device for circulating cooling water Download PDFInfo
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- CN220397971U CN220397971U CN202321986239.1U CN202321986239U CN220397971U CN 220397971 U CN220397971 U CN 220397971U CN 202321986239 U CN202321986239 U CN 202321986239U CN 220397971 U CN220397971 U CN 220397971U
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- 239000000498 cooling water Substances 0.000 title claims abstract description 127
- 238000001816 cooling Methods 0.000 title claims abstract description 100
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 205
- 239000007921 spray Substances 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 230000001154 acute effect Effects 0.000 claims abstract description 8
- 238000005507 spraying Methods 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims description 39
- 239000004065 semiconductor Substances 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 15
- 230000003134 recirculating effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 125000004122 cyclic group Chemical group 0.000 abstract description 3
- 238000005057 refrigeration Methods 0.000 description 17
- 238000005087 graphitization Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 230000001502 supplementing effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Abstract
The application provides a recirculated cooling water heat sink, include: the circulating water tank is communicated with a cooling inlet of equipment to be cooled through a water outlet pipeline, and a heat exchange outlet of the equipment to be cooled is communicated with a spraying assembly through a water return pipeline; one end of the spray assembly, which is far away from the water return pipeline, penetrates through and stretches into the circulating water tank; the cooling assembly comprises a cooling fan and a plurality of cooling plates; the cooling fan sets up at the top of circulation water tank, and one side activity of a plurality of heating panels sets up in circulation water tank's interior bottom, and the contained angle between the rivers direction in every heating panel and the circulation water tank is the acute angle. The application improves the cooling efficiency of the circulating cooling water to the equipment to be cooled and the utilization rate of the equipment to be cooled, and realizes the cyclic utilization of the circulating cooling water, thereby improving the utilization efficiency of the circulating cooling water.
Description
Technical Field
The application relates to a circulating cooling water technology, in particular to a circulating cooling water cooling device.
Background
The graphitizing furnace is mainly used for high-temperature treatment of sintering and graphitizing carbon materials, graphitizing PI films, graphitizing heat conducting materials, sintering carbon fiber ropes, sintering and graphitizing carbon fiber filaments, purifying graphite powder, graphitizing other materials in a carbon environment and the like. Its use temperature is up to 3000 deg.C. High production efficiency, energy saving and electricity saving. The temperature in the furnace can be monitored in real time and automatically regulated by the on-line temperature measuring and controlling system.
Because the graphitization furnace can be recycled after being cooled after being used, the cooling of the existing graphitization furnace usually enables a circulating cooling water pipeline with circulating cooling water to penetrate through the shell of the graphitization furnace, so that the circulating cooling water in the circulating cooling water pipeline exchanges heat with the graphitization furnace when passing through the shell of the graphitization furnace, the purpose of cooling the graphitization furnace is achieved, the self temperature of the circulating cooling water is higher after heat exchange is carried out with the graphitization furnace for a plurality of times, the cooling efficiency of the circulating cooling water to the graphitization furnace is lower, and the service efficiency of the graphitization furnace is influenced, and therefore, the graphitization furnace needs to be improved.
Disclosure of Invention
The application provides a circulating cooling water cooling device for solve the technical problem among the above-mentioned background art.
In order to solve the technical problems, the application is realized by adopting the technical scheme:
the application provides a recirculated cooling water heat sink, include:
the circulating water tank is communicated with a cooling inlet of equipment to be cooled through a water outlet pipeline, and a heat exchange outlet of the equipment to be cooled is communicated with a spray assembly through a water return pipeline;
one end of the spraying assembly, which is far away from the water return pipeline, penetrates through and stretches into the circulating water tank;
the cooling assembly comprises a cooling fan and a plurality of cooling plates; the cooling fan is arranged at the top of the circulating water tank, one sides of the plurality of cooling plates are movably arranged at the inner bottom of the circulating water tank, and an included angle between each cooling plate and the water flow direction in the circulating water tank is an acute angle.
