CN105304539A - Chip flying centering device and method - Google Patents

Chip flying centering device and method Download PDF

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Publication number
CN105304539A
CN105304539A CN201510582385.1A CN201510582385A CN105304539A CN 105304539 A CN105304539 A CN 105304539A CN 201510582385 A CN201510582385 A CN 201510582385A CN 105304539 A CN105304539 A CN 105304539A
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China
Prior art keywords
distance
chip
pick
vision system
head
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CN105304539B (en
Inventor
庄文波
叶乐志
李恺
孙玮淇
于海波
唐亮
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CETC Beijing Electronic Equipment Co
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CETC Beijing Electronic Equipment Co
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Publication of CN105304539B publication Critical patent/CN105304539B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

The invention provides a chip flying centering device and method. The chip flying centering device comprises a pickup mechanism with a pickup head and a mark point, and a top view vision system. When the pickup mechanism moves into the view filed of the top view vision system, a camera of the top view vision system is used to acquire the image of the pickup head and the image of the mark point. According to an image acquisition result, the first distance between the mark point and the pickup head is calculated. When the pickup mechanism picks up a chip and passes through the view filed interval of the top view vision system, the camera of the top view vision system acquires the image of the chip on the pickup head and the image of the mark point. According to the chip flying centering device and method, which are provided by the invention, the influence of non-constant speed caused by mechanical reasons on flying centering can be avoided, and the stability and the recognition accuracy are improved.

