CN106459374A - Sealant for organic electroluminescence display element - Google Patents
Sealant for organic electroluminescence display element Download PDFInfo
- Publication number
- CN106459374A CN106459374A CN201680001611.5A CN201680001611A CN106459374A CN 106459374 A CN106459374 A CN 106459374A CN 201680001611 A CN201680001611 A CN 201680001611A CN 106459374 A CN106459374 A CN 106459374A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- organic
- display element
- sealant
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000565 sealant Substances 0.000 title claims abstract description 65
- 238000005401 electroluminescence Methods 0.000 title abstract description 4
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 53
- 239000003822 epoxy resin Substances 0.000 claims abstract description 52
- 239000000945 filler Substances 0.000 claims abstract description 33
- 150000001875 compounds Chemical class 0.000 claims abstract description 29
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 15
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000292 calcium oxide Substances 0.000 claims abstract description 11
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 7
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229930185605 Bisphenol Natural products 0.000 claims description 25
- 238000010521 absorption reaction Methods 0.000 claims description 25
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 210000000988 bone and bone Anatomy 0.000 claims 1
- 239000002250 absorbent Substances 0.000 abstract description 3
- 230000004888 barrier function Effects 0.000 abstract 1
- -1 glycidyl ether Chemical compound 0.000 description 35
- 239000000463 material Substances 0.000 description 29
- 239000003795 chemical substances by application Substances 0.000 description 26
- 239000000758 substrate Substances 0.000 description 19
- 239000002585 base Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 10
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 10
- 229910000077 silane Inorganic materials 0.000 description 10
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 9
- 235000012255 calcium oxide Nutrition 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
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- 150000003568 thioethers Chemical class 0.000 description 8
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- 230000000052 comparative effect Effects 0.000 description 7
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- 239000011147 inorganic material Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 6
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- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 5
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- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 description 4
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- LTYMSROWYAPPGB-UHFFFAOYSA-O diphenylsulfanium Chemical compound C=1C=CC=CC=1[SH+]C1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-O 0.000 description 4
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 4
- RMVRSNDYEFQCLF-UHFFFAOYSA-O phenylsulfanium Chemical compound [SH2+]C1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-O 0.000 description 4
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
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- 238000012360 testing method Methods 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 238000005342 ion exchange Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- ROMWNDGABOQKIW-UHFFFAOYSA-N phenyliodanuidylbenzene Chemical compound C=1C=CC=CC=1[I-]C1=CC=CC=C1 ROMWNDGABOQKIW-UHFFFAOYSA-N 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- 238000007738 vacuum evaporation Methods 0.000 description 3
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical class C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 2
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- CIZVQWNPBGYCGK-UHFFFAOYSA-N benzenediazonium Chemical compound N#[N+]C1=CC=CC=C1 CIZVQWNPBGYCGK-UHFFFAOYSA-N 0.000 description 2
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
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- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000003405 preventing effect Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The purpose of the present invention is to provide a sealant for an organic electroluminescence display element, the sealant having excellent barrier properties and being capable of suppressing peeling of a panel. The present invention is a sealant for an organic electroluminescence display element, the sealant containing a cationically polymerizable compound, a photocationic polymerization initiator, and a water-absorbent filler, the cationically polymerizable compound containing a bisphenol-F-type epoxy resin and an epoxy resin having a flexible skeleton, the water-absorbent filler being calcium oxide and/or magnesium oxide, and the total surface area of the sealant being 10-100 m2 per 100 g of the cationically polymerizable compound.
Description
Technical field
The present invention relates to block excellent and can suppress panel peel off organic electro-luminescent display unit sealant.
Background technology
Organic electroluminescent (being also referred to as " organic EL " below) display element has between mutually opposing a pair of electrodes
Be clamped with the laminate construction of organic light emitting material, by from an electrode to this organic light emitting material inject electronics and
From another electrode to this organic light emitting material inject hole, thus in organic light emitting material electronics be combined with hole and
Carry out self-luminous.So, because organic EL display element carries out self-luminous, therefore with the liquid crystal display cells needing backlight
Etc. comparing, have the advantages that visibility is good, can be thinned and can DC low-voltage drive.
Constitute the organic light emitting material of organic EL display element, electrode presence easily makes characteristic bad because of moisture, oxygen etc.
The problem changed.Therefore, in order to obtain the organic EL display element of practicality, need organic light emitting material, electrode and big air bound
Realize long lifetime absolutely.As by the method for organic light emitting material, electrode and atmospheric isolation, carry out is to use sealant
Organic EL display element is sealed with (such as patent documentation 1).What organic EL display element was sealed with sealant
In the case of, in order to fully suppress moisture, oxygen etc. to pass through, it is generally used in setting on the duplexer have organic light emitting material and claims
The method made the inoranic membrane of passivating film and sealed with sealant on this inoranic membrane.
In recent years, replace extracting the bottom of the light being sent by organic light emitting material from the substrate surface side being formed with light-emitting component
The organic EL display element of portion's illumination mode, extracts organic EL of the top light emitting mode of light from the upper surface side of organic luminous layer
Display element attracts attention.Which, because aperture opening ratio is high and becomes low voltage drive, therefore has and is conducive to long lifetime
Advantage.In the organic EL display element of this kind of top light emitting mode, the upper surface side due to needing to make luminescent layer is transparent, because
This is carried out close by the upper surface side in light-emitting component via the transparent moisture resistance base material such as transparent sealing resin laminated glass
Envelope (referring for example to patent documentation 2).
However, in the organic EL display element of this kind of top light emitting mode, depositing to not block the extraction direction of light
It is being configured without the space of desiccant, be difficult to obtain the problem of sufficiently damp proof effect, lifetime.