Optionally, a plurality of water diversion holes are sequentially formed in the heat dissipation plate from bottom to top, and the apertures of the water diversion holes sequentially increase from bottom to top.
Optionally, one side of each heat dissipation plate is hinged to the inner bottom of the circulating water tank, and one side of each heat dissipation plate, which forms an acute angle with the water flow direction in the circulating water tank, is connected with the inner bottom of the circulating water tank through a spring.
Optionally, semiconductor refrigeration sheets are installed on the top wall of the circulating water tank and the side wall of the upper section, the refrigeration surface of the semiconductor refrigeration sheet is located in the circulating water tank, the heating surface of the semiconductor refrigeration sheet is located outside the circulating water tank, and a heat radiating sheet is arranged on the heating surface of the semiconductor refrigeration sheet;
the circulating water tank is internally provided with a temperature sensor, and the cooling fan and the semiconductor refrigerating sheet are electrically connected with the temperature sensor.
Optionally, a circulating water pump is arranged on the water return pipeline.
Optionally, the spraying assembly comprises a main water blind pipe, a plurality of water diversion pipes and a plurality of spraying heads which are in one-to-one correspondence with the water diversion pipes;
the main water blind pipe is characterized in that the pipe body of the main water blind pipe is communicated with one end, away from the heat exchange outlet of the equipment to be cooled, of the water return pipe, one ends of the water diversion pipes are all communicated with the pipe body of the main water blind pipe, and the other ends of the water diversion pipes penetrate through and extend into the circulating water tank and are communicated with the spray header.
Optionally, the water return pipeline, the main water blind pipe and each water diversion pipe are all provided with radiating fins on the pipe body outside the circulating water tank.
Optionally, the circulating water tank is provided with a liquid level sensor and is communicated with a water supplementing pipeline, one end, away from the circulating water tank, of the water supplementing pipeline is used for being communicated with a water supply source, the water supplementing pipeline is provided with an electromagnetic valve, and the electromagnetic valve is electrically connected with the liquid level sensor.
The utility model provides a circulation cooling water heat sink provides circulation cooling water to waiting cooling device through circulation water tank, circulation cooling water and wait cooling device take place heat exchange after, wait cooling device's temperature reduction, and circulation cooling water's temperature rise, circulation cooling water after the intensification sprays into circulation water tank through spraying the subassembly in, spray the effect of circulation cooling water after the subassembly plays the dispersion intensification, make the part heat in the circulation cooling water after the intensification in time lose, circulation cooling water stirs it and disperses its direction of flow along its flow in proper order in circulation water tank's flow in-process a plurality of heating panels, circulation cooling water's heat dissipation has been accelerated, and a plurality of heating panels can take place heat exchange with circulation cooling water and quickened the cooling efficiency of circulation cooling water, cooling down to the circulation cooling water in the circulation water tank through cooling fan simultaneously. In addition, the cooling fan can also timely discharge heat emitted by the circulating cooling water in the circulating water tank, so that the temperature of the circulating cooling water after temperature rise is rapidly reduced. Therefore, the application improves the cooling efficiency of the circulating cooling water to the equipment to be cooled and the utilization rate of the equipment to be cooled, and realizes the cyclic utilization of the circulating cooling water, thereby improving the utilization efficiency of the circulating cooling water.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief description will be given below of the drawings that are needed in the embodiments or the prior art descriptions, and it is obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural diagram of a cooling device for circulating cooling water according to an embodiment of the present disclosure;
fig. 2 is a schematic view of an internal structure of a circulation tank according to another embodiment of the present application;
fig. 3 is a schematic view of a connection structure between a heat dissipating plate connection and an inner bottom of a circulation tank according to another embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a circulating water tank provided with a semiconductor refrigeration sheet according to another embodiment of the present application.
