CN106486401A - A kind of reel-to-reel transfer system towards the detection of slice component multinode - Google Patents

A kind of reel-to-reel transfer system towards the detection of slice component multinode Download PDF

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Publication number
CN106486401A
CN106486401A CN201610814103.0A CN201610814103A CN106486401A CN 106486401 A CN106486401 A CN 106486401A CN 201610814103 A CN201610814103 A CN 201610814103A CN 106486401 A CN106486401 A CN 106486401A
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slice component
reel
pick
coordinate value
axis coordinate
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CN106486401B (en
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陈建魁
雷景添
马亮
洪金华
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Huazhong University of Science and Technology
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Huazhong University of Science and Technology
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages

Abstract

The invention belongs to Electronic Packaging equipment association area, and disclose a kind of reel-to-reel transfer system towards the detection of slice component multinode, which includes base, and install material volume conveying device on the base, component pick-up device, clamping device and on regarding detection means, wherein material volume conveying device is used for reel-to-reel feeding material, and slice component is taken off film and aluminum coated steel during feeding;The component pick-up device be used for will slice component execute pickup after be transferred to clamping device and detected, then return it into placement to material strip hopper, and be respectively adopted down and which carried out down apparent place appearance shooting depending on observing camera;Coordinate regarding detection means on this and slice component is executed upper apparent place appearance shoots.The invention also discloses the optimization processing algorithm of each link of position compensation and comprehensive evaluation algorithm.By means of the invention it is possible to guarantee to realize the pickup of slice component in continuous detection process and return placement operation, the advantages of be provided simultaneously with high efficiency and high accuracy.

Description

A kind of reel-to-reel transfer system towards the detection of slice component multinode
Technical field
The invention belongs to Electronic Packaging equipment association area, examines towards slice component multinode more particularly, to one kind The reel-to-reel transfer system of survey.
Background technology
Component surface mounting technology (Surface Mount Technology, abbreviation SMT) is the main flow of electronic manufacture Technology, it is ensured that its technique becomes more meticulous and product high reliability, be unable to do without high-quality, high efficient detection technology.From attachment unit Device assembling components of reaching the standard grade are finished in offline whole SMT assembling flow path, and detection is primarily disposed in three main node:I.e. Component detection after detecting and assemble in supplied materials detection, assembling process before assembling.
In prior art with regard in the electronic component detection scheme of supplied materials detection, be all mostly from detection functional perspective It is designed with structure composition angle.For example, a kind of SMD sampling observation towards charging tray is disclosed in CN105555123A and is checked set Standby, which can complete to reclaim after the quick sampling observation of element and inspection on SMD charging tray, can also rapidly and accurately complete element on charging tray in addition The checking and cutting of number.But the technical scheme mainly proposes corresponding structure group from the angle for meeting element sampling observation and check Become, the specific embodiment for being related in detection that element is accurately positioned and shifts but is not provided.Correspondingly, this area needs pin badly Seek more sophisticated solution to above-mentioned technical problem, to meet the technological requirement for increasingly improving at present.
Content of the invention
Disadvantages described above or Improvement requirement for prior art, the invention provides one kind is examined towards slice component multinode The reel-to-reel transfer system of survey, wherein by carrying out weight to the unitary construction of reel-to-reel transfer system composition and its key component The new efficient feeding for designing, not only can achieve slice component to be checked, and can be in conjunction with demand to many during whole feeding Node executes high-precision complete detection;Additionally, the present invention be also respectively directed to component pick-up link, element return place link equal Different Optimization Compensation algorithms are devised, while evaluation algorithms are it is also proposed to shifting precision, accordingly be can further ensure that The precision pick of slice component is realized in continuous detection process and returns placement operation.
For achieving the above object, it is proposed, according to the invention, turn there is provided a kind of reel-to-reel towards the detection of slice component multinode Shifting system, the reel-to-reel system include base, and install material volume conveying device on the base, component pick-up device, folder Hold device and on regarding detection means, it is characterised in that:
The material volume conveying device includes blowing module, rewinding module, takes off film module and overlay film module, and wherein material is from this Blowing module executes admission towards the rewinding module in the way of reel-to-reel, and is taken off via described during feeding first Film module is opened the film packaged by surface and exposes slice component to be detected, is then covered via described after detection is completed again Film module gives again overlay film encapsulation to the slice component;
The component pick-up device includes pick-up head and lower regarding observation camera, and the wherein pick-up head has tri- axle freedom of XYZ Spend and around the W of Z axis rotation to the free degree, and filled with being transferred to the clamping for slice component to be detected is executed pickup Put and detected, then the slice component for completing to detect is returned and place to the material strip hopper of the material volume conveying device;Should It is fixed on the pick-up head and together can be movable along both x and y axes therewith depending on observing camera down, and is used for the pick-up head institute Pickup/return under the slice component that places is executed depending on shooting to obtain position and attitude information;
The clamping device arranges the horizontal side in the material volume transfer position, and for being turned the pick-up head Move past the slice component that comes to be clamped and energising process, then to its electric property perform detection, so as to judge this chip unit Whether the electric property of part meets demand;
Arrange regarding detection means on described and be between the material volume conveying device and the clamping device, and be used for institute State pick-up head to be picked up/return in the slice component execution of placement depending on shooting to obtain its position and attitude information.