Prior art literature
Patent documentation
Patent documentation 1：Japanese Unexamined Patent Publication 2007-115692 publication
Patent documentation 2：Japanese Unexamined Patent Publication 2009-051980 publication
Content of the invention
Invention problem to be solved
It is an object of the invention to provide block excellent and can suppress panel peel off ORGANIC ELECTROLUMINESCENCE DISPLAYS unit
Part sealant.
Means for solving the problems
The present invention is a kind of organic electro-luminescent display unit sealant, and it contains cationically polymerizable compound, light
Cationic polymerization initiators and water absorption filler, above-mentioned cationically polymerizable compound contains bisphenol f type epoxy resin and has
The epoxy resin of flexibility skeleton, above-mentioned water absorption filler is calcium oxide and/or magnesium oxide, and total surface area is with respect to above-mentioned sun
Photopolymerizable compound 100g is 10～100m2.
Hereinafter, the present invention is described in detail.
The present inventor etc. in order to improve the block (preventing property of moisture-inhibiting) of organic EL display element sealant and to interpolation
Calcium oxide and/or magnesium oxide are studied as the situation of water absorption filler.However, by substantial amounts of this kind of water absorption filler
Although playing excellent water absorption in the case of being added to organic EL display element sealant, but exist expansion rate high, because
The bad problem such as absorb moisture and cause panel to peel off.
For this reason, that the present inventor etc. is furtherd investigate it is found that：By being applied in combination bisphenol f type epoxy resin and tool
Have the epoxy resin of flexibility skeleton as cationically polymerizable compound used in organic EL display element sealant,
And the total surface area of water absorption filler is set to specific scope, excellent and panel can be suppressed such that it is able to obtain block
The organic EL display element sealant peeled off, so that complete the present invention.
The organic EL display element sealant of the present invention contains cationically polymerizable compound.
The epoxy resin that above-mentioned cationically polymerizable compound contains bisphenol f type epoxy resin and has flexibility skeleton.
By being applied in combination above-mentioned bisphenol f type epoxy resin and the above-mentioned epoxy resin with flexibility skeleton, thus the present invention's has
Even if machine EL display element sealant is used calcium oxide and/or magnesium oxide as water absorption filler it is also possible to prevent panel from shelling
From.
Above-mentioned bisphenol f type epoxy resin has the coating of organic EL display element sealant and the suppression of adjustment gained
The effect of the reduction of the block caused by resinous principle.
It is explained, the bisphenol f type epoxy resin that caprolactone modification bisphenol f type epoxy resin etc. has flexibility skeleton is made
To process for " there is the epoxy resin of flexibility skeleton ".
From the viewpoint of coating, above-mentioned bisphenol f type epoxy resin preferred compositions are using in 25 DEG C of Bisphenol F for solid-state
Type epoxy resin and the bisphenol f type epoxy resin of liquid.
Be combined in the bisphenol f type epoxy resin that 25 DEG C is the bisphenol f type epoxy resins of solid-state and liquid as on
In the case of stating bisphenol f type epoxy resin, it is the bisphenol f type epoxy resin of solid-state and the bisphenol F type epoxy tree of liquid at 25 DEG C
The content ratio of fat is with weight ratio meter preferably in 25 DEG C of bisphenol f type epoxy resins as solid-state: in 25 DEG C of bisphenol-f type as liquid
Epoxy resin=1: 5～1: 50.It is the bisphenol f type epoxy resin of solid-state and the bisphenol F type epoxy tree of liquid by making at 25 DEG C
The content ratio of fat is this scope, so that the coating of the organic EL display element sealant of gained is more excellent.At 25 DEG C
The content ratio of the bisphenol f type epoxy resin of the bisphenol f type epoxy resin for solid-state and liquid is with weight ratio meter more preferably 25
DEG C for solid-state bisphenol f type epoxy resin: 25 DEG C be liquid bisphenol f type epoxy resin=1: 10～1: 30.
The content of above-mentioned bisphenol f type epoxy resin in above-mentioned cationically polymerizable compound 100 weight portion preferred
Lower limit is 5.0 weight portions, the preferred upper limit is 70 weight portions.It is this scope by the content making above-mentioned bisphenol f type epoxy resin,
So that the solidfied material of the organic EL display element sealant of gained had not only suppressed panel to peel off but also make block more excellent.Above-mentioned
The preferred lower limit of the content of bisphenol f type epoxy resin is 10 weight portions, the preferred upper limit is 60 weight portions.
The above-mentioned epoxy resin with flexibility skeleton preferably has the structure shown in following formula (1-1), following formula (1-2)
Structure shown in shown structure, following formula (1-3) or the structure shown in following formula (1-4) as flexibility skeleton, more preferably
There is the structure shown in following formula (1-1), further preferably there is the structure that the m in following formula (1-1) is 4 or 6.
[changing 1]
In formula (1-1), m is 1～15 integer.In formula (1-2), n is 1～5 integer.In formula (1-3), R1And R2For carbon
The alkyl of number 1～3, they can be identical or different respectively.
The glass transition temperature (Tg) of the above-mentioned epoxy resin with flexibility skeleton is preferably less than 100 DEG C.As
For the above-mentioned epoxy resin with flexibility skeleton, by using the epoxy resin less than 100 DEG C for the Tg, so that suppression panel
The effect peeled off is more excellent.The Tg of the above-mentioned epoxy resin with flexibility skeleton is more preferably less than 50 DEG C.
It is explained, in this manual, above-mentioned " glass transition temperature " refers to obtaining using Measurement of Dynamic Viscoelasticity
To loss angle tangent (tan δ) maximum in occur during the maximum being caused by micro-Brownian movement temperature, it is possible to use
Existing known method using Measurement of Dynamic Viscoelasticity device is measured.
