CN106493483A - Low-temperature lead-free tin cream - Google Patents
Low-temperature lead-free tin cream Download PDFInfo
- Publication number
- CN106493483A CN106493483A CN201611081748.4A CN201611081748A CN106493483A CN 106493483 A CN106493483 A CN 106493483A CN 201611081748 A CN201611081748 A CN 201611081748A CN 106493483 A CN106493483 A CN 106493483A
- Authority
- CN
- China
- Prior art keywords
- lead
- low
- tin cream
- free
- cream
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The present invention proposes a kind of low-temperature lead-free tin cream, calculates according to percetage by weight, is mixed with weld-aiding cream 10～15% by lead-free solder alloy powder 85%～90%, and the lead-free solder alloy powder is calculated according to percetage by weight, is made including following raw material：Zinc 5～10%, nickel 0.1～0.2%, copper 0.3～0.5%, bismuth 2～4% and Graphene 0.6～2.4%, balance of stannum；The group of the weld-aiding cream is divided into：Bonding 35～45wt% of film former, 0.5～2wt% of dibromo ethyl benzene, Semen Ricini oleoyl diethanolamine 1～2%, citric acid 3～6%, balance of organic solvent.The low-temperature lead-free tin cream has good solder joint bond strength, solves the problems, such as that current low temperature tin cream easily blacks.
Description
Technical field
The invention belongs to mastic technical field of welding materials, and in particular to a kind of low-temperature lead-free tin cream.
Background technology
Modern electronics industry is fast-developing, and solder(ing) paste is its important production link for the welding of electronic product, tradition
Solder(ing) paste because containing a large amount of lead and produce volume of smoke and gradually replaced, be unleaded electricity using low patina solder alloy
Subgroup fills the development trend for improving cost performance, the solder(ing) paste prepared based on SAC305 on existing market, but which has the disadvantage
High expensive, is badly in need of by reducing the Ag contents in solder alloy with this, and then improves the cost performance of packaging technology.
Sn-Zn systems solder is a kind of lead-free solder for substituting Sn-Pb solders at present in electronic packaging industry, with Sn-Pb
The fusing point of eutectic solder is sufficiently close to, and therefore attracts attention.Many-side has been carried out to which to Sn-Zn systems solder people
Research, also obtain much substantial progress and achievement, but in place of also show some shortcomings in practice.Sn-Zn systems
Solder is poor with the reliability of the bond strength of substrate and solder joint.Additionally, be the element for easily aoxidizing, containing the more melt tables of Zn
Face is more readily formed oxide, and the effect of the unprotected melt of the oxide that formed, so as to cause the non-oxidizability of solder compared with
Difference, limits the application of solder alloy.The existing maximum shortcoming of low temperature tin cream is easily to black, and reason is metal Zn than other
Metal more oxidizable, oxide layer is also thicker, and the slaine that weld-aiding cream is formed after removing oxide also compares many, and these salt are welded
After will form a kind of atrament.Therefore, the On Blackening for how improving low temperature tin cream becomes the key of prior art.
Content of the invention
The present invention proposes a kind of low-temperature lead-free tin cream, and the low-temperature lead-free tin cream has good solder joint bond strength, solves
The problem that low temperature tin cream easily blacks at present.
The technical scheme is that and be achieved in that：
A kind of low-temperature lead-free tin cream, according to percetage by weight calculate, by lead-free solder alloy powder 85%～90% with help
Soldering paste 10～15% is mixed, and the lead-free solder alloy powder is calculated according to percetage by weight, is made including following raw material：
Zinc 5～10%, nickel 0.1～0.2%, copper 0.3～0.5%, bismuth 2～4% and Graphene 0.6～2.4%, balance of stannum；Described
The group of weld-aiding cream is divided into：Bonding 35～45wt% of film former, 0.5～2wt% of dibromo ethyl benzene, Semen Ricini oleoyl diethanolamine 1～
2%th, citric acid 3～6%, balance of organic solvent.