As it is further preferred that the clamping device is in plank frame, and each it is provided with and can stretch in its surface both sides The elastic thimble of contracting, the elastic thimble are used for the slice component contact by pick-up head transfer so far and compress, then with electricity Performance detection instrument is connected, and thus executes the detection of electric property.
As it is further preferred that under described for observation camera, when slice component to be detected is picked up by described When the slice component for taking head execution pickup or completing to detect is executed return placement by the pick-up head, the slice component is all complete Lower within the field range of observation camera in this;Additionally, on described regarding detection means for, which is preferably regarding sight Camera is surveyed, and its visual field center is just consistent with the center of the pick-up head under rotation zero-bit state.
As it is further preferred that when slice component to be detected is executed pickup to be transferred to the folder by the pick-up head When holding device and being detected, preferably according to following equation to its pick-up operation execution position compensation:
Wherein,It is default pickup datum mark N respectively1X-axis coordinate value and Y-axis coordinate value,Point Actual pickup point N position compensation after is not carried out2X-axis coordinate value and Y-axis coordinate value;kDx、kDyIt is respectively used to represent X-axis side To in, Y direction for the compensating proportion factor under described regarding camera, which can be by executing vision regarding observation camera under described Demarcate and obtain;It is X-axis coordinate value and the Y-axis coordinate value of slice component geometric center to be detected respectively,Be respectively described under regarding the X-axis coordinate value of picture centre captured by observation camera and Y-axis coordinate value;Additionally, δx1y1It is respectively used to represent that the pick-up head rotates against zero-bit state under pick-up situation in X-direction, Y direction Change in location, its can be by obtaining to executing actual demarcation regarding observation camera on described.
As it is further preferred that when the slice component that the pick-up head is completed to detect returns placement to the material volume When in the material strip hopper of conveying device, preferably the compensation of placement operation execution position is returned to which according to following equation group:
Wherein,It is that default return places datum mark M respectively1X-axis coordinate value and Y-axis coordinate value,Actual return set-point M position compensation after is carried out respectively2X-axis coordinate value and Y-axis coordinate value;kEx、kEyPoint Yong Yu not represent for the compensating proportion factor on described regarding camera in X-direction, Y direction, which can be by regarding on described Observation camera executes vision calibration and obtains;It is the X of the slice component geometric center for completing and detecting respectively Axial coordinate value and Y-axis coordinate value,It is the X-axis coordinate regarding the picture centre captured by observation camera on described respectively Value and Y-axis coordinate value;θ is used for representing the material strip of the relatively described material volume conveying device of slice component drift angle in feed direction, And 0≤θ≤90 °;Moreover, it is assumed that the pick-up head here is returned under placement operation position rotated a circle with 10 ° as interval, its fortune Dynamic rail mark will be fitted and obtain an oblique ellipse, wherein, Ra、RbIt is respectively intended to represent the oblique oval major axis and short axle, Cx、CyRespectively For representing the coordinate in the oblique ellipse center of circle, γ is used for representing the anglec of rotation that the oblique ellipse relative standard is oval, above-mentioned 5 parameters Obtain as oblique ellipse fitting result.
As it is further preferred that when the slice component that the pick-up head is completed to detect returns placement to the material volume When in the material strip hopper of conveying device, preferably the maximum allowable inclined of the slice component is calculated first according to following equation group CornerWherein a, b represent length and the width of the slice component for completing and detecting respectively, and m, h represent the now chip respectively Element will be returned length and the width of the material strip hopper of placement:
And in the maximum allowable deflection angleWhen, placement operation execution position is returned to which according to following simplification formula Put compensation:
Wherein, θ is used for representing the material strip of the relatively described material volume conveying device of slice component drift angle in feed direction, and 0≤θ≤90°;It is that default return places datum mark M respectively1X-axis coordinate value and Y-axis coordinate value, Actual return set-point M position compensation after is carried out respectively2X-axis coordinate value and Y-axis coordinate value;kEx、kEyIt is respectively used to table Show the compensating proportion factor in X-direction, Y direction, which can be by obtaining depending on observing camera execute vision calibration on described ?;It is the X-axis coordinate value of slice component geometric center for completing to detect and Y-axis coordinate value respectively,It is X-axis coordinate value and the Y-axis coordinate value regarding the picture centre captured by observation camera on described respectively.
