CN106497510A - One kind has thixotropy insulated type PCB organic silicon electronic potting adhesive - Google Patents
One kind has thixotropy insulated type PCB organic silicon electronic potting adhesive Download PDFInfo
- Publication number
- CN106497510A CN106497510A CN201610975034.1A CN201610975034A CN106497510A CN 106497510 A CN106497510 A CN 106497510A CN 201610975034 A CN201610975034 A CN 201610975034A CN 106497510 A CN106497510 A CN 106497510A
- Authority
- CN
- China
- Prior art keywords
- vinyl
- organic silicon
- thixotropy
- potting adhesive
- insulated type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Insulating Materials (AREA)
Abstract
The invention discloses one kind has thixotropy insulated type PCB organic silicon electronic potting adhesive; after solidification, hardness, resistance to compression, shock resistance are good; insulation protection is played to various electronic devices and components; there is the performance of rapid thixotroping after mixing simultaneously; the occasion that embedding device has micro gap is particularly well-suited to, is worthy to be popularized.
Description
Technical field
The present invention relates to printed-circuit board encapsulating glue technical field, more particularly to one kind has thixotropy insulated type PCB circuits
Plate organic silicon electronic potting adhesive.
Background technology
With the fast development of electronic science and technology, electronic component, device, instrument and instrument are obtained in the electronics industry
It is widely applied.As the working environment of many electronic equipments is complicated and changeable, exceedingly odious natural bar can be run into even sometimes
Part, is to protect electronic component and integrated circuit not to be affected by working environment, improves the electric property and stability of electronic device, tastes
Tasting needs to carry out embedding protection to electronic equipment.Embedding is one of important procedure of electronic components, and it is by Embedding Material
It is filled in the space of electronic device with the method such as mechanical or manual, machine-shaping under certain condition makes device inside
The operating procedure that electronic component and circuit are environmentally isolated with.At present, electronic component and integrated circuit forward direction high-performance, densification,
High accuracy and powerful direction are fast-developing, and this necessarily causes the caloric value of electronic device to greatly improve.Meanwhile, electronics device
The miniaturization of part strongly reduces its heat-dissipating space again, and heat dissipation channel is more crowded, causes heat to gather in a large number, if heat is not
Timely and effectively can conduct, it will the operating temperature of circuit is increased rapidly, cause electronic device failure probability into
Increase again, have a strong impact on the stability and reliability of electronic device, or even the service life that electronic equipment can be shortened.Therefore, use
To not only there is good electrical insulation capability should also have the higher capacity of heat transmission in the Embedding Material of electronic device, in order to avoid height
Cause Embedding Material to catch fire under the working condition such as voltage and electric discharge, also require that Embedding Material has good fire resistance, additionally,
In order to prevent moisture and harmful gass from causing the pollution and corrosion of circuit board, Embedding Material sea by the gap between electronic device
English has good adhesive property.Organosilicon material has excellent electrical insulation capability, especially additional organosilicon casting glue
During solidification, the consumption of catalyst is less, and no coupling product is produced, and the dimensional stability of solidfied material is high, and linear shrinkage is low, and chemistry is steady
Qualitative good, thus development prospect is extensively, but to there is low thermal conductivity, anti-flammability and adhesive property poor for common organic silicon potting adhesive
The shortcomings of, have a strong impact on range of application, although embedding can be improved by a large amount of heat filling, fire retardant and bonding agents of adding
The performance of glue, but the mechanical property of casting glue, processing characteristics can be had adverse effect on, so the Halogen resistance of research autohension
Combustion heat conduction additional organosilicon casting glue has important theory significance and application prospect.
