CN106475562A - A kind of double scraper power spreading device of increasing material manufacturing attritive powder and its method - Google Patents
A kind of double scraper power spreading device of increasing material manufacturing attritive powder and its method Download PDFInfo
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- CN106475562A CN106475562A CN201611040439.2A CN201611040439A CN106475562A CN 106475562 A CN106475562 A CN 106475562A CN 201611040439 A CN201611040439 A CN 201611040439A CN 106475562 A CN106475562 A CN 106475562A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/34—Process control of powder characteristics, e.g. density, oxidation or flowability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/70—Recycling
- B22F10/73—Recycling of powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/60—Planarisation devices; Compression devices
- B22F12/67—Blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/003—Apparatus, e.g. furnaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention discloses a kind of double scraper power spreading device of attritive powder of increasing material manufacturing technique.The present invention devises double scraper powdering modes and carries out powdering.Scraper adopts the physical dimension of particular design, and specific setting angle is it is achieved that micron order, or even sub-micron powder is laid.Laid powder layer thickness can reach 1~10 μm.Instant invention overcomes traditional pulley type powdering and scraper type powdering cannot laid attritive powder to less than 20 μm powder layer thickness bisque, thus realizing making the high accuracy increasing material manufacturing of fine structure part, improve size definitions and the surface quality of the part of increasing material manufacturing.Present invention also offers a kind of double scraper powdering method of attritive powder of increasing material manufacturing technique.
Description
Technical field
The invention belongs to increases material manufacturing technology field is and in particular to a kind of laid device of the little thickness of attritive powder, this
Bright be mainly used in the micro- sintering of laser, the micro- fusing of laser, precinct laser fusion, precinct laser sintering, Selected area electron bundle fusing shape
Etc. material increasing field.
Background technology
In the increases material manufacturing technology based on three-dimensional CAD model and powder forming, the bisque of little thickness can reduce step
Effect, improve the precision of Forming Workpiece, particularly improve the quality of Forming Workpiece, reduce spherical effect and the defect such as not fine and close.
The bisque wanting laid little thickness is it is necessary to adopt attritive powder.With the minimizing of powder size, quiet between intermolecular force and granule
Substantially, the active force between attritive powder particle is more easy to overcome self gravitation to the surface force mastery reaction such as electric power, forms agglomerate and leads
Cause powder inner homogeneous poor, and the active force between clustered particles is larger.Common scraper power spreading device is in laid fine powder
Find during last thin bisque that attritive powder only very small amount powder remains on substrate, most of powder is all taken away by scraper, and this is
Because the active force that during laid attritive powder, scraper is applied on powder is more than the frictional force between powder and substrate it is impossible to picture is big
Particle powder powdering rests on substrate like that.Therefore in this kind of increases material manufacturing technology, the uniform ground of powder is laid always
It is a key technology and difficult point.In microsecond delay increasing material manufacturing, due to needing to obtain the characteristic size of very little, very high space
Resolution, it usually needs using the attritive powder of micron order even submicron order, lay the powder of a few micrometers thickness is therefore difficult
Degree is bigger.
Laying for powder mainly has following two methods and device at present:One kind is pulley type powdering, and its principle is
With the movement progress powder heap motion of roller, powder forms very thin bisque due to mobility between the gap of roller and substrate.
And the tangential of roller gradual change has pressure to act in the face of bisque.The advantage of this powdering method is that roller acts on to the pressure of bisque
Make bisque consistency obtain certain raising, but the surface energy of attritive powder is big, in roller rotation process, these powder are easy
It is bonded on roller it is impossible to realize the laying of little thickness powder, the minimum thickness of the laid powder of current roller powdering mode is in 50 μ
M about;Another kind is exactly scraper type powdering, and the principle of scraper type powdering is the mobility using powder, powder pushing away in scraper
Under dynamic on substrate drawout, and bisque is formed by the blade motion of scraper.The method is contact area due to scraper and powder
Little, and to bisque almost no pressure, thus avoiding the adhesion of powder.Although the laid bisque apparent density of this mode does not have roller
Cartridge type powdering is high, but scraper type powdering can realize the powdering thickness that minimum thickness is 20 μm about.At present than larger powder
Last increasing material manufacturing equipment manufacturers latest equipment, the EOSINT M280 equipment of such as EOS Corp., MCP company
The power spreading device of the AM 250 of 500HL and RENISHAW company is all to adopt in this way.
