CN106514941A - Temperature measuring layer forming process of insulation container - Google Patents
Temperature measuring layer forming process of insulation container Download PDFInfo
- Publication number
- CN106514941A CN106514941A CN201610982417.1A CN201610982417A CN106514941A CN 106514941 A CN106514941 A CN 106514941A CN 201610982417 A CN201610982417 A CN 201610982417A CN 106514941 A CN106514941 A CN 106514941A
- Authority
- CN
- China
- Prior art keywords
- cool
- bag
- thermometric
- chip
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000009413 insulation Methods 0.000 title claims abstract description 13
- 239000010410 layer Substances 0.000 claims abstract description 26
- 239000004744 fabric Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000002344 surface layer Substances 0.000 claims abstract description 3
- 239000011344 liquid material Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 238000007596 consolidation process Methods 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000011496 polyurethane foam Substances 0.000 claims description 3
- 229920000049 Carbon (fiber) Polymers 0.000 abstract description 2
- 239000004917 carbon fiber Substances 0.000 abstract description 2
- 238000005187 foaming Methods 0.000 abstract description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 239000003365 glass fiber Substances 0.000 abstract 1
- 239000007943 implant Substances 0.000 abstract 1
- 238000010276 construction Methods 0.000 description 5
- 230000006378 damage Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910021384 soft carbon Inorganic materials 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
- B29C2045/14245—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity using deforming or preforming means outside the mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Buffer Packaging (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
Abstract
The invention discloses a temperature measuring layer forming process of an insulation container for forming a surface layer with a temperature measuring chip on the insulation container. The forming process comprises such steps as preparation of a foaming material container, sheet pasting and sheet curing; sheets are carbon fiber cloth or glass fiber cloth; and the temperature measuring chip is positioned between two layers of sheets in the sheet pasting procedure. The forming process can implant the temperature measuring chip in the insulation container in a reliable fixing mode without damaging a traditional insulation structure of the insulation container.
Description
Technical field
The present invention relates to the thermometric formable layer technique of field of heat preservation equipment, especially a kind of cool-bag.
Background technology
Cool-bag plays an important role in logistics cold chain, due to traditional Cold-chain management in, only beyond cut open temperature measurer
Device tests the temperature of cool-bag, and on the one hand more inconvenience, on the other hand hardly results in the actual temperature of sealed thermal insulating container inner chamber
Degree, if thermometric chip is embedded on cool-bag, it will help promote the fine-grained management of cold chain, but cool-bag typically to have
Standby specific insulation construction, if being embedded in chip by force, it is possible to destroy the original insulation construction of cool-bag, and be incubated appearance
Device is subjected to vibrations of jolting in logistics transportation, and conventional chip fixed form is difficult to be securely fixed chip, how to solve this
A little problems, are research directions.
The content of the invention
The present invention proposes a kind of thermometric formable layer technique of cool-bag, can be with reliable fixed form on cool-bag
Implantation thermometric chip, and the original insulation construction of cool-bag will not be destroyed.
The present invention is employed the following technical solutions.
The thermometric formable layer technique of a kind of cool-bag, for forming the surface with thermometric chip at cool-bag
Layer, the moulding process are comprised the following steps successively.
A1, cool-bag is prepared with expanded material.
A2, apply the outer wall sheet of multilamellar on the outer surface of cool-bag, when needing thermometric chip to be placed in outer surface,
Thermometric chip is placed in the step operation in the middle of the outer wall sheet of adjacent two-layer.
A3, the support block that hard is put in the inner chamber of cool-bag, make the outer surface of support block interior with cool-bag
Cavity wall contacts to form support to prevent cool-bag wall from sinking when pressurized.
A4, with pressurized equipment to cool-bag wall press, make outer wall sheet consolidation in the outer surface of cool-bag wall.
A5, taking-up support block.
A6, wall sheet is applied in multilamellar at the inwall of cool-bag inner chamber and is pressed, make interior wall sheet consolidation in
The inner surface of cool-bag wall, when needing thermometric chip to be placed at internal chamber wall, in the step operation is placed in thermometric chip
In adjacent two-layer in the middle of wall sheet.
A7, the application cool-bag that completes of sheet material is put in mould, liquid material is injected in mould, liquid material is solid
Interior wall sheet and outer wall sheet are further fixed after change, make formed product.