Description

A kind of chip flight centralising device and method
Technical field
The present invention relates to machine vision technique application, particularly a kind of chip flight centralising device and method.
Background technology
Semiconductor, electronic equipment market are one of great market of machine vision technique application, also constantly perfect, the development along with the development of the technology such as semiconductor, electronics, optics, automation of machine vision meter art itself.Current semiconductor packaging device both domestic and external mostly combines with vision system, to obtain excellent encapsulation precision.
Conventional flight centering adopts sensor signal as triggering signal, requires that the speed that actuator enters viewing field of camera is at the uniform velocity with known, then calculates the position of actuator according to speedometer thus calculate the precision offset amount of chip relative to mechanism for picking.And due to reasons such as machinery and camera trigger delays in reality, be difficult to ensure that mechanism for picking is at the uniform velocity through camera fields of view hourly velocity, the chip therefore obtained is poor relative to the side-play amount precision of mechanism for picking, can not meet the requirement of high accuracy encapsulation.
Summary of the invention
The invention provides a kind of chip flight centralising device and method, its objective is that speed is non-constant to have an impact to chip flight centering in order to avoid causing because of mechanical reason.
In order to achieve the above object, The embodiment provides a kind of chip flight centralising device, comprise: have pick-up head and gauge point mechanism for picking and on look vision system, wherein, when described mechanism for picking move to described on look in the visual field of vision system time, by the image of pick-up head and the image of gauge point described in the collected by camera of looking vision system on described, and calculate the first distance between described gauge point and described pick-up head according to image taking results;
When described mechanism for picking pick-up chip is in time above looking the interval, visual field of vision system, the image of chip and the image of described gauge point on pick-up head described in the collected by camera looking vision system on described, and the center calculating the center of described chip and described gauge point according to image taking results respectively with the second distance at center of camera and the 3rd distance of above looking vision system, calculate the offset deviation of described chip on described pick-up head according to described second distance, the 3rd Distance geometry first distance.
Wherein, described mechanism for picking also comprises:
For described mechanism for picking is moved to described on look linear electric motors in the visual field of vision system;
For adjusting the angle electric rotating machine of described pick-up head angle, described angle electric rotating machine is connected with described linear electric motors, and the bottom of described angle electric rotating machine is connected with described pick-up head by a connecting rod;
For the labelling apparatus of fixing described gauge point, described labelling apparatus is set on described connecting rod, and is arranged on the disk on described pick-up head top.
Wherein, described labelling apparatus comprises:
For the holddown groove of fixing described gauge point, described holddown groove is arranged on the both sides of described labelling apparatus, and protrudes from the disk on described pick-up head top;
For described labelling apparatus being fixed on the retaining mechanism on described connecting rod, described retaining mechanism is arranged on the mid portion of described labelling apparatus, and one end of described retaining mechanism is hatch frame, is arranged on one end of described mid portion; The other end of described retaining mechanism is provided with a manhole, is arranged on the center of described mid portion;
For regulating described labelling apparatus in the vertical fine adjustment mechanism of described connecting rod upper-lower position, described vertical fine adjustment mechanism is arranged on the other end of described mid portion.
Wherein, described gauge point is arranged in the holddown groove of described labelling apparatus, and the material good by reflective is made.
The above embodiment of the present invention additionally provides a kind of chip flight centering method, and be applied to the chip flight centralising device described in above-described embodiment, wherein said chip flight centering method comprises:
When described mechanism for picking moves in the visual field looking vision system, by the image of pick-up head and the image of gauge point described in the collected by camera of looking vision system on described, and calculate the first distance between described gauge point and described pick-up head according to image taking results;
When described mechanism for picking pick-up chip is in time above looking the interval, visual field of vision system, by the image of chip and the image of described gauge point on pick-up head described in the collected by camera of looking vision system on described, and the center calculating the center of described chip and described gauge point according to image taking results respectively with the second distance at center of camera and the 3rd distance of above looking vision system;
The offset deviation of chip on described pick-up head is calculated according to described second distance, the 3rd Distance geometry first distance.