As it is further preferred that above-mentioned reel-to-reel transfer system also includes CPU, the CPU Evaluate for the transfer precision to being reached after the compensation of slice component execution position, and preferably come according to following equation group Calculate transfer precision evaluation value kx、ky
Wherein, a, b represent length and the width of the slice component for completing and detecting respectively, and m, h represent the now piece respectively Formula element will be returned length and the width of the material strip hopper of placement;Ex、EyBe respectively intended to expression placement is returned to the material strip hopper Interior slice component X-direction, Y direction with respect to this material strip hopper center deviation;β is returned placement for representing Slice component to the material strip hopper is in the angle with respect to material direction of feed;Additionally, kx、kyValue less, then show Transfer precision is higher.
In general, possesses following skill compared with prior art, mainly by the contemplated above technical scheme of the present invention Art advantage:
1st, wherein by redesigning to the unitary construction of reel-to-reel transfer system composition and its key component, no The efficient feeding of slice component to be checked is only can achieve, and height can be executed to the multinode during whole feeding in conjunction with demand The complete detection of precision;
2nd, the present invention be also respectively directed to component pick-up link, element return place link independently devise different excellent Change backoff algorithm, wherein when pick-up head is related to the positioning of element pickup link, by regarding observation camera under introducing, under regard Observation camera is adopted figure and obtains slice component posture information, and binding member posture information calculates compensation with lower depending on visual compensation Deviation, drives pick-up head to compensate corresponding deviation based on pickup datum mark and is picked up with completing the positioning to element geometric center;
3 additionally, be related to pick-up head to element when accurately putting back to hopper link, by introducing regard observation camera To eliminate the error that pick process is caused, on obtain slice component posture information calculating compensation partially depending on observing camera and adopt figure Difference, it is possible thereby to ensure that pick-up head is accurately put back to element;
4th, also it is specifically designed for proposing evaluation algorithms to shifting precision in the present invention, thus, it is possible to quantitative assessment using above-mentioned Visual compensation carries out, to different size element, the transfer precision effect reached after error compensation.
Description of the drawings
Fig. 1 be according to being rolled onto migration volume system towards the detection of slice component multinode constructed by the preferred embodiment of the present invention The unitary construction schematic diagram of system;
Fig. 2 is the process chart of the global transfer process according to the present invention;
Fig. 3 is to evaluate schematic diagram according to the transfer accuracy quantification of the preferred embodiment for the present invention;
Fig. 4 is the exemplary lower principle schematic regarding observation camera illustrated according to the present invention;
Fig. 5 is exemplary explanation according to the principle schematic in the present invention regarding observation camera.
Specific embodiment
In order that the objects, technical solutions and advantages of the present invention become more apparent, below in conjunction with drawings and Examples, right The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only in order to explain the present invention, and It is not used in the restriction present invention.As long as additionally, involved technical characteristic in each embodiment of invention described below Do not constitute conflict each other can just be mutually combined.
Fig. 1 be according to being rolled onto migration volume system towards the detection of slice component multinode constructed by the preferred embodiment of the present invention The unitary construction schematic diagram of system.As shown in figure 1, the reel-to-reel transfer system mainly includes base 1, and install on the base Material volume conveying device 2, component pick-up device 3, clamping device 4 and on regarding components such as detection means 5, below will be to which one by one It is specifically described.
Material volume conveying device 2 may include blowing module 21, rewinding module 26, take off film module 22 and overlay film module 27, wherein Material executes admission towards the rewinding module 26 from the blowing module 21 in the way of reel-to-reel, and (in figure is shown along Y Direction of principal axis), and open the film packaged by surface and expose piece to be detected via taking off film module 22 during feeding first Formula element 24, then gives overlay film encapsulation via 27 pairs of slice components of overlay film module after detection is completed again again.
Component pick-up device 3 mainly includes pick-up head 32 and lower regarding observation camera 31, and wherein the pick-up head 32 can be with XYZ The three axle frees degree and around Z axis rotation W to the free degree, and for slice component to be detected is executed pickup to be transferred to folder Hold device 4 to be detected, the quality testing being directed primarily in terms of electric property, the slice component that then will complete to detect is returned Place to the material strip hopper of the material volume conveying device.This is lower to be fixed on pick-up head 32 and can therewith together depending on observing camera 31 It is movable along both x and y axes, and for the pick-up head being picked up/being returned under the slice component of placement is executed depending on shooting to obtain Obtain position and attitude information.
