CN218163404U - Cooling system - Google Patents

Cooling system Download PDF

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CN218163404U
CN218163404U CN202222117403.7U CN202222117403U CN218163404U CN 218163404 U CN218163404 U CN 218163404U CN 202222117403 U CN202222117403 U CN 202222117403U CN 218163404 U CN218163404 U CN 218163404U
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water
heat
pipeline
pump
water inlet
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张鹏
方大伟
金建明
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Dawning Data Infrastructure Innovation Technology Beijing Co ltd
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Dawning Data Infrastructure Innovation Technology Beijing Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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Abstract

The present application relates to a cooling system. The cooling system includes: at least one cooling device and an atomizing spray device; each cooling device comprises a cold source device, a heat exchanger and a liquid cooling mechanism; the heat exchanger comprises a heat-releasing side and a heat-absorbing side; the heat exchanger heat-radiating side is communicated with the cold source device through a pipeline to form a primary side circulation loop for the heat-radiating medium to circularly flow; the heat absorption side of the heat exchanger is communicated with the liquid cooling mechanism through a pipeline to form a secondary side circulation loop for the heat absorption medium to circularly flow; the atomization spraying device comprises a plurality of atomizers, and the spray heads of the atomizers are arranged towards the cold source device so as to spray atomized water onto the cold source device. By adopting the system, the server of the data center can be cooled by opening the auxiliary cooling device of the atomization spraying device, so that the energy consumption of the data center can be reduced, and the safe operation of the data center is ensured.

Description

Cooling system
Technical Field
The application relates to the technical field of data center cooling, in particular to a cooling system.
Background
With the rapid development of industry technologies such as cloud computing, internet of things, big data and artificial intelligence, the demand for timely and efficient processing of mass data is continuously increased, and the energy consumption is very high when the data center is used as the infrastructure of the bottom layer of data processing.
Generally, a data center mainly includes three parts, i.e., IT equipment, a cooling system and auxiliary equipment, and the energy consumption of the cooling system in the three parts accounts for about 30% of the total energy consumption of the data center.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is necessary to provide a cooling system for solving the above technical problems.
The present application provides a cooling system comprising: at least one cooling device and an atomizing spray device; each cooling device comprises a cold source device, a heat exchanger and a liquid cooling mechanism; the heat exchanger comprises a heat exchanger heat-releasing side and a heat exchanger heat-absorbing side;
the heat exchanger heat-radiating side is communicated with the cold source device through a pipeline to form a primary side circulation loop for the heat-radiating medium to circularly flow; the heat absorption side of the heat exchanger is communicated with the liquid cooling mechanism through a pipeline to form a secondary side circulation loop for the heat absorption medium to circularly flow;
the atomization spraying device comprises a plurality of atomizers, and the spray heads of the atomizers are arranged towards the cold source device so as to spray atomized water onto the cold source device.
According to the embodiment of the application, the auxiliary cooling device of the atomization spraying device can be started to cool the data center server, so that the energy consumption of the data center can be reduced, the safe operation of the data center can be ensured, and the cooling speed of the data center server can be increased; in addition, the cooling mode realized by the cooling system is not limited by regions and seasons, and safe and effective auxiliary cooling guarantee can be provided for the data center, so that the cooling system has wider application range for cooling the data center server, and the wide applicability of the cooling system is improved.
In one embodiment, the atomization spraying device further comprises a water storage tank and a spraying pump;
the water filling port is connected at the water inlet end of the water storage tank, the water outlet end of the water storage tank is connected with the water inlet end of the spray pump through a pipeline, and the water outlet end of the spray pump is connected with the water inlet ends of the atomizers through a pipeline.
This application embodiment can carry out cooling to the data center server through opening atomizing spray set auxiliary cooling device to let the data center server reach the target cooling demand, and can also improve the cooling speed of data center server.
In one embodiment, the atomization spraying device further comprises a water treatment unit, the water filling port is connected to the water inlet end of the water treatment unit, and the water outlet end of the water treatment unit is connected with the water inlet end of the water storage tank through a pipeline.
The embodiment of the application can filter the impurity of the aquatic that the atomizer provided to can reduce the impurity precipitation of storage water tank normal water, reduce the washing frequency of storage water tank, reduce and wash the cost.
In one embodiment, the atomization spraying device further comprises a first electromagnetic valve and a second electromagnetic valve; the first electromagnetic valve is connected between the water storage tank and the spray pump, and the second electromagnetic valve is connected on the water supply pipeline of each atomizer.
The embodiment of the application can control the flow of pipeline normal water and the discharge of pipeline normal water in the spray set through two solenoid valves, provide water to realize supplementary cooling through one of them solenoid valve operation for the atomizer among the spray set when needs spray set supplementary cooling device carries out cooling, improve cooling speed, and simultaneously, can arrange the deposit water in the water supply pipe of each atomizer completely when ambient temperature is lower through another solenoid valve operation, by frost crack to prevent the pipeline among the spray set, influence cooling system's supplementary cooling function.
In one embodiment, the primary-side circulation loop further comprises a first circulation pump;
the water outlet end of the cold source device is connected with the water inlet end of the first circulating pump, the water outlet end of the first circulating pump is connected with the water inlet end of the heat radiating side of the heat exchanger, and the water outlet end of the heat radiating side of the heat exchanger is connected with the water inlet end of the cold source device.
