CN106486401B - A kind of reel-to-reel transfer system towards the detection of slice component multinode - Google Patents
A kind of reel-to-reel transfer system towards the detection of slice component multinode Download PDFInfo
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- CN106486401B CN106486401B CN201610814103.0A CN201610814103A CN106486401B CN 106486401 B CN106486401 B CN 106486401B CN 201610814103 A CN201610814103 A CN 201610814103A CN 106486401 B CN106486401 B CN 106486401B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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Abstract
The invention belongs to Electronic Packaging equipment related fieldss, and disclose a kind of reel-to-reel transfer system towards the detection of slice component multinode, it includes pedestal, and material volume conveying device, component pick-up device, clamping device and the upper view detection device being mounted on the base, wherein material volume conveying device feeds material for reel-to-reel, and slice component is taken off film and coating processing during feeding；The component pick-up device for slice component is executed pick up after be transferred to clamping device and detected, then return it into placement to material strip hopper, and lower view observation camera is respectively adopted carries out lower view pose to it and shoot；Detection device cooperation is regarded on this, and view pose shooting is executed to slice component.The invention also discloses the optimization processing algorithm of each link of position compensation and comprehensive evaluation algorithms.By means of the invention it is possible to the advantages that ensuring to realize the pickup of slice component in continuous detection process and returning to placement operation, be provided simultaneously with high efficiency and high-precision.
Description
Technical field
The invention belongs to Electronic Packaging equipment related fieldss, examine more particularly, to one kind towards slice component multinode
The reel-to-reel transfer system of survey.
Background technique
Component surface mounting technology (Surface Mount Technology, abbreviation SMT) is the mainstream of electronic manufacture
Technology, it is ensured that the fining of its technique and product high reliability be unable to do without high quality, high efficient detection technology.First from attachment
Device is online to be finished in offline entire SMT assembling flow path to component assembling, and detection is primarily disposed in three main nodes: i.e.
Component detection after detecting and assemble in supplied materials detection, assembling process before assembling.
In the prior art about in the electronic component detection scheme of supplied materials detection, being all from detection function angle mostly
It is designed with structure composition angle.For example, disclosed in CN105555123 A it is a kind of towards charging tray SMD sampling observation and check
Equipment is recycled on achievable SMD charging tray after the quick sampling observation and inspection of element, furthermore can also rapidly and accurately be completed first on charging tray
Part number checking and cutting.But the technical solution is mainly to propose corresponding structure from the angle for meeting element sampling observation and checking
Composition does not provide the specific embodiment that element involved in detection is accurately positioned and shifts but.Correspondingly, this field needs
Seek more perfect solution, in view of the above technical problems to meet increasing technique requirement at present.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, the present invention provides one kind examines towards slice component multinode
The reel-to-reel transfer system of survey, wherein carrying out weight by overall construction to reel-to-reel transfer system composition and its key component
New design can not only realize the efficient feeding of slice component to be checked, but also can be in conjunction with demand to more during entire feeding
Node executes high-precision complete detection；In addition, the present invention is also equal for component pick-up link, element return placement link respectively
Different Optimization Compensation algorithms is devised, while evaluation algorithms also proposed to transfer precision, accordingly can further ensure that
The precision pick of slice component is realized in continuous detection process and returns to placement operation.
To achieve the above object, it is proposed, according to the invention, provide a kind of reel-to-reel turn towards the detection of slice component multinode
Shifting system, which includes pedestal, and the material volume conveying device, the component pick-up that are mounted on the base fill
It sets, clamping device and upper view detection device, it is characterised in that:
The material volume conveying device includes blowing module, rewinding module, takes off film module and overlay film module, wherein material from this
Blowing module executes admission towards the rewinding module in a manner of reel-to-reel, and takes off first via described during feeding
Film module opens film packaged by surface and exposes slice component to be detected, then covers again via described after completing detection
Film module gives overlay film encapsulation to the slice component again；
The component pick-up device includes pick-up head and lower view observation camera, and wherein the pick-up head has tri- axis of XYZ free
Degree and the W rotated around Z axis are picked up to freedom degree, and for executing slice component to be detected to be transferred to the clamping and fill
It sets and is detected, then the slice component for completing detection is returned and is placed to the material strip hopper of the material volume conveying device；It should
It is lower to be fixed on the pick-up head depending on observation camera and be movable along both x and y axes together therewith, and for the pick-up head institute
The slice component that pickup/return is placed executes lower depending on shooting to obtain position and posture information；
The clamping device setting is in the horizontal side of the material volume conveying device, and for turning the pick-up head
The slice component moved past is clamped and energization processing, then executes detection to its electric property, to judge this chip member
The electric property of part whether meet demand；
The upper view detection device setting is between the material volume conveying device and the clamping device, and for institute
Pick-up head is stated to pick up/return in the slice component execution of placement depending on shooting to obtain its position and posture information.