Clamping device 4 arranges the horizontal side in the material volume transfer position, and is used for pick-up head 32) shifted The slice component that comes is clamped and energising is processed, then to its electric property perform detection, so as to judge this slice component Whether electric property meets demand.More specifically, the clamping device is in for example plank frame, and in its each self installation in surface both sides There is telescopic elasticity thimble, the elastic thimble is used for the slice component contact by pick-up head transfer so far and compresses, then It is connected with electric property detecting instrument, thus executes the detection of electric property.Position of the slice component in the clamping device The position being preferably designed as with which on material strip is perpendicular.
Additionally, on for example arrange between material volume conveying device 2 and clamping device depending on detection means 5, and be used for institute State pick-up head to be picked up/return in the slice component execution of placement depending on shooting to obtain its position and attitude information.
In other words, as shown in fig. 1, include altogether in the entire system 3 observation bit i.e. observation bit A, observation bit B and Observation bit C;According to a preferred embodiment of the present invention, under regarding observation camera 31 corresponding to observation bit A and observation bit B, and And when slice component to be detected is held by the pick-up head by pick-up head execution pickup or the slice component for completing to detect Row is returned when placing, and it is lower within the field range of observation camera that the slice component is all completely in this.On exist regarding detection means 5 It is preferably upper regarding observation camera in the present invention, which corresponds to observation bit C, and its visual field center is being just under zero-bit state is rotated The good center with the pick-up head is consistent.
More specifically, as shown in Figure 4, regarding observation camera in lower observation schematic diagram at observation bit B to element under being, Specifically take off regarding visual compensation by the schematic diagram.Camera coordinates system is regarded down as XDODYD, slice component geometric center is PointLower regarding adopts figure picture centre as pointThe point is fixed regarding observation bit and solid with lower Fixed and pick-up head is fixed depending on camera spacing with lower.As long as therefore being carried out depending on vision pick device (3) under band based on Current observation position The distance movement of the constant spacing, it is possible to which pick-up head is moved in figure point ND1, the point is corresponding to point in world coordinate systemTake N1For picking up datum mark.But as location layout pick-up head shown in Fig. 1 will from material strip position to fixture position Rotate 90 ° and pick-up head itself rotation introduces position deviation, actual pickup datum mark is corresponded to and in figure point
Similar, as shown in Figure 5, be pick-up head in upper observation schematic diagram at observation bit B to element, show by this It is intended to regard visual compensation in concrete explanation.On regard camera coordinates system as XEOEYE, pick-up head geometric center with regarding Cai Tutu Inconocenter is coincided with a littlePick-up head rotational trajectory center is in figure elliptical center point NE.Above depending on adopting figure When element in figure position, element central be pointAngular deviation with hopper is θ.
Additionally, pickup link, return being also directed in the present invention and placing link separately devise specific algorithm process Carry out execution position compensation, further to improve transfer precision.Certainly, on the basis of the above-mentioned base case of the present invention, The optimized algorithm that other can also be selected appropriate, or the optimized algorithm merging treatment by each link.
According to a preferred embodiment of the present invention, when slice component to be detected is executed pickup by the pick-up head 32 With when being transferred to the clamping device 4 and being detected, preferably according to following equation to its pick-up operation execution position compensation:
Wherein,It is default pickup datum mark N respectively1X-axis coordinate value and Y-axis coordinate value,Point Actual pickup point N position compensation after is not carried out2X-axis coordinate value and Y-axis coordinate value;kDx、kDyIt is respectively used to represent X-axis side To in, Y direction for the compensating proportion factor under described regarding camera, which can be by executing vision regarding observation camera under described Demarcate and obtain;It is X-axis coordinate value and the Y-axis coordinate value of slice component geometric center to be detected respectively,Be respectively described under regarding the X-axis coordinate value of picture centre captured by observation camera and Y-axis coordinate value;Additionally, δx1y1It is respectively used to represent that the pick-up head rotates against zero-bit state under pick-up situation in X-direction, Y direction Change in location, its can be by obtaining to executing actual demarcation regarding observation camera on described.
