CN104119683A - A bi-component addition type electronic organosilicon embedding liquid adhesive - Google Patents
A bi-component addition type electronic organosilicon embedding liquid adhesive Download PDFInfo
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- CN104119683A CN104119683A CN201410328698.XA CN201410328698A CN104119683A CN 104119683 A CN104119683 A CN 104119683A CN 201410328698 A CN201410328698 A CN 201410328698A CN 104119683 A CN104119683 A CN 104119683A
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Abstract
A bi-component addition type electronic organosilicon embedding liquid adhesive is disclosed. Vinyl-terminated silicone oil is adopted to dilute vinyl-containing MQ silicon resin with high viscosity, a tackifier is added, a thermally insulating filling material is added at intervals, and an inhibiting agent and hydrogen-containing silicone oil are reasonably blended, so as to prepare an A component. Vinyl silicone oil is adopted to dilute vinyl-containing MQ silicon resin with high viscosity, a tackifier is added, a thermally insulating filling material is added at intervals, and a catalyst is added with reasonable compatibility, so as to prepare a B component. The A component and the B component are uniformly mixed according to a mass ratio of 1:1, and defoamed under vacuum. By heating and curing the embedding liquid adhesive, the objective of achieving embedment of electronic components or assembly parts is achieved.
Description
Technical field
The present invention relates to organosilicon liquid glue technical field, espespecially a kind of bi-component addition type organic silicon electronic embedding liquid glue.
Background technology
In electronic industry, in order to improve the reliability of electronic devices and components and complete machine, often need electronic devices and components or assembling parts to carry out embedding, except drawing wire or web member, whole parts are wrapped up and are sealed by joint sealant, isolated with ambient atmosphere, with this, guarantee that complete machine still can normally work in being subject to the environment such as vibrations, high humidity, temperature acute variation, air are contaminated
Conventional Embedding Material has epoxy resin, urethane and organic silica gel, and the over-all properties of epoxy resin is splendid, but can not reach snappiness, when curing, there is certain internal stress, cured article embrittlement, polyurethane material has good electrical property, but poisonous, HUMAN HEALTH is endangered again, and organic silica gel forms silicon rubber after solidifying, there is good electrical insulating property, compare with the first two class Embedding Material, while having sulfuration, less, damping cushion effect is good and heat-resisting, cold-resistant, the feature of good weatherability in heating.Along with the fast development of electronic industry, add-on type liquid silica gel, because its excellent performance application in electronic package day by day strengthens, is considered to extremely rising used in electronic industry type material.
Summary of the invention
A kind of bi-component addition type organic silicon electronic of the present invention embedding liquid glue, it is characterized in that, adopt vinyl-terminated silicone fluid to high the diluting containing vinyl MQ silicone resin of viscosity, add tackifier and intermittently add heat conductive filler, reasonable compatibility inhibitor and containing hydrogen silicone oil, make A component, adopt vinyl silicone oil to high the diluting containing vinyl MQ silicone resin of viscosity, add tackifier and intermittently add heat conductive filler, reasonable compatibility catalyzer, makes B component
,a component and B component be the ratio of 1 ﹕ 1 in mass ratio, mixes, and vacuum defoamation is used, and by being heating and curing of organosilicon embedding liquid glue, realizes the object that electronic devices and components or assembling parts are carried out to embedding.
To achieve these goals, technical solution of the present invention is: a kind of bi-component addition type organic silicon electronic embedding liquid glue is comprised of A component and B component, wherein, described A component and the mass ratio of B component are 1 ﹕ 1, and described A component comprises the raw material of following mass parts: 40～45 parts of vinyl-terminated silicone fluids, containing 4～8 parts of vinyl MQ silicone resin, 2～3 parts of Methyl Hydrogen Polysiloxane Fluid linking agents, 40～45 parts of aluminium sesquioxides, 4～6 parts of beta-silicon carbide whiskers, 1～2 part of tackifier, 0.4～0.6 part, inhibitor; Described B component comprises 40～45 parts of vinyl silicone oils, contains 6～10 parts of vinyl MQ silicone resin, 40～45 parts of aluminium sesquioxides, 4～6 parts of beta-silicon carbide whiskers, 1～2 part of tackifier, 0.05～0.1 part of catalyzer.