After the completion of step A7, outer wall, inwall surface coated with glue-line.
The liquid material is any one in epoxy resin, unsaturated-resin, polyurethane foam material or expanded material.
The outer wall sheet, interior wall sheet are carbon cloth or glass-fiber-fabric.
The thermometric chip is RFID chip, and when thermometric chip is scanned, RFID chip receives the energy of scanning electric wave
To start thermometric operation, and measured temperature data is outwards launched with electric wave form.
The RFID chip internal memory contains the serial number data of cool-bag, when thermometric chip is scanned, RFID chip
The serial number data of cool-bag is outwards launched with electric wave form.
The present invention prepares cool-bag with expanded material, and the liquid material is epoxy resin, unsaturated-resin, polyurethane
Any one in expanded material or expanded material；The outer wall sheet, interior wall sheet are carbon cloth or glass-fiber-fabric；Due to such
Possess foaming structure or insulation construction after liquid material solidification, make layer of cloth possess good energy of attachment in cool-bag surface energy
Power, the present invention are overlying at cool-bag with soft carbon fiber cloth or glass-fiber-fabric, and thermometric chip is put in the middle of layer of cloth so that core
Piece can be fixed on cool-bag under the cladding of soft material, while soft buffer protection layer is provided for chip, and
Chip is made to be difficult to move, simultaneously because chip is laid in layer of cloth at random so that ordinary person is difficult to the concrete position for determining chip
Put, chip is difficult maliciously to be removed so that the temp sensing function of cool-bag is protected.
The present invention is coated on cool-bag surface chip with soft fabric, increased temp sensing function for cool-bag
Meanwhile, the original insulation construction of cool-bag will not be destroyed.
In the present invention, the thermometric chip is RFID chip, and when thermometric chip is scanned, RFID chip receives scanning electricity
The energy of ripple is to start thermometric operation, and measured temperature data is outwards launched with electric wave form；The design causes thermometric
Chip need not work by power supply, due to having deducted battery structure, be conducive to the miniaturization of chip, be easy to be coated on cool-bag
Place, and die sites need not be taken apart to change battery.
In the present invention, when sheet material compacting solidification after the completion of, outer wall, inwall surface coated with glue-line；The design is further
The adhesive force of sheet material is enhanced, and makes sheet layer be difficult to be immersed by water, contribute to protecting chip.
In the present invention, cool-bag is prepared with expanded material so that the case hardness of cool-bag can be in preparation process
Controlled, this causes sheet material when cool-bag surface is compacted solidification, and the deformation on cool-bag surface can be estimated so that
The pressure suffered by chip in technique in sheet layer can be controlled, so as to ensure that chip is difficult to be pressed in sheet material packing stage
Damage destruction.
In the present invention, cool-bag surface is invested with carbon cloth or glass-fiber-fabric, and using carbon cloth or glass-fiber-fabric as
The coating of parcel thermometric chip, as carbon cloth or glass-fiber-fabric will not form heat insulation structural so that thermometric chip can be exactly
Predict the temperature of cool-bag outer surface or cool-bag inner chamber, and carbon cloth or glass-fiber-fabric can pass through electric wave, therefore not
The electric wave of scanning chip can be stopped, so that thermometric chip successfully can outwards transmit temperature measurement data.
Description of the drawings
The present invention is described in more detail with reference to the accompanying drawings and detailed description：
Accompanying drawing 1 is the schematic flow sheet of the present invention；
Accompanying drawing 2 is the partial exploded view of the cool-bag for having pasted sheet material of the present invention；
In figure：1- cool-bags；Wall sheet in 2-；The outer wall sheets of 3-；4- chips；5- cool-bag inner chambers.
Specific embodiment
As shown in Figure 1, 2, the thermometric formable layer technique of a kind of cool-bag, for being formed with survey at cool-bag 1
The surface layer of warm chip 4, it is characterised in that：The moulding process is comprised the following steps successively.
A1, cool-bag 1 is prepared with expanded material.
A2, the outer wall sheet 3 of multilamellar is applied on the outer surface of cool-bag, when needing that thermometric chip 4 is placed in outer surface
When, thermometric chip is placed in the step operation in the middle of the outer wall sheet 2 of adjacent two-layer.