As the above-mentioned epoxy resin with flexibility skeleton, specifically, can enumerate for example：Alkylene oxide modified body or own
Lactone-modified body；(gathering) Ethylene glycol diglycidyl ether, (gathering) 1,3-PD diglycidyl ether, (gathering) BDO two
(gathering) the alkane Hexanediol diglycidyl ether such as glycidyl ether, (gathering) 1,6- hexanediol diglycidyl ether；Double (2- (3,4- epoxies
Cyclohexyl) ethyl) polydimethylsiloxane, polydimethylsiloxane diglycidyl ether, polyisobutylene diglycidyl ether etc..
, can enumerate for example for commercially available product as the above-mentioned epoxy resin with flexibility skeleton：jER
YL7410, jER YED216, jER YL7175-500 (is Mitsubishi Chemical Ind's system)；EPICLON705、EPICLON707、
EPICLON726, EPICLON EXA-4816, EPICLON EXA-4822, EPICLON EXA-4850 (being DIC company system)；
Denacol EX-212, Denacol EX-830, Denacol EX-931 (being Nagase ChemteX company system)；KF-
105th, X-22-169 (being chemical industrial company of SHIN-ETSU HANTOTAI system) etc..
The content of the above-mentioned epoxy resin with flexibility skeleton in above-mentioned cationically polymerizable compound 100 weight portion
Preferred lower limit be 1.0 weight portions, the preferred upper limit be 20 weight portions.By making the above-mentioned asphalt mixtures modified by epoxy resin with flexibility skeleton
The content of fat is this scope, thus not only having suppressed the panel of gained organic EL display element to peel off but also make block more excellent.Above-mentioned
The preferred lower limit with the content of the epoxy resin of flexibility skeleton is 2.0 weight portions, the preferred upper limit is 15 weight
Part.
The organic EL display element sealant of the present invention contains light cationic polymerization initiator.
As long as above-mentioned light cationic polymerization initiator utilizes, light irradiation produces Bronsted acid or lewis acidic polymerization causes
Agent, then be not particularly limited, and can produce acid type for ionic light or nonionic light produces acid type.
Produce the light cationic polymerization initiator of acid type as above-mentioned ionic light, can enumerate such as cationic moiety is fragrance
Race's sulfonium, aromatic series iodine, aromatic diazo, aromatic series ammonium or (2,4- cyclopentadiene -1- base) ((1- Methylethyl) benzene)-Fe
Cation and anionicsite are BF4 -、PF6 -、SbF6 -Or (BX4)-(wherein, X represents by the fluorine of more than at least 2 or fluoroform
The phenyl that base replaces) salt that constituted etc..
As above-mentioned aromatic series sulfonium salt, can enumerate for example：The double hexafluorophosphate of double (4- (diphenyl sulfonium) phenyl) thioether, double
The double hexafluoro antimonate of (4- (diphenyl sulfonium) phenyl) thioether, double (4- (diphenyl sulfonium) phenyl) thioether double tetrafluoroborate, double (4-
(diphenyl sulfonium) phenyl) thioether four (pentafluorophenyl group) borate, diphenyl -4- (thiophenyl) phenyl sulfonium hexafluorophosphate, hexichol
Base -4- (thiophenyl) phenyl sulfonium hexafluoro antimonate, diphenyl -4- (thiophenyl) phenyl sulfonium tetrafluoroborate, diphenyl -4- (benzene
Sulfenyl) phenyl sulfonium four (pentafluorophenyl group) borate, triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoro antimonate, triphenylsulfonium
Tetrafluoroborate, triphenylsulfonium four (pentafluorophenyl group) borate, double (4- (two (4- (2- hydroxyl-oxethyl)) phenyl sulfonium) phenyl)
The double hexafluorophosphate of thioether, double (4- (two (4- (2- hydroxyl-oxethyl)) phenyl sulfonium) phenyl) thioether double hexafluoro antimonate, double (4-
(two (4- (2- hydroxyl-oxethyl)) phenyl sulfonium) phenyl) thioether double tetrafluoroborate, double (4- (two (4- (2- hydroxyl-oxethyls))
Phenyl sulfonium) phenyl) thioether four (pentafluorophenyl group) borate etc..
As above-mentioned aromatic iodonium salts, can enumerate for example：Diphenyl iodine hexafluorophosphate, diphenyl iodine hexafluoro antimony
Hydrochlorate, diphenyl iodine tetrafluoroborate, diphenyl iodine four (pentafluorophenyl group) borate, double (dodecylphenyl) iodine six
Fluorophosphate, double (dodecylphenyl) iodine hexafluoro antimonate, double (dodecylphenyl) iodine tetrafluoroborate, double (ten
Dialkyl phenyl organic) iodine end four (pentafluorophenyl group) borate, 4- aminomethyl phenyl -4- (1- Methylethyl) phenyl-iodide hexafluorophosphoric acid
Salt, 4- aminomethyl phenyl -4- (1- Methylethyl) phenyl-iodide hexafluoro antimonate, 4- aminomethyl phenyl -4- (1- Methylethyl) phenyl
Iodine tetrafluoroborate, 4- aminomethyl phenyl -4- (1- Methylethyl) phenyl-iodide four (pentafluorophenyl group) borate etc..
As above-mentioned aromatic diazonium salt, can enumerate for example：Phenyldiazonium hexafluorophosphate, phenyldiazonium hexafluoro
Stibate, phenyldiazonium tetrafluoroborate, phenyldiazonium four (pentafluorophenyl group) borate etc..
As above-mentioned aromatic series ammonium salt, can enumerate for example：1- benzyl -2- cyanopyridine hexafluorophosphate, 1- benzyl -2-
Cyanopyridine hexafluoro antimonate, 1- benzyl -2- cyanopyridine tetrafluoroborate, 1- benzyl -2- cyanopyridine four (five fluorine
Phenyl) borate, 1- (naphthyl methyl) -2- cyanopyridine hexafluorophosphate, 1- (naphthyl methyl) -2- cyanopyridine hexafluoro
Stibate, 1- (naphthyl methyl) -2- cyanopyridine tetrafluoroborate, 1- (naphthyl methyl) -2- cyanopyridine four (phenyl-pentafluoride
Base) borate etc..