Although this scraper type powdering achieves 20 μm of powdering thickness, this powdering thickness still cannot meet will
Ask:For the increasing material manufacturings such as precinct laser fusion shaping, precinct laser sintering, the fusing shaping of Selected area electron bundle, little thickness
Precision and the surface quality of formation of parts can be improved, and for microsecond delay increases material manufacturing technology up-to-date now, need
Thickness is in a few micrometers level.Therefore people are devoted to the development of powdering method and apparatus always.
For reducing powdering thickness, Belgian J.P.Kruth improves scraper type power spreading device, has invented a kind of " slot
The device of feeder ", this device purpose is to reduce the volume of powder heap and quality in front of scraper, thus reducing the work of scraper and powder
Firmly.This device effectively increases the stability of scraper type powdering.German University of Applied Science
Regenfuss of Mittweida et al. devises annular scraper rotation powdering method and apparatus, but this device annular scraper motion
Speed is slower, and powdering is inefficient.This device is successfully realized the powdering of less than 5 μm powder layer thickness.
Content of the invention
It is an object of the invention to provide a kind of little thickness of the attritive powder for increasing material manufacturing is laid, this device can
By attritive powder (micron, submicron order diameter powders) uniformly laid on substrate, and powder layer thickness can arrive micron order, thus carrying
The machining accuracy of high powder increasing material manufacturing and the surface quality of processing part.
In order to realize technique scheme, a kind of little thickness of attritive powder for increasing material manufacturing of the present invention laid,
Including substrate processing, moulding cylinder, powder feeding cylinder, recovery tank A, recovery tank B, doctor blade holder A, doctor blade holder B and scraper A and scraper B;
Described moulding cylinder, powder feeding cylinder, recovery tank A, recovery tank B, doctor blade holder A, doctor blade holder B are arranged on the table;
Described substrate processing can be with oscilaltion in moulding cylinder;
Powder in described powder feeding cylinder is by piston upwards powder feeding;
Scraper A, scraper B are respectively provided with described doctor blade holder A, doctor blade holder B;Scraper A, scraper B are horizontally movable, scraper A,
Scraper B blade is overlapped with substrate processing plane.
Preferably, the horizontal movement of the up and down motion of described moulding cylinder and powder feeding cylinder and scraper A and scraper B is all using exchanging
Servomotor drives, and is completed by high-accuracy ball leading screw driving.
Preferably, the anterior angle of described scraper A is designed as 0 °, chamfer angle γ01The angle of design adopts 60 °~75 °;Chamfered edge
Width b01For 5~10mm.
Preferably, the anterior angle of described scraper B is designed as 0 °, chamfer angle γ02The angle of design is 15 °.Chamfered edge width b02
For 3~5mm, relief angle α is more than 45 °.
Preferably, to move direction vertical for described scraper A installation direction, and scraper B installation direction is with a vertical one
Determine angle, θ, angle, θ is 15 °~30 °.
Another technical scheme of the present invention is to provide attritive powder double scraper substep of any one increasing material manufacturing above-mentioned
The powdering method of power spreading device, comprises the following steps:
(1) frosting treatment is carried out to substrate processing;
(2) demagnetization, the electrostatic that disappears, dried are carried out to powder, and carry out mechanical vibration or ultrasonic activation;
(3) substrate processing is installed on moulding cylinder piston, adjusts substrate processing and overlap with basal plane;Scraper A, scraper are installed
B, adjusts scraper A, scraper B blade is overlapped with substrate processing plane;
(4) powder after processing is poured in powder feeding cylinder;
(5) pass through the laid relatively thick bisque of scraper A;
(6) by scraper B, pre- laid thick bisque is cut to and requires thickness.
The present invention is a little:This device can will be uniformly laid for attritive powder (micron, submicron order diameter powders)
On substrate, and powder layer thickness can arrive micron order, thus improving the machining accuracy of powder increasing material manufacturing and the surface of processing part
Quality.
Brief description
Fig. 1 is the double scraper substep power spreading device structural representation of attritive powder of the increasing material manufacturing of the present invention;
Fig. 2 is the cutter one of the present invention, the sectional view of cutter two;
Fig. 3 is the setting angle of the cutter two of the present invention;
Fig. 4 is the double scraper substep power spreading device process chart of attritive powder of the increasing material manufacturing of the present invention.
Specific embodiment
It is an object of the invention to provide a kind of little thickness of the attritive powder for increasing material manufacturing is laid, this device can
By attritive powder (micron, submicron order diameter powders) uniformly laid on substrate, and powder layer thickness can arrive micron order, thus carrying
The machining accuracy of high powder increasing material manufacturing and the surface quality of processing part.