In the figure: 100. a circulation water tank; 101. a semiconductor refrigeration sheet; 1011. a heat sink; 102. a temperature sensor; 103. a liquid level sensor; 104. a water replenishing pipe; 1041. an electromagnetic valve; 200. a water outlet pipe; 300. a device to be cooled; 400. a water return pipe; 401. a circulating water pump; 500. a spray assembly; 501. a main water blind pipe; 502. a water diversion pipe; 503. a spray header; 600. a cooling component; 601. a cooling fan; 602. a heat dissipation plate; 6021. a water dividing hole; 700. and (3) a spring.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application are clearly and completely described below, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without inventive effort, are also within the scope of the present application based on the embodiments herein.
Referring to fig. 1 to 4, the present application provides a circulating cooling water cooling apparatus, comprising:
the circulating water tank 100, the circulating water tank 100 is communicated with a cooling inlet of the equipment 300 to be cooled through the water outlet pipeline 200, and a heat exchange outlet of the equipment 300 to be cooled is communicated with the spray assembly 500 through the water return pipeline 400; the circulating water tank 100 is filled with circulating cooling water, the circulating cooling water in the circulating water tank 100 sequentially enters the equipment 300 to be cooled through the water outlet pipeline 200 and the cooling inlet of the equipment 300 to be cooled and exchanges heat with the equipment 300 to be cooled, the temperature of the equipment 300 to be cooled is reduced, the temperature of the circulating cooling water is increased, and the circulating cooling water after the temperature is increased sequentially enters the spray assembly 500 through the heat exchange outlet of the equipment 300 to be cooled and the water return pipeline 400.
One end of the spray assembly 500, which is remote from the return water pipe 400, penetrates and extends into the circulation water tank 100; wherein, spray the subassembly 500 through spray the circulating cooling water that will get into in it in to circulating water tank 100, spray the subassembly 500 and spray circulating cooling water in the in-process that circulating cooling water was in circulating water tank 100 play the effect of the circulating cooling water after the dispersed temperature rise for some heat in the circulating cooling water after the temperature rise in time looses, thereby plays the purpose of cooling down the circulating cooling water after the temperature rise.
The cooling assembly 600, the cooling assembly 600 includes a cooling fan 601 and a plurality of heat dissipation plates 602; the cooling fan 601 is disposed at the top of the circulation water tank 100, one sides of the plurality of heat dissipation plates 602 are movably disposed at the inner bottom of the circulation water tank 100, and an included angle between each heat dissipation plate 602 and the water flow direction in the circulation water tank 100 is an acute angle. The heat dissipation plate 602 may be made of stainless steel, copper, aluminum, etc., so as to improve heat exchange efficiency between the heat dissipation plate 602 and the circulating cooling water after heating. Therefore, the number and material of the heat dissipation plates 602 can be set according to actual needs, and the present application is not limited thereto.
In the flowing process of the circulating cooling water in the circulating water tank 100, under the flowing force of the circulating cooling water, the included angle between the plurality of cooling plates 602 and the water flow direction in the circulating water tank 100 is continuously changed (changed from an acute angle to an obtuse angle), so that the plurality of cooling plates 602 stir and disperse the circulating cooling water along the flowing direction, heat dissipation of the circulating cooling water is accelerated, and the plurality of cooling plates 602 can exchange heat with the circulating cooling water to accelerate the cooling efficiency of the circulating cooling water, and meanwhile, the circulating cooling water in the circulating water tank 100 is cooled by the cooling fan 601. In addition, the cooling fan 601 can also discharge the heat emitted by the circulating cooling water in the circulating water tank 100 in time, so that the temperature of the circulating cooling water after temperature rising is rapidly reduced. The number of cooling fans 601 and the number of heat dissipation plates 602 may be set according to the volume of the circulation tank 100, and are not further limited herein.