Further, described vinyl silicone oil is that chemical general formula is Me
3siO (Me
2siO)
x(Me
2viSiO)
ysiMe
3compound, vinyl massfraction is 0.3%～0.8%, in formula: Vi is vinyl, Me is methyl, x, y are greater than 5 integer, and meet x+y=50～200;
Described vinyl-terminated silicone fluid is that chemical general formula is ViMe
2siO (Me
2siO)
zme
2the compound of SiVi, vinyl massfraction is 0.1%, and in formula: Vi is vinyl, Me is methyl, and z is greater than 5 integer;
Described Methyl Hydrogen Polysiloxane Fluid is that chemical general formula is Me
3siO (Me
2siO)
m(MeHSiO)
nsiMe
3compound, in formula, Vi is vinyl, Me is methyl, m is greater than 0 integer, n is greater than 3 integer, and meets m+ n=10～90;
Described is that chemical general formula is (Me containing vinyl MQ silicone resin
3siO
1/2)
a(ViMe
2siO
1/2)
b(Me
2siO)
c(SiO
2)
dcompound, its viscosity is 7500～20000mPa ﹒ s, in formula: a, b, c, d are the decimal that is greater than 0, and meets a+ b+ c+ d=1, Vi is vinyl, Me is methyl;
Preferred platinum-1 of described catalyzer, 3-divinyl tetramethyl disiloxane and platinum-diethyl phthalate catalyzer;
The aluminium sesquioxide of described filler preferable particle size 5～20 μ m;
Described beta-silicon carbide whisker preferable particle size 0.5～2.5 μ m, more than 99% beta-silicon carbide whisker of purity;
Described tackifier are sec.-propyl three oleic acid acyloxy titanic acid ester;
Described inhibitor preferably 3,5-dimethyl-1-hexin-3-alcohol, ethynylcyclohexanol and 2-vinyl primary isoamyl alcohol;
The preparation method of a kind of bi-component addition type organic silicon electronic of the present invention embedding liquid glue comprises the preparation of A component and the preparation of B component; Wherein,
The preparation of described A component: in the agitator with chuck, it by mass parts, is the vinyl-terminated silicone fluid of 40～45 parts, mass parts be 4～8 parts containing vinyl MQ silicone resin, mass parts is the tackifier of 1～2 part, join successively in agitator, after stirring with 300 revs/min of rotating speeds, adding again and in batches mass parts is the beta-silicon carbide whisker that the aluminium sesquioxide of 40～45 parts and mass parts are 4～6 parts, with 900 revs/min of powerful high-speed stirring of rotating speed 1～1.5 hour, finally adding mass parts is the inhibitor of 0.4～0.6 part, with 300 revs/min of rotating speeds, carry out dispersed with stirring 0.5～1 hour, in whole preparation process chuck, logical water coolant carries out cooling all the time, stop stirring, discharging obtains described A component,
The preparation of described B component: in the agitator with chuck, it by mass parts, is the vinyl silicone oil of 40～45 parts, mass parts be 6～10 parts containing vinyl MQ silicone resin, mass parts is the tackifier of 1～2 part, join successively in agitator, after stirring with 300 revs/min of rotating speeds, adding again and in batches mass parts is the beta-silicon carbide whisker that the aluminium sesquioxide of 40～45 parts and mass parts are 4～6 parts, with 900 revs/min of powerful high-speed stirring of rotating speed 1～1.5 hour, finally adding mass parts is the catalyzer of 0.05～0.1 part, with 300 revs/min of rotating speeds, carry out dispersed with stirring 0.5～1 hour, in whole preparation process chuck, logical water coolant carries out cooling all the time, stop stirring, discharging obtains described B component,
During use, by described A component and the B component ratio of 1 ﹕ 1 in mass ratio, mix vacuum defoamation 30～45 minutes, point glue or filling on electronic devices and components or assembling parts, is slowly heated to 150 ℃, and in 150 ℃ of isothermal curings 2～3 hours, stop heating, cooling, completes curing.