Further, the organic solvent is 40 by tetrahydrofurfuryl alcohol, triethylene-glycol, hydrogenated rosin propyl ether according to volume ratio
～50:10～20:30～50 compositions.
Further, the bonding film former is hydrogenated rosin, newtrex or water-white Colophonium.
A kind of preparation method of low-temperature lead-free tin cream, comprises the following steps：
1) prepared by lead-free solder alloy powder；
2) prepared by weld-aiding cream：First it is placed in the container with dispersal device by the organic solvent and bonding film former of dosage,
Heat and be stirred continuously to material and be completely dissolved, then disposably add rest materials, continue heated and stirred complete to all materials
CL stops heating and stirring into limpid dilute thick liquid, seals vessel port, stands and is cooled to room temperature, obtains weld-aiding cream；
3) first weld-aiding cream is placed in synthesizer, is subsequently adding lead-free solder alloy powder solder powder, synthesizer is sealed,
Then nitrogen is filled with to malleation, and subsequent start-up stirring system is stirred, and stops stirring, is discharged, i.e., after starting vacuum system evacuation
?.
Further, in the preferred embodiment of the present invention, the lead-free solder alloy powder preparation method is：
A, pure zinc ingot, pure nickel ingot, fine copper ingot, pure bismuth ingot and pure tin ingot are encapsulated in vitreosil pipe, are then charged with
Highly purified nitrogen protective gas；
B, packaged raw material in step a is put into melting heat treatment in reacting furnace, the liquation after being completely melt；
C, Graphene is placed in stirring ball mill, liquid nitrogen is filled with to being totally submerged after abrading-ball, carries out ball milling, by ball milling
Powder afterwards takes out, and is stirred, is subsequently placed in inert gas shielding case and is cooled to room temperature in the liquation for adding step b, then
Load mould for hot pressed sintering；
D, by hot pressed sintering after base substrate extrusion process molding, obtain final product.
Beneficial effects of the present invention：
1st, the weld-aiding cream that the present invention is used efficiently solves asking for lead-free tin cream nigrescence by the screening to various components
Topic.It is made up of additionally, carrying out screening to organic solvent and finding to use tetrahydrofurfuryl alcohol, triethylene-glycol, hydrogenated rosin propyl ether
Organic solvent so that lead-free tin cream wettability is preferable, solder joint profile is fuller, and spreading ratio is both greater than 92%, more traditional alcohol ether
Complex solvent spreading ratio improves a lot.
2nd, Graphene of the present invention by interpolation proper proportion, Graphene are interacted with solid solution nickel hydroxide crystal so that solid solution
Nickel is preferentially reacted with oxygen, forms one layer of thin and compact oxide-film in the liquid level moment of fusion welding, and the oxide-film can be effective
Isolation extraneous oxygen in ground is entered in film, the Zn in fusion welding can be suppressed to aoxidize, so as to significantly improve solder alloy
Antioxygenic property.
3rd, has following advantage with practical application after testing：Mastic is fine and smooth, and not halogen-containing, free from extraneous odour, printing are excellent, solder joint
Good moldability, does not put up a bridge, not top-notch, has lasting slow curing.After backflow, solder joint is bright, full, and the face of weld is smooth, without residue,
No clean.Welding product is through standard detection and destructive detection, it was demonstrated that reliability is excellent.
Specific embodiment
Embodiment 1
A kind of low-temperature lead-free tin cream, calculates according to percetage by weight, by lead-free solder alloy powder 85% and weld-aiding cream
15% is mixed.
Lead-free solder alloy powder is calculated according to percetage by weight, is made including following raw material：Zinc 7%, nickel 0.15%, copper
0.4%th, bismuth 3% and Graphene 1.8%, balance of stannum.
The group of weld-aiding cream is divided into：Hydrogenated rosin 35wt%, dibromo ethyl benzene 2wt%, Semen Ricini oleoyl diethanolamine 2%, lemon
Lemon acid 6%, balance of organic solvent.Organic solvent is by tetrahydrofurfuryl alcohol, triethylene-glycol, hydrogenated rosin propyl ether according to volume ratio
For 40：20：40 compositions.
