CN106488603B - 显示装置和其制造方法 - Google Patents

显示装置和其制造方法 Download PDF

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Publication number
CN106488603B
CN106488603B CN201610757709.5A CN201610757709A CN106488603B CN 106488603 B CN106488603 B CN 106488603B CN 201610757709 A CN201610757709 A CN 201610757709A CN 106488603 B CN106488603 B CN 106488603B
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China
Prior art keywords
layer
display device
resin layer
substrate
manufacturing
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English (en)
Chinese (zh)
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CN106488603A (zh
Inventor
栗谷川武
渡部史
渡部一史
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Magno Haote Co ltd
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Japan Display Central Inc
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8428Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851Division of substrate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN201610757709.5A 2015-08-27 2016-08-29 显示装置和其制造方法 Active CN106488603B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015168186A JP6474337B2 (ja) 2015-08-27 2015-08-27 表示装置及びその製造方法
JP2015-168186 2015-08-27

Publications (2)

Publication Number Publication Date
CN106488603A CN106488603A (zh) 2017-03-08
CN106488603B true CN106488603B (zh) 2018-07-10

Family

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CN201610757709.5A Active CN106488603B (zh) 2015-08-27 2016-08-29 显示装置和其制造方法

Country Status (4)

Country Link
US (1) US10115774B2 (enExample)
JP (1) JP6474337B2 (enExample)
KR (1) KR101871047B1 (enExample)
CN (1) CN106488603B (enExample)

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JP6947536B2 (ja) * 2017-05-26 2021-10-13 株式会社ジャパンディスプレイ 表示装置
CN110943066A (zh) * 2018-09-21 2020-03-31 联华电子股份有限公司 具有高电阻晶片的半导体结构及高电阻晶片的接合方法
JP2020071967A (ja) * 2018-10-30 2020-05-07 三星ダイヤモンド工業株式会社 フレキシブル有機elディスプレイの製造方法
JP2020071970A (ja) * 2018-10-30 2020-05-07 三星ダイヤモンド工業株式会社 フレキシブル有機elディスプレイの製造方法
JP2020071966A (ja) * 2018-10-30 2020-05-07 三星ダイヤモンド工業株式会社 フレキシブル有機elディスプレイの製造方法
JP2020071969A (ja) * 2018-10-30 2020-05-07 三星ダイヤモンド工業株式会社 フレキシブル有機elディスプレイの製造方法
WO2021131022A1 (ja) 2019-12-27 2021-07-01 シャープ株式会社 表示装置
KR20210151304A (ko) 2020-06-04 2021-12-14 삼성디스플레이 주식회사 표시 장치

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Also Published As

Publication number Publication date
JP6474337B2 (ja) 2019-02-27
CN106488603A (zh) 2017-03-08
KR101871047B1 (ko) 2018-06-25
KR20170026131A (ko) 2017-03-08
US10115774B2 (en) 2018-10-30
JP2017044921A (ja) 2017-03-02
US20170062761A1 (en) 2017-03-02

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Effective date of registration: 20250723

Address after: Tokyo, Japan

Patentee after: Magno Haote Co.,Ltd.

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Address before: Tokyo, Japan

Patentee before: JAPAN DISPLAY Inc.

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