As it is further preferred that the clamping device is in plank frame, and respectively it is equipped with and can stretches in its surface two sides
The elastic thimble of contracting, the elasticity thimble be used for by the pick-up head transfer so far slice component contact compresses, then with electricity
Performance detection instrument is connected, and thus executes the detection of electric property.
As it is further preferred that for the lower view observation camera, when slice component to be detected is picked up by described
When the slice component that head execution is picked up or completion detects being taken to be placed by pick-up head execution return, the slice component is complete
Within field range in the lower view observation camera；In addition, preferably upper view is seen for the upper view detection device
Camera is surveyed, and its center of visual field center just with the pick-up head is consistent in the case where rotating zero-bit state.
As it is further preferred that picking up when the pick-up head executes slice component to be detected to be transferred to the folder
When holding device and being detected, preferably its pick-up operation execution position is compensated according to following equation:
Wherein,It is preset pickup datum mark N respectively1X axis coordinate value and Y axis coordinate value,Point
It is not the compensated practical pickup point N of execution position2X axis coordinate value and Y axis coordinate value；kDx、kDyIt is respectively used to indicate X-axis side
It, can be by observing camera execution vision to the lower view in, Y direction for the compensating proportion factor of the lower view camera
It demarcates and obtains；It is the X axis coordinate value and Y axis coordinate value of slice component geometric center to be detected respectively,It is the X axis coordinate value and Y axis coordinate value of picture centre captured by the lower view observation camera respectively；In addition,
δx1,δy1Be respectively used to indicate the pick-up head under pick-up situation relative rotation zero-bit state in X-direction, Y direction
Change in location can be obtained by observing and camera executes practical calibration the upper view.
As it is further preferred that placing when the pick-up head returns to the slice component that detection is completed to the material volume
When in the material strip hopper of conveying device, the compensation of placement operation execution position is preferably returned to it according to following equation group:
Wherein,It is that datum mark M is placed in preset return respectively1X axis coordinate value and Y axis coordinate value,It is the compensated practical return set-point M of execution position respectively2X axis coordinate value and Y axis coordinate value；kEx、kEyPoint
Yong Yu not indicate X-direction, in Y direction for the compensating proportion factor of the upper view camera, can be by the upper view
Observation camera executes vision calibration and obtains；It is the X of the slice component geometric center that detection is completed respectively
Axial coordinate value and Y axis coordinate value,It is the X axis coordinate of picture centre captured by the upper view observation camera respectively
Value and Y axis coordinate value；θ is used to indicate the drift angle of the material strip of the relatively described material volume conveying device of slice component in feed direction,
And 0≤θ≤90 °；It is rotated a circle, is transported for interval with 10 ° under placement operation position moreover, it is assumed that the pick-up head returns herein
Fitting is obtained an oblique ellipse by dynamic rail mark, wherein Ra、RbIt is respectively intended to indicate tiltedly elliptical long axis and the short axle, Cx、CyRespectively
For indicating the coordinate in the oblique oval center of circle, γ is for indicating the elliptical rotation angle of oblique oval relative standard, above-mentioned 5 parameters
It is obtained as oblique ellipse fitting result.
As it is further preferred that placing when the pick-up head returns to the slice component that detection is completed to the material volume
When in the material strip hopper of conveying device, the maximum allowable inclined of the slice component is preferably calculated first according to following equation group
CornerWherein a, b respectively indicate the length and width of the slice component that detection is completed, and m, h respectively indicate the chip at this time
Element will be returned the length and width of the material strip hopper of placement:
And in the maximum allowable deflection angleWhen, placement operation execution position is returned to it according to following simplified formula
Set compensation:
Wherein, θ is used to indicate the drift angle of the material strip of the relatively described material volume conveying device of slice component in feed direction, and
0≤θ≤90°；It is that datum mark M is placed in preset return respectively1X axis coordinate value and Y axis coordinate value,
It is the compensated practical return set-point M of execution position respectively2X axis coordinate value and Y axis coordinate value；kEx、kEyIt is respectively used to table
Show X-direction, the compensating proportion factor in Y direction, can by it is described it is upper execute vision calibration depending on observation camera and obtain
?；It is the X axis coordinate value and Y axis coordinate value of the slice component geometric center that detection is completed respectively,It is the X axis coordinate value and Y axis coordinate value of picture centre captured by the upper view observation camera respectively.