This application embodiment can be through the circulating pump operation in the circulation loop of once inclining to the water cycle in the circulation loop flows to distribute away the heat in the data center server through cooling device, thereby reach the purpose of cooling.
In one embodiment, the primary-side circulation loop further comprises a first regulating valve; the first regulating valve is connected in parallel between the water inlet pipe and the water outlet pipe of the cold source device.
This application embodiment can be through the aperture of adjusting the governing valve, control the flow increase that gets into the water in the pipeline between cold source ware and the heat exchanger to water in the outlet conduit to the cold source ware mixes, with the leaving water temperature who reduces the cold source ware.
In one embodiment, the secondary side circulation loop comprises a second circulation pump and a second regulating valve;
the water outlet end of the heat absorption side of the heat exchanger is connected with the water inlet end of the second circulating pump, the water outlet end of the second circulating pump is connected with the water inlet end of the liquid cooling mechanism, the water outlet end of the liquid cooling mechanism is connected with one end of the second regulating valve, and the other end of the second regulating valve is connected with the water inlet end of the heat absorption side of the heat exchanger.
According to the embodiment of the application, the heat generated by the data center server can be taken away by enabling the water in the pipeline in the secondary side circulation loop to circularly flow through the circulating pump, and the flow speed and the flow of the water in the pipeline in the secondary side circulation loop can be controlled through the circulating pump and the regulating valve in the secondary side circulation loop, so that the heat dissipation speed of the data center server can be directly controlled.
In one embodiment, the cold source comprises a plurality of dry coolers arranged in parallel; the cooling system also comprises a water supply ring network, a water return ring network and a plurality of heat exchangers;
the water outlet end of each dry cooler is connected to one end of a water supply ring network through a pipeline, and the other end of the water supply ring network is connected with the water inlet end of the heat release side of each heat exchanger through a pipeline;
the water inlet end of each dry cooler is connected to one end of a water return ring network through a pipeline, and the other end of the water return ring network is connected with the water outlet end of the heat release side of each heat exchanger through a pipeline.
This application embodiment can set up a plurality of liquid cooling mechanisms to absorb the heat that data center server produced simultaneously through a plurality of liquid cooling mechanisms, thereby improve data center server's cooling speed, simultaneously, when some liquid cooling mechanism among this cooling system broke down, can also carry out cooling through normal operating's liquid cooling mechanism work in order to carry out cooling to data center server, can not influence the process of carrying out cooling to data center server.
In one embodiment, the cooling system further comprises a heat recovery device, the heat recovery device comprises a water source heat pump, a hot water circulating pump and a hot water storage tank, and the water source heat pump comprises a water source heat pump heat absorption end and a water source heat pump heat release end;
the water inlet end of the heat absorption end of the water source heat pump is connected with the water inlet end of the cold source device through a pipeline, and the water outlet end of the heat absorption end of the water source heat pump is connected with the water outlet end of the cold source device through a pipeline; the water outlet end of the heat release end of the water source heat pump is connected with the water inlet end of the hot water circulating pump, and the water outlet end of the hot water circulating pump is connected with the water inlet end of the first side of the hot water storage tank; the water outlet end of the heat release end of the water source heat pump is connected with the water inlet end of the first side of the hot water storage tank through a pipeline, and the water inlet end of the heat release end of the water source heat pump is connected with the water inlet end of the first side of the hot water storage tank through a pipeline; the water inlet and outlet ends of the second side of the hot water storage tank are respectively connected to the water end.
The embodiment of the application can carry out heat recovery to the heat of the data center server through the heat recovery device, thereby enabling the heat to be recycled, reducing the waste of heat, avoiding aggravating the heat island effect of the current environment, reducing the energy consumption of the data center and achieving the purpose of cooling the data center.
In one embodiment, the heat recovery device further comprises a third regulating valve, the water inlet end of the heat absorbing end of the water source heat pump is connected with one end of the third regulating valve, and the other end of the third regulating valve is connected to a pipeline between the water inlet end of the cold source device and the water outlet end of the heat discharging side of the heat exchanger.
The embodiment of the application can control the flow of water in the heat recovery pipeline by adjusting the opening of the adjusting valve in the heat recovery device, further increase the heat recovery speed, and further improve the cooling speed of the data center server.
Drawings
FIG. 1 is a block diagram of a cooling system according to an embodiment;
FIG. 2 is a block diagram showing the construction of a cooling system in another embodiment;
FIG. 3 is a schematic view showing a detailed structure of a cooling system in another embodiment;
FIG. 4 is a schematic view showing a detailed structure of a cooling system in another embodiment;
fig. 5 is a schematic diagram showing a detailed structure of a cooling system in another embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The ordinal numbers used herein for the components, such as "first," "second," etc., are used merely to distinguish between the objects described, and do not have any sequential or technical meaning. The term "connected" and "coupled" as used herein includes both direct and indirect connections (couplings), unless otherwise specified. In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like are used in the orientations and positional relationships indicated in the drawings, which are based on the orientations and positional relationships indicated in the drawings, and are used for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.
In this application, unless expressly stated or limited otherwise, a first feature is "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In order to make the objects, technical solutions and advantages of the present application more clearly understood, the technical solutions in the embodiments of the present application are further described in detail by the following embodiments in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.