According to another preferred embodiment of the present invention, when the slice component that the pick-up head 32 is completed to detect is returned When placing to the material strip hopper of the material volume conveying device, preferably placement operation execution position is returned to which according to following equation group Put compensation:
Wherein,It is that default return places datum mark M respectively1X-axis coordinate value and Y-axis coordinate value,Actual return set-point M position compensation after is carried out respectively2X-axis coordinate value and Y-axis coordinate value;kEx、kEyPoint The compensating proportion factor in X-direction, Y direction Yong Yu not represented, which can be by executing vision regarding observation camera on described Demarcate and obtain;It is X-axis coordinate value and the Y-axis seat of the slice component geometric center for completing and detecting respectively Scale value,It is X-axis coordinate value and the Y-axis coordinate value regarding the picture centre captured by observation camera on described respectively;θ It is used for representing the material strip of the relatively described material volume conveying device of slice component drift angle in feed direction, and 0≤θ≤90 °;This Outward, it is assumed that the pick-up head here is returned under placement operation position and rotated a circle as interval with 10 °, and fitting is obtained by its movement locus (for example, the oblique oval general parameters equation can be typically expressed as x=R in the art to obtain an oblique ellipseacost*cosγ- Rbsint*sinγ+Cx, y=Racosθ*sinγ+Rbsinθ*cosγ+Cy, wherein, Ra、RbIt is respectively intended to represent the ellipse Major axis and short axle, Cx、CyIt is respectively used to represent the coordinate in the oval center of circle, γ is used for representing the rotation that the oval relative standard is oval Corner, above-mentioned 5 parameters are all obtained as oblique ellipse fitting result;T (0≤t≤2 π) is eccentric angle of an ellipse, is the oblique ellipse The independent variable parameter of parametric equation, in the operating mode, the value of t is θ).
Further, when the slice component that the pick-up head 32 is completed to detect returns placement to material volume conveying When in the material strip hopper of device, the maximum allowable deflection angle of the slice component can be calculated according to following equation group firstWherein a, b represent length and the width of the slice component for completing and detecting respectively, and m, h represent that now the slice component will respectively It is returned length and the width of the material strip hopper of placement:
And in the maximum allowable deflection angleWhen, placement operation execution position is returned to which according to following simplification formula Put compensation:
Wherein, θ is used for representing the material strip of the relatively described material volume conveying device of slice component drift angle in feed direction, and 0≤θ≤90°;It is that default return places datum mark M respectively1X-axis coordinate value and Y-axis coordinate value, Actual return set-point M position compensation after is carried out respectively2X-axis coordinate value and Y-axis coordinate value;kEx、kEyIt is respectively used to table Show for the compensating proportion factor on described regarding camera in X-direction, Y direction, which can be by regarding observation camera on described Execute vision calibration and obtain;It is the X-axis coordinate value of the slice component geometric center for completing and detecting respectively With Y-axis coordinate value,It is X-axis coordinate value and the Y-axis seat regarding the picture centre captured by observation camera on described respectively Scale value.And work as the maximum allowable deflection angleWhen, then remain in which returns placement operation to above-mentioned unreduced formula to which Execution position is compensated.
Referring to Fig. 3, it is shown that the transfer accuracy quantification according to the preferred embodiment for the present invention evaluates schematic diagram.In the figure In, Δ x represents the axial error boundary of Xz, Δ y represent Y direction to error boundary, a, b, m, h are respectively slice component With the length and width of hopper, β is deflection angle of the element with respect to hopper.Then
By taking the Chip-R element that package dimension is 0201 as an example, a height of 0.6mm × 0.3mm of component size length and width × 0.3mm, the size of components and parts groove corresponding to the SMD are 0.7mm × 0.4mm.When deflection angle beta=0 of element opposed slot, add up Error allows border maximum, then can try to achieve largest cumulative error and allow border, i.e. Δ xmax=0.05mm, Δ ymax=0.05mm. So when element is shifted from fixture position to hopper, the X caused in transfer process to being both needed to less than 50 μm with Y-direction Accumulated deviation, Just can guarantee that and successfully put back to.
Correspondingly, according to the another preferred embodiment of the present invention, above-mentioned reel-to-reel transfer system can also include central authorities Processing unit, the CPU are used for evaluating the transfer precision reached after the compensation of slice component execution position, And it is preferred that transfer precision evaluation value k is calculated according to following equation groupx、ky
Wherein, a, b represent length and the width of the slice component for completing and detecting respectively, and m, h represent the now piece respectively Formula element will be returned length and the width of the material strip hopper of placement;Ex、EyBe respectively intended to expression placement is returned to the material strip hopper Interior slice component X-direction, Y direction with respect to this material strip hopper center deviation;β is returned placement for representing Slice component to the material strip hopper is in the angle with respect to material direction of feed;Additionally, kx、kyValue less, then show Transfer precision is higher.
The global transfer technique according to the present invention is explained below with reference to Fig. 2.