As it is further preferred that above-mentioned reel-to-reel transfer system further includes central processing unit, the central processing unit
For evaluating transfer precision achieved after the compensation of slice component execution position, and preferably come according to following equation group
Calculate transfer precision evaluation value kx、ky:
Wherein, a, b respectively indicate the length and width of the slice component that detection is completed, and m, h respectively indicate the piece at this time
Formula element will be returned the length and width of the material strip hopper of placement；Ex、EyIt is respectively intended to indicate to be returned placement to the material strip hopper
Deviation of the interior slice component in X-direction, Y direction relative to this material strip hopper center；β is used to indicate to be returned placement
Slice component in the material strip hopper is in the angle relative to material direction of feed；In addition, kx、kyValue it is smaller, then show
It is higher to shift precision.
In general, through the invention it is contemplated above technical scheme is compared with the prior art, mainly have following skill
Art advantage:
1, it is wherein made up of the overall construction to the reel-to-reel transfer system and its key component redesigns, no
It can only realize the efficient feeding of slice component to be checked, and height can be executed to the multinode during entire feeding in conjunction with demand
The complete detection of precision；
2, the present invention also returned respectively for component pick-up link, element place link independently devise it is different excellent
Change backoff algorithm, wherein passing through when being related to positioning pickup link of the pick-up head to element and introducing lower view observation camera, lower view
Observation camera adopts figure and obtains slice component posture information, and binding member posture information calculates compensation depending on visual compensation with lower
Deviation compensates corresponding deviation based on datum mark driving pick-up head is picked up to complete the pickup of the positioning to element geometric center；
3, in addition, passing through view observation camera on introducing being related to pick-up head to element when accurately putting back to hopper link
Eliminate error caused by pick process, it is upper depending on observation camera to adopt figure to obtain slice component posture information to calculate compensation inclined
Difference, it is possible thereby to guarantee that pick-up head accurately puts back to element；
4, evaluation algorithms also are proposed specifically for transfer precision in the present invention, thus, it is possible to quantitative assessments using above-mentioned
Visual compensation is to transfer precision effect achieved after different size element progress error compensation.
Detailed description of the invention
Fig. 1 is to be rolled onto migration volume system towards the detection of slice component multinode according to constructed by the preferred embodiment of the present invention
The overall construction schematic diagram of system；
Fig. 2 is the process flow chart of global transfer process according to the invention；
Fig. 3 is to evaluate schematic diagram according to the transfer accuracy quantification of the preferred embodiment for the present invention；
Fig. 4 is the exemplary schematic illustration for illustrating lower view observation camera according to the invention；
Fig. 5 is the exemplary schematic illustration for illustrating upper view observation camera according to the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
Not constituting a conflict with each other can be combined with each other.
Fig. 1 is to be rolled onto migration volume system towards the detection of slice component multinode according to constructed by the preferred embodiment of the present invention
The overall construction schematic diagram of system.As shown in Figure 1, the reel-to-reel transfer system mainly includes pedestal 1, and it is mounted on the base
The components such as material volume conveying device 2, component pick-up device 3, clamping device 4 and upper view detection device 5, below will be to it one by one
It is specifically described.
Material volume conveying device 2 may include blowing module 21, rewinding module 26, take off film module 22 and overlay film module 27, wherein
Material executes admission towards the rewinding module 26 in a manner of reel-to-reel from the blowing module 21 and (is shown along Y in figure
Axis direction), and during feeding first via take off film module 22 open film packaged by surface and expose to be detected
Then formula element 24 gives overlay film encapsulation to the slice component via overlay film module 27 again after completing detection again.