The apparatus 300 to be cooled in the present application may be some small-sized apparatus used in a graphitization furnace or a factory operation, but the present application is not limited thereto. Taking a graphitizing furnace as an example, because the cooling of the existing graphitizing furnace is generally that a circulating cooling water pipeline which is communicated with circulating cooling water penetrates through the shell of the graphitizing furnace, the circulating cooling water in the circulating cooling water pipeline exchanges heat with the graphitizing furnace when passing through the shell of the graphitizing furnace, so as to achieve the purpose of cooling the graphitizing furnace, the circulating cooling water has higher self temperature after exchanging heat with the graphitizing furnace for many times, so that the cooling efficiency of the circulating cooling water on the graphitizing furnace is lower, thereby influencing the service efficiency of the graphitizing furnace, and the circulating cooling water cooling device provided by the application provides the circulating cooling water for the graphitizing furnace through the circulating water tank 100, the temperature of graphitization stove reduces, and the temperature of recirculated cooling water risees, the recirculated cooling water after the intensification sprays into recirculated water tank 100 through spray assembly 500, spray assembly 500 plays the effect of the recirculated cooling water after the dispersed intensification, make the part heat in the recirculated cooling water after the intensification in time lose, the recirculated cooling water stirs and disperses its direction along its flow in proper order in the flow process of recirculated cooling water in recirculated water tank, the heat dissipation of recirculated cooling water has been quickened, and a plurality of heating panels 602 can take place the cooling efficiency of heat exchange with recirculated cooling water for recirculated cooling water, the while carries out cooling to recirculated cooling water in the recirculated cooling water tank 100 through cooling fan. In addition, the cooling fan 601 can also discharge the heat emitted by the circulating cooling water in the circulating water tank 100 in time, so that the temperature of the circulating cooling water after temperature rising is rapidly reduced. Therefore, the cooling efficiency of circulating cooling water to the graphitization furnace and the utilization rate of the graphitization furnace are improved, and the cyclic utilization of the circulating cooling water is realized, so that the utilization efficiency of the circulating cooling water is improved.
In some embodiments, referring to fig. 2 and 3, a plurality of water diversion holes 6021 are sequentially formed on the heat dissipation plate 602 in the application from bottom to top, the hole diameters of the water diversion holes 6021 from bottom to top are sequentially increased, when the flow speed of the circulating cooling water in the circulating water tank 100 is large or the water quantity is large, the water diversion holes 6021 with smaller hole diameters at the bottom of the heat dissipation plate 602 are insufficient for the circulating cooling water entering the circulating water tank 100 to pass through, so that a part of the circulating cooling water is blocked by the heat dissipation plate 602 and then passes through the water diversion holes 6021 with larger hole diameters on the heat dissipation plate 602, and thus the circulating cooling water in the circulating water tank 100 can pass through the water diversion holes 6021 from bottom to top on each heat dissipation plate 602 as much as possible in the flowing process, so that the circulating cooling water is fully contacted with the heat dissipation plate 602 in the flowing process, the flow speed of the circulating cooling water in the circulating water tank 100 is reduced, the time of the circulating cooling water in the circulating water tank 100 is prolonged, the temperature of the circulating cooling water in the circulating cooling water to the cooling device 300 is lower, and the cooling effect of the circulating cooling water to the cooling device 300 is guaranteed. In addition, the circulating cooling water can form a water film at the water dividing holes 6021 under the action of surface tension when passing through the water dividing holes 6021, so that the heat dissipation area of the circulating cooling water is increased, and the cooling efficiency of the circulating cooling water is further improved.
In some embodiments, referring to fig. 3, one side of each heat dissipation plate 602 in the present application is hinged at an inner bottom of the circulation tank 100, and one side of each heat dissipation plate 602, which forms an acute angle with a water flow direction in the circulation tank 100, is connected with the inner bottom of the circulation tank 100 through a spring 700. Wherein, the circulating cooling water gives the heat dissipation plate 602 an impact force identical to the flowing direction of the circulating cooling water in the flowing process of the circulating water tank 100, so that the heat dissipation plate 602 and the flowing direction of the circulating water in the circulating water tank 100 gradually form an obtuse angle, and the heat dissipation plate 602 can play a role in stirring the circulating cooling water in the flowing process, thereby accelerating the heat dissipation efficiency of the circulating cooling water, and the heat dissipation plate 602 returns to the original position under the action of the elasticity of the spring 700 when the heat dissipation plate 602 is not impacted by the circulating cooling water.