Huang Zhibin exists《The preparation and performance study of heat conductive transparent organic silicon potting adhesive》In one text, by vinyl silicone oil
Studied with the architectural characteristic and reinforced filling Miscibility, the species of viscosifier of containing hydrogen silicone oil etc., be prepared for possessing good
The organic silicon potting adhesive of good mechanical property, optical property and adhesive property, have studied VMQ silicones, nano silicon, thickening
The impact to casting glue performance such as agent, on this basis, adds heat filling nano aluminium oxide and nano zine oxide, is prepared for having
The organic silicon potting adhesive of standby high intensity, high heat conductance and high transmission rate, and have studied nanoparticle, coupling agent modified etc. to filling
The impact of sealing performance.As a result show the vinyl-terminated silicone fluid of viscosity 19mPa S and 3000mPa S with mass ratio 8:100 compoundings
Based on polymer, add reactive hydrogen mass fraction be 0.8% containing hydrogen silicone oil, make mol ratio n（Si-H）：n（Si-Vi）For
The consumption of 1.2, VMQ silicones prepares the LED casting glues of optimal synthesis performance when being 30phr, synthesized not using additive reaction
Congener viscosifier DA, DAVE and DAVM, the wherein casting glue of DAVM possess optimal adhesive property and optical property, to leading
Hot filler carries out surface silanization process, and the thermal conductivity and refractive index of casting glue are gradually increasing, light transmittance, thermal coefficient of expansion and body
Product resistivity is gradually lowered, and thermostability is significantly improved.But the casting glue synthesized in article is not met by PCB circuits on market
Use requirement of the plate to casting glue, and various aspects of performance is not high, it is necessary to further improve and could expand use range.
Content of the invention
The object of the invention is exactly the defect in order to make up prior art, there is provided one kind has thixotropy insulated type PCB
Use organic silicon electronic potting adhesive.
The present invention is achieved by the following technical solutions：
One kind has thixotropy insulated type PCB organic silicon electronic potting adhesive, is made up of the raw material of following weight portion：
- 1 40-50 of vinyl-terminated silicone fluid, -2 50-60 of vinyl-terminated silicone fluid, 12% platinum catalyst 0.38-0.5, ethynylcyclohexanol
0.02-0.04, vinyl polysiloxane 25-30,1- allyloxy -2,3- expoxy propane 14.8-16.8,1,3,5,7- tetramethyl-rings
Tetrasiloxane 23-25, silane coupling A 1712.7-3.6, appropriate containing hydrogen silicone oil, castor oil hydrogenated 1-1.3, nanoporous quartz
Powder 4.5-7, acrylic resin 3.3-4, silane coupler KH5600.2-0.3, appropriate dehydrated alcohol.
Described one kind has thixotropy insulated type PCB organic silicon electronic potting adhesive, is prepared by following concrete steps
Make：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171,12% platinum catalyst of Deca 1/4, reacts 2-3h at 40-45 DEG C, then rises high temperature under agitation
Spend to 68-78 DEG C of reaction 2-3h, reaction terminate after by mixture vacuum distillation, standby after natural cooling；
（2）Nanoporous quartz powder is added in the 10-13 times of dehydrated alcohol that measures, ultrasonic disperse is subsequently adding hydrogenation into slurry
Oleum Ricini and silane coupler KH560 continue stirring 20-30min, then acrylic resin is diluted with dehydrated alcohol, wherein propylene
It is 5-8% that acid resin accounts for the mass percent of dehydrated alcohol, adds above-mentioned nanoporous quartz powder solution, then uses ultraviolet light
Irradiation 3-4h, filters, and solid washes of absolute alcohol is vacuum dried for several times afterwards；
（3）At room temperature by the vinyl-terminated silicone fluid of 3/4 mixing, containing hydrogen silicone oil, vinylite, step（2）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
In power mixer, mixing is sufficiently stirred for 35-45min and obtains B component, by component A and B component according to mass ratio 1；1 cuts in high speed
Cutting is mixed in the presence of dissipating, and is placed in vacuum drying oven（Vacuum is -0.1MPa）Deaeration 10min, pours in mould
110 DEG C of solidification 2h obtain organic silicon potting adhesive.
Described one kind has thixotropy insulated type PCB organic silicon electronic potting adhesive, the vinyl-terminated silicone fluid -1
Viscosity be 300mPa s, contents of ethylene is 1.92mol%, and the viscosity of vinyl-terminated silicone fluid -2 is 1000mPa s, vinyl
Content is 0.8mol%.
Described one kind has thixotropy insulated type PCB organic silicon electronic potting adhesive, living in described containing hydrogen silicone oil
Property hydrogen content be 0.50Wt%, and the addition of containing hydrogen silicone oil be n (Si-H)：n（Si-Vi）For 1.2-1.4.