Advantage and disadvantage of the present invention is: adopt vinyl-terminated silicone fluid to high the diluting containing vinyl MQ silicone resin of viscosity, add tackifier and intermittently add heat conductive filler, reasonable compatibility inhibitor and containing hydrogen silicone oil, make A component, can reduce the viscosity of A component, adopt vinyl silicone oil to high the diluting containing vinyl MQ silicone resin of viscosity, add tackifier and intermittently add heat conductive filler, reasonable compatibility catalyzer, makes B component, can reduce the viscosity of B component; A component and B component be the ratio of 1 ﹕ 1 in mass ratio, mixes, and vacuum defoamation is used, and by being heating and curing of organosilicon embedding liquid glue, reaches the effect that electronic devices and components or assembling parts are carried out to embedding; Adopt aluminium sesquioxide and beta-silicon carbide whisker as filler, after solidifying, can form netted organo-silicone rubber, can reach the effect of increased thermal conductivity; In preparation process, add in batches aluminium sesquioxide, can reach the uniform effect of rapid dispersion.
Embodiment
Embodiment 1
A kind of bi-component addition type organic silicon electronic embedding liquid glue is comprised of A component and B component, wherein, described A component and the mass ratio of B component are 1 ﹕ 1, and described A component comprises the raw material of following mass parts: 40 parts of vinyl-terminated silicone fluids, containing 4 parts of vinyl MQ silicone resin, 2 parts of Methyl Hydrogen Polysiloxane Fluid linking agents, 40 parts of aluminium sesquioxides, 4 parts of beta-silicon carbide whiskers, sec.-propyl three 1 part of oleic acid acyloxy titanic acid ester tackifier, 0.4 part, ethynylcyclohexanol inhibitor; Described B component comprises 40 parts of vinyl silicone oils, contains 8 parts of vinyl MQ silicone resin, 45 parts of aluminium sesquioxides, 6 parts of beta-silicon carbide whiskers, sec.-propyl three 1 part of oleic acid acyloxy titanic acid ester tackifier, platinum-1,0.05 part of 3-divinyl tetramethyl disiloxane catalyzer.
Its preparation method is: the preparation of A component: in the agitator with chuck, it by mass parts, is the vinyl-terminated silicone fluid of 40 parts, mass parts be 4 parts containing vinyl MQ silicone resin, mass parts is the sec.-propyl three oleic acid acyloxy titanic acid ester tackifier of 1 part, join successively in agitator, after stirring with 300 revs/min of rotating speeds, adding again and in batches mass parts is the beta-silicon carbide whisker that the aluminium sesquioxide of 40 parts and mass parts are 4 parts, with 900 revs/min of powerful high-speed stirring of rotating speed 1 hour, finally adding mass parts is the ethynylcyclohexanol inhibitor of 0.4 part, with 300 revs/min of rotating speeds, carry out dispersed with stirring 1 hour, in whole preparation process chuck, logical water coolant carries out cooling all the time, stop stirring, discharging obtains described A component,
The preparation of B component: in the agitator with chuck, it by mass parts, is the vinyl silicone oil of 40 parts, mass parts be 8 parts containing vinyl MQ silicone resin, mass parts is the sec.-propyl three oleic acid acyloxy titanic acid ester tackifier of 1 part, join successively in agitator, after stirring with 300 revs/min of rotating speeds, adding again and in batches mass parts is the beta-silicon carbide whisker that the aluminium sesquioxide of 45 parts and mass parts are 6 parts, with 900 revs/min of powerful high-speed stirring of rotating speed 1 hour, finally adding mass parts is the catalyzer of 0.05～0.1 part, with 300 revs/min of rotating speeds, carry out dispersed with stirring 1 hour, in whole preparation process chuck, logical water coolant carries out cooling all the time, stop stirring, discharging obtains described B component,
During use, by described A component and the B component ratio of 1 ﹕ 1 in mass ratio, mix vacuum defoamation 30～45 minutes, point glue or filling on electronic devices and components or assembling parts, is slowly heated to 150 ℃, and in 150 ℃ of isothermal curings 2～3 hours, stop heating, cooling, completes curing.