As above-mentioned (2,4- cyclopentadiene -1- base) ((1- Methylethyl) benzene)-Fe salt, can enumerate for example：(2,4- rings penta
Diene -1- base) ((1- Methylethyl) benzene -)-Fe (II) hexafluorophosphate, (2,4- cyclopentadiene -1- base) ((1-- methyl second
Base) benzene)-Fe (II) hexafluoro antimonate, (2,4- cyclopentadiene -1- base) ((r Methylethyl) benzene)-Fe (II) tetrafluoroborate,
(2,4 cyclopentadiene -1- base) ((1- Methylethyl) benzene)-Fe (II) four (pentafluorophenyl group) borate etc..
Produce the light cationic polymerization initiator of acid type as above-mentioned nonionic light, can enumerate for example：Nitrobenzyl ester, sulphur
Acid derivative, phosphate ester, sulfophenylate, diazo naphthoquinone, N- hydroxy imide sulphonic acid ester etc..
As commercially available product in above-mentioned light cationic polymerization initiator, can enumerate for example：DTS-200 (Midori chemistry
Company system)；UVI6990, UVI6974 (are Union Carbide Corporation system)；SP-150, SP-170 (are
ADEKA company system)；FC-508, FC-512 (are 3M company system)；IRGACURE261 (BASF AG's system)；PI2074
(Rhodia company system) etc..
With respect to above-mentioned cationically polymerizable compound 100 weight portion, the content of above-mentioned light cationic polymerization initiator
Preferred lower limit is 0.1 weight portion, the preferred upper limit is 10 weight portions.By making the content of above-mentioned light cationic polymerization initiator
More than 0.1 weight portion, so that the photo-curable of the organic EL display element sealant of gained is more excellent.Above-mentioned by making
The content of light cationic polymerization initiator is below 10 weight portions, thus not making the organic EL display element sealant of gained
Curing reaction become too fast, make operability more excellent, solidfied material can be made evenly.Above-mentioned light cationic polymerization initiator
The preferred lower limit of content is 0.5 weight portion, the preferred upper limit is 5 weight portions.
The organic EL display element sealant of the present invention contains water absorption filler.
Above-mentioned water absorption filler is calcium oxide and/or magnesium oxide.By being used as above-mentioned suction containing calcium oxide and/or magnesium oxide
Aqueouss filler, so that the block of the organic EL display element sealant of gained is excellent.
Wherein, preferably comprise specific surface area less than 10.0m2The calcium oxide of/g.
The lower limit with respect to cationically polymerizable compound 100g for the total surface area of above-mentioned water absorption filler is 10m2, the upper limit
For 100m2.By making the total surface area of above-mentioned water absorption filler be 10m with respect to cationically polymerizable compound 100g2More than,
So that the block of the solidfied material of organic EL display element sealant of gained is more excellent.By making above-mentioned water absorption filler
Total surface area be 100m2Hereinafter, so that the effect that suppression panel is peeled off, crackle produces is more excellent.Above-mentioned water absorption filler
Total surface area preferred lower limit be 20m2, the preferred upper limit be 80m2.
It is explained, the total surface area of above-mentioned water absorption filler is by the content of above-mentioned water absorption filler and BET specific surface area
To calculate.Specifically, for example by using specific area measuring device (Shimadzu Seisakusho Ltd.'s company system, ASAP-2000) and use
BET specific surface area measured by nitrogen is calculating.
With respect to above-mentioned cationically polymerizable compound 100 weight portion, the content of above-mentioned water absorption filler preferred under
It is limited to 1.0 weight portions, the preferred upper limit is 50 weight portions.It is this scope by the content making above-mentioned water absorption filler, so that
The solidfied material of the organic EL display element sealant of gained had not only suppressed panel to peel off, crackle produces but also makes block more excellent.
The preferred lower limit of the content of above-mentioned water absorption filler is 2.0 weight portions, the preferred upper limit is 20 weight portions.
For improving the purposes such as cementability, the organic EL display element sealant of the present invention can not hinder the present invention
Other fillers in addition to above-mentioned water absorption filler are contained in the range of purpose.
As other fillers above-mentioned, can enumerate for example：The inorganic fillers such as silicon dioxide, Talcum, aluminium oxide；Polyester micropartical,
Organic fillers such as polyurethane particulate, polyvinyl microgranule, acrylic polymer microgranule etc..Wherein, from raising moisture-proof
The aspect of excellent effect set out, preferably talc.
With respect to above-mentioned cationically polymerizable compound 100 weight portion, the preferred lower limit of the content of other fillers above-mentioned
It is 100 weight portions for 5 weight portions, the preferred upper limit.It is more than 5 weight portions by the content making other fillers above-mentioned, so that
The effect improving cementability etc. is more excellent.It is below 100 weight portions by the content making other fillers above-mentioned, so that gained
The coating of organic EL display element sealant is more excellent.The preferred lower limit of the content of other fillers above-mentioned is 10 weight
Part, the preferred upper limit are 80 weight portions.
The organic EL display element sealant of the present invention can contain thermal curing agents.
As above-mentioned thermal curing agents, such as hydrazide compound, imdazole derivatives, anhydride, dicyandiamide, guanidine can be enumerated and derive
Thing, addition compound product of modified aliphatic polyamine, various amine and epoxy resin etc..
As above-mentioned hydrazide compound, such as 1,3- double (diazanyl carbonyl ethyl -5- isopropyl hydantoin), the last of the ten Heavenly stems two can be enumerated
Acid dihydrazide, isophthalic dihydrazide, adipic dihydrazide, acid dihydrazide etc..
