CN106449611B - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
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- CN106449611B CN106449611B CN201610648773.XA CN201610648773A CN106449611B CN 106449611 B CN106449611 B CN 106449611B CN 201610648773 A CN201610648773 A CN 201610648773A CN 106449611 B CN106449611 B CN 106449611B
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- dielectric layer
- block
- conductive
- redistribution structure
- dielectric material
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US10515927B2 (en) * | 2017-04-21 | 2019-12-24 | Applied Materials, Inc. | Methods and apparatus for semiconductor package processing |
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US10103038B1 (en) * | 2017-08-24 | 2018-10-16 | Micron Technology, Inc. | Thrumold post package with reverse build up hybrid additive structure |
KR20200076778A (ko) | 2018-12-19 | 2020-06-30 | 삼성전자주식회사 | 반도체 패키지의 제조방법 |
US11462418B2 (en) * | 2020-01-17 | 2022-10-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated circuit package and method |
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US20090140442A1 (en) * | 2007-12-03 | 2009-06-04 | Stats Chippac, Ltd. | Wafer Level Package Integration and Method |
US20130082402A1 (en) * | 2005-02-18 | 2013-04-04 | Fujitsu Semiconductor Limited | Semiconductor device |
US20150097277A1 (en) * | 2013-10-04 | 2015-04-09 | Mediatek Inc. | Fan-out semiconductor package with copper pillar bumps |
CN104795382A (zh) * | 2014-01-22 | 2015-07-22 | 联发科技股份有限公司 | 半导体封装 |
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US5239448A (en) * | 1991-10-28 | 1993-08-24 | International Business Machines Corporation | Formulation of multichip modules |
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KR101411813B1 (ko) * | 2012-11-09 | 2014-06-27 | 앰코 테크놀로지 코리아 주식회사 | 반도체 디바이스 및 그 제조 방법 |
KR20150081161A (ko) * | 2014-01-03 | 2015-07-13 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 제조 방법 및 이를 이용한 반도체 패키지 |
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US20130082402A1 (en) * | 2005-02-18 | 2013-04-04 | Fujitsu Semiconductor Limited | Semiconductor device |
US20090140442A1 (en) * | 2007-12-03 | 2009-06-04 | Stats Chippac, Ltd. | Wafer Level Package Integration and Method |
US20150097277A1 (en) * | 2013-10-04 | 2015-04-09 | Mediatek Inc. | Fan-out semiconductor package with copper pillar bumps |
CN104795382A (zh) * | 2014-01-22 | 2015-07-22 | 联发科技股份有限公司 | 半导体封装 |
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