Embodiment 2
A kind of bi-component addition type organic silicon electronic embedding liquid glue is comprised of A component and B component, wherein, described A component and the mass ratio of B component are 1 ﹕ 1, and described A component comprises the raw material of following mass parts: 45 parts of vinyl-terminated silicone fluids, containing 0.6 part of 6 parts of vinyl MQ silicone resin, 2.5 parts of Methyl Hydrogen Polysiloxane Fluid linking agents, 43 parts of aluminium sesquioxides, 6 parts of beta-silicon carbide whiskers, sec.-propyl three 1.6 parts of oleic acid acyloxy titanic acid ester tackifier, 2-vinyl primary isoamyl alcohol inhibitor; Described B component comprises 43 parts of vinyl silicone oils, containing 0.08 part of 10 parts of vinyl MQ silicone resin, 40 parts of aluminium sesquioxides, 5 parts of beta-silicon carbide whiskers, sec.-propyl three 1.5 parts of oleic acid acyloxy titanic acid ester tackifier, the agent of platinum-diethyl phthalate catalyst.
Its preparation method is: the preparation of A component: in the agitator with chuck, it by mass parts, is the vinyl-terminated silicone fluid of 45 parts, mass parts be 6 parts containing vinyl MQ silicone resin, mass parts is the sec.-propyl three oleic acid acyloxy titanic acid ester tackifier of 1.6 parts, join successively in agitator, after stirring with 300 revs/min of rotating speeds, adding again and in batches mass parts is the beta-silicon carbide whisker that the aluminium sesquioxide of 43 parts and mass parts are 6 parts, with 900 revs/min of powerful high-speed stirring of rotating speed 1.2 hours, finally adding mass parts is the 2-vinyl primary isoamyl alcohol inhibitor of 0.6 part, with 300 revs/min of rotating speeds, carry out dispersed with stirring 45 minutes, in whole preparation process chuck, logical water coolant carries out cooling all the time, stop stirring, discharging obtains described A component,
The preparation of B component: in the agitator with chuck, it by mass parts, is the vinyl silicone oil of 43 parts, mass parts be 10 parts containing vinyl MQ silicone resin, mass parts is the sec.-propyl three oleic acid acyloxy titanic acid ester tackifier of 1.5 parts, join successively in agitator, after stirring with 300 revs/min of rotating speeds, adding again and in batches mass parts is the beta-silicon carbide whisker that the aluminium sesquioxide of 40 parts and mass parts are 5 parts, with 900 revs/min of powerful high-speed stirring of rotating speed 1.2 hours, finally adding mass parts is platinum-diethyl phthalate catalyst agent of 0.08 part, with 300 revs/min of rotating speeds, carry out dispersed with stirring 45 minutes, in whole preparation process chuck, logical water coolant carries out cooling all the time, stop stirring, discharging obtains described B component,
During use, by described A component and the B component ratio of 1 ﹕ 1 in mass ratio, mix vacuum defoamation 30～45 minutes, point glue or filling on electronic devices and components or assembling parts, is slowly heated to 150 ℃, and in 150 ℃ of isothermal curings 2～3 hours, stop heating, cooling, completes curing.
Embodiment 3
A kind of bi-component addition type organic silicon electronic embedding liquid glue is comprised of A component and B component, wherein, described A component and the mass ratio of B component are 1 ﹕ 1, described A component comprises the raw material of following mass parts: 42 parts of vinyl-terminated silicone fluids, containing 2 parts of 8 parts of vinyl MQ silicone resin, 3 parts of Methyl Hydrogen Polysiloxane Fluid linking agents, 45 parts of aluminium sesquioxides, 5 parts of beta-silicon carbide whiskers, sec.-propyl three oleic acid acyloxy titanic acid ester tackifier, 3,0.5 part, 5-dimethyl-1-hexin-3-alcohol inhibitor; Described B component comprises 45 parts of vinyl silicone oils, containing 0.1 part of 6 parts of vinyl MQ silicone resin, 42 parts of aluminium sesquioxides, 4 parts of beta-silicon carbide whiskers, sec.-propyl three 2 parts of oleic acid acyloxy titanic acid ester tackifier, the agent of platinum-diethyl phthalate catalyst.