As above-mentioned imdazole derivatives, such as 1- cyano ethyl -2- phenylimidazole, N- (2- (2 methyl isophthalic acids-imidazoles can be enumerated
Base) ethyl) urea, 2,4- diaminourea -6- (2 '-methylimidazolyl-(1 '))-ethyl-s-triazine, N, N '-bis- (2- methyl isophthalic acid-miaow
Oxazolyl ethyl) urea, N, N '-(2- methyl isophthalic acid-imidazolylethyl)-adipamide, 2- phenyl -4- methyl -5- hydroxymethyl miaow
Azoles, 2- phenyl -4,5- bishydroxymethyl imidazoles etc..
As above-mentioned anhydride, such as tetrabydrophthalic anhydride, ethylene glycol double (dehydration trimellitate) etc. can be enumerated.
These thermal curing agents can be used alone it is also possible to and use two or more.
As commercially available product in above-mentioned thermal curing agents, can enumerate for example：SDH (Japanese FINECHEM company system), ADH
(big chemical company system), AMICURE VDH, AMICURE VDH-J, AMICURE UDH (are aginomoto Microtechnic
System) etc..
With respect to above-mentioned cationically polymerizable compound 100 weight portion, the preferred lower limit of the content of above-mentioned thermal curing agents
It is 30 weight portions for 0.5 weight portion, the preferred upper limit.It is more than 0.5 weight portion by the content making above-mentioned thermal curing agents, thus
Make the Thermocurable of the organic EL display element sealant of gained more excellent.It is 30 weights by the content making above-mentioned thermal curing agents
Below amount part, so that the storage stability of the organic EL display element sealant of gained is more excellent, and make solidfied material
Moisture-proof is more excellent.The preferred lower limit of the content of above-mentioned thermal curing agents is 1 weight portion, the preferred upper limit is 15 weight
Part.
The organic EL display element sealant of the present invention can contain sensitizer.Above-mentioned sensitizer has and improves further
The polymerization initiation efficiency of above-mentioned light cationic polymerization initiator and promote the organic EL display element of the present invention to seal further
The effect of the curing reaction of agent.
As above-mentioned sensitizer, the anthracene based compounds such as such as 9,10- dibutoxy anthracene, 2,4- diethyl thioxanthone can be enumerated
Deng thiaxanthone based compound, 2,2- dimethoxy -1,2- diphenylethane -1- ketone, benzophenone, 2,4- dichloro benzophenone,
O-benzoyl yl benzoic acid methyl ester, 4,4 '-bis- (dimethylamino) benzophenone, 4- benzoyl -4 ' dimethyl diphenyl sulfide
Deng.
With respect to above-mentioned cationically polymerizable compound 100 weight portion, the preferred lower limit of the content of above-mentioned sensitizer is
0.05 weight portion, the preferred upper limit are 3 weight portions.By make above-mentioned sensitizer content be 0.05 weight portion more than, thus entering
One step plays sensitization effect.By make above-mentioned sensitizer content be 3 weight portions below, thus not make absorption become too much,
Light can be sent to deep.The preferred lower limit of the content of above-mentioned sensitizer is 0.1 weight portion, the preferred upper limit is 1
Weight portion.
For improving the purposes such as storage stability, the organic EL display element sealant of the present invention preferably comprises to be stablized
Agent.
As aforementioned stable agent, such as amine compound, amino phenol-type epoxy resin etc. can be enumerated.
With respect to above-mentioned cationically polymerizable compound 100 weight portion, the preferred lower limit of the content of aforementioned stable agent is
0.001 weight portion, the preferred upper limit are 2 weight portions.By make aforementioned stable agent content be this scope, thus suppress solidification resistance
Hinder, and make storage stability raising of organic EL display element sealant of gained and other effects more excellent.Above-mentioned steady
The preferred lower limit determining the content of agent is 0.05 weight portion, the preferred upper limit is 1 weight portion.
The organic EL display element sealant of the present invention can contain silane coupler.Above-mentioned silane coupler has and carries
The effect of the cementability of the organic EL display element sealant of the high present invention and substrate etc..
As above-mentioned silane coupler, such as 3- TSL 8330,3- mercaptopropyi trimethoxy can be enumerated
Base silane, 3- glycidoxy-propyltrimethoxy silane, 3- isocyanates propyl trimethoxy silicane etc..These silane couplers
Can be used alone it is also possible to and use two or more.
With respect to above-mentioned cationically polymerizable compound 100 weight portion, the content of above-mentioned silane coupler preferred under
It is limited to 0.1 weight portion, the preferred upper limit is 10 weight portions.By make above-mentioned silane coupler content be this scope, thus pressing down
System oozing out caused by remaining silane coupler, and make the cementability of the organic EL display element sealant of gained
The effect improving is more excellent.The preferred lower limit of the content of above-mentioned silane coupler is 0.5 weight portion, the preferred upper limit is
5 weight portions.
The organic EL display element sealant of the present invention can contain surface not hindering in the range of the object of the invention
Modifying agent.By containing above-mentioned surface modifier, applying such that it is able to be given with sealant to the organic EL display element of the present invention
The flatness of film.
As above-mentioned surface modifier, such as surfactant, levelling agent etc. can be enumerated.
As above-mentioned surfactant, above-mentioned levelling agent, live in the surface that can enumerate such as silicon systems, acrylic acid seriess, fluorine system etc.
Property agent, levelling agent.
As commercially available product in above-mentioned surfactant, above-mentioned levelling agent, can enumerate for example：BYK-345、BYK-340
(being BYK-CHEMIE-JAPAN company system), Surflon S-611 (AGC SEMICHEMICAL company system) etc..
In order to improve the durability of element electrode, the organic EL display element sealant of the present invention can not hinder this
Ion exchange resin is contained in the range of goal of the invention.
As above-mentioned ion exchange resin, it is possible to use in cation exchange, anion exchange, two ion-exchange types
Any one, be particularly preferably capable of cation exchange or two ion-exchange types of adsorbing chlorinated thing ion.