A3, the support block that hard is put in the inner chamber 5 of cool-bag, make the outer surface of support block interior with cool-bag
Cavity wall contacts to form support to prevent cool-bag wall from sinking when pressurized.
A4, with pressurized equipment to cool-bag wall press, make outer wall sheet consolidation in the outer surface of cool-bag wall.
A5, taking-up support block.
A6, wall sheet 2 is applied in multilamellar at the inwall of cool-bag inner chamber 5 and is pressed, make 2 consolidation of interior wall sheet
In the inner surface of cool-bag wall, when needing thermometric chip 4 to be placed at internal chamber wall, thermometric chip 4 in the step operation
It is placed in adjacent two-layer in the middle of wall sheet 2.
A7, the application cool-bag that completes of sheet material is put in mould, liquid material is injected in mould, liquid material is solid
Interior wall sheet and outer wall sheet are further fixed after change, make formed product.
After the completion of step A7, outer wall, inwall surface coated with glue-line.
The liquid material is any one in epoxy resin, unsaturated-resin, polyurethane foam material or expanded material.
The outer wall sheet, interior wall sheet are carbon cloth or glass-fiber-fabric.
The thermometric chip 4 is RFID chip, and when thermometric chip 4 is scanned, RFID chip receives the energy of scanning electric wave
Amount is to start thermometric operation, and measured temperature data is outwards launched with electric wave form.
The RFID chip internal memory contains the serial number data of cool-bag, when thermometric chip is scanned, RFID chip
The serial number data of cool-bag is outwards launched with electric wave form.
Claims (6)
1. the thermometric formable layer technique of a kind of cool-bag, for forming the surface layer with thermometric chip at cool-bag,
It is characterized in that：The moulding process is comprised the following steps successively；
A1, cool-bag is prepared with expanded material；
A2, apply the outer wall sheet of multilamellar on the outer surface of cool-bag, when needing thermometric chip to be placed in outer surface, at this
Thermometric chip is placed in the middle of the outer wall sheet of adjacent two-layer in step operation；
A3, the support block that hard is put in the inner chamber of cool-bag, make the outer surface of support block and the internal chamber wall of cool-bag
Contact forms and supports to prevent cool-bag wall from sinking when pressurized；
A4, with pressurized equipment to cool-bag wall press, make outer wall sheet consolidation in the outer surface of cool-bag wall；
A5, taking-up support block；
A6, wall sheet is applied in multilamellar at the inwall of cool-bag inner chamber and is pressed, interior wall sheet consolidation is made in insulation
The inner surface of chamber wall, when needing thermometric chip to be placed at internal chamber wall, in the step operation is placed in thermometric chip adjacent
Two-layer in the middle of wall sheet；
A7, the application cool-bag that completes of sheet material is put in mould, liquid material is injected in mould, after liquid material solidification
Interior wall sheet and outer wall sheet are further fixed, formed product is made.
2. the thermometric formable layer technique of a kind of cool-bag according to claim 1, it is characterised in that：The liquid material
For any one in epoxy resin, unsaturated-resin, polyurethane foam material or expanded material.
3. the thermometric formable layer technique of a kind of cool-bag according to claim 1, it is characterised in that：The outer wall flaps
Material, interior wall sheet are carbon cloth or glass-fiber-fabric.
4. the thermometric formable layer technique of a kind of cool-bag according to claim 1, it is characterised in that：The thermometric chip
For RFID chip, when thermometric chip is scanned, RFID chip receives the energy of scanning electric wave to start thermometric operation, and institute
The temperature data for measuring outwards is launched with electric wave form.
5. the thermometric formable layer technique of a kind of cool-bag according to claim 4, it is characterised in that：The RFID chip
Internal memory contains the serial number data of cool-bag, and when thermometric chip is scanned, RFID chip outwards launches guarantor with electric wave form
The serial number data of warm container.