The cooling system provided by the embodiment of the application can be used in a data center cooling scene, but is not limited to the scene. Fig. 1 is a block diagram of a cooling system according to an embodiment of the present disclosure, where the cooling system may include: at least one cooling device 11 and an atomizing spray device 12; each cooling device 11 comprises a cold source device 111, a heat exchanger 112 and a liquid cooling mechanism 113; the heat exchanger 112 comprises a heat-releasing side of the heat exchanger 112 and a heat-absorbing side of the heat exchanger 112;
the heat-radiating side of the heat exchanger 112 is communicated with the cold source device 111 through a pipeline to form a primary side circulation loop for the heat-radiating medium to circularly flow; the heat absorption side of the heat exchanger 112 is communicated with the liquid cooling mechanism 113 through a pipeline to form a secondary side circulation loop for the heat absorption medium to circularly flow; the atomization spray device 12 includes a plurality of atomizers 121, and a spray head of each atomizer 121 is disposed toward the cold sink 111 to spray the atomized water onto the cold sink 111.
Specifically, the cooling system comprises at least one cooling device 11 and an atomization spray device 12, and the at least one cooling device 11 is connected with the atomization spray device 12. In order to save the equipment cost, the cooling system in the embodiment of the present application only includes one atomization spray device 12. Alternatively, if a plurality of cooling devices 11 are included in the cooling system and are connected to the atomizing spray devices 12, each cooling device 11 and each atomizing spray device 12 may be connected in parallel. Fig. 1 illustrates a cooling system comprising two cooling devices 11 and one atomizing spray device 12, wherein the atomizing spray device 12 may also be connected to only one of the cooling devices 11.
Alternatively, each cooling device 11 in the cooling system may be implemented by a pipe, a thermostat, a water pump, a refrigerator, a radiator fan, and/or a reservoir tank, among other components. In the embodiment of the present application, each cooling device 11 includes a cold sink 111, a heat exchanger 112, and a liquid cooling mechanism 113. Alternatively, the above-mentioned piping may be implemented by a liquid pipe.
It will be appreciated that the heat sink 111 described above may be used to reduce the temperature of the water in the pipe of the cooling device 11. The liquid flowing in all the pipelines in the cooling system may be other liquid media besides water, and the embodiment of the present application is described by taking water as an example. Alternatively, the cold sink 111 may be one or more dry coolers; if the cold source 111 includes a plurality of chillers, the chillers may be connected in series.
The heat exchanger 112 may be a heat exchanger with a runner, a coil thermal ring, or a heat pipe. Alternatively, the liquid cooling mechanism 113 may be implemented by a cooling container, a semiconductor refrigeration device, a radiator, a fan assembly, an outer case, a resilient plate, a heat conducting pad, and/or a heat insulating member, but in this embodiment, the liquid cooling mechanism 113 may be a liquid cooling cabinet or a liquid cooling plate.
It is understood that the heat exchanger 112 includes a primary side and a secondary side, in the embodiment of the present application, the primary side may be referred to as a heat-releasing side of the heat exchanger 112, the secondary side may be referred to as a heat-absorbing side of the heat exchanger 112, and the primary side and the secondary side are isolated and only heat can be exchanged. Optionally, in order to achieve the effects of increasing the heat transfer coefficient, improving the heat exchange efficiency, reducing the heat loss, being compact and light in structure, occupying small area, being convenient to install and clean and the like, the heat exchanger 112 in the cooling system can be designed as a plate heat exchanger, and plates in the plate heat exchanger can be increased and decreased according to the cooling requirement, so that the design can be flexibly performed according to the cooling requirement. Alternatively, the primary-side circulation circuit may be referred to as a heat-release-side circulation circuit, and the secondary-side circulation circuit may be referred to as a heat-absorption-side circulation circuit.
The primary side circulation loop is formed by a heat-radiating side of a heat exchanger 112, a cold source device 111 and a pipeline; the secondary side circulation circuit is formed by the heat absorbing side of the heat exchanger 112, the liquid cooling mechanism 113 and the piping. Alternatively, part of the pipeline in the primary-side circulation loop may be disposed through the cold sink 111 and the heat-discharging side of the heat exchanger 112; part of the piping in the secondary side circulation circuit may be provided through the inside of the liquid cooling mechanism 113 and the heat absorbing side of the heat exchanger 112.
It should be noted that the atomizing spray device 12 in the cooling system may be implemented by an atomizer 121 and/or a pipeline. However, in the embodiment of the present application, the atomizing spray device 12 includes a plurality of atomizers 121, and the plurality of atomizers 121 may be disposed around the heat sink 111, and the spray heads of the atomizers 121 are disposed toward the heat sink 111, so that the mist particles sprayed from the atomizers 121 can act on the outer side of the heat sink 111, and the purpose of reducing the temperature of the environment around the heat sink 111 is fully achieved. Alternatively, the different atomizers 121 may be disposed around the heat sink 111 at different intervals, which is not limited in this embodiment. Optionally, a water storage tank may be disposed inside the atomizer 121, and the atomizer 121 may atomize water in the water storage tank and spray the atomized water to the outer wall of the cold source 111. Alternatively, the atomizer 121 may be understood as a device that converts water into atomized particles.
The cooling system provided by the embodiment of the application can cool the data center server by starting the auxiliary cooling device of the atomization spraying device, so that the energy consumption of the data center can be reduced, the safe operation of the data center is ensured, and the cooling speed of the data center server can be increased; in addition, the cooling mode realized by the cooling system is not limited by regions and seasons, and safe and effective auxiliary cooling guarantee can be provided for the data center, so that the cooling system has wider application range for cooling the data center server, and the wide applicability of the cooling system is improved.