Component pick-up device 3 mainly includes that pick-up head 32 and lower view observe camera 31, and wherein the pick-up head 32 can have XYZ
Three axis freedom degrees and the W rotated around Z axis are picked up to freedom degree, and for executing slice component to be detected to be transferred to folder
It holds device 4 to be detected, is directed primarily to the quality testing in terms of electric property, then return to the slice component for completing detection
It places to the material strip hopper of the material volume conveying device.This is lower to be fixed on pick-up head 32 and can therewith together depending on observation camera 31
It is movable along both x and y axes, and the slice component execution for the pick-up head being picked up/being returned placement is lower depending on shooting to obtain
Obtain position and posture information.
The setting of clamping device 4 is in the horizontal side of the material volume conveying device, and is used for pick-up head 32) it shifted
The slice component come is clamped and energization processing, then detection is executed to its electric property, to judge this slice component
Electric property whether meet demand.More specifically, the clamping device is for example in plank frame, and in its each self installation in surface two sides
There is telescopic elastic thimble, which is used to compress the slice component contact of pick-up head transfer so far, then
It is connected with electric property detecting instrument, thus executes the detection of electric property.Position of the slice component in the clamping device
It is preferably designed as and its position on material strip is perpendicular.
It is between material volume conveying device 2 and clamping device in addition, upper view detection device 5 is for example arranged, and for institute
Pick-up head is stated to pick up/return in the slice component execution of placement depending on shooting to obtain its position and posture information.
In other words, as shown in fig. 1, in the entire system altogether including 3 observation bits, that is, observation bit A, observation bit B and
Observation bit C；A preferred embodiment according to the invention, lower view observation camera 31 correspond to observation bit A and observation bit B, and
And it is held when slice component to be detected executes the slice component picked up or complete to detect by the pick-up head by the pick-up head
When row returns to placement, which is completely within field range of the lower view observation camera.Upper view detection device 5 exists
Preferably upper view observation camera, corresponds to observation bit C in the present invention, and its visual field center is being just in the case where rotating zero-bit state
The good center with the pick-up head is consistent.
More specifically, as shown in Figure 4, for lower view observation camera to the observation schematic diagram of element at lower view observation bit B,
View visual compensation is specifically taken off by the schematic diagram.It is lower to regard camera coordinates system as XDODYD, slice component geometric center is
PointLower regard adopts figure picture centre as pointThe point is consolidated with lower fix depending on observation bit
Fixed and pick-up head is fixed with lower depending on camera spacing.As long as therefore being carried out based on Current observation position to leukorrhagia view vision pick device (3)
The distance of the constant spacing is mobile, so that it may which pick-up head is moved to figure midpoint ND1, the point is in world coordinate system corresponding to pointTake N1To pick up datum mark.But the location layout pick-up head as shown in Fig. 1 is wanted from material strip position to fixture position
It is rotated by 90 ° and pick-up head itself rotation introduces position deviation, it is practical to pick up datum mark correspondence and figure midpoint
Similar, as shown in Figure 5, it is pick-up head in the upper observation schematic diagram regarded at observation bit B to element, shows by this
It is intended to regard visual compensation in specific explanation.The upper camera coordinates system that regards is XEOEYE, pick-up head geometric center and upper view Cai Tutu
Inconocenter coincides with a littlePick-up head rotational trajectory center is elliptical center point N in figureE.It is upper depending on adopting figure
When element in figure at position, element central is a littleAngular deviation with hopper is θ.
In addition, placing link also directed to pickup link, return in the present invention separately devises specific algorithm processing
Carry out execution position compensation, further to improve transfer precision.Certainly, on the basis of above-mentioned base case of the invention,
Also other optimization algorithms appropriate be can choose, or by the optimization algorithm merging treatment of each link.
A preferred embodiment according to the invention, when slice component to be detected is executed pickup by the pick-up head 32
When being detected with being transferred to the clamping device 4, preferably its pick-up operation execution position is compensated according to following equation:
Wherein,It is preset pickup datum mark N respectively1X axis coordinate value and Y axis coordinate value,Point
It is not the compensated practical pickup point N of execution position2X axis coordinate value and Y axis coordinate value；kDx、kDyIt is respectively used to indicate X-axis side
It, can be by observing camera execution vision to the lower view in, Y direction for the compensating proportion factor of the lower view camera
It demarcates and obtains；It is the X axis coordinate value and Y axis coordinate value of slice component geometric center to be detected respectively,It is the X axis coordinate value and Y axis coordinate value of picture centre captured by the lower view observation camera respectively；In addition,
δx1,δy1Be respectively used to indicate the pick-up head under pick-up situation relative rotation zero-bit state in X-direction, Y direction
Change in location can be obtained by observing and camera executes practical calibration the upper view.