6. the thermometric formable layer technique of a kind of cool-bag according to claim 1, it is characterised in that：When step A7 is completed
Afterwards, outer wall, inwall surface coated with glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610982417.1A CN106514941B (en) | 2016-11-09 | 2016-11-09 | A kind of thermometric formable layer technique of cool-bag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610982417.1A CN106514941B (en) | 2016-11-09 | 2016-11-09 | A kind of thermometric formable layer technique of cool-bag |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106514941A true CN106514941A (en) | 2017-03-22 |
| CN106514941B CN106514941B (en) | 2019-10-25 |
Family
ID=58350258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610982417.1A Active CN106514941B (en) | 2016-11-09 | 2016-11-09 | A kind of thermometric formable layer technique of cool-bag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106514941B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06194030A (en) * | 1992-12-25 | 1994-07-15 | Matsushita Refrig Co Ltd | Thermal insulating box |
| JP2003202183A (en) * | 2002-01-10 | 2003-07-18 | Matsushita Refrig Co Ltd | Thermal insulating box body provided with electrothermal module |
| CN1791881A (en) * | 2003-05-09 | 2006-06-21 | 诚实公司 | Component handling device having a film insert molded RFID tag |
| CN101739586A (en) * | 2009-12-31 | 2010-06-16 | 上海杰远环保科技有限公司 | Composite multilayer radio frequency identification transmitting component and method for manufacturing same |
| CN101970204A (en) * | 2008-03-13 | 2011-02-09 | 埃普科斯股份有限公司 | Sensing device for detecting a physical quantity and method for producing said sensor |
| CN103381637A (en) * | 2011-12-31 | 2013-11-06 | 深圳市通产丽星股份有限公司 | Plastic package container and manufacturing method thereof |
| WO2014178726A1 (en) * | 2013-04-30 | 2014-11-06 | Sinvent As | A lab-on-a-chip fabrication method and system |
| CN105627678A (en) * | 2016-02-17 | 2016-06-01 | 北京明泰朗繁精密设备有限公司 | Heat insulation structure, preparation method thereof and refrigerator |
| CN105773907A (en) * | 2016-05-13 | 2016-07-20 | 东莞铭普光磁股份有限公司 | Electronic tag plug of optical fiber connector and injection molding method of electronic tag plug |
| CN107116747A (en) * | 2017-04-27 | 2017-09-01 | 昆山市曙光照明器材有限公司 | A kind of manufacture method of intelligent chopsticks and intelligent chopsticks |
-
2016
- 2016-11-09 CN CN201610982417.1A patent/CN106514941B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06194030A (en) * | 1992-12-25 | 1994-07-15 | Matsushita Refrig Co Ltd | Thermal insulating box |
| JP2003202183A (en) * | 2002-01-10 | 2003-07-18 | Matsushita Refrig Co Ltd | Thermal insulating box body provided with electrothermal module |
| CN1791881A (en) * | 2003-05-09 | 2006-06-21 | 诚实公司 | Component handling device having a film insert molded RFID tag |
| CN101970204A (en) * | 2008-03-13 | 2011-02-09 | 埃普科斯股份有限公司 | Sensing device for detecting a physical quantity and method for producing said sensor |
| CN101739586A (en) * | 2009-12-31 | 2010-06-16 | 上海杰远环保科技有限公司 | Composite multilayer radio frequency identification transmitting component and method for manufacturing same |
| CN103381637A (en) * | 2011-12-31 | 2013-11-06 | 深圳市通产丽星股份有限公司 | Plastic package container and manufacturing method thereof |
| WO2014178726A1 (en) * | 2013-04-30 | 2014-11-06 | Sinvent As | A lab-on-a-chip fabrication method and system |
| CN105627678A (en) * | 2016-02-17 | 2016-06-01 | 北京明泰朗繁精密设备有限公司 | Heat insulation structure, preparation method thereof and refrigerator |
| CN105773907A (en) * | 2016-05-13 | 2016-07-20 | 东莞铭普光磁股份有限公司 | Electronic tag plug of optical fiber connector and injection molding method of electronic tag plug |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN106514941B (en) | 2019-10-25 |
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Effective date of registration: 20210701 Address after: 362000 Room 301, ladder a, building a, Shifu Mingmen, 126 Changfu Road, Hubin street, Shishi City, Quanzhou City, Fujian Province Patentee after: Shishi Yanghong New Energy Technology Co., Ltd Address before: Room 1505, 2nd floor, sunshine city, Jinqiu, Shishi City, Quanzhou City, Fujian Province 362700 Patentee before: Zhang Guoqing |