In some embodiments, referring to fig. 4, semiconductor refrigeration sheets 101 are installed on the top wall and the side wall of the upper section of the circulation water tank 100 in the present application, the refrigeration surface of the semiconductor refrigeration sheet 101 is located in the circulation water tank 100, the heat-generating surface of the semiconductor refrigeration sheet 101 is located outside the circulation water tank 100, and a heat-dissipating sheet 1011 is provided on the heat-generating surface of the semiconductor refrigeration sheet 101; after the semiconductor cooling fin 101 is energized, the cooling surface of the semiconductor cooling fin 101 located in the circulation water tank 100 cools the circulation cooling water in the circulation water tank 100, and the heat of the cooling surface of the semiconductor cooling fin 101 is transferred to the heating surface of the semiconductor cooling fin 101, and then the heat dissipation surface of the semiconductor cooling fin is dissipated by the heat dissipation fin 1011 arranged on the heating surface of the semiconductor cooling fin 101, so that the cooling efficiency of the semiconductor cooling fin 101 for the circulation cooling water in the circulation water tank 100 is improved, specifically, the heat dissipation fin 1011 can be made of stainless steel, copper, aluminum or other materials, and the number of the heat dissipation fins can be set according to actual needs. Therefore, the material and number of the heat sink 1011 are not further limited in this application.
In addition, a temperature sensor 102 is provided in the circulation tank 100, and the cooling fan 601 and the semiconductor refrigeration sheet 101 are electrically connected to the temperature sensor 102. Wherein, detect the temperature of the cooling water in the circulation water tank 100 in real time through temperature sensor 102, wait when the temperature in the circulation water tank 100 is higher, temperature sensor 102 sends this signal to cooling fan 601 and semiconductor refrigeration piece 101 respectively (integrate the PLC controller on temperature sensor 102) for cooling fan 601 and semiconductor refrigeration piece 101's operating frequency increase, and then cool down the circulation cooling water in the circulation water tank 100 fast through cooling fan 601 and semiconductor refrigeration piece 101, improve the cooling efficiency of circulation cooling water.
In the above embodiment, the specifications and types of the temperature sensor 102, the cooling fan 601 and the semiconductor refrigeration sheet 101 may be selected according to actual needs, and the present application is not limited thereto.
In some embodiments, referring to fig. 1, a circulating water pump is provided on the water return line 400 in the present application. Wherein, the power of the circulating cooling water flowing in the circulating water tank 100 is provided by the circulating water pump 401, thereby ensuring the cooling efficiency of the circulating cooling water to the equipment 300 to be cooled and improving the cooling efficiency of the circulating cooling water.
In some embodiments, referring to fig. 2, a spray assembly 500 in the present application includes a main water blind pipe 501, a plurality of water diversion pipes 502, and a plurality of spray headers 503 in one-to-one correspondence with the plurality of water diversion pipes 502; specifically, the main water blind pipe 501 is connected to one end of the water return pipe 400, which is far away from the heat exchange outlet of the device 300 to be cooled, and one ends of the water diversion pipes 502 are all connected to the main water blind pipe 501, and the other ends of the water diversion pipes 502 are all penetrated and extend into the circulating water tank 100 and are connected to the shower head 503. The number of shower heads 503 may be set according to the height of the circulation tank 100, which is not further limited herein. In addition, a sealing plate is provided on a sidewall of the circulation tank 100, and the sealing plate is opened to facilitate installation of the showerhead into the circulation tank 100.