Another preferred embodiment according to the invention, when the pick-up head 32 returns to the slice component that detection is completed
When placing to the material strip hopper of the material volume conveying device, placement operation execution position is preferably returned to it according to following equation group
Set compensation:
Wherein,It is that datum mark M is placed in preset return respectively1X axis coordinate value and Y axis coordinate value,It is the compensated practical return set-point M of execution position respectively2X axis coordinate value and Y axis coordinate value；kEx、kEyPoint
It Yong Yu not indicate X-direction, the compensating proportion factor in Y direction, vision can be executed by observing camera to the upper view
It demarcates and obtains；It is that the X axis coordinate value of the slice component geometric center that detection is completed and Y-axis are sat respectively
Scale value,It is the X axis coordinate value and Y axis coordinate value of picture centre captured by the upper view observation camera respectively；θ
For indicating the drift angle of the material strip of the relatively described material volume conveying device of slice component in feed direction, and 0≤θ≤90 °；This
Outside, it is assumed that the pick-up head is returned rotated a circle under placement operation position with 10 ° for interval herein, and motion profile obtains fitting
Obtaining one, tiltedly (for example, which can be typically expressed as x=R to ellipse in the artacost*cosγ-
Rbsint*sinγ+Cx, y=Racosθ*sinγ+Rbsinθ*cosγ+Cy, wherein Ra、RbIt is respectively intended to indicate that this is elliptical
Long axis and short axle, Cx、CyIt is respectively used to indicate the coordinate in the ellipse center of circle, γ is for indicating the elliptical rotation of ellipse relative standard
Corner, above-mentioned 5 parameters are obtained as oblique ellipse fitting result；T (π of 0≤t≤2) is eccentric angle of an ellipse, is the oblique ellipse
The independent variable parameter of parametric equation, the value of t is θ in the operating condition).
Further, it is conveyed when the slice component that detection is completed is returned to place to the material volume by the pick-up head 32
When in the material strip hopper of device, the maximum allowable deflection angle of the slice component can be calculated first according to following equation groupWherein a, b respectively indicate the length and width of the slice component that detection is completed, and m, h respectively indicate the slice component at this time will
It is returned the length and width of the material strip hopper of placement:
And in the maximum allowable deflection angleWhen, placement operation execution position is returned to it according to following simplified formula
Set compensation:
Wherein, θ is used to indicate the drift angle of the material strip of the relatively described material volume conveying device of slice component in feed direction, and
0≤θ≤90°；It is that datum mark M is placed in preset return respectively1X axis coordinate value and Y axis coordinate value,
It is the compensated practical return set-point M of execution position respectively2X axis coordinate value and Y axis coordinate value；kEx、kEyIt is respectively used to table
Show X-direction, in Y direction for the compensating proportion factor of the upper view camera, can be by the upper view observation camera
It executes vision calibration and obtains；It is the X axis coordinate value of the slice component geometric center that detection is completed respectively
With Y axis coordinate value,It is the X axis coordinate value and Y-axis of picture centre captured by the upper view observation camera respectively
Coordinate value.And work as the maximum allowable deflection angleWhen, then still maintaining above-mentioned unreduced formula, it returns to placement behaviour to it
Make execution position compensation.
Referring to Fig. 3, it is shown that evaluate schematic diagram according to the transfer accuracy quantification of the preferred embodiment for the present invention.In the figure
In, Δ x indicate Xz axis direction error boundary, Δ y indicate Y direction to error boundary, a, b, m, h are respectively slice component
With the length and width of hopper, β is deflection angle of the element with respect to hopper.Then
By taking package dimension is 0201 Chip-R element as an example, a height of 0.6mm × 0.3mm of component size length and width ×
The size of component slot corresponding to 0.3mm, the SMD is 0.7mm × 0.4mm.As the deflection angle β=0 of element opposed slot, add up
Error allows boundary maximum, then can acquire largest cumulative error allows boundary, i.e. Δ xmax=0.05mm, Δ ymax=0.05mm.