Its preparation method is: the preparation of A component: in the agitator with chuck, it by mass parts, is the vinyl-terminated silicone fluid of 42 parts, mass parts be 8 parts containing vinyl MQ silicone resin, mass parts is the sec.-propyl three oleic acid acyloxy titanic acid ester tackifier of 2 parts, join successively in agitator, after stirring with 300 revs/min of rotating speeds, adding again and in batches mass parts is the beta-silicon carbide whisker that the aluminium sesquioxide of 45 parts and mass parts are 5 parts, with 900 revs/min of powerful high-speed stirring of rotating speed 1.5 hours, finally add mass parts be 0.5 part 3, 5-dimethyl-1-hexin-3-alcohol inhibitor, with 300 revs/min of rotating speeds, carry out dispersed with stirring 0.5 hour, in whole preparation process chuck, logical water coolant carries out cooling all the time, stop stirring, discharging obtains described A component,
The preparation of B component: in the agitator with chuck, it by mass parts, is the vinyl silicone oil of 45 parts, mass parts be 6 parts containing vinyl MQ silicone resin, mass parts is the sec.-propyl three oleic acid acyloxy titanic acid ester tackifier of 2 parts, join successively in agitator, after stirring with 300 revs/min of rotating speeds, adding again and in batches mass parts is the beta-silicon carbide whisker that the aluminium sesquioxide of 42 parts and mass parts are 4 parts, with 900 revs/min of powerful high-speed stirring of rotating speed 1.5 hours, finally adding mass parts is platinum-diethyl phthalate catalyst agent of 0.1 part, with 300 revs/min of rotating speeds, carry out dispersed with stirring 0.5 hour, in whole preparation process chuck, logical water coolant carries out cooling all the time, stop stirring, discharging obtains described B component,
During use, by described A component and the B component ratio of 1 ﹕ 1 in mass ratio, mix vacuum defoamation 30～45 minutes, point glue or filling on electronic devices and components or assembling parts, is slowly heated to 150 ℃, and in 150 ℃ of isothermal curings 2～3 hours, stop heating, cooling, completes curing.
The above; embodiment is only that the preferred embodiment of the present invention is described; not scope of the present invention is limited; under the prerequisite of spirit that does not depart from the technology of the present invention; various distortion and improvement that this area engineering technical personnel make technical scheme of the present invention, all should fall in the definite protection domain of claims of the present invention.
Claims (3)
1. a bi-component addition type organic silicon electronic embedding liquid glue, is characterized in that: described a kind of bi-component addition type organic silicon electronic embedding liquid glue is comprised of A component and B component; Wherein, described A component and the mass ratio of B component are 1 ﹕ 1, and described A component comprises the raw material of following mass parts: 40～45 parts of vinyl-terminated silicone fluids, containing 4～8 parts of vinyl MQ silicone resin, 2～3 parts of Methyl Hydrogen Polysiloxane Fluid linking agents, 40～45 parts of aluminium sesquioxides, 4～6 parts of beta-silicon carbide whiskers, 1～2 part of tackifier, 0.4～0.6 part, inhibitor; Described B component comprises 40～45 parts of vinyl silicone oils, contains 6～10 parts of vinyl MQ silicone resin, 40～45 parts of aluminium sesquioxides, 4～6 parts of beta-silicon carbide whiskers, 1～2 part of tackifier, 0.05～0.1 part of catalyzer.