First, material volume conveying device 2 is fed into down slice component 24 to be detected regarding the visual field of observation camera 31 in advance In the range of, figure is adopted to lower depending on observation bit A depending on observing camera 31 under movement, and obtained in the geometry of slice component using image procossing The heart
Then, willBring compensation calculation formula into and obtain actual pickup point at material strip Coordinate;Then pick up head to move toComplete to slice component to be checked positioning pickup, and move at fixture and pick up Take datum markPlacing element, so as to element is transferred at clamping device 4;
Then, on clamping device 4, the thimble of both sides stretches out, and tested slice component is connected in measure loop, is realized to piece The detection of formula element electrical performance;Treat that slice component detection is finished, thimble is retracted, regarding observation camera 31 to lower regarding observation under movement Position B adopts figure, and obtains the geometric center of element using image procossing
Then, willBring compensation calculation formula into and obtain actual pickup point at fixture Coordinate;Pick-up head is moved toComplete to examining slice component positioning pickup, and by qualified slice component Transfer is put back in the empty hopper of material strip 23, and underproof slice component is abandoned;Wherein for needing to put back to material strip feeding groove Slice component, also need before putting back to by pick-up head move to regard observation bit C, using on regarding sighting device 5 on pick-up head Slice component is adopted figure and is obtained the geometric center of slice component by image procossingMaterial strip relative with element Direction of feed bias angle theta (0≤θ≤90 °);
Then, maximum deflection angle is allowed according to θ and elementAngular deviation compensation in judgement depending on link of rectifying a deviation could be saved Slightly.IfThe angle to element can then be omitted rectify a deviation, willBring into and regard without on rotary deviation-rectifying Vision compensation calculation formula, obtains actual set-point at material stripCoordinate;IfThen pick-up head (32) The angular deviation compensation of element is completed by W axial-rotation, and willBring into depending on regarding on rotary deviation-rectifying Feel compensation calculation formula, obtain actual set-point at material stripCoordinate.Pick-up head moves to actual set-pointThus accurately putting back to slice component is completed.
To sum up, the present invention is by being set to the unitary construction of reel-to-reel transfer system composition and its key component again Meter, not only can achieve the efficient feeding of slice component to be checked, and can be in conjunction with demand to the multinode during whole feeding Execute high-precision complete detection;Additionally, the present invention is also respectively directed to component pick-up link, element return and placing link and all designing Different Optimization Compensation algorithm, while it is also proposed evaluation algorithms to shifting precision, accordingly can further ensure that continuous The precision pick of slice component is realized in detection process and returns placement operation.
As it will be easily appreciated by one skilled in the art that the foregoing is only presently preferred embodiments of the present invention, not in order to The restriction present invention, all any modification, equivalent and improvement that is made within the spirit and principles in the present invention etc., all should include Within protection scope of the present invention.

Claims (7)

1. a kind of reel-to-reel transfer system towards the detection of slice component multinode, the reel-to-reel system includes base (1), and Install material volume conveying device (2) on the base, component pick-up device (3), clamping device (4) and on regarding detection means (5), it is characterised in that:
Described material volume conveying device (2) include blowing module (21), rewinding module (26), take off film module (22) and overlay film module (27), wherein material executes admission towards the rewinding module (26) from the blowing module (21) in the way of reel-to-reel, and Open the film packaged by surface and expose chip unit to be detected via the film module (22) of taking off during feeding first Part (24), then gives again overlay film encapsulation via overlay film module (27) after detection is completed again to the slice component;
Described component pick-up device (3) include pick-up head (32) and lower regarding observation camera (31), and wherein pick-up head (32) has The tri- axle free degree of XYZ and around Z axis rotation W to the free degree, and for slice component to be detected is executed pickup to shift Detected to the clamping device (4), then the slice component for completing to detect is returned and place to the material volume conveying device Material strip hopper in;This is lower to be fixed on the pick-up head (32) and together can transport along X-axis and Y-axis therewith depending on observing camera (31) Dynamic, and for the pick-up head being picked up/being returned depending on shooting to obtain position and attitude letter under the slice component of placement is executed Breath;
Described clamping device (4) arrange the horizontal side in the material volume transfer position, and are used for the pick-up head (32) The slice component for being shifted is clamped and energising is processed, then to its electric property perform detection, so as to judge this piece Whether the electric property of formula element meets demand;
Arrange regarding detection means (5) on described and be between material volume conveying device (2) and the clamping device, and for right The pick-up head is picked up/is returned the slice component of placement and executed depending on shooting to obtain its position and attitude information.
2. as claimed in claim 1 a kind of towards slice component multinode detection reel-to-reel transfer system, it is characterised in that Clamping device (4) are in preferably plank frame, and are each provided with telescopic elasticity thimble, the elasticity in its surface both sides Thimble is used for the slice component contact by pick-up head transfer so far and compresses, and is then connected with electric property detecting instrument, Thus the detection of electric property is executed.