When so being shifted from fixture position to hopper in element, in transfer process caused by X be both needed to Y-direction Accumulated deviation less than 50 μm,
It just can guarantee and successfully put back to.
Correspondingly, another preferred embodiment according to the invention, above-mentioned reel-to-reel transfer system can also include center
Processing unit, the central processing unit are used to evaluate transfer precision achieved after the compensation of slice component execution position,
And it is preferred that calculating transfer precision evaluation value k according to following equation groupx、ky:
Wherein, a, b respectively indicate the length and width of the slice component that detection is completed, and m, h respectively indicate the piece at this time
Formula element will be returned the length and width of the material strip hopper of placement；Ex、EyIt is respectively intended to indicate to be returned placement to the material strip hopper
Deviation of the interior slice component in X-direction, Y direction relative to this material strip hopper center；β is used to indicate to be returned placement
Slice component in the material strip hopper is in the angle relative to material direction of feed；In addition, kx、kyValue it is smaller, then show
It is higher to shift precision.
Global transfer technique according to the invention is explained below with reference to Fig. 2.
Firstly, slice component 24 to be detected is fed into the visual field of lower view observation camera 31 by material volume conveying device 2 in advance
In range, movement is lower to adopt figure depending on observation bit A to lower depending on observation camera 31, and using in the geometry of image procossing acquisition slice component
The heart
Then, willIt brings compensation calculation formula into and obtains practical pickup point at material strip
Coordinate；Then pick-up head is moved toIt completes to position slice component to be checked and pick up, and be moved at fixture and pick up
Take datum markPlacing element, so that element is transferred at clamping device 4；
Then, the thimble of two sides stretches out on clamping device 4, and tested slice component is connected in measure loop, is realized to piece
The detection of formula element electrical performance；It is finished to slice component detection, thimble retracts, and mobile lower view observation camera 31 to lower view is observed
Position B adopts figure, and the geometric center of element is obtained using image procossing
Then, willIt brings compensation calculation formula into and obtains practical pickup point at fixtureCoordinate；Pick-up head is moved toCompletion is picked up to slice component positioning has been examined, and will
Qualified slice component transfer is put back in the empty hopper of material strip 23, and underproof slice component is abandoned；Wherein needs are put
Slice component of the feed back with feeding groove also needs for pick-up head to be moved to upper view observation bit C before putting back to, utilizes upper view sighting device
Slice component on 5 pairs of pick-up heads adopts figure and obtains the geometric center of slice component by image procossing
With element with respect to material strip direction of feed bias angle theta (0≤θ≤90 °)；
Then, maximum deflection angle is allowed according to θ and elementAngular deviation compensation in judgement depending on link of rectifying a deviation could save
Slightly.IfThe angle correction to element can be then omitted, it willBring the upper view without rotary deviation-rectifying into
Vision compensation calculation formula obtains practical set-point at material stripCoordinate；IfThen pick-up head (32)
The angular deviation compensation of element is completed by W axial-rotation, and willBring the upper view view with rotary deviation-rectifying into
Feel compensation calculation formula, obtains practical set-point at material stripCoordinate.Pick-up head is moved to practical set-pointThus accurately putting back to slice component is completed.
To sum up, the present invention is made up of the overall construction to the reel-to-reel transfer system and its key component is set again
Meter can not only realize the efficient feeding of slice component to be checked, but also can be in conjunction with demand to the multinode during entire feeding
Execute high-precision complete detection；It is designed in addition, the present invention also returns to placement link for component pick-up link, element respectively
Different Optimization Compensation algorithm, while evaluation algorithms also proposed to transfer precision, it accordingly can further ensure that continuous
The precision pick of slice component is realized in detection process and returns to placement operation.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (7)
1. a kind of reel-to-reel transfer system towards the detection of slice component multinode, which includes pedestal (1),
And material volume conveying device (2), component pick-up device (3), clamping device (4) and the upper inspection being mounted on the base survey dress
Set (5), it is characterised in that:
The material volume conveying device (2) includes blowing module (21), rewinding module (26), takes off film module (22) and overlay film module
(27), wherein material from the blowing module (21) in a manner of reel-to-reel towards the rewinding module (26) execute admission, and
Film packaged by surface and exposing chip member to be detected are opened via the film module (22) of taking off first during feeding
Part (24) then gives overlay film encapsulation to the slice component via the overlay film module (27) again after completing detection again；
The component pick-up device (3) includes pick-up head (32) and lower view observation camera (31), and wherein the pick-up head (32) has
Tri- axis freedom degree of XYZ and the W rotated around Z axis are picked up to freedom degree, and for executing slice component to be detected to shift
It is detected to the clamping device (4), then the slice component for completing detection is returned and is placed to the material volume conveying device
Material strip hopper in；This is lower to be fixed on the pick-up head (32) depending on observation camera (31) and can transport together along X-axis and Y-axis therewith
It is dynamic, and believed under the slice component execution for the pick-up head being picked up/being returned placement depending on shooting with obtaining position and posture
Breath；
Clamping device (4) setting is in the horizontal side of the material volume conveying device, and is used for the pick-up head (32)
The slice component shifted is clamped and energization processing, then detection is executed to its electric property, to judge this piece
The electric property of formula element whether meet demand；
Upper view detection device (5) setting is used for pair between the material volume conveying device (2) and the clamping device
The slice component that the pick-up head picked up/returned placement is executed depending on shooting to obtain its position and posture information.