Embodiment 2
A kind of low-temperature lead-free tin cream, calculates according to percetage by weight, by lead-free solder alloy powder 88% and weld-aiding cream
12% is mixed.
Lead-free solder alloy powder is calculated according to percetage by weight, is made including following raw material：Zinc 5%, nickel 0.2%, copper
0.5%th, bismuth 4% and Graphene 2.4%, balance of stannum.
The group of weld-aiding cream is divided into：Newtrex 40wt%, dibromo ethyl benzene 1.2wt%, Semen Ricini oleoyl diethanolamine
1.6%th, citric acid 4%, balance of organic solvent.Organic solvent is pressed by tetrahydrofurfuryl alcohol, triethylene-glycol, hydrogenated rosin propyl ether
It is 45 according to volume ratio:15:40 compositions.
Embodiment 3
A kind of low-temperature lead-free tin cream, calculates according to percetage by weight, by lead-free solder alloy powder 86% and weld-aiding cream
14% is mixed.
Lead-free solder alloy powder is calculated according to percetage by weight, is made including following raw material：Zinc 10%, nickel 0.1%, copper
0.3%th, bismuth 2% and Graphene 0.6%, balance of stannum.
The group of weld-aiding cream is divided into：Water-white Colophonium 42wt%, dibromo ethyl benzene 0.8wt%, Semen Ricini oleoyl diethanolamine
1.2%th, citric acid 3.6%, balance of organic solvent.Organic solvent is by tetrahydrofurfuryl alcohol, triethylene-glycol, hydrogenated rosin propyl ether
It is 50 according to volume ratio:20:30 compositions.
Embodiment 4
A kind of low-temperature lead-free tin cream, calculates according to percetage by weight, by lead-free solder alloy powder 90% and weld-aiding cream
10% is mixed.
Lead-free solder alloy powder is calculated according to percetage by weight, is made including following raw material：Zinc 10%, nickel 0.1%, copper
0.3%th, bismuth 2% and Graphene 0.6%, balance of stannum.
The group of weld-aiding cream is divided into：Hydrogenated rosin 45wt%, dibromo ethyl benzene 0.5wt%, Semen Ricini oleoyl diethanolamine 1%,
Citric acid 3%, balance of organic solvent.Organic solvent is by tetrahydrofurfuryl alcohol, triethylene-glycol, hydrogenated rosin propyl ether according to volume
Than for 48:12:40 compositions.
Presently preferred embodiments of the present invention is the foregoing is only, not in order to limit the present invention, all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements that is made etc. should be included within the scope of the present invention.
Claims (3)
1. a kind of low-temperature lead-free tin cream, it is characterised in that calculate according to percetage by weight, by lead-free solder alloy powder 85%～
90% is mixed with weld-aiding cream 10～15%, and the lead-free solder alloy powder is calculated according to percetage by weight, including following
Raw material is made：Zinc 5～10%, nickel 0.1～0.2%, copper 0.3～0.5%, bismuth 2～4% and Graphene 0.6～2.4%, surplus
For stannum；The group of the weld-aiding cream is divided into：Bonding 35～45wt% of film former, 0.5～2wt% of dibromo ethyl benzene, Semen Ricini oleoyl two
Ethanolamine 1～2%, citric acid 3～6%, balance of organic solvent.
2. low-temperature lead-free tin cream according to claim 1, it is characterised in that the organic solvent is by tetrahydrofurfuryl alcohol, two contractings
Triethylene glycol, hydrogenated rosin propyl ether are 40～50 according to volume ratio:10～20:30～50 compositions.