The structure of the atomizing spray device 12 will be described in the following embodiment of the present application. In an embodiment, as shown in fig. 2, which is a schematic structural diagram of a cooling system, on the basis of the structure of the atomization spray device 12 in fig. 1, the atomization spray device 12 in the cooling system further includes a water storage tank 122 and a spray pump 123;
the water filling port is connected to the water inlet end of the water storage tank 122, the water outlet end of the water storage tank 122 is connected to the water inlet end of the spray pump 123 through a pipeline, and the water outlet end of the spray pump 123 is connected to the water inlet ends of the atomizers 121 through a pipeline.
In the embodiment of the present application, the atomizing spray device 12 further includes a water storage tank 122 and a spray pump 123. The water storage tank 122 is used for storing water to provide water to be atomized for the atomizer 121; after the spraying pump 123 is turned on, the water in the water storage tank 122 can be delivered to each atomizer 121.
It should be noted that the capacity of the water storage tank 122 may be any value, and may also be determined according to the cooling requirement. Alternatively, the water storage tank 122 may be made of corrosion-resistant plastic, metal, or the like. Alternatively, a certain amount of water may be injected into the water storage tank 122 through a water injection port provided on the water storage tank 122.
Optionally, a spray pump 123 is connected between the water storage tank 122 and each atomizer 121. Alternatively, the spray pump 123 may be understood as a water pump that provides a certain pressure and continuous water flow to the atomizer 121. Wherein, the spray pump 123 can be a booster pump, an axial flow pump, a centrifugal pump, a mixed flow pump, and the like.
Further, in order to reduce the failure frequency of the atomizer 121 and increase the service life of the atomizer 121, it is necessary to filter impurities in the water supplied from the atomizer 121. Based on this, in an embodiment, as shown in fig. 2, the atomizing spray device 12 further includes a water treatment unit 124, the water inlet is connected to the water inlet of the water treatment unit 124, and the water outlet of the water treatment unit 124 is connected to the water inlet of the water storage tank 122 through a pipeline.
It will be appreciated that the water to be injected into the storage tank 122 may first pass through the water treatment unit 124 in the atomizing spray device 12 to filter impurities in the water provided by the atomizer 121.
The embodiment of the application can filter the impurity of the aquatic that the atomizer provided to can reduce the impurity precipitation of storage water tank normal water, reduce the washing frequency of storage water tank, reduce the washing cost.
The cooling system that this application embodiment provided can carry out cooling to the data center server through opening atomizing spray set auxiliary cooling device to let the data center server reach the target cooling demand, and can also improve the cooling speed of data center server.
Fig. 3 is a schematic structural diagram of a cooling system according to another embodiment. On the basis of the embodiment of fig. 2, the atomizing spray device 12 further includes a first solenoid valve 125 and a second solenoid valve 126; the first solenoid valve 125 is connected between the water storage tank 122 and the spray pump 123, and the second solenoid valve 126 is connected to the water supply line of each atomizer 121.
In particular, the first solenoid valve 125 in the atomizing spray device 12 can be understood as an on-off valve for controlling the water in the pipeline between the spray pump 123 and the water storage tank 122 to flow back into the water storage tank 122 and controlling the water in the water storage tank to flow to each atomizer 121.
The second solenoid valve 126 and the first solenoid valve 125 may be of the same type and material, or may be of different materials. The water in the pipe of the atomizing spray device 12 is drained mainly by draining the water stored in the water supply pipe of each atomizer 121, so the second electromagnetic valve 126 can be disposed on the water supply pipe of each atomizer 121 to drain the water in the pipe of each atomizer 121 more effectively.
In addition, a plurality of atomizers 121 in the atomizing spray device 12 are uniformly spaced and wrapped around the cold source 111.
In this application embodiment, the even interval setting of a plurality of atomizers 121 among the atomizing spray set 12 wraps up around cold source ware 111 to can carry out even cooling to cold source ware 111 through a plurality of atomizers 121, improve cold source ware 111's cooling rate.
The utility model provides an atomizing spray set among cooling system can control the flow of pipeline normal water and the discharge of pipeline normal water in the atomizing spray set through two solenoid valves, provide water for the atomizer among the atomizing spray set through one of them solenoid valve operation when the supplementary cooling device of needs atomizing spray set carries out cooling and realize supplementary cooling, improve cooling speed, simultaneously, can arrange the water deposit in the water supply pipe of each atomizer completely when ambient temperature is lower through another solenoid valve operation, in order to prevent that the pipeline among the atomizing spray set from being frost crack, influence cooling system's supplementary cooling function.
In one embodiment, with continued reference to fig. 3, the primary-side circulation loop in the cooling system further includes a first circulation pump 114; the water outlet end of the cold source device 111 is connected with the water inlet end of the first circulating pump 114, the water outlet end of the first circulating pump 114 is connected with the water inlet end of the heat-radiating side of the heat exchanger 112, and the water outlet end of the heat-radiating side of the heat exchanger 112 is connected with the water inlet end of the cold source device 111.
Specifically, a first circulation pump 114 is further provided on the primary-side circulation circuit in the above-described cooling system. In the embodiment of the present application, the first circulation pump 114 can control the flow of water in the pipe in the primary-side circulation loop, and can adjust the flow rate of water in the pipe.