3. a kind of reel-to-reel transfer system towards the detection of slice component multinode as claimed in claim 1 or 2, its feature exists In under described for observation camera (31), when slice component to be detected is executed pickup or complete by the pick-up head When becoming the slice component of detection to be executed return placement by the pick-up head, it is lower regarding observation camera that the slice component is all completely in this Field range within;Additionally, on described regarding detection means (5) for, which is preferably upper regarding observation camera, and is revolving Turn its visual field center under zero-bit state to be just consistent with the center of the pick-up head.
4. as described in claim 1-3 any one a kind of towards slice component multinode detection reel-to-reel transfer system, Characterized in that, when slice component to be detected is executed pickup to be transferred to the clamping device (4) by pick-up head (32) When being detected, preferably according to following equation to its pick-up operation execution position compensation:
x N 2 = x N 1 - k D x ( x Q D - x N D 1 ) - δ x 1 y N 2 = y N 1 - k D y ( y Q D - y N D 1 ) - δ y 1
Wherein,It is default pickup datum mark N respectively1X-axis coordinate value and Y-axis coordinate value,It is respectively Actual pickup point N after execution position compensation2X-axis coordinate value and Y-axis coordinate value;kDx、kDyIt is respectively used to represent X-direction, Y For regarding the camera compensating proportion factor under described on direction of principal axis, which can be by executing vision calibration regarding observation camera under described Obtain;It is X-axis coordinate value and the Y-axis coordinate value of slice component geometric center to be detected respectively,Point Be not described under regarding the X-axis coordinate value of picture centre captured by observation camera and Y-axis coordinate value;Additionally, δx1y1Use respectively Change in location of the zero-bit state in X-direction, Y direction is rotated against under pick-up situation in the expression pick-up head, its Can be by obtaining to executing actual demarcation regarding observation camera on described.
5. as described in claim 1-4 any one a kind of towards slice component multinode detection reel-to-reel transfer system, Characterized in that, when the slice component that pick-up head (32) are completed to detect returns placement to the material volume conveying device When in material strip hopper, preferably the compensation of placement operation execution position is returned to which according to following equation group:
λ P E 1 Q E 1 = ( x Q E 1 - x P E 1 ) 2 + ( y Q E 1 - y P E 1 ) 2
Wherein,It is that default return places datum mark M respectively1X-axis coordinate value and Y-axis coordinate value,Point Actual return set-point M position compensation after is not carried out2X-axis coordinate value and Y-axis coordinate value;kEx、kEyIt is respectively used to represent X For the compensating proportion factor on described regarding camera in direction of principal axis, Y direction, which can be by executing regarding observation camera on described Vision calibration and obtain;It is X-axis coordinate value and the Y of the slice component geometric center for completing and detecting respectively Axial coordinate value,It is X-axis coordinate value and the Y-axis coordinate regarding the picture centre captured by observation camera on described respectively Value;θ is used for representing the material strip of the relatively described material volume conveying device of slice component drift angle in feed direction, and 0≤θ≤90 °; Moreover, it is assumed that the pick-up head here is returned under placement operation position being rotated a circle with 10 ° as interval, its movement locus will be fitted Obtain an oblique ellipse, wherein, Ra、RbIt is respectively intended to represent the oblique oval major axis and short axle, Cx、CyIt is respectively used to represent that this is oblique The coordinate in the oval center of circle, γ are used for representing the anglec of rotation that the oblique ellipse relative standard is oval that above-mentioned 5 parameters to be used as oblique oval plan Close result to obtain.
6. as claimed in claim 5 a kind of towards slice component multinode detection reel-to-reel transfer system, it is characterised in that When the slice component that the pick-up head (32) is completed to detect returns placement to the material strip hopper of the material volume conveying device When, preferably calculate the maximum allowable deflection angle of the slice component according to following equation group firstWherein a, b distinguish table Show length and the width of the slice component for completing and detecting, m, h represent that now the slice component will be returned the material of placement respectively Length and width with hopper:
β 1 = arccos a + m 2 a 2 + b 2 + arctan b a β 2 = arccos b + h 2 a 2 + b 2 - arctan b a β ‾ = min ( β 1 , β 2 )
And in the maximum allowable deflection angleWhen, placement operation execution position benefit is returned to which according to following simplification formula Repay:
x M 2 = x M 1 - k E x ( x Q E 1 - x P E 1 )
y M 2 = y M 1 - k E y ( y Q E 1 - y P E 1 )
Wherein, θ is used for representing the material strip of the relatively described material volume conveying device of slice component drift angle in feed direction, and 0≤θ ≤90°;It is that default return places datum mark M respectively1X-axis coordinate value and Y-axis coordinate value,Respectively It is carried out the actual return set-point M after position compensation2X-axis coordinate value and Y-axis coordinate value;kEx、kEyIt is respectively used to represent X-axis The compensating proportion factor on direction, Y direction, its can be by obtaining depending on observing camera execute vision calibration on described;It is the X-axis coordinate value of slice component geometric center for completing to detect and Y-axis coordinate value respectively,It is X-axis coordinate value and the Y-axis coordinate value regarding the picture centre captured by observation camera on described respectively.