2. a kind of reel-to-reel transfer system towards the detection of slice component multinode as described in claim 1, which is characterized in that
The clamping device (4) is in plank frame, and is respectively equipped with telescopic elastic thimble, the elasticity thimble in its surface two sides
For compressing the slice component contact of pick-up head transfer so far, then it is connected with electric property detecting instrument, thus
Execute the detection of electric property.
3. a kind of reel-to-reel transfer system towards the detection of slice component multinode as claimed in claim 1 or 2, feature exist
In being picked up or complete when slice component to be detected is executed by the pick-up head for lower view observation camera (31)
When executing return placement by the pick-up head at the slice component of detection, which is completely in lower view observation camera
Field range within；In addition, observing camera for the upper view detection device (5) for upper view, and in rotation zero
Its center of visual field center just with the pick-up head is consistent under the state of position.
4. a kind of reel-to-reel transfer system towards the detection of slice component multinode as claimed in claim 1 or 2, feature exist
In when the pick-up head (32) is detected slice component to be detected execution pickup to be transferred to the clamping device (4)
When, its pick-up operation execution position is compensated according to following equation:
Wherein,It is preset pickup datum mark N respectively1X axis coordinate value and Y axis coordinate value,It is respectively
The compensated practical pickup point N of execution position2X axis coordinate value and Y axis coordinate value；kDx、kDyIt is respectively used to indicate X-direction, Y
The lower view camera compensating proportion factor is directed in axis direction, it can be and to the lower view observation camera execution vision calibration
It obtains；It is the X axis coordinate value and Y axis coordinate value of slice component geometric center to be detected respectively,
It is the X axis coordinate value and Y axis coordinate value of picture centre captured by the lower view observation camera respectively；In addition, δx1,δy1Respectively
For indicating the pick-up head change in location of relative rotation zero-bit state in X-direction, Y direction under pick-up situation,
It can be obtained by observing and camera executes practical calibration the upper view.
5. a kind of reel-to-reel transfer system towards the detection of slice component multinode as claimed in claim 1 or 2, feature exist
In when the slice component that detection is completed is returned to the material strip hopper placed to the material volume conveying device by the pick-up head (32)
When interior, the compensation of placement operation execution position is returned to it according to following equation group:
Wherein,It is that datum mark M is placed in preset return respectively1X axis coordinate value and Y axis coordinate value,Point
It is not the compensated practical return set-point M of execution position2X axis coordinate value and Y axis coordinate value；kEx、kEyIt is respectively used to indicate X
For the compensating proportion factor of the upper view camera in axis direction, Y direction, can be executed by observing camera to the upper view
Vision calibration and obtain；It is the X axis coordinate value and Y of the slice component geometric center that detection is completed respectively
Axial coordinate value,It is the X axis coordinate value and Y axis coordinate of picture centre captured by the upper view observation camera respectively
Value；θ is used to indicate the drift angle of the material strip of the relatively described material volume conveying device of slice component in feed direction, and 0≤θ≤90 °；
It is rotated a circle moreover, it is assumed that the pick-up head returns herein under placement operation position with 10 ° for interval, motion profile will be fitted
It is tiltedly oval to obtain one, wherein Ra、RbIt is respectively intended to indicate tiltedly elliptical long axis and the short axle, Cx、CyIt is respectively used to indicate this tiltedly
The coordinate in the oval center of circle, γ is for indicating the elliptical rotation angle of oblique oval relative standard, and above-mentioned 5 parameters are as tiltedly oval quasi-
Result is closed to obtain.