The present invention is also based on scraper type powdering, proposes double scraper substep powderings, the power spreading device bag of the present invention first
Include (as shown in Figure 1) substrate processing 1, moulding cylinder 2, powder feeding cylinder 3, recovery tank A4 and recovery tank B5, doctor blade holder A6 and doctor blade holder B8
And scraper A7 and scraper B9.Wherein substrate processing 1 is can be with oscilaltion in moulding cylinder 2.On powder in powder feeding cylinder 3
It is by piston upwards powder feeding (it should be noted that the automatic powder feeding system of apparatus of the present invention may also be employed bakie mode, below
Illustrated with powder feeding cylinder powder feeding).Scraper A7 and scraper B9 moves on xy horizontal plane.Whole power spreading device include moulding cylinder and
The up and down motion of powder feeding cylinder and the horizontal movement of scraper.These four motions all use AC servo machinery driving, by high-accuracy
Ball leading screw driving is completing.
The present invention can laid thickness be several microns of bisque on substrate processing, and the method comprises the following steps:
I. frosting treatment is carried out to substrate.Roughing method has sandblast texturing, laser roughening and electric spark texturing etc., at texturing
Substrate roughness after reason is in Ra:5~20 μm, Rz:Between 5~50 μm;
Ii. demagnetization, the electrostatic that disappears, dried are carried out to powder, and carry out mechanical vibration or ultrasonic activation.Purpose is
Reduce powder particle intermolecular forces and powder agglomerate;
Iii. will be installed on moulding cylinder piston by the pretreated substrate of step i, and adjust substrate and overlap with basal plane,
Then two scrapers are installed, and adjust the blade of scraper and overlap with base plan;
Iv. will be poured in the powder feeding cylinder of apparatus of the present invention by the pretreated powder of step ii;
V. double scraper substep power spreading devices of the present invention are utilized by laid for micron powder micron order bisque.
The present invention can spread the bisque that thickness is several microns on substrate processing 1, completes by double scrapers are laid twice
Micron order powder layer thickness.First pass through the laid relatively thick bisque of scraper 7, specific knife-edge design makes scraper A7 that bisque is had
Certain downward pressure, to a certain extent bisque is compacted on the substrate processing after texturing, increases between bisque and substrate
Active force.Then by the scraper B9 of specific knife-edge design, pre- laid thick bisque is cut to the powder of appointed thickness again
Layer.
Double scraper substep powderings that the present invention adopts, are difficult to the powder paving of relatively thin powder layer thickness for solving attritive powder
Put problem, the blade geometry (as shown in Figure 2) employing particular design is to realize this purpose.Scraper A7 be realize relatively thick
Bisque laid, and in order to increase the active force to powder for the substrate, the anterior angle of scraper A7 is designed as 0 °, chamfer angle γ01If
That counts is larger, is typically chosen 60 °~75 °, specific angle is relevant with dusty material and physical property.So scraper powdering when before
Knife face has pressure effect to powder so that powder is increased with the contact area of substrate, improves the adhesion to powder for the substrate, separately
Outer chamfered edge width b01Size selects 5~10mm.The effect of scraper B9 is to cut as required thickness by relatively thick bisque,
So its anterior angle is also configured as 0 °, chamfer angle γ015~15 ° of the angle Selection of design, the cutter of this angle is cut with bisque
Cut power less.Chamfered edge width selects 3~5mm.Relief angle α is mainly the friction of the rear knife face reducing cutter and bisque.The conjunction of relief angle
Reason is chosen and is mainly determined according to powdering speed.Because powdering speed is unsuitable too fast, in order to avoid mechanical vibration increase impact powdering
Uniformity, relief angle selects more than 45 ° preferably.
The scraper of double scraper substep power spreading devices of the present invention employs specific setting angle, scraper A7 installation direction with
Its direction of motion is 1. vertical, but 2. scraper B9 installation direction moves direction is not vertical relation, but with a vertical
Certain angle θ, as shown in Figure 3.15 °~30 ° of this angle Selection, it is therefore intended that increasing the shear force parallel to substrate, subtracts
Little scraper active force vertically upward to bisque, is conducive to powder to rest on and is not taken away by scraper on substrate, improves powdering matter
The stability of amount.
Double scraper attritive powder power spreading devices of the present invention are applied in the increasing material manufacturing of attritive powder, be embodied as
Under:
According to step i described in reality~iv to powder and substrate pretreatment.By above-mentioned steps, attritive powder is increased material system
The preparation made completes, and after powder loads powder feeding cylinder, increasing material manufacturing device closes working chamber.Start evacuation and fill work gas
Body.Increasing material manufacturing processing part proceeds by under control of the computer.