In the above embodiment, the temperature of the circulating cooling water is increased after heat exchange with the to-be-cooled device 300, the circulating cooling water after the temperature increase sequentially enters the main water blind pipe 501 through the heat exchange outlet and the water return pipe 400 of the to-be-cooled device 300, and then is sprayed into the circulating water tank 100 through the plurality of water distribution pipes 502 and the spray heads 503 corresponding to each water distribution pipe 502, compared with the circulating cooling water entering the circulating water tank 100 through one pipe, the circulating cooling water sprayed into the circulating water tank 100 through the plurality of spray heads 503 has higher dispersion degree and quickens heat dissipation of the circulating cooling water, thereby improving cooling efficiency of the circulating cooling water.
In some embodiments, the return water pipe 400, the main blind pipe 501 and each of the water diversion pipes 502 are provided with heat radiating fins on the pipe body outside the circulation tank 100. Wherein, the water return pipeline 400, the main water blind pipe 501 and each water diversion pipe 502 can be steel pipes, stainless steel pipes or copper pipes, and the like, and the radiating fins play a role in enhancing heat transfer, so as to accelerate heat dissipation in the water return pipeline 400, the main water blind pipe 501 and each water diversion pipe 502, and further play a role in cooling circulating cooling water after heat exchange with the equipment 300 to be cooled, and the radiating fins can be steel belts, stainless steel belts, copper belts, aluminum belts, and the like.
In the above embodiment, the materials of the water return pipe 400, the main blind pipe 501 and each water diversion pipe 502 and the heat dissipation fins can be selected according to actual needs, and the number of the heat dissipation fins can be set according to the lengths and pipe diameters of the water return pipe 400, the main blind pipe 501 and each water diversion pipe 502. Therefore, the materials of the return water pipe 400, the main blind pipe 501, and each of the water diversion pipes 502, the materials of the heat radiating fins, and the number of heat radiating fins are not particularly limited herein.
In some embodiments, referring to fig. 1, 2 and 4, a liquid level sensor 103 is provided on a circulation tank 100 in the present application and is communicated with a water replenishing pipe 104, one end of the water replenishing pipe 104 away from the circulation tank 100 is used for communicating with a water supply source, a solenoid valve 1041 is provided on the water replenishing pipe 104, and the solenoid valve 1041 is electrically connected with the liquid level sensor 103. The specifications and types of the liquid level sensor 103 and the solenoid valve 1041 may be selected according to actual needs, and are not specifically limited herein.
In the above embodiment, since the circulating cooling water is warmed up during the cooling of the apparatus 300 to be cooled, part of the circulating cooling water is evaporated due to the too high temperature during the warming up of the circulating cooling water, so that the amount of the circulating cooling water in the circulating water tank 100 becomes small. Therefore, in order to ensure the cooling efficiency of the apparatus 300 to be cooled by circulating cooling water, the liquid level in the circulating water tank 100 is detected in real time by the liquid level sensor 103, when the liquid level in the circulating water tank 100 detected by the liquid level sensor 103 is lower than the lowest value of the liquid level in the circulating water tank 100 (the liquid level sensor 103 is integrated with a PLC controller), the liquid level sensor 103 sends this signal to the solenoid valve 1041, the solenoid valve 1041 is opened, and water supplied from the water supply source sequentially enters the circulating water tank 100 through the water supplementing pipe 104, thereby realizing water supplementing into the circulating water tank 100, so that the circulating cooling water in the circulating water tank 100 is always sufficient to cool the apparatus 300 to be cooled, thereby improving the cooling efficiency of the apparatus 300 to be cooled by circulating cooling water.