In addition, the organic EL display element sealant of the present invention can not hinder basis in the range of the object of the invention
Need containing public affairs such as cure retarder, reinforcing agent, softening agent, plasticizer, viscosity modifier, UV absorbent, antioxidants
The various additives known.
As the method for the organic EL display element sealant manufacturing the present invention, can enumerate for example：Using homogenous disperse
The mixers such as machine, homogeneous mixer, universal mixer, planetary-type mixer, kneader, three-roller are by cationically polymerizable chemical combination
Thing, light cationic polymerization initiator, water absorption filler and the method etc. of the additive mixing being added as needed on.
For the organic EL display element sealant of the present invention, using measured by E type viscometer at 25 DEG C
Viscosity preferred lower limit be 100Pa s, the preferred upper limit be 500Pa s.By making above-mentioned viscosity be this scope, thus
Make the present invention of gained the coating of organic EL display element sealant, coating after shape stability more excellent.Above-mentioned
The preferred lower limit of viscosity is 150Pa s, the preferred upper limit is 450Pa s, and further preferred lower limit is
200mPa s, the further preferred upper limit are 400Pa s.
It is explained, above-mentioned viscosity can be measured by such as in the following manner：Using VISCOMETER TV-22 (eastern machine
Industry companies' system) as E type viscometer, using CP7 cone-plate according to the optimal moment of torsion number in each viscosity region come suitably
Select the rotating speed of 1～100rpm.
The glass transition temperature (Tg) of the solidfied material of organic EL display element sealant of the present invention preferred under
Be limited to 85 DEG C, the preferred upper limit be 180 DEG C.It is more than 85 DEG C by making the glass transition temperature of above-mentioned solidfied material, so that
Block is more excellent.It is less than 180 DEG C by making the glass transition temperature of above-mentioned solidfied material, so that suppression crackle, panel
The effect peeled off is more excellent.The preferred lower limit of the glass transition temperature of above-mentioned solidfied material is 100 DEG C, the preferred upper limit
For 150 DEG C.
It is explained, the solidfied material of said determination Tg can irradiate 3000mJ/cm by using high voltage mercury lamp etc.2's
The ultraviolet of 365nm and further at 80 DEG C heat treated 30 minutes obtaining.
As the shape of the sealing being formed with sealant by the organic EL display element of the present invention, as long as can protect
There is the shape that the duplexer of organic light emitting material affects from ambient atmos, be then not particularly limited, can be for covering completely
Cover the shape of this duplexer it is also possible to be formed at the pattern of the periphery closure of this duplexer, be additionally formed in this duplexer
Periphery be provided with local openings portion shape pattern, the sealing of the periphery of this duplexer can be suitable for.
Invention effect
According to the present invention it is possible to provide block excellent and panel stripping can be suppressed organic electro-luminescent display unit
Use sealant.
Specific embodiment
It is exemplified below embodiment the present invention is described in detail further, but the present invention is not limited to these enforcements
Example.
(embodiment 1)
At 110 DEG C with make to be dissolved in as 9,10- dibutoxy anthracene 0.1 weight portion of sensitizer within 1 hour as sun from
Bisphenol f type epoxy resin (Mitsubishi Chemical Ind's system, " jER 4005P ") 20 weight portions of the solid-state of sub- polymerizable compound, liquid
Bisphenol f type epoxy resin (DIC company system, " EPICLON EXA-830LVP ") 70 weight portions of shape and there is above-mentioned formula (1-1)
In m be 4 structure as flexibility skeleton epoxy resin (Mitsubishi Chemical Ind's system, " jER YL7410 ", also referred to as have
The epoxy resin A of flexibility skeleton) in 10 weight portions, then, add the aromatic series iodine as light cationic polymerization initiator
Salt (Rhodia company system, " PI2074 ") 3.0 weight portions, heating for dissolving 1 hour at 60 DEG C.Afterwards, add as silane occasionally
3- glycidoxy-propyltrimethoxy silane (chemical industrial company of SHIN-ETSU HANTOTAI system, " KBM-403 ") 2.0 weight portions of connection agent, conduct
Calcium oxide (Ji Ze Calx industrial group system, " quick lime J1P ", specific surface area 2.5m of water absorption filler2/ g) 20 weight portions, work
Talcum (Japanese Talcum company system, " FG-15 ") 30 weight portions for other fillers, using stirring mixer (THINK Y company
System, " AR-250 "), under low whipping speed 2000rpm, equably stirring mixing, is fabricated to organic EL display element sealant.
(embodiment 2～12, comparative example 1～5)
According to the match ratio described in table 1,2, each material described in table 1,2 is stirred mixing similarly to Example 1,
It is fabricated to organic EL display element sealant.
It is explained, in table 1, " having the epoxy resin B of flexibility skeleton " is the m having in above-mentioned formula (1-1) is 6
The epoxy resin of structure, " having the epoxy resin C of flexibility skeleton " is the ring of the structure that the m having in above-mentioned formula (1-1) is 2
Oxygen tree fat.
<Evaluate>
For each organic EL display element sealant of gained in embodiment and comparative example, carry out following evaluation.
Result is as shown in table 1,2.
(1) viscosity
For each organic EL display element sealant of gained in embodiment and comparative example, using E type viscometer (eastern machine
Industry companies' system, " VISCOMETER TV-22 "), determine the viscosity (initial viscosity) at 25 DEG C.
(2) glass transition temperature of solidfied material
For each organic EL display element sealant of gained in embodiment and comparative example, with 3000mJ/cm2Irradiate
The ultraviolet of 365nm, then heat 30 minutes at 80 DEG C, thus make sealant cures, make film forming.For the film of gained, use
Measurement of Dynamic Viscoelasticity device (IT measures Heat ＆ Control Pty Ltd.'s system, " DVA-200 ") measures under 30 DEG C～200 DEG C, 10Hz and dynamically glues
Elasticity, the temperature of maximum trying to achieve loss angle tangent (tan δ) is as glass transition temperature.