Alternatively, the first circulation pump 114 may be a booster pump, an axial flow pump, a centrifugal pump, a mixed flow pump, or the like. Alternatively, the operating speed of the first circulation pump 114 may also control the flow rate of water in the primary-side circulation loop. Wherein, the larger the flow velocity of water in the primary side circulation loop is, the faster the heat dissipation of the water is.
Further, with continued reference to fig. 3, the primary-side circulation circuit further includes a first regulator valve 115; the first adjusting valve 115 is connected in parallel between the inlet and outlet pipes of the cold sink 111.
It will be appreciated that the cold sink in the cooling system shown in fig. 3 comprises a dry cooler. The first regulating valve 115 is not included in the primary-side circulation circuit in the cooling system, and the first regulating valve 115 in the primary-side circulation circuit in the cooling device 11 may be a manual regulating valve, a pneumatic regulating valve, an electric regulating valve, or a hydraulic regulating valve, etc.
Generally, the temperature of the water outlet of the heat sink 111 in the cooling device 11 cannot be too high, and if the temperature of the water outlet of the heat sink 111 is too high, the cooling requirement of the data center server cannot be met or the cooling speed is slow, so the first adjusting valve 115 is further disposed in the primary side circulation loop in the embodiment of the present application. The first adjusting valve 115 is disposed in parallel on a pipeline between a pipeline where a water inlet of the cold source device 111 is located and a pipeline where a water outlet of the cold source device 111 is located, so as to control the flow of water entering the pipeline between the cold source device 111 and the heat exchanger 112 to increase by adjusting the opening degree of the first adjusting valve 115, thereby mixing water in a water outlet pipeline of the cold source device 111, and reducing the temperature of outlet water of the cold source device 111. Alternatively, the regulating valve is arranged on the pipeline, which means that the regulating valve is arranged in the middle of the pipeline, i.e. both ends of the regulating valve are connected with the pipeline.
In this embodiment, water in the primary-side circulation loop may flow from the water outlet on the heat-releasing side of the heat exchanger 112 to the water inlet of the heat sink 111, and then flow from the water outlet of the heat sink 111 to the pipeline where the first circulation pump 114 is disposed to enter the water inlet on the heat-releasing side of the heat exchanger 112.
The primary side circulation loop in the cooling system provided by the embodiment of the application can make the water circulation in the primary side circulation loop flow through the operation of the circulating pump, so that the heat in the data center server is dissipated through the cooling device, and the purpose of cooling is achieved.
In one embodiment, with continued reference to fig. 3, the secondary side circulation loop of the cooling system includes: a second circulation pump 116 and a second regulating valve 117;
the water outlet end of the heat absorption side of the heat exchanger 112 is connected with the water inlet end of the second circulating pump 116, the water outlet end of the second circulating pump 116 is connected with the water inlet end of the liquid cooling mechanism 113, the water outlet end of the liquid cooling mechanism 113 is connected with one end of a second regulating valve 117, and the other end of the second regulating valve 117 is connected with the water inlet end of the heat absorption side of the heat exchanger 112.
Specifically, the secondary-side circulation circuit in the cooling system includes a second circulation pump 116 and a second regulator valve 117. Optionally, a pipeline is further included in the secondary side circulation loop. The second circulation pump 116 can control the flow of water in the pipeline in the secondary side circulation loop and can adjust the flow rate of water in the pipeline; the second regulating valve 117 is used to regulate the flow of water in the pipe in the secondary side circulation loop.
Alternatively, second regulator valve 117 may or may not be the same type as first regulator valve 115. Alternatively, the second regulating valve 117 may be provided on a pipe between the water outlet side of the liquid cooling mechanism 113 and the water inlet side of the heat absorbing side of the heat exchanger 112.
The cooling system provided by the embodiment of the application can take away heat generated by the data center server by enabling water in the pipeline in the secondary side circulation loop to circularly flow through the second circulating pump, and can control the flow speed and flow of the water in the pipeline in the secondary side circulation loop through the circulating pump and the regulating valve in the secondary side circulation loop, so that the heat dissipation speed of the data center server can be directly controlled.
The following embodiment of the present application will describe a specific structural schematic diagram of the cooling system. In one embodiment, as shown in fig. 4, the cold sink 111 in the cooling system includes a plurality of dry coolers 1111 disposed in parallel; the cooling system also comprises a water supply ring network 118, a water return ring network 119 and a plurality of heat exchangers 112;
the water outlet end of each dry cooler 1111 is connected to one end of the water supply ring network 118 through a pipeline, and the other end of the water supply ring network 118 is connected to the water inlet end of the heat release side of each heat exchanger 112 through a pipeline;
the water inlet end of each dry cooler 1111 is connected to one end of the return ring network 119 through a pipeline, and the other end of the return ring network 119 is connected to the water outlet end of the heat release side of each heat exchanger 112 through a pipeline.
In this embodiment, in order to increase the heat dissipation speed of the water in the primary side circulation loop, the heat sink 111 includes a plurality of dry coolers 1111, and the plurality of dry coolers 1111 in the heat sink 111 may be set to be in a parallel structure, and in addition, the design may also be performed to dissipate the heat of the water in the primary side circulation loop through the normally operating dry coolers 1111 when some dry coolers 1111 in the heat sink 111 fail. Figure 4 shows a cooling system in which 3 dry coolers 1111 are included in the cold sink,
specifically, the cooling system further includes a water supply ring network 118, a water return ring network 119 and a plurality of heat exchangers 112, in addition to at least one cooling device 11 and the atomization spray device. Alternatively, the shapes and sizes of the water supply ring network 118 and the water return ring network 119 may be the same. Meanwhile, the water supply ring network 118 and the water return ring network 119 may be ring structures of different shapes formed by pipelines, such as a circular ring structure, a square ring structure, and the like.