Finally, it should be noted that the above embodiments are merely for illustrating the technical solution of the present application, and are not limiting; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand; the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims (8)
1. A recirculating cooling water chiller, comprising:
the circulating water tank (100), the circulating water tank (100) is communicated with a cooling inlet of equipment (300) to be cooled through a water outlet pipeline (200), and a heat exchange outlet of the equipment (300) to be cooled is communicated with a spray assembly (500) through a water return pipeline (400);
one end of the spraying assembly (500) far away from the water return pipeline (400) penetrates through and stretches into the circulating water tank (100);
a cooling assembly (600), the cooling assembly (600) comprising a cooling fan (601) and a plurality of cooling plates (602); the cooling fan (601) is arranged at the top of the circulating water tank (100), one sides of the plurality of cooling plates (602) are movably arranged at the inner bottom of the circulating water tank (100), and an included angle between each cooling plate (602) and the water flow direction in the circulating water tank (100) is an acute angle.
2. The cooling device for circulating cooling water according to claim 1, wherein a plurality of water diversion holes (6021) are formed in the cooling plate (602) in sequence from bottom to top, and the apertures of the water diversion holes (6021) in sequence from bottom to top are increased.
3. The circulating cooling water cooling apparatus according to claim 2, wherein one side of each of the heat dissipation plates (602) is hinged to an inner bottom of the circulating water tank (100), and one side of each of the heat dissipation plates (602) forming an acute angle with a water flow direction in the circulating water tank (100) is connected to the inner bottom of the circulating water tank (100) through a spring (700).
4. The circulating cooling water cooling device according to claim 1, wherein semiconductor refrigerating sheets (101) are mounted on the top wall and the side wall of the upper section of the circulating water tank (100), the refrigerating surface of the semiconductor refrigerating sheets (101) is positioned in the circulating water tank (100), the heating surface of the semiconductor refrigerating sheets (101) is positioned outside the circulating water tank (100), and a radiating fin (1011) is arranged on the heating surface of the semiconductor refrigerating sheets (101);
a temperature sensor (102) is arranged in the circulating water tank (100), and the cooling fan (601) and the semiconductor refrigerating sheet (101) are electrically connected with the temperature sensor (102).
5. The circulating cooling water cooling apparatus according to claim 1, wherein a circulating water pump (401) is provided on the water return pipe (400).
6. The circulating cooling water cooling apparatus according to claim 1, wherein the spray assembly (500) includes a main water blind pipe (501), a plurality of water diversion pipes (502), and a plurality of spray headers (503) in one-to-one correspondence with the plurality of water diversion pipes (502);
the pipe body of the main water blind pipe (501) is communicated with one end, away from the heat exchange outlet of the equipment to be cooled (300), of the water return pipe (400), one ends of the water diversion pipes (502) are all communicated with the pipe body of the main water blind pipe (501), and the other ends of the water diversion pipes (502) penetrate through and extend into the circulating water tank (100) and are communicated with the spray header (503).
7. The circulating cooling water cooling apparatus according to claim 6, wherein the return water pipe (400), the main water blind pipe (501) and each of the water diversion pipes (502) are provided with heat radiating fins on a pipe body located outside the circulating water tank (100).
8. The circulating cooling water cooling apparatus according to any one of claims 1 to 7, wherein a liquid level sensor (103) is provided on the circulating water tank (100) and is communicated with a water replenishment pipe (104), one end of the water replenishment pipe (104) away from the circulating water tank (100) is used for communicating with a water supply source, a solenoid valve (1041) is provided on the water replenishment pipe (104), and the solenoid valve (1041) is electrically connected with the liquid level sensor (103).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321986239.1U CN220397971U (en) | 2023-07-27 | 2023-07-27 | Cooling device for circulating cooling water |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321986239.1U CN220397971U (en) | 2023-07-27 | 2023-07-27 | Cooling device for circulating cooling water |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220397971U true CN220397971U (en) | 2024-01-26 |
Family
ID=89605466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321986239.1U Active CN220397971U (en) | 2023-07-27 | 2023-07-27 | Cooling device for circulating cooling water |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220397971U (en) |
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2023
- 2023-07-27 CN CN202321986239.1U patent/CN220397971U/en active Active
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