Further, describedly calculate the first distance between described gauge point and described pick-up head according to image taking results, be specially:
Δ X=Δ X 1-Δ X 2; Wherein,
Δ X is the first distance; Δ X 1for described pick-up head and described on look vision system camera between distance; Δ X 2for described gauge point and described on look vision system camera between distance.
Further, describedly calculate the offset deviation of chip on described pick-up head according to described second distance, the 3rd Distance geometry first distance, be specially:
Δ d=Δ X 3-Δ X 4-Δ X; Wherein,
Δ d is offset deviation; Δ X 3for second distance; Δ X 4it is the 3rd distance; Δ X is the first distance.
The beneficial effect of such scheme of the present invention is as follows:
Chip flight centralising device provided by the present invention and method design a labelling apparatus in mechanism for picking, by the relative displacement relation of gauge point and mechanism for picking, through image recognition, calculate gauge point and chip respectively with the deviation post of image center, obtain the accurate relative position skew of chip on mechanism for picking, solve in flight centering technology and obtain the not high difficult problem of chip relativity shift positional precision because speed instability causes, achieve the requirement of flight centering high-speed, high precision image recognition, improve the operational efficiency of whole equipment.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is mechanism for picking schematic diagram of the present invention;
Fig. 3 is labelling apparatus schematic diagram of the present invention;
Fig. 4 is gauge point schematic diagram of the present invention;
Fig. 5 is the implementation procedure schematic diagram of flight centering method of the present invention.
[description of reference numerals]
1-mechanism for picking; 2-looks vision system; 3-linear electric motors; 4-angle electric rotating machine; 5-pick-up head; 6-connecting rod; 7-labelling apparatus; 8-disk; 9-gauge point; 10-holddown groove; 11-retaining mechanism; 12-vertical fine adjustment mechanism.
Embodiment
For making the technical problem to be solved in the present invention, technical scheme and advantage clearly, be described in detail below in conjunction with the accompanying drawings and the specific embodiments.
The present invention is directed in existing flight centering technology and obtain the not high problem of chip relativity shift positional precision because speed instability causes, provide a kind of chip flight centralising device and method.
As shown in Figure 1, The embodiment provides a kind of chip flight centralising device, comprise: have pick-up head 5 and gauge point 9 mechanism for picking 1 and on look vision system 2, wherein, when described mechanism for picking 1 move to described on look in the visual field of vision system 2 time, by the image of pick-up head 5 and the image of gauge point 9 described in the collected by camera of looking vision system 2 on described, and calculate the first distance between described gauge point 9 and described pick-up head 5 according to image taking results; When described mechanism for picking 1 pick-up chip is in time above looking the interval, visual field of vision system 2, the image of chip and the image of described gauge point 9 on pick-up head 5 described in the collected by camera looking vision system 2 on described, and the center calculating the center of described chip and described gauge point 9 according to image taking results respectively with the second distance at center of camera and the 3rd distance of above looking vision system 2, calculate the offset deviation of described chip on described pick-up head 5 according to described second distance, the 3rd Distance geometry first distance.
Chip flight centralising device described in the above embodiment of the present invention designs a labelling apparatus 7 in described mechanism for picking 1, by the relative displacement relation of described gauge point 9 with described mechanism for picking 1, through image recognition, calculate gauge point 9 and chip respectively with the deviation post of image center, obtain the accurate relative position skew of chip on mechanism for picking 1, solve flight centering and technically obtain the not high difficult problem of chip relativity shift positional precision because speed instability causes, achieve the requirement of flight centering high-speed, high precision image recognition, improve the operational efficiency of whole equipment.
As shown in Figure 2, described mechanism for picking 1 also comprises: for described mechanism for picking 1 is moved to described on look linear electric motors 3 in the visual field of vision system 2; For adjusting the angle electric rotating machine 4 of described pick-up head 5 angle, described angle electric rotating machine 4 is connected with described linear electric motors 3, and the bottom of described angle electric rotating machine 4 is connected with described pick-up head 5 by a connecting rod 6; For the labelling apparatus 7 of fixing described gauge point 9, described labelling apparatus 7 is set on described connecting rod 6, and is arranged on the disk 8 on described pick-up head 5 top.
Described mechanism for picking 1 described in the above embodiment of the present invention also comprises the linear electric motors 3 driving described mechanism for picking 1 to move, and adjust the angle electric rotating machine 4 of described pick-up head 5 angle, in order to the visual field of described mechanism for picking 1 depending on vision system 2 on described can be made better to adjust position, conveniently gather image.