It is understood that a plurality of hole structures can be arranged on each of the water supply ring network 118 and the water return ring network 119. Alternatively, a plurality of hole structures on the water supply and return ring networks 118 and 119 may be used to connect the pipes in the primary side circulation loop. Optionally, the plurality of hole-shaped structures on the water supply ring network 118 and the water return ring network 119 may include water inlets and water outlets, and the number of the water inlets on the water supply ring network 118 and the number of the water outlets on the water return ring network 119 may be equal to or different from the number of the water outlets on the water supply ring network 118 and the water return ring network 119.
Alternatively, the number of the water inlet holes on the water supply ring network 118 may be equal to the number of the dry coolers 1111 in the cold sink 111; the number of water outlet holes in the feeding ring network 118 may be one or more. Optionally, the number of the water inlet holes on the return ring network 119 may be one or more, and the number of the water outlet holes on the return ring network 119 may be equal to the number of the dry coolers 1111 in the cold source device 111. Alternatively, the connection of the water inlet hole of the water supply ring network 118 and the pipeline may be referred to as a water inlet end of the water supply ring network 118, and the connection of the water outlet hole of the water supply ring network 118 and the pipeline may be referred to as a water outlet end of the water supply ring network 118. Optionally, the water inlet of the water return ring network 119 is connected with the pipeline and can be called as a water inlet end of the water return ring network 119, and the water outlet of the water return ring network 119 is connected with the pipeline and can be called as a water outlet end of the water return ring network 119.
It should be noted that the water supply looped network 118 and the water return looped network 119 may be independently arranged, but in the embodiment of the present application, in order to save the volume of the cooling system, the sizes of the water supply looped network 118 and the water return looped network 119 may be set to different sizes, and the water supply looped network 118 and the water return looped network 119 may be nested. Optionally, the water supply ring network 118 and the water return ring network 119 may be fixed by being connected to a pipeline respectively.
In the embodiment of the present application, in order to increase the heat dissipation speed of the data center server as much as possible, a plurality of heat exchangers 112 are disposed in the cooling system, and in this case, the number of water outlets disposed on the water supply ring network 118 in the cooling system is equal to the number of heat exchangers 112 in the cooling system, and the number of water inlets disposed on the water return ring network 119 in the cooling system is also equal to the number of heat exchangers 112 in the cooling system.
Alternatively, the heat exchanger 112 includes a primary side and a secondary side, in this embodiment, the primary side may be referred to as a heat-releasing side of the heat exchanger 112, the secondary side may be referred to as a heat-absorbing side of the heat exchanger 112, and the primary side and the secondary side are isolated and only heat can be exchanged. Optionally, in order to achieve the effects of increasing the heat transfer coefficient, improving the heat exchange efficiency, reducing the heat loss, being compact and light in structure, occupying small area, being convenient to install and clean and the like, the heat exchanger 112 in the cooling system can be designed as a plate heat exchanger, and plates in the plate heat exchanger can be increased and decreased according to the cooling requirement, so that the plate heat exchanger can be flexibly designed according to the cooling requirement. In the embodiment of the present application, the primary-side circulation circuit may be referred to as a heat-releasing-side circulation circuit in the cooling system, and the secondary-side circulation circuit may be referred to as a heat-absorbing-side circulation circuit in the cooling system.
Wherein, the water outlet end of each dry cooler 1111 in the cold source device 111 is connected to the water inlet end of the water supply ring network 118 through a pipeline, and the water outlet end of the water supply ring network 118 is connected to the water inlet end of the heat discharge side of each heat exchanger 112 through a pipeline; the water inlet ends of the dry coolers 1111 in the cold source device 111 are connected to the water outlet end of the return ring network 119 through pipelines, and the water inlet ends of the return ring network 119 are connected to the water outlet ends of the heat discharging sides of the heat exchangers 112 through pipelines.
Further, the cooling system further includes a plurality of liquid cooling mechanisms 113, and each heat exchanger 112 is connected to one liquid cooling mechanism 113 through a pipe.
It is also understood that the cooling system further includes the liquid cooling mechanisms 113, and the number of the liquid cooling mechanisms 113 and the number of the heat exchangers 112 may be the same. In the cooling system, each heat exchanger 112 has a corresponding liquid cooling mechanism 113 connected thereto. Alternatively, the liquid cooling mechanism 113 may be implemented by a cooling container, a semiconductor refrigeration device, a radiator, a fan assembly, an outer case, a resilient plate, a heat conducting pad, and/or a heat insulating member, but in this embodiment, the liquid cooling mechanism 113 may be a liquid cooling cabinet or a liquid cooling plate.
In the embodiment of the application, a primary side circulation loop in the cooling system is formed by a heat-releasing side of a heat exchanger 112, a cold source device 111, a first circulation pump 114, a first regulating valve 115, a water supply ring network 118, a water return ring network 119 and a pipeline; the secondary side circulation loop is formed by the heat absorption side of the heat exchanger 112, the liquid cooling mechanism 113, the second circulation pump 116, the second regulating valve 117 and a pipeline.