(3) block of solidfied material
For each organic EL display element sealant of gained in embodiment and comparative example, carry out following Ca-
TEST.
First, the mask of the peristome with multiple 2mm × 2mm is covered on the glass substrate of 30mm × 30mm, utilizes
Vacuum evaporation plating machine is deposited with Ca.Evaporation condition be：It is decompressed to 2 × 10 by the evaporator of vacuum deposition apparatus-3Pa, by Ca withEvaporation rate film formingBy evaporation have the glass substrate of Ca mobile to be managed for dew point (- 60 DEG C with
On) glove box in, it is fitted in surface and is coated with each organic EL display element of gained in embodiment and comparative example with close
The glass substrate of envelope agent.Now, have be deposited with Ca's according in the position by 2mm, 4mm, 6mm apart from glass substrate end face
Mode is fitted.Then, with 3000mJ/cm2Irradiate the ultraviolet of 365nm, then heat 30 minutes at 80 DEG C, thus make sealing
Agent solidifies, and is fabricated to Ca-TEST substrate.The Ca-TEST substrate of gained is exposed to 85 DEG C, the hot and humid condition of 85%RH,
The immersion distance of moisture hourly is observed by the disappearance of Ca.
The result of Ca-TEST：Time till the immersion distance of moisture is reached 6mm is that the situation of more than 1000 hours sets
For " ◎ ", by more than 500 hours and the situation less than 1000 hours is set to "○", by more than 100 hours and less than 500 hours
Situation is set to " △ ", and the situation less than 100 hours is set to "×", thus the block to solidfied material is evaluated.
(4) adhering state of panel
(being configured with the making of the substrate of the duplexer with organic light emitting material)
On glass substrate (length 25mm, width 25mm, thickness 0.7mm) withThickness film forming ITO electrode
Afterwards, as substrate.By aforesaid substrate respectively with acetone, aqueous alkali, ion exchange water, that isopropanol carries out 15 minutes ultrasound wave is clear
After washing, cleaned 10 minutes using the isopropanol boiling, recycle UV- ozone cleaner (Japanese electronic laser company system, " NL-
UV253 ") pre-treatment that carries out.
Then, this substrate is fixed on the substrate folder of vacuum deposition apparatus, unglazed crucible adds N, N '-two (1-
Naphthyl)-N, N '-diphenylbenzidine (α-NPD) 200mg, another unglazed crucible adds three (8-hydroxyquinoline) aluminum
(Alq3) 200mg, it is depressurized to 1 × 10 by vacuum chamber-4Pa.Afterwards, the crucible that will be equipped with α-NPD is heated, and makes α-NPD
With evaporation rateIt is stacked on substrate, film forming thicknessHole transmission layer.Then, will be equipped with Alq3Earthenware
Crucible is heated, withEvaporation rate film forming thicknessOrganic light emitting material.Afterwards, free by being formed
The substrate of cave transport layer and organic light emitting material moves into the tungsten system in another vacuum deposition apparatus, in this vacuum deposition apparatus
Add lithium fluoride 200mg in resistance-heated boat, another tungsten boat adds aluminum steel 1.0g.Afterwards, vacuum evaporation is filled
It is decompressed to 2 × 10 in the evaporator put-4Pa, by lithium fluoride withEvaporation rate film formingAfterwards, by aluminum withSpeed film formingMake to return to normal pressure in evaporator using nitrogen, taking-up is configured with to be hadThe duplexer of organic light emitting material substrate.
(coating using inorganic material film A)
In the way of covering this duplexer entirety of the substrate being configured with duplexer of gained, setting has 13mm × 13mm
Peristome mask, using plasma CVD method formed inorganic material film A.
Plasma CVD method is using SiH4Gas and nitrogen are set to 10sccm as unstrpped gas, by respective flow
And 200sccm, RF power is set to 10W (frequency 2.45GHz), within the chamber temperature is set to 100 DEG C, cavity indoor pressure is set to
Carry out under conditions of 0.9Torr.
The thickness of the inorganic material film A being formed is about 1 μm.
(formation of resin protection film)
In vacuum equipment, setting is configured with the substrate of the duplexer being coated to by inorganic material film A, is being arranged at vacuum holding
Add each organic EL display element sealant 0.5g of gained in embodiment and comparative example in the heated boat put, be depressurized to
10Pa, for the tetragonal part of the 11mm × 11mm comprising duplexer, at 200 DEG C, heating organic EL display element is with close
Envelope agent, carries out vacuum evaporation in the way of making thickness reach 0.5 μm.Afterwards, under vacuum conditions using high voltage mercury lamp, to irradiate
Amount reaches 3000mJ/cm2Mode illumination wavelength 365nm ultraviolet, make organic EL display element sealant cures, formed
Resin protection film.
(coating using inorganic material film B)
After forming resin protection film, arranged in the way of the entirety covering this resin protection film and there is opening of 12mm × 12mm
The mask of oral area, forms inorganic material film B using plasma CVD method, obtains organic EL display element.
Plasma CVD method is using SiH4Gas and nitrogen are set to SiH as unstrpped gas, by respective flow4Gas
10sccm, nitrogen 200sccm, RF power are set to 10W (frequency 2.45 GHz), within the chamber temperature is set to 100 DEG C, cavity indoor pressure
Carry out under conditions of being set to 0.9Torr.
The thickness of the inorganic material film B being formed is about 1 μm.
(observation of the adhering state of panel)
After the organic EL display element of gained being exposed 500 hours in the environment of 85 DEG C, 85%RH with visual observation
The adhering state of panel.Its result is：Panel is not had to peel off and do not observe yet that the situation of the insertion in sealant sets completely
For " ◎ ", although not having the situation that panel is peeled off to be set to "○" by confirming a little insertion in sealant, will confirm that
The situation that a part of panel is peeled off is set to " △ ", and the situation confirming panel stripping from major part is set to "×", thus opposite
The adhering state of plate is evaluated.