As shown in Figure 3, described labelling apparatus 7 comprises: for the holddown groove 10 of fixing described gauge point 9, described holddown groove 10 is arranged on the both sides of described labelling apparatus 7, and protrudes from the disk 8 on described pick-up head 5 top; For described labelling apparatus 7 being fixed on the retaining mechanism 11 on described connecting rod 6, described retaining mechanism 11 is arranged on the mid portion of described labelling apparatus 7, and one end of described retaining mechanism 11 is hatch frame, is arranged on one end of described mid portion; The other end of described retaining mechanism 11 is provided with a manhole, is arranged on the center of described mid portion; For regulating described labelling apparatus 7 in the vertical fine adjustment mechanism 12 of described connecting rod 6 upper-lower position, described vertical fine adjustment mechanism 12 is arranged on the other end of described mid portion.
Labelling apparatus 7 described in the above embodiment of the present invention is arranged on the connecting rod 6 of described mechanism for picking 1, and be closely set on described connecting rod 6 by described retaining mechanism 11, prevent the situation of slip, error appears in the calculating causing position to offset; Described labelling apparatus 7 is also provided with and can adjusts the vertical fine adjustment mechanism 12 of described labelling apparatus 7 at described connecting rod 6 upper-lower position, allow and obtain gauge point 9 image clearly depending on camera, assistant images identification, obtain the accurate relative position skew of chip on mechanism for picking 1, thus reach the identification requirement of chip flight centering high-speed, high precision.
As shown in Figure 4, described gauge point 9 is arranged in the holddown groove 10 of described labelling apparatus 7, and the material good by reflective is made.
Gauge point 9 in the holddown groove 10 of the labelling apparatus 7 described in the above embodiment of the present invention is made up of the material that reflective is good, facilitates collected by camera image and identifies; Based on the actual application requirements, with the use of two cover gauge points 9, more accurately location position can be realized simultaneously.
As shown in Figure 5, the above embodiment of the present invention additionally provides a kind of chip flight centering method, be applied to the chip flight centralising device described in above-described embodiment, wherein said chip flight centering method comprises: when described mechanism for picking 1 moves in the visual field looking vision system 2, by the image of pick-up head 5 and the image of gauge point 9 described in the collected by camera of looking vision system 2 on described, and calculate the first distance between described gauge point 9 and described pick-up head 5 according to image taking results; When described mechanism for picking 1 pick-up chip is in time above looking the interval, visual field of vision system 2, by the image of chip and the image of described gauge point 9 on pick-up head 5 described in the collected by camera of looking vision system 2 on described, and the center calculating the center of described chip and described gauge point 9 according to image taking results respectively with the second distance at center of camera and the 3rd distance of above looking vision system 2; The offset deviation of chip on described pick-up head 5 is calculated according to described second distance, the 3rd Distance geometry first distance.
Further, describedly calculate the first distance between described gauge point 9 and described pick-up head 5 according to image taking results, be specially: Δ X=Δ X 1-Δ X 2; Wherein, Δ X is the first distance; Δ X 1for described pick-up head 5 and described on look vision system 2 camera between distance; Δ X 2for described gauge point 9 and described on look vision system 2 camera between distance.
Further, describedly calculate the offset deviation of chip on described pick-up head 5 according to described second distance, the 3rd Distance geometry first distance, be specially: Δ d=Δ X 3-Δ X 4-Δ X; Wherein, Δ d is offset deviation; Δ X 3for second distance; Δ X 4it is the 3rd distance; Δ X is the first distance.
Chip flight centering method described in the above embodiment of the present invention is applied to the chip flight centralising device described in above-described embodiment, its concrete scheme is: be installed to by labelling apparatus 7 on mechanism for picking 1, according to technique, mechanism for picking 1 is moved in the visual field of upper optometry system, by the image of collected by camera pick-up head 5 and gauge point 9, image recognition algorithm is adopted to calculate the deviation delta X of pick-up head 5 center and gauge point 9 center and image center respectively 1with Δ X 2, thus calculate the distance between gauge point 9 and pick-up head 5: Δ X=Δ X 1-Δ X 2; Secondly, mechanism for picking 1 pick-up chip is fast when viewing field of camera is interval, and the image of chip and the image of gauge point 9 on collected by camera to pick-up head 5, adopt image recognition algorithm to obtain chip center and the gauge point 9 center deviation delta X respectively at image center 3with Δ X 4.The offset deviation Δ d=Δ X of chip on pick-up head 5 can be calculated thus 3-Δ X 4-Δ X; Method described in the above embodiment of the present invention solves the present position of the mechanism for picking 1 when to collect image when to be difficult to obtain flight centering because speed is non-constant, can not get a difficult problem for the accurate relative position skew of chip, improve the operational efficiency of whole equipment.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from principle of the present invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.