It is an advantage of the invention that：Vinyl silicone oil is one of most basic composition of additional organosilicon casting glue, the present invention
Tensile strength and hardness, elongation at break are obtained by the vinyl silicone oil compounding for selecting different viscosities coefficient and contents of ethylene
With all higher organic silicon potting adhesive of elasticity, containing hydrogen silicone oil as cross-linking agent, when its active hydrogen content is higher, with organosilicon embedding
The crosslink density of glue will be larger, and stress can be made to be dispersed on more strands, higher tensile strength, hardness is shown
And elongation at break, but when active hydrogen content is too high, crosslinking rate is too fast, and strand has little time to form perfect cross-linked network
Network, and side reaction is also susceptible under the catalyst of Karst, make in organic silicon potting adhesive, to form more bubble, cause to lack
Fall into, so it is that 0.5Wt% is more suitable that the present invention selects active hydrogen content, the present invention selects vinyl polysiloxane to fill out as reinforcement
Material, be because with contents of ethylene is more, outer layer by organic team knowledge, molecular weight is little the characteristics of, and and organic silicon potting adhesive
There is good dispersion and the compatibility, preferable mobility and the transparency can be kept, and also can be occurred with containing hydrogen silicone oil
Hydrosilylation, it is possible to increase the mechanical property of casting glue, because the universal non-binding of organosilicon material, with base after solidification
There are space, the infiltration of long-time steam to cause fault occur between material, the present invention utilizes chemical reactive synthesis viscosifier, energy
The enough caking property for effectively improving organic silicon potting adhesive, tensile shear strength, do not affect viscosity and mobility, the present invention also to utilize
Filler improves the heat conductivity and anti-flammability of casting glue, but filler has pole with matrix in terms of molecular structure and physical property
Big difference, and the dispersibility of system is poorer, and the thermal conductivity of casting glue is lifted and is more difficult to, and the surface modification of filler can promote filler
Dispersion in the base, reduces the interface resistance on direction of heat flow, so as to can effectively lift the performances such as the thermal conductivity of system, receives
The characteristics of rice cell quartz powder has excellent waterproof, fire prevention, good fluidity, and there be a certain amount of hydroxyl silicon on surface itself
Alcohol, easily by coupling agent surface treatment, increases crosslinking, the effect of reinforcement, and the present invention is tied using silane coupler process, surface
Unification layer silane coupler, recycles photocrosslinking so as to form good crosslinking with acrylic resin, improves which resistance to old
Change, heat-resisting and mechanical strength, and there is in casting glue good dispersion and the compatibility, embedding adhesive curing prepared by the present invention
Hardness, resistance to compression, shock resistance are good afterwards, play insulation protection to various electronic devices and components, while rapid thixotroping after there is mixing
Performance, be particularly well-suited to the occasion that embedding device has micro gap, be worthy to be popularized.
Specific embodiment
One kind has thixotropy insulated type PCB organic silicon electronic potting adhesive, by following weight portion（Kilogram）Original
Material preparation is made：Vinyl-terminated silicone fluid 40, vinyl-terminated silicone fluid 50,12% platinum catalyst 0.38, ethynylcyclohexanol 0.02,
Vinyl polysiloxane 25,1- allyloxy -2,14.8,1,3,5,7- tetramethyl-ring tetrasiloxane 23 of 3- expoxy propane, silane idol
Connection agent A1712.7, appropriate containing hydrogen silicone oil, castor oil hydrogenated 1, nanoporous quartz powder 4.5, acrylic resin 3.3, silane coupled
Agent KH560 0.2, appropriate dehydrated alcohol.
Described one kind has thixotropy insulated type PCB organic silicon electronic potting adhesive, is prepared by following concrete steps
Make：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171,12% platinum catalyst of Deca 1/4, reacts 2h at 40 DEG C, then rises high-temperature to 68 under agitation
DEG C reaction 2h, reaction terminate after by mixture vacuum distillation, standby after natural cooling；
（2）Nanoporous quartz powder is added in the dehydrated alcohol of 10 times of amounts, ultrasonic disperse is subsequently adding hydrogenated castor into slurry
Oil and silane coupler KH560 continue stirring 20min, then acrylic resin is diluted with dehydrated alcohol, wherein acrylic resin
The mass percent for accounting for dehydrated alcohol is 5%, adds above-mentioned nanoporous quartz powder solution, then uses ultraviolet light irradiation 3h, mistake
Filter, solid washes of absolute alcohol are vacuum dried for several times afterwards；
（3）At room temperature by the vinyl-terminated silicone fluid of 3/4 mixing, containing hydrogen silicone oil, vinylite, step（2）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
In power mixer, mixing is sufficiently stirred for 35min and obtains B component, by component A and B component according to mass ratio 1；1 in high speed shear
Mixed in the presence of dispersion, be placed in vacuum drying oven（Vacuum is MPa）Deaeration 10min, pour in mould 110 DEG C solid
Change 2h and obtain organic silicon potting adhesive.