2. a bi-component addition type organic silicon electronic embedding liquid glue, is characterized in that: the preparation method of described a kind of bi-component addition type organic silicon electronic embedding liquid glue is: its preparation method comprises the preparation of A component and the preparation of B component; Wherein,
The preparation of described A component: in the agitator with chuck, it by mass parts, is the vinyl-terminated silicone fluid of 40～45 parts, mass parts be 4～8 parts containing vinyl MQ silicone resin, mass parts is the tackifier of 1～2 part, join successively in agitator, after stirring with 300 revs/min of rotating speeds, adding again and in batches mass parts is the beta-silicon carbide whisker that the aluminium sesquioxide of 40～45 parts and mass parts are 4～6 parts, with 900 revs/min of powerful high-speed stirring of rotating speed 1～1.5 hour, finally adding mass parts is the inhibitor of 0.4～0.6 part, with 300 revs/min of rotating speeds, carry out dispersed with stirring 0.5～1 hour, in whole preparation process chuck, logical water coolant carries out cooling all the time, stop stirring, discharging obtains described A component,
The preparation of described B component: in the agitator with chuck, it by mass parts, is the vinyl silicone oil of 40～45 parts, mass parts be 6～10 parts containing vinyl MQ silicone resin, mass parts is the tackifier of 1～2 part, join successively in agitator, after stirring with 300 revs/min of rotating speeds, adding again and in batches mass parts is the beta-silicon carbide whisker that the aluminium sesquioxide of 40～45 parts and mass parts are 4～6 parts, with 900 revs/min of powerful high-speed stirring of rotating speed 1～1.5 hour, finally adding mass parts is the catalyzer of 0.05～0.1 part, with 300 revs/min of rotating speeds, carry out dispersed with stirring 0.5～1 hour, in whole preparation process chuck, logical water coolant carries out cooling all the time, stop stirring, discharging obtains described B component.
3. a kind of bi-component addition type organic silicon electronic embedding liquid glue according to claim 1, is characterized in that: described vinyl silicone oil is that chemical general formula is Me
3siO (Me
2siO)
x(Me
2viSiO)
ysiMe
3compound, vinyl massfraction is 0.3%～0.8%, in formula: Vi is vinyl, Me is methyl, x, y are greater than 5 integer, and meet x+y=50～200;
Described vinyl-terminated silicone fluid is that chemical general formula is ViMe
2siO (Me
2siO)
zme
2the compound of SiVi, vinyl massfraction is 0.1%, and in formula: Vi is vinyl, Me is methyl, and z is greater than 5 integer; Described Methyl Hydrogen Polysiloxane Fluid is that chemical general formula is Me
3siO (Me
2siO)
m(MeHSiO)
nsiMe
3compound, in formula, Vi is vinyl, Me is methyl, m is greater than 0 integer, n is greater than 3 integer, and meets m+ n=10～90; Described is that chemical general formula is (Me containing vinyl MQ silicone resin
3siO
1/2)
a(ViMe
2siO
1/2)
b(Me
2siO)
c(SiO
2)
dcompound, its viscosity is 7500～20000mPa ﹒ s, in formula: a, b, c, d are the decimal that is greater than 0, and meets a+ b+ c+ d=1, Vi is vinyl, Me is methyl; Preferred platinum-1 of described catalyzer, 3-divinyl tetramethyl disiloxane and platinum-diethyl phthalate catalyzer; The aluminium sesquioxide of described filler preferable particle size 5～20 μ m; Described beta-silicon carbide whisker preferable particle size 0.5～2.5 μ m, more than 99% beta-silicon carbide whisker of purity; Described tackifier are sec.-propyl three oleic acid acyloxy titanic acid ester; Described inhibitor preferably 3,5-dimethyl-1-hexin-3-alcohol, ethynylcyclohexanol and 2-vinyl primary isoamyl alcohol.
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| CN201410328698.XA CN104119683A (en) | 2014-07-11 | 2014-07-11 | A bi-component addition type electronic organosilicon embedding liquid adhesive |
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|---|---|---|---|
| CN201410328698.XA CN104119683A (en) | 2014-07-11 | 2014-07-11 | A bi-component addition type electronic organosilicon embedding liquid adhesive |
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Family
ID=51765330
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| WO2021109730A1 (en) * | 2019-12-02 | 2021-06-10 | 苏州太湖电工新材料股份有限公司 | Two-component organosilicon potting sealant and application method therefor |
| CN112133817A (en) * | 2020-09-14 | 2020-12-25 | 东莞市谷麦光学科技有限公司 | Multi-chip packaging structure |
| CN114573990A (en) * | 2022-03-11 | 2022-06-03 | 重庆大学 | Polysiloxane with adjustable hardness and viscosity and preparation method thereof |
| CN114573990B (en) * | 2022-03-11 | 2022-11-01 | 重庆大学 | Polysiloxane with adjustable hardness and viscosity and preparation method thereof |
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