(5) reliability of organic EL display element
By the organic EL display element that obtains in the same manner as above-mentioned " adhering state of (3) panel " in 85 DEG C, 85%RH
After exposing 500 hours under environment, apply the voltage of 3V, stain (is had or not with the visual luminance observing organic EL display element
And pixel periphery delustring).By no stain, periphery delustring and equably light situation be set to "○", even if will be a little but still true
Recognize stain, the situation of periphery delustring is set to "×", thus being evaluated to the reliability of organic EL display element.
[table 1]
[table 2]
Industrial applicability
According to the present invention it is possible to provide block excellent and panel stripping can be suppressed organic electro-luminescent display unit
Use sealant.
Claims (3)
1. a kind of organic electro-luminescent display unit sealant is it is characterised in that contain cationically polymerizable compound, light sun
Cation polymerization initiator and water absorption filler,
The epoxy resin that described cationically polymerizable compound contains bisphenol f type epoxy resin and has flexibility skeleton,
Described water absorption filler is calcium oxide and/or magnesium oxide, and total surface area is with respect to described cationically polymerizable compound
100g is 10～100m2.
2. organic electro-luminescent display unit sealant according to claim 1 is it is characterised in that have flexibility bone
The epoxy resin of frame has shown in the structure shown in the structure shown in following formula (1-1), following formula (1-2), following formula (1-3)
Structure shown in structure or following formula (1-4) as flexibility skeleton,
In formula (1-1), m is 1～15 integer, and in formula (1-2), n is 1～5 integer, in formula (1-3), R1And R2For carbon number 1～
3 alkyl, and each can be identical or different.
3. organic electro-luminescent display unit sealant according to claim 1 and 2 is it is characterised in that contain than table
Area is less than 10.0m2The calcium oxide of/g is as water absorption filler.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015026739 | 2015-02-13 | ||
| JP2015-026739 | 2015-02-13 | ||
| PCT/JP2016/053198 WO2016129472A1 (en) | 2015-02-13 | 2016-02-03 | Sealant for organic electroluminescence display element |
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| Publication Number | Publication Date |
|---|---|
| CN106459374A true CN106459374A (en) | 2017-02-22 |
| CN106459374B CN106459374B (en) | 2020-10-13 |
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| JP (1) | JP5966113B1 (en) |
| KR (1) | KR101717035B1 (en) |
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| CN111837457A (en) * | 2018-04-20 | 2020-10-27 | 积水化学工业株式会社 | Sealing agent for organic EL display element |
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| KR102340967B1 (en) * | 2016-09-16 | 2021-12-17 | 세키스이가가쿠 고교가부시키가이샤 | Encapsulant for organic electroluminescent display elements |
| CN108886849B (en) * | 2016-10-19 | 2022-10-21 | 积水化学工业株式会社 | Sealing agent for organic EL display element and method for producing sealing agent for organic EL display element |
| JP2018095679A (en) * | 2016-12-08 | 2018-06-21 | 三井化学株式会社 | Sheet-like seal material, display element seal material, surface sealing material for organic el element, organic el device, and method for manufacturing organic el device |
| WO2019004241A1 (en) * | 2017-06-28 | 2019-01-03 | 積水化学工業株式会社 | In-plane sealing agent for organic el display elements, and sealing agent set for organic el display elements |
| WO2019106953A1 (en) * | 2017-11-30 | 2019-06-06 | 京セラ株式会社 | Resin sheet, semiconductor device and method for producing semiconductor device |
| TWI791716B (en) * | 2017-12-18 | 2023-02-11 | 南韓商Ｌｇ化學股份有限公司 | Encapsulating composition |
| JPWO2022024839A1 (en) * | 2020-07-27 | 2022-02-03 | ||
| WO2024134951A1 (en) * | 2022-12-23 | 2024-06-27 | ナミックス株式会社 | Epoxy resin composition, cured product, and semiconductor device |
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|---|---|---|---|---|
| JP2009259656A (en) * | 2008-04-18 | 2009-11-05 | Toyo Ink Mfg Co Ltd | Sealer |
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| JPH07278129A (en) * | 1994-04-08 | 1995-10-24 | Takeda Chem Ind Ltd | New low-viscosity linear glycidyl ethers, their production and epoxy resin composition containing the same |
| JP3603426B2 (en) * | 1995-11-21 | 2004-12-22 | 日立化成工業株式会社 | Connection member for circuit |
| KR100685845B1 (en) | 2005-10-21 | 2007-02-22 | 삼성에스디아이 주식회사 | Organic eletroluminescence display device and method for fabricating of the same |
| JP5044326B2 (en) | 2007-08-28 | 2012-10-10 | パナソニック株式会社 | Epoxy resin composition and resin sealing device |
| TWI473854B (en) * | 2009-01-23 | 2015-02-21 | Ajinomoto Kk | Resin composition |
| JP5750855B2 (en) * | 2010-09-30 | 2015-07-22 | 大日本印刷株式会社 | Curable resin composition and cured product thereof |
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- 2016-02-03 KR KR1020167034320A patent/KR101717035B1/en active IP Right Grant
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| JP2009259656A (en) * | 2008-04-18 | 2009-11-05 | Toyo Ink Mfg Co Ltd | Sealer |
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| CN111837457A (en) * | 2018-04-20 | 2020-10-27 | 积水化学工业株式会社 | Sealing agent for organic EL display element |
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| KR20160147285A (en) | 2016-12-22 |
| CN106459374B (en) | 2020-10-13 |
| TW201639919A (en) | 2016-11-16 |
| JP5966113B1 (en) | 2016-08-10 |
| JPWO2016129472A1 (en) | 2017-04-27 |
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| WO2016129472A1 (en) | 2016-08-18 |
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