7. a kind of reel-to-reel transfer system towards the detection of slice component multinode as described in claim 5 or 6, its feature exists In above-mentioned reel-to-reel transfer system also includes CPU, and the CPU is used for slice component execution position The transfer precision reached after compensation is evaluated, and preferably calculates transfer precision evaluation value k according to following equation groupx、 ky
k x = 2 E x h - a 2 + b 2 sin ( β + arctan b a ) k y = 2 E y m - a 2 + b 2 cos ( β - arctan b a )
Wherein, a, b represent length and the width of the slice component for completing and detecting respectively, and m, h represent the now chip unit respectively Part will be returned length and the width of the material strip hopper of placement;Ex、EyBe respectively intended to represent placement is returned to the material strip hopper Slice component X-direction, Y direction with respect to this material strip hopper center deviation;β is returned placement to institute for representing The slice component in material strip hopper is stated in the angle with respect to material direction of feed;Additionally, kx、kyValue less, then show transfer Precision is higher.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107487669A (en) * 2017-08-02 2017-12-19 苏州市朗电机器人有限公司 The feed unit of optical film Visual intelligent detection device
CN116677686A (en) * 2023-07-31 2023-09-01 常州铭赛机器人科技股份有限公司 Mounting method for multiple photographing of chip mounter based on machine vision

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100339499B1 (en) * 2000-07-31 2002-06-05 백남현 Loadding device and method of PCB manufacturing process
US20020095999A1 (en) * 2001-01-25 2002-07-25 Leica Microsystems Jena Gmbh Method and arrangement for transporting and inspecting semiconductor substrates
CN104754931A (en) * 2013-12-31 2015-07-01 弗兰克·魏 Storage card for surface-mounted component, feeder and automatic chip mounter
CN104837328A (en) * 2015-05-07 2015-08-12 华中科技大学 High-efficiency automatic sampling inspection equipment for SMD material tray
CN104981105A (en) * 2015-07-09 2015-10-14 广东工业大学 Detecting and error-correcting method capable of rapidly and accurately obtaining element center and deflection angle
CN105304539A (en) * 2015-09-14 2016-02-03 北京中电科电子装备有限公司 Chip flying centering device and method
CN105555123A (en) * 2015-12-22 2016-05-04 华中科技大学 Tray-oriented SMD sampling and counting equipment

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100339499B1 (en) * 2000-07-31 2002-06-05 백남현 Loadding device and method of PCB manufacturing process
US20020095999A1 (en) * 2001-01-25 2002-07-25 Leica Microsystems Jena Gmbh Method and arrangement for transporting and inspecting semiconductor substrates
CN104754931A (en) * 2013-12-31 2015-07-01 弗兰克·魏 Storage card for surface-mounted component, feeder and automatic chip mounter
CN104837328A (en) * 2015-05-07 2015-08-12 华中科技大学 High-efficiency automatic sampling inspection equipment for SMD material tray
CN104981105A (en) * 2015-07-09 2015-10-14 广东工业大学 Detecting and error-correcting method capable of rapidly and accurately obtaining element center and deflection angle
CN105304539A (en) * 2015-09-14 2016-02-03 北京中电科电子装备有限公司 Chip flying centering device and method
CN105555123A (en) * 2015-12-22 2016-05-04 华中科技大学 Tray-oriented SMD sampling and counting equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107487669A (en) * 2017-08-02 2017-12-19 苏州市朗电机器人有限公司 The feed unit of optical film Visual intelligent detection device
CN107487669B (en) * 2017-08-02 2019-02-05 苏州市朗电机器人有限公司 The feed unit of optical film Visual intelligent detection device
CN116677686A (en) * 2023-07-31 2023-09-01 常州铭赛机器人科技股份有限公司 Mounting method for multiple photographing of chip mounter based on machine vision
CN116677686B (en) * 2023-07-31 2023-10-20 常州铭赛机器人科技股份有限公司 Mounting method for multiple photographing of chip mounter based on machine vision

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