As shown in figure 4, the increasing material manufacturing work process using double scraper power spreading devices of the present invention is as follows:
1) computer professional software carries out slicing treatment to part three-dimensional CAD model, obtains the plane geometric figure of two dimension
And Laser Light Plane Scanning profile information;
2) substrate processing 1 declines 3 processing thickness, and powder feeding cylinder 3 rises 5 processing thickness, promotes powder to rise 5 processing
Thickness, scraper 7 moves right (a → b in Fig. 4) by laid for powder in moulding cylinder, and has been compacted powder to a certain extent, now
Bisque have 3 processing thickness, unnecessary powder falls in recovery tank 4;
3) substrate processing 1 rises 2 processing thickness, and scraper 9 moves (b → c in Fig. 4) upwards, by the powder of 3 processing thickness
Layer is cut to the bisque of 1 processing thickness, and unnecessary powder falls in recovery tank 5, completes a powdering process.Now, laser
Or electron beam is scanned completing monolayer processing according to two-dimensional geometry information;
4) after the completion of laser or electron beam scanning, substrate processing declines 3~5 processing thickness, and scraper 9 moves downward (Fig. 4
Middle c → d) return initial position;
5) scraper 7 also returns to initial position to left movement (d → a in Fig. 4);
Repeat the above steps 2)~5) complete the course of processing of whole part.
Pay special attention to:Step 2) in except during first time powdering substrate processing 1 need to decline 3~5 processing thickness, subsequent
All no longer decline.Hereafter during fabrication cycles, step 4 completes the down maneuver of substrate processing.
The above is presently preferred embodiments of the present invention, but the present invention should not be limited to this embodiment and accompanying drawing institute
Disclosure.So every without departing from complete equivalent or modification under spirit disclosed in this invention, both fall within the present invention and protect
The scope of shield.
Claims (6)
1. a kind of double scraper substep power spreading device of attritive powder of increasing material manufacturing is it is characterised in that include substrate processing, molding
Cylinder, powder feeding cylinder, recovery tank A, recovery tank B, doctor blade holder A, doctor blade holder B and scraper A and scraper B;
Described moulding cylinder, powder feeding cylinder, recovery tank A, recovery tank B, doctor blade holder A, doctor blade holder B are arranged on the table;
Described substrate processing can be with oscilaltion in moulding cylinder;
Powder in described powder feeding cylinder is by piston upwards powder feeding;
Scraper A, scraper B are respectively provided with described doctor blade holder A, doctor blade holder B;Scraper A, scraper B are horizontally movable, scraper A, scraper
B blade is overlapped with substrate processing plane.
2. the double scraper substep power spreading device of the attritive powder based on a kind of increasing material manufacturing described in claim 1 it is characterised in that:
The horizontal movement of the up and down motion of described moulding cylinder and powder feeding cylinder and scraper A and scraper B, all using AC servo machinery driving, is led to
Too high precise ball screw is driven and to complete.
3. the double scraper substep power spreading device of the attritive powder based on a kind of increasing material manufacturing described in claim 1 it is characterised in that:
The anterior angle of described scraper A is designed as 0 °, chamfer angle γ01The angle of design adopts 60 °~75 °;Chamfered edge width b01For 5~
10mm.
4. the double scraper substep power spreading device of the attritive powder based on a kind of increasing material manufacturing described in claim 1 it is characterised in that:
The anterior angle of described scraper B is designed as 0 °, chamfer angle γ02The angle of design is 15 °.Chamfered edge width b02For 3~5mm, relief angle α
More than 45 °.
5. the double scraper substep power spreading device of the attritive powder based on a kind of increasing material manufacturing described in claim 1 it is characterised in that:
Described scraper A installation direction moves direction vertically, and with a vertical certain angle θ, angle, θ is scraper B installation direction
15 °~30 °.
6. the powdering side of the double scraper substep power spreading device of the attritive powder based on any one increasing material manufacturing in Claims 1 to 5
Method is it is characterised in that comprise the following steps:
(7) frosting treatment is carried out to substrate processing;
(8) demagnetization, the electrostatic that disappears, dried are carried out to powder, and carry out mechanical vibration or ultrasonic activation;
(9) substrate processing is installed on moulding cylinder piston, adjusts substrate processing and overlap with basal plane;Scraper A, scraper B are installed, adjust
Section scraper A, scraper B blade are overlapped with substrate processing plane;
(10) powder after processing is poured in powder feeding cylinder;
(11) pass through the laid relatively thick bisque of scraper A;
(12) by scraper B, pre- laid thick bisque is cut to and requires thickness.
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