Described one kind has thixotropy insulated type PCB organic silicon electronic potting adhesive, the vinyl-terminated silicone fluid -1
Viscosity be 300mPa s, contents of ethylene is 1.92mol%, and the viscosity of vinyl-terminated silicone fluid -2 is 1000mPa s, vinyl
Content is 0.8mol%.
Described one kind has thixotropy insulated type PCB organic silicon electronic potting adhesive, living in described containing hydrogen silicone oil
Property hydrogen content be 0.50Wt%, and the addition of containing hydrogen silicone oil be n (SiH)：n（SiVi）For 1.2.
According to casting glue prepared by embodiment, performance test is carried out to which, as a result as follows：
Thermal conductivity（W/m•K）：0.62；Tensile strength（MPa）：3.6；Shear strength（MPa）：1.6；Specific insulation（Ω•cm）：
2.4×1015；Anti-flammability (UL94；V 0)：Pass through；Dielectric constant（50HZ）：3.5；Percentage elongation（%）：220.
Claims (4)
1. one kind has thixotropy insulated type PCB organic silicon electronic potting adhesive, it is characterised in that by following weight portion
Raw material is made：- 1 40-50 of vinyl-terminated silicone fluid, -2 50-60 of vinyl-terminated silicone fluid, 12% platinum catalyst 0.38-0.5, second
Alkynyl Hexalin 0.02-0.04, vinyl polysiloxane 25-30,1- allyloxy -2,3- expoxy propane 14.8-16.8,1,3,5,
7- tetramethyl-ring tetrasiloxane 23-25, silane coupling A 1712.7-3.6, appropriate containing hydrogen silicone oil, castor oil hydrogenated 1-1.3, receive
Rice cell quartz powder 4.5-7, acrylic resin 3.3-4, silane coupler KH5600.2-0.3, appropriate dehydrated alcohol.
2. one kind has thixotropy insulated type PCB organic silicon electronic potting adhesive, its feature to exist according to claim 1
In being made up of following concrete steps：
（1）Sequentially add 1- allyloxy -2 in four-hole boiling flask, 3- expoxy propane, 1,3,5,7- tetramethyl-ring tetrasiloxanes and
Silane coupling A 171,12% platinum catalyst of Deca 1/4, reacts 2-3h at 40-45 DEG C, then rises high temperature under agitation
Spend to 68-78 DEG C of reaction 2-3h, reaction terminate after by mixture vacuum distillation, standby after natural cooling；
（2）Nanoporous quartz powder is added in the 10-13 times of dehydrated alcohol that measures, ultrasonic disperse is subsequently adding hydrogenation into slurry
Oleum Ricini and silane coupler KH560 continue stirring 20-30min, then acrylic resin is diluted with dehydrated alcohol, wherein propylene
It is 5-8% that acid resin accounts for the mass percent of dehydrated alcohol, adds above-mentioned nanoporous quartz powder solution, then uses ultraviolet light
Irradiation 3-4h, filters, and solid washes of absolute alcohol is vacuum dried for several times afterwards；
（3）At room temperature by the vinyl-terminated silicone fluid of 3/4 mixing, containing hydrogen silicone oil, vinylite, step（2）The product of preparation
Proportionally mix with ethynylcyclohexanol, 25min is sufficiently stirred in the presence of vacuum power mixer component A is obtained；Will
Remaining mixing vinyl-terminated silicone fluid, vinyl polysiloxane, step（1）The product of preparation and remaining 12% platinum catalyst are in vacuum
In power mixer, mixing is sufficiently stirred for 35-45min and obtains B component, by component A and B component according to mass ratio 1；1 cuts in high speed
Cutting is mixed in the presence of dissipating, and is placed in vacuum drying oven（Vacuum is -0.1MPa）Deaeration 10min, pours in mould
110 DEG C of solidification 2h obtain organic silicon potting adhesive.
3. one kind according to claim 1-2 has thixotropy insulated type PCB organic silicon electronic potting adhesive, its feature
It is, the viscosity of the vinyl-terminated silicone fluid -1 is 300mPa s, and contents of ethylene is 1.92mol%, vinyl-terminated silicone fluid -2
Viscosity is 1000mPa s, and contents of ethylene is 0.8mol%.