3. low-temperature lead-free tin cream according to claim 1 and 2, it is characterised in that the bonding film former be hydrogenated rosin,
Newtrex or water-white Colophonium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611081748.4A CN106493483A (en) | 2016-11-30 | 2016-11-30 | Low-temperature lead-free tin cream |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611081748.4A CN106493483A (en) | 2016-11-30 | 2016-11-30 | Low-temperature lead-free tin cream |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106493483A true CN106493483A (en) | 2017-03-15 |
Family
ID=58327320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611081748.4A Pending CN106493483A (en) | 2016-11-30 | 2016-11-30 | Low-temperature lead-free tin cream |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106493483A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108857149A (en) * | 2018-08-29 | 2018-11-23 | 佛山朝鸿新材料科技有限公司 | A kind of preparation method of aluminum welding tin paste |
| CN114799612A (en) * | 2022-05-27 | 2022-07-29 | 常州时创能源股份有限公司 | Photovoltaic brazing solder, and preparation method and application thereof |
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| JP2005238328A (en) * | 2004-01-30 | 2005-09-08 | Japan Science & Technology Agency | Lead-free solder alloy, method for manufacturing the same, mounting structural body, mounting method, lead-free fuse alloy, method for manufacturing the same, plate fuse, lead-free alloy, and method for manufacturing the same |
| CN1730696A (en) * | 2005-08-05 | 2006-02-08 | 大连理工大学 | Tin-zinc-copper-nickel lead-free solder alloy |
| CN1861311A (en) * | 2006-04-30 | 2006-11-15 | 北京市航天焊接材料厂 | Lead-free anti-oxidation rare-earth-contg. type SnZn alloy welding flux, and its prepn. method |
| CN101224525A (en) * | 2008-01-21 | 2008-07-23 | 广州瀚源电子科技有限公司 | Lead-free pasty solder and preparing method thereof |
| CN101733575A (en) * | 2008-11-13 | 2010-06-16 | 北京有色金属研究总院 | Tin-zinc-bismuth-copper leadless solder with low cost and welding spot thereof |
| CN104801887A (en) * | 2015-05-20 | 2015-07-29 | 苏州汉尔信电子科技有限公司 | Paste flux for low-temperature solder paste and preparation method thereof |
| CN106001979A (en) * | 2016-05-19 | 2016-10-12 | 厦门圣之岛金属科技有限公司 | Grapheme, zinc oxide crystal whisker and tin base composite material and preparation method thereof |
-
2016
- 2016-11-30 CN CN201611081748.4A patent/CN106493483A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005238328A (en) * | 2004-01-30 | 2005-09-08 | Japan Science & Technology Agency | Lead-free solder alloy, method for manufacturing the same, mounting structural body, mounting method, lead-free fuse alloy, method for manufacturing the same, plate fuse, lead-free alloy, and method for manufacturing the same |
| CN1730696A (en) * | 2005-08-05 | 2006-02-08 | 大连理工大学 | Tin-zinc-copper-nickel lead-free solder alloy |
| CN1861311A (en) * | 2006-04-30 | 2006-11-15 | 北京市航天焊接材料厂 | Lead-free anti-oxidation rare-earth-contg. type SnZn alloy welding flux, and its prepn. method |
| CN101224525A (en) * | 2008-01-21 | 2008-07-23 | 广州瀚源电子科技有限公司 | Lead-free pasty solder and preparing method thereof |
| CN101733575A (en) * | 2008-11-13 | 2010-06-16 | 北京有色金属研究总院 | Tin-zinc-bismuth-copper leadless solder with low cost and welding spot thereof |
| CN104801887A (en) * | 2015-05-20 | 2015-07-29 | 苏州汉尔信电子科技有限公司 | Paste flux for low-temperature solder paste and preparation method thereof |
| CN106001979A (en) * | 2016-05-19 | 2016-10-12 | 厦门圣之岛金属科技有限公司 | Grapheme, zinc oxide crystal whisker and tin base composite material and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108857149A (en) * | 2018-08-29 | 2018-11-23 | 佛山朝鸿新材料科技有限公司 | A kind of preparation method of aluminum welding tin paste |
| CN114799612A (en) * | 2022-05-27 | 2022-07-29 | 常州时创能源股份有限公司 | Photovoltaic brazing solder, and preparation method and application thereof |
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| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170315 |
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