The cooling system in this application embodiment can set up a plurality of liquid cooling mechanisms to absorb the heat that data center server produced simultaneously through a plurality of liquid cooling mechanisms, thereby improve the cooling speed of data center server, simultaneously, when some liquid cooling mechanism among this cooling system broke down, can also carry out cooling through the work of the liquid cooling mechanism of normal operating in order to carry out cooling to data center server, can not influence the process of carrying out cooling to data center server.
In order to recycle the heat generated by the data center server and reduce the waste of heat, a heat recovery device can be arranged in the cooling system. In an embodiment, as shown in fig. 5, the cooling system further includes a heat recovery device 13, the heat recovery device 13 includes a water source heat pump 131, a hot water circulating pump 132, and a hot water storage tank 133, the water source heat pump 131 includes a heat absorption end of the water source heat pump 131 and a heat release end of the water source heat pump 131;
the water inlet end of the heat absorption end of the water source heat pump 131 is connected with the water inlet end of the cold source device 111 through a pipeline, and the water outlet end of the heat absorption end of the water source heat pump 131 is connected with the water outlet end of the cold source device 111 through a pipeline; the water outlet end of the heat release end of the water source heat pump 131 is connected with the water inlet end of the hot water circulating pump 132, and the water outlet end of the hot water circulating pump 132 is connected with the water inlet end of the first side of the hot water storage tank 133; the water outlet end of the heat release end of the water source heat pump 131 is connected with the water inlet end of the first side of the hot water storage tank 133 through a pipeline, and the water inlet end of the heat release end of the water source heat pump 131 is connected with the water inlet end of the first side of the hot water storage tank 133 through a pipeline; the water inlet and outlet ends of the second side of the hot water storage tank 133 are connected to the water end respectively.
In which fig. 5 shows a cooling system comprising only one cooling device. Specifically, the heat recovery device 13 in the cooling system includes a water source heat pump 131, a hot water circulation pump 132, and a hot water storage tank 133. In the embodiment of the present application, the water source heat pump 131, the hot water circulating pump 132, the hot water storage tank 133, the heat-releasing side of the heat exchanger 112, and part of the pipeline in the cooling system form a heat recovery loop. Optionally, the medium in the pipeline in the heat recovery circuit may also be water, or other liquid mediums, and this application is not limited to this embodiment.
It is understood that the water source heat pump 131 may be a cold and hot water type water source heat pump; the cold and hot water type water source heat pump can be a cold and hot water type water source heat pump and can also be a heat pump type water source heat pump. Optionally, the cold and hot water type water source heat pump may be an integral structure or a split structure. The water source heat pump 131 includes a heat absorption end of the water source heat pump 131 and a heat release end of the water source heat pump 131. Alternatively, the end of the water source heat pump 131 directly connected with the heat release end of the heat exchanger 112 through a pipeline may be referred to as the heat absorption end of the water source heat pump 131; the other end of the water source heat pump 131 not directly connected with the heat release end of the heat exchanger 112 can be called as the heat release end of the water source heat pump 131.
The hot water circulation pump 132 may be a booster pump, an axial flow pump, a centrifugal pump, a mixed flow pump, or the like. Alternatively, the hot water circulation pump 132 may be provided on a pipe between the water source heat pump 131 and the hot water storage tank 133.
In the embodiment of the present application, the water inlet and outlet ends of one side of the hot water storage tank 133 may be respectively connected to the water using ends. Alternatively, the water using end may be a radiator, air conditioner, water heater, or the like.
The cooling system that this application embodiment provided can carry out heat recovery to the heat of data center server through heat recovery unit 13 to can make the heat by recycle, reduce thermal waste, avoid aggravating the heat island effect of current environment, so not only can reduce data center's energy consumption, can also reach the purpose of carrying out cooling to data center.
In some scenarios, the heat recovery device 13 in the cooling system also needs to adjust the heat recovery speed during the process of performing heat recovery, and based on this, a regulating valve may be provided in the heat recovery device 13, and the heat recovery speed is adjusted by controlling the flow rate of water in the heat recovery pipeline through the regulating valve. In an embodiment, with continued reference to fig. 5, the heat recovery device 13 further includes a third adjusting valve 134, a water inlet end of the heat absorbing end of the water source heat pump 131 is connected to one end of the third adjusting valve 134, and the other end of the third adjusting valve 134 is connected to a pipeline between the water inlet end of the heat sink 111 and the water outlet end of the heat discharging side of the heat exchanger 112.
Specifically, the heat recovery device 13 further includes a third regulating valve 134. Optionally, the third regulating valve 134 may be the same as or different from the first regulating valve 115 and the second regulating valve 117 in type, material and structure. Alternatively, both ends of the third adjusting valve 134 may be connected to a pipeline, and in the embodiment of the present application, the third adjusting valve 134 is disposed on the pipeline between the water inlet end of the heat absorbing end of the water source heat pump 131 and the water outlet end of the heat releasing side of the heat exchanger 112.