6. a kind of reel-to-reel transfer system towards the detection of slice component multinode as claimed in claim 5, which is characterized in that
It places when the pick-up head (32) returns to the slice component that detection is completed to the material strip hopper of the material volume conveying device
When, the maximum allowable deflection angle of the slice component is calculated first according to following equation groupWherein a, b respectively indicate institute
The length and width of the slice component that detection is completed are stated, m, h respectively indicate the material strip material that the slice component at this time will be returned placement
The length and width of slot:
And in the maximum allowable deflection angleWhen, placement operation execution position benefit is returned to it according to following simplified formula
It repays:
Wherein, θ is used to indicate the drift angle of the material strip of the relatively described material volume conveying device of slice component in feed direction, and 0≤θ
≤90°；It is that datum mark M is placed in preset return respectively1X axis coordinate value and Y axis coordinate value,Respectively
It is the compensated practical return set-point M of execution position2X axis coordinate value and Y axis coordinate value；kEx、kEyIt is respectively used to indicate X-axis
The compensating proportion factor on direction, Y direction can obtain and to the upper camera execution vision calibration depending on observation；It is the X axis coordinate value and Y axis coordinate value of the slice component geometric center that detection is completed respectively,It is the X axis coordinate value and Y axis coordinate value of picture centre captured by the upper view observation camera respectively.
7. a kind of reel-to-reel transfer system towards the detection of slice component multinode as claimed in claim 6, which is characterized in that
Above-mentioned reel-to-reel transfer system further includes central processing unit, which is used to compensate slice component execution position
Transfer precision achieved is evaluated afterwards, and transfer precision evaluation value k is calculated according to following equation groupx、ky:
Wherein, a, b respectively indicate the length and width of the slice component that detection is completed, and m, h respectively indicate chip member at this time
Part will be returned the length and width of the material strip hopper of placement；Ex、EyIt is respectively intended to indicate to be returned in placement to the material strip hopper
Deviation of the slice component in X-direction, Y direction relative to this material strip hopper center；β is used to indicate to be returned placement to institute
The slice component in material strip hopper is stated in the angle relative to material direction of feed；In addition, kx、kyValue it is smaller, then show to shift
Precision is higher.
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| CN116677686B (en) * | 2023-07-31 | 2023-10-20 | 常州铭赛机器人科技股份有限公司 | Mounting method for multiple photographing of chip mounter based on machine vision |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104754931A (en) * | 2013-12-31 | 2015-07-01 | 弗兰克·魏 | Storage card for surface-mounted component, feeder and automatic chip mounter |
| CN104837328A (en) * | 2015-05-07 | 2015-08-12 | 华中科技大学 | High-efficiency automatic sampling inspection equipment for SMD material tray |
| CN104981105A (en) * | 2015-07-09 | 2015-10-14 | 广东工业大学 | Detecting and error-correcting method capable of rapidly and accurately obtaining element center and deflection angle |
| CN105304539A (en) * | 2015-09-14 | 2016-02-03 | 北京中电科电子装备有限公司 | Chip flying centering device and method |
| CN105555123A (en) * | 2015-12-22 | 2016-05-04 | 华中科技大学 | Tray-oriented SMD sampling and counting equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104754931A (en) * | 2013-12-31 | 2015-07-01 | 弗兰克·魏 | Storage card for surface-mounted component, feeder and automatic chip mounter |
| CN104837328A (en) * | 2015-05-07 | 2015-08-12 | 华中科技大学 | High-efficiency automatic sampling inspection equipment for SMD material tray |
| CN104981105A (en) * | 2015-07-09 | 2015-10-14 | 广东工业大学 | Detecting and error-correcting method capable of rapidly and accurately obtaining element center and deflection angle |
| CN105304539A (en) * | 2015-09-14 | 2016-02-03 | 北京中电科电子装备有限公司 | Chip flying centering device and method |
| CN105555123A (en) * | 2015-12-22 | 2016-05-04 | 华中科技大学 | Tray-oriented SMD sampling and counting equipment |
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