Claims (7)

1. a chip flight centralising device, it is characterized in that, comprise: have pick-up head and gauge point mechanism for picking and on look vision system, wherein, when described mechanism for picking move to described on look in the visual field of vision system time, by the image of pick-up head and the image of gauge point described in the collected by camera of looking vision system on described, and calculate the first distance between described gauge point and described pick-up head according to image taking results;
When described mechanism for picking pick-up chip is in time above looking the interval, visual field of vision system, the image of chip and the image of described gauge point on pick-up head described in the collected by camera looking vision system on described, and the center calculating the center of described chip and described gauge point according to image taking results respectively with the second distance at center of camera and the 3rd distance of above looking vision system, calculate the offset deviation of described chip on described pick-up head according to described second distance, the 3rd Distance geometry first distance.
2. chip flight centralising device according to claim 1, it is characterized in that, described mechanism for picking also comprises:
For described mechanism for picking is moved to described on look linear electric motors in the visual field of vision system;
For adjusting the angle electric rotating machine of described pick-up head angle, described angle electric rotating machine is connected with described linear electric motors, and the bottom of described angle electric rotating machine is connected with described pick-up head by a connecting rod;
For the labelling apparatus of fixing described gauge point, described labelling apparatus is set on described connecting rod, and is arranged on the disk on described pick-up head top.
3. chip flight centralising device according to claim 2, it is characterized in that, described labelling apparatus comprises:
For the holddown groove of fixing described gauge point, described holddown groove is arranged on the both sides of described labelling apparatus, and protrudes from the disk on described pick-up head top;
For described labelling apparatus being fixed on the retaining mechanism on described connecting rod, described retaining mechanism is arranged on the mid portion of described labelling apparatus, and one end of described retaining mechanism is hatch frame, is arranged on one end of described mid portion; The other end of described retaining mechanism is provided with a manhole, is arranged on the center of described mid portion;
For regulating described labelling apparatus in the vertical fine adjustment mechanism of described connecting rod upper-lower position, described vertical fine adjustment mechanism is arranged on the other end of described mid portion.
4. chip flight centralising device according to claim 3, it is characterized in that, described gauge point is arranged in the holddown groove of described labelling apparatus, and the material good by reflective is made.
5. a chip flight centering method, be applied to the chip flight centralising device as described in any one of claim 1-4, it is characterized in that, described chip flight centering method comprises:
When described mechanism for picking moves in the visual field looking vision system, by the image of pick-up head and the image of gauge point described in the collected by camera of looking vision system on described, and calculate the first distance between described gauge point and described pick-up head according to image taking results;
When described mechanism for picking pick-up chip is in time above looking the interval, visual field of vision system, by the image of chip and the image of described gauge point on pick-up head described in the collected by camera of looking vision system on described, and the center calculating the center of described chip and described gauge point according to image taking results respectively with the second distance at center of camera and the 3rd distance of above looking vision system;
The offset deviation of chip on described pick-up head is calculated according to described second distance, the 3rd Distance geometry first distance.
6. chip according to claim 5 flight centering method, is characterized in that, describedly calculates the first distance between described gauge point and described pick-up head according to image taking results, is specially:
Δ X=Δ X 1-Δ X 2; Wherein,
Δ X is the first distance; Δ X 1for described pick-up head and described on look vision system camera between distance; Δ X 2for described gauge point and described on look vision system camera between distance.
7. chip according to claim 6 flight centering method, is characterized in that, describedly calculates the offset deviation of chip on described pick-up head according to described second distance, the 3rd Distance geometry first distance, is specially:
Δ d=Δ X 3-Δ X 4-Δ X; Wherein,
Δ d is offset deviation; Δ X 3for second distance; Δ X 4it is the 3rd distance; Δ X is the first distance.
CN201510582385.1A 2015-09-14 2015-09-14 A kind of chip flight centralising device and method Expired - Fee Related CN105304539B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105953727A (en) * 2016-04-29 2016-09-21 合肥学院 Suction nozzle alignment device and method under visual compensation
CN106486401A (en) * 2016-09-09 2017-03-08 华中科技大学 A kind of reel-to-reel transfer system towards the detection of slice component multinode

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JPH04154146A (en) * 1990-10-17 1992-05-27 Niyuurii Kk Positioning device of circular plate body
JPH10284576A (en) * 1997-04-07 1998-10-23 Mecs:Kk Wafer conveyer
CN102636120A (en) * 2012-05-10 2012-08-15 吴晓 Visual servo secondary locating system for LED (light emitting diode) chip and locating method of visual servo secondary locating system
CN202701931U (en) * 2011-08-05 2013-01-30 中村留精密工业株式会社 Periphery processing device of hard brittle plate

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04154146A (en) * 1990-10-17 1992-05-27 Niyuurii Kk Positioning device of circular plate body
JPH10284576A (en) * 1997-04-07 1998-10-23 Mecs:Kk Wafer conveyer
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Cited By (3)

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CN105953727A (en) * 2016-04-29 2016-09-21 合肥学院 Suction nozzle alignment device and method under visual compensation
CN106486401A (en) * 2016-09-09 2017-03-08 华中科技大学 A kind of reel-to-reel transfer system towards the detection of slice component multinode
CN106486401B (en) * 2016-09-09 2019-04-12 华中科技大学 A kind of reel-to-reel transfer system towards the detection of slice component multinode

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