The cooling system that this application embodiment provided can be through the aperture of adjusting the governing valve among the heat reclamation device 13, controls the flow of water in the heat recovery pipeline, further accelerates heat recovery speed to improve data center server's cooling speed.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, and these are all within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A cooling system, characterized in that the cooling system comprises: at least one cooling device and an atomizing spray device; each cooling device comprises a cold source device, a heat exchanger and a liquid cooling mechanism; the heat exchanger comprises a heat exchanger heat-releasing side and a heat exchanger heat-absorbing side;
the heat exchanger heat-radiating side is communicated with the cold source device through a pipeline to form a primary side circulation loop for the heat-radiating medium to circularly flow; the heat absorption side of the heat exchanger is communicated with the liquid cooling mechanism through a pipeline to form a secondary side circulation loop for heat absorption medium to circularly flow;
the atomization spraying device comprises a plurality of atomizers, and the spray heads of the atomizers face the cold source device to spray atomized water onto the cold source device.
2. The cooling system of claim 1, wherein the atomizing spray device further comprises a water storage tank and a spray pump;
the water filling port is connected with the water inlet end of the water storage tank, the water outlet end of the water storage tank is connected with the water inlet end of the spray pump through a pipeline, and the water outlet end of the spray pump is connected with the water inlet ends of the atomizers through a pipeline.
3. The cooling system according to claim 2, wherein the atomization spray device further comprises a water treatment unit, the water injection port is connected to a water inlet end of the water treatment unit, and a water outlet end of the water treatment unit is connected with a water inlet end of the water storage tank through a pipeline.
4. The cooling system of claim 2, wherein the atomizing spray device further comprises a first solenoid valve and a second solenoid valve; the first electromagnetic valve is connected between the water storage tank and the spray pump, and the second electromagnetic valve is connected on a water supply pipeline of each atomizer;
the atomizers are uniformly arranged at intervals and wrapped around the cold source device.
5. The cooling system according to any one of claims 1 to 4, wherein the primary-side circulation circuit further includes a first circulation pump therein;
the water outlet end of the cold source device is connected with the water inlet end of the first circulating pump, the water outlet end of the first circulating pump is connected with the water inlet end of the heat radiating side of the heat exchanger, and the water outlet end of the heat radiating side of the heat exchanger is connected with the water inlet end of the cold source device.
6. The cooling system according to claim 5, characterized in that the primary-side circulation circuit further includes a first regulation valve therein; the first regulating valve is connected in parallel between the water inlet pipe and the water outlet pipe of the cold source device;
the primary side circulation loop also comprises a first regulating valve; one end of the first regulating valve is connected with a water outlet end of the heat release side of the heat exchanger through a pipeline, and the other end of the first regulating valve is connected with a water inlet end of the cold source device through a pipeline.
7. The cooling system according to any one of claims 1 to 4, wherein a second circulation pump and a second regulation valve are included in the secondary-side circulation circuit;
the water outlet end of the heat absorption side of the heat exchanger is connected with the water inlet end of the second circulating pump, the water outlet end of the second circulating pump is connected with the water inlet end of the liquid cooling mechanism, the water outlet end of the liquid cooling mechanism is connected with one end of the second regulating valve, and the other end of the second regulating valve is connected with the water inlet end of the heat absorption side of the heat exchanger.
8. The cooling system as claimed in any one of claims 1 to 4, wherein the cold sink comprises a plurality of dry coolers arranged in parallel; the cooling system also comprises a water supply ring network, a water return ring network and a plurality of heat exchangers;
the water outlet end of each dry cooler is connected to one end of the water supply ring network through a pipeline, and the other end of the water supply ring network is connected with the water inlet end of the heat release side of each heat exchanger through a pipeline;
the water inlet ends of the dry coolers are connected to one end of the return ring network through pipelines, and the other end of the return ring network is connected with the water outlet ends of the heat-releasing sides of the heat exchangers through pipelines;
the cooling system further comprises a plurality of liquid cooling mechanisms, and each heat exchanger is connected with one liquid cooling mechanism through a pipeline.
9. The cooling system according to any one of claims 1 to 4, wherein the cooling system further comprises a heat recovery device, the heat recovery device comprises a water source heat pump, a hot water circulating pump, a hot water storage tank, the water source heat pump comprises a water source heat pump heat absorption end and a water source heat pump heat release end;
the water inlet end of the heat absorption end of the water source heat pump is connected with the water inlet end of the cold source device through a pipeline, and the water outlet end of the heat absorption end of the water source heat pump is connected with the water outlet end of the cold source device through a pipeline; the water outlet end of the heat release end of the water source heat pump is connected with the water inlet end of the hot water circulating pump, and the water outlet end of the hot water circulating pump is connected with the water inlet end of the first side of the hot water storage tank; the water outlet end of the heat release end of the water source heat pump is connected with the water inlet end of the first side of the hot water storage tank through a pipeline, and the water inlet end of the heat release end of the water source heat pump is connected with the water inlet end of the first side of the hot water storage tank through a pipeline; and the water inlet and outlet ends of the second side of the hot water storage tank are respectively connected to the tail ends of the water.
10. The cooling system of claim 9, wherein the heat recovery device further comprises a third regulating valve, a water inlet end of the heat absorbing end of the water source heat pump is connected with one end of the third regulating valve, and the other end of the third regulating valve is connected to a pipeline between the water inlet end of the cold source device and a water outlet end of the heat releasing side of the heat exchanger.
CN202222117403.7U 2022-08-12 2022-08-12 Cooling system Active CN218163404U (en)

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Application Number Priority Date Filing Date Title
CN202222117403.7U CN218163404U (en) 2022-08-12 2022-08-12 Cooling system

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Application Number Priority Date Filing Date Title
CN202222117403.7U CN218163404U (en) 2022-08-12 2022-08-12 Cooling system

Publications (1)

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