4. one kind according to claim 1-2 has thixotropy insulated type PCB organic silicon electronic potting adhesive, its feature
It is, in described containing hydrogen silicone oil, active hydrogen content is 0.50Wt%, and the addition of containing hydrogen silicone oil is n (Si-H)：n（Si-
Vi）For 1.2-1.4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610975034.1A CN106497510A (en) | 2016-11-07 | 2016-11-07 | One kind has thixotropy insulated type PCB organic silicon electronic potting adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610975034.1A CN106497510A (en) | 2016-11-07 | 2016-11-07 | One kind has thixotropy insulated type PCB organic silicon electronic potting adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106497510A true CN106497510A (en) | 2017-03-15 |
Family
ID=58323511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610975034.1A Withdrawn CN106497510A (en) | 2016-11-07 | 2016-11-07 | One kind has thixotropy insulated type PCB organic silicon electronic potting adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106497510A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115746565A (en) * | 2022-10-13 | 2023-03-07 | 隆基绿能科技股份有限公司 | Room temperature vulcanized silicone rubber and preparation method and application thereof |
-
2016
- 2016-11-07 CN CN201610975034.1A patent/CN106497510A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115746565A (en) * | 2022-10-13 | 2023-03-07 | 隆基绿能科技股份有限公司 | Room temperature vulcanized silicone rubber and preparation method and application thereof |
| CN115746565B (en) * | 2022-10-13 | 2023-08-29 | 隆基绿能科技股份有限公司 | Room temperature vulcanized silicone rubber and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106751904B (en) | Heat-conducting organic silicon gel and preparation method thereof | |
| CN103865271B (en) | A kind of preparation method of the modified organosilicon heat conductive electronic pouring sealant of nano-hybrid material | |
| CN102337033B (en) | Additive high-thermal-conductivity organic silicon electronic pouring sealant and preparation method thereof | |
| CN101735619B (en) | Halogen-free flame-retarded heat-conducting organic silicon electronic potting adhesive and preparation method thereof | |
| CN103756631B (en) | Double-component self-adhesive addition type flame retardant heat conducting room temperature curing organic silicon pouring sealant | |
| CN106753213A (en) | A kind of PCB organic silicon electronic potting adhesive with excellent moistureproof and waterproof performance | |
| CN107974232B (en) | LED chip insulating heat-conducting die bond adhesive and preparation method thereof | |
| CN109913185A (en) | A kind of multilayered structure heat-conductive composite material and preparation method thereof containing heat conducting film | |
| CN106753208B (en) | Graphene oxide modified LED heat-conducting pouring sealant and preparation method thereof | |
| CN104804705A (en) | Low release quantity additive halogen-free flame-retardant heat-conduction organic silicon pouring sealant and preparation method thereof | |
| CN105754542A (en) | Two-component organic silicon pouring sealant and preparation process thereof | |
| CN102212269B (en) | Insulative potting composite material with high thermal conductivity and preparation method thereof | |
| CN102675882A (en) | Addition type heat-conducting anti-settling silicon rubber and preparation method thereof | |
| CN105176484A (en) | Potting adhesive for power electronic devices, and preparation method thereof | |
| CN104031388B (en) | Phenyl siloxane rubber nanometer composite material and preparation method thereof | |
| CN104119683A (en) | A bi-component addition type electronic organosilicon embedding liquid adhesive | |
| CN105670555A (en) | High heat conductivity organosilicon potting compound | |
| CN105969277A (en) | Heat-dissipating pouring sealant for packaging electronic devices | |
| CN106833508A (en) | A kind of high temperature resistant PCB organic silicon potting adhesive | |
| WO2018121048A1 (en) | Heat-resistant packaging adhesive for high-power led and manufacturing method thereof | |
| CN106381121A (en) | Transparent organic pouring sealant | |
| CN106753212A (en) | A kind of good transparency of caking property PCB organic silicon electronic potting adhesive high | |
| CN106634812A (en) | Organic silicon resin pouring sealant with high thermal conductivity and low viscosity for PCB (Printed Circuit Board) | |
| CN113881190A (en) | Epoxy resin composite material for packaging power electronic transformer and preparation method thereof | |
| CN106634814A (en) | Organic silicon electronic pouring sealant with good ultraviolet-resisting cooling performance for PCB (Printed